Light-emitting substrate and light-emitting device
By setting a support structure higher than the leads in the non-lead area of the light-emitting substrate and setting grooves on the encapsulation sheet, the problem of scratching the leads after the encapsulation sheet is cut is solved, and the product yield of OLED light-emitting devices is improved.
Patent Information
- Application Number
- CN202520136256.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-01-20
AI Technical Summary
In the mass production of OLED light-emitting devices, the portion of the encapsulation wafer corresponding to the bonding area is cut off and falls onto the lead wire, scratching the lead wire, resulting in poor performance and reducing product yield.
A support structure is provided in the non-lead area of the light-emitting substrate, with its height greater than that of the lead area. A groove corresponding to the lead area is provided on the package to prevent the package from directly contacting the lead after cutting.
This effectively avoids contact between the packaged chip and the lead wire after cutting, ensuring the performance of the light-emitting device and improving product yield.
Smart Images
Figure CN223829740U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of light-emitting technology, specifically relating to a light-emitting substrate and a light-emitting device. Background Technology
[0002] In the mass production of Organic Light Emitting Display (OLED) devices, multiple screen areas are arranged on a large substrate, and light-emitting units are set on the screen areas. To avoid the influence of the external environment on each light-emitting unit, an encapsulation sheet is used to encapsulate the large substrate. Then, the encapsulation sheet and the large substrate are cut to obtain multiple OLED light-emitting devices.
[0003] The screen area also includes a bonding area, which contains lead wires. When the package is cut, the portion of the package corresponding to the bonding area is cut off and falls onto the lead wires, scratching them and causing poor performance of the OLED light-emitting device, thus reducing the product yield. Utility Model Content
[0004] This utility model provides a light-emitting substrate and a light-emitting device to solve the technical problem in related technologies where a portion of the bonding area corresponding to the package sheet is cut off and falls onto the lead wire, scratching the lead wire and causing poor performance of the light-emitting device.
[0005] In a first aspect, the present invention provides a light-emitting substrate, wherein a plurality of screen areas are disposed on the surface of the light-emitting substrate, the screen areas including a bonding area and a light-emitting area, and the bonding area is located on one side of the light-emitting area;
[0006] The bonding area includes a lead area and a non-lead area;
[0007] A support structure is provided on the non-lead area, and the height of the support structure is greater than the height of the lead wires provided on the lead area.
[0008] Optionally, there are at least two support structures, and the distance between at least two support structures is greater than a preset distance;
[0009] When the lead wire area is located in the middle of the bonding area, the non-lead wire area is the area on the bonding area other than the lead wire area, and the at least two support structures are respectively arranged on both sides of the lead wire area;
[0010] When the lead wire area is located at the edge of the bonding area, the non-lead wire area is the area on the bonding area other than the lead wire area, and the at least two support structures are arranged on one side of the lead wire area.
[0011] Optionally, the preset cross-section of the support structure is rectangular or trapezoidal; the preset cross-section is perpendicular to the light-emitting substrate.
[0012] Optionally, the material of the support structure is the same as the material of the lead wire.
[0013] Optionally, the light-emitting substrate further includes an encapsulation region surrounding the light-emitting region. A lead wire is disposed on the portion of the encapsulation region located between the light-emitting region and the bonding region. The lead wire is used to connect the light-emitting unit and the lead wire region. The support structure extends from the non-lead wire region to the encapsulation region.
[0014] In a second aspect, the present invention provides a light-emitting device, including a package sheet and a light-emitting substrate as described in any of the first aspects;
[0015] The surface of the encapsulation sheet adjacent to the light-emitting substrate is provided with multiple preset areas, and each preset area corresponds to each screen area;
[0016] The preset area includes a first area corresponding to the binding area and a second area corresponding to the light-emitting area;
[0017] The first region is provided with a first groove corresponding to the lead area, and the height of the first groove along a first preset direction is greater than the height of the lead along the first preset direction; the first preset direction is the direction from the light-emitting substrate to the encapsulation sheet.
[0018] Optionally, the ratio of the length of the first groove along the second preset direction to the length of the lead area along the second preset direction is greater than 1 and less than a preset threshold; the second preset direction is perpendicular to the direction from the first region to the second region.
[0019] Optionally, a first overflow groove and a second overflow groove are provided on the first region; the first overflow groove is located on the side of the first region closer to the second region, and the second overflow groove is located on the side of the first region farther from the second region;
[0020] The first groove is located between the first overflow groove and the second overflow groove, and the first groove is connected to both the first overflow groove and the second overflow groove.
[0021] Optionally, the light-emitting device further includes:
[0022] Multiple light-emitting units are arranged in their respective light-emitting areas.
[0023] Optionally, the light-emitting unit includes an anode, a light-emitting layer, and a cathode;
[0024] The anode is disposed on the surface of the light-emitting substrate;
[0025] The light-emitting layer is disposed on the side of the anode away from the light-emitting substrate;
[0026] The cathode is disposed on the side of the light-emitting layer away from the anode.
[0027] Optionally, a second groove is provided on the second region, the second groove being used to accommodate the corresponding light-emitting unit.
[0028] The light-emitting substrate and light-emitting device provided in this application embodiment have multiple screen areas on their surface. Each screen area includes a bonding area, which in turn includes a lead area and a non-lead area. A support structure is provided on the non-lead area, and the height of the support structure is greater than the height of the leads on the lead area. This way, when the package is cut, the package strip will fall onto the support structure after being cut. The support structure, being higher than the leads, supports the package strip, preventing it from contacting the leads. This avoids the problem of the package strip falling directly onto the leads and causing scratches, thus ensuring the performance of the light-emitting device and improving product yield.
[0029] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description
[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0031] Figure 1 This is a schematic diagram of the structure of a light-emitting substrate;
[0032] Figure 2 This is a schematic diagram of the structure of a light-emitting device;
[0033] Figure 3 This is a schematic diagram of the structure of a light-emitting substrate provided in an embodiment of this application;
[0034] Figure 4 yes Figure 3 A magnified view of part E shown;
[0035] Figure 5 This is a schematic diagram of the structure of a light-emitting substrate provided in another embodiment of this application;
[0036] Figure 6 This is a schematic diagram of the structure of a light-emitting substrate provided in another embodiment of this application;
[0037] Figure 7This is a schematic diagram of the structure of a light-emitting device provided in an embodiment of this application;
[0038] Figure 8 yes Figure 7 A magnified view of part F shown;
[0039] Figure 9 This is a side view of another type of light-emitting device;
[0040] Figure 10 This is a partially enlarged view of a light-emitting device provided in an embodiment of this application;
[0041] Figure 11 It is along Figure 10 Cross-sectional view of the mid-section line GG'. Detailed Implementation
[0042] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0043] In the description of this utility model, it should be noted that the terms "top", "bottom", "upper", "lower", "left", "right", "front", "rear", "inner", and "outer" used to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the indicated position or component must have a specific orientation, specific structure, or specific operation. Therefore, they should not be construed as limitations on this utility model.
[0044] To make the objectives, technical solutions, and advantages of this utility model clearer, the following description will be provided in conjunction with the accompanying drawings and specific embodiments.
[0045] As mentioned above, in the mass production of light-emitting devices, see... Figure 1 Multiple screen regions 100 are arranged in an array on a large light-emitting substrate. Each screen region 100 includes a light-emitting region 102, an encapsulation region 103, and a bonding region 101. See also... Figure 1 In each screen area 100, an encapsulation area 103 surrounds a light-emitting area 102, and a bonding area 101 is located on one side of the light-emitting area 102, with the bonding area 101 and the light-emitting area 102 separated by the encapsulation area 103. A light-emitting unit (not shown) is disposed on the light-emitting area 102, and a lead wire 1014 is disposed on the bonding area 101. Another portion of the lead wire 1031 is disposed on the portion of the encapsulation area 103 located between the light-emitting area 102 and the bonding area 101; this other portion of the lead wire 1031 is used to connect the light-emitting unit and the aforementioned lead wire 1014.
[0046] In related technologies, see Figure 2 To protect the light-emitting unit, a package 20 is used to encapsulate the large light-emitting substrate 10 with encapsulating adhesive 31. When the package 20 is cut along the cutting line 30, the portion of the package 20 corresponding to the bonding area is cut off and falls onto the lead wire 1014, scratching the lead wire 1014, causing poor performance of the light-emitting device and reducing the product yield.
[0047] In order to solve the above problems, this utility model improves the light-emitting substrate.
[0048] Figure 3 This is a schematic diagram of the structure of a light-emitting substrate provided in an embodiment of this application. Figure 4 yes Figure 3 A magnified view of part E shown. (As shown) Figure 3 and Figure 4 As shown, the surface of the light-emitting substrate 10 is provided with a plurality of screen areas 100. Each screen area 100 includes a bonding area 101 and a light-emitting area 102. The bonding area 101 is located on one side of the light-emitting area 102. The bonding area 101 includes a lead area 1011 and a non-lead area 1012. A lead 1014 is provided on the lead area 1011, and a support structure 1013 is provided on the non-lead area 1012. The height of the support structure 1013 is greater than the height of the lead 1014.
[0049] In this embodiment, the light-emitting substrate 10 is transparent and can be a flexible substrate. The material of the flexible substrate can be organic polymers such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), and PI (polyimide) or ultra-thin glass. The light-emitting substrate 10 can also be a rigid substrate, such as a glass substrate.
[0050] Optionally, the screen area 100 may further include an encapsulation area 103, which surrounds the light-emitting area 102. The bonding area 101 is specifically located on the side of the encapsulation area 103 away from the light-emitting area 102. A light-emitting unit is disposed on the light-emitting area 102. Another portion of the lead wire 1031 is also disposed in the portion of the encapsulation area 103 located between the light-emitting area 102 and the bonding area 101. This other portion of the lead wire 1031 is used to connect the light-emitting unit and the lead wire 1014 of the lead wire area 1011. When the encapsulation sheet encapsulates the light-emitting unit, encapsulating adhesive is applied to the encapsulation area, and the encapsulation sheet is bonded to the light-emitting substrate using the encapsulating adhesive, thereby encapsulating the light-emitting substrate 10.
[0051] For example, in this embodiment, the non-lead area 1012 is provided with a support structure 1013, and the height of the support structure 1013 is greater than the height of the lead 1014 provided on the lead area 1011. For example, the non-lead area 1012 may be provided with two or more support structures 1013, each support structure 1013 being respectively provided on both sides of the lead area 1011, or each support structure 1013 being provided on one side of the lead area 1011 and the distance between each support structure 1013 being greater than a preset distance. Thus, when the portion of the package corresponding to the lead area (hereinafter referred to as the package strip) is cut and falls downwards, the support structure 1013 higher than the lead 1014 can support the package strip, so that a gap can be left between the package strip and the lead 1014, and the package strip does not contact the lead 1014, avoiding the problem that the package strip falls directly onto the lead 1014 and scratches the lead, thereby causing poor performance of the light-emitting device and reducing the product yield.
[0052] The light-emitting substrate provided in this application embodiment has multiple screen areas on its surface. The screen areas include bonding areas, which in turn include lead areas and non-lead areas. A support structure is provided on the non-lead areas, and the height of the support structure is greater than the height of the leads provided on the lead areas. In this way, when the package is cut, the package strip will fall onto the support structure after being cut. The support structure, which is higher than the leads, supports the package strip, preventing it from contacting the leads. This avoids the problem of the package strip falling directly onto the leads and causing scratches, thus ensuring the performance of the light-emitting device and improving the product yield.
[0053] In some embodiments, the lead area 1011 is located in the middle of the bonding area 101, the non-lead area 1012 is the area on the bonding area 101 other than the lead area 1011, and there are at least two support structures 1013, which are respectively disposed on both sides of the lead area 1011.
[0054] For example, see Figure 3 To facilitate lead wire fabrication, the lead wire area 1011 is typically positioned in the center of the bonding area 101. To better support the encapsulation strip, at least two support structures 1013 can be provided, each positioned on one side of the lead wire area 1011. For example, the support structures 1013 can be evenly distributed on both sides of the lead wire area 1011. Alternatively, two support structures 1013 can be provided, one on each side of the lead wire area 1011, or three support structures can be provided, with two on one side and the third on the other. In this way, the support structures 1013 effectively prevent the encapsulation strip from contacting the lead wire 1014, thus avoiding scratching the lead wire 1014.
[0055] In some embodiments, see Figure 5 The support structure 1013 can extend from the non-lead area 1012 to the encapsulation area 103, meaning that at least a portion of the support structure 1013 is located in the encapsulation area 103. Thus, when the encapsulation die is cut along the dicing line, the portion of the support structure 1013 located in the encapsulation area 103, combined with the encapsulating adhesive, provides better support for the encapsulation die compared to a structure with only encapsulating adhesive, preventing the encapsulation die from breaking and scratching the leads 1014 when cut along the dicing line.
[0056] In some embodiments, the lead area 1011 is located at the edge of the bonding area 101, the non-lead area 1012 is the area on the bonding area 101 other than the lead area 1011, and there are at least two support structures 1013, with the distance between the at least two support structures 1013 being greater than a preset distance.
[0057] Optional, see Figure 6 When the lead area 1011 is located at the edge of the bonding area 101, at least two support structures 1013 can be provided to better support the encapsulation strip. Each support structure 1013 is located on one side of the lead area 1011, and the distance between each support structure 1013 is greater than a preset distance. The preset distance can be determined based on the shortest distance at which two support structures 1013 can effectively support the encapsulation strip. For example, the preset distance can be 0.1mm, 0.5mm, 1mm, 2mm, 5mm, 10mm, 20mm, 30mm, 50mm, 80mm, or 100mm. Thus, when the lead area 1011 is located at the edge of the bonding area 101 and it is not possible to provide support structures 1013 on both sides of the lead area 1011, at least two support structures 1013 can be provided on one side of the encapsulation strip. By ensuring that the distance between each support structure 1013 is greater than the preset distance, it is guaranteed that the support structures 1013 can effectively support the encapsulation strip, preventing the encapsulation strip from scratching the lead.
[0058] In some embodiments, the preset cross-section of the support structure 1013 is rectangular or trapezoidal, wherein the preset cross-section is perpendicular to the light-emitting substrate. Here, the preset cross-section refers to a cross-section parallel to the boundary line between the light-emitting area 102 and the bonding area 101. When the preset cross-section of the support structure 1013 is rectangular, trapezoidal, or other shapes, the support structure 1013 can more effectively support the encapsulation strip.
[0059] In some embodiments, the material of the support structure 1013 is the same as the material of the lead 1014. Here, the lead 1014 disposed on the lead region 1011 is typically obtained by photolithography. For example, a metal layer, an ITO layer, a silicon oxide layer, and a photoresist layer are coated on the light-emitting substrate 10, and the lead 1014 is obtained after photolithography. Therefore, when photolithographically ...
[0060] To further ensure that the encapsulation strip will not scratch the leads, the encapsulation sheet can also be improved.
[0061] Figure 7 This is a schematic diagram of the structure of a light-emitting device provided in an embodiment of this application. Figure 8 yes Figure 7 A magnified view of part F shown. (As shown) Figure 7 and Figure 8 As shown, the light-emitting device includes a package 20 and a light-emitting substrate 10. The surface of the package 20 adjacent to the light-emitting substrate 10 is provided with a plurality of preset areas 200, and each preset area 200 corresponds to each screen area 100.
[0062] The preset area 200 includes a first area 201 corresponding to the bonding area 101 and a second area 202 corresponding to the light-emitting area 102. A first groove 2011 corresponding to the lead area 1011 is provided on the first area 201. The height of the first groove 2011 along a first preset direction is greater than the height of the lead 1014 along the first preset direction. The first preset direction is the direction from the light-emitting substrate 10 to the encapsulation sheet 20.
[0063] The light-emitting substrate 10 described above can be any of the light-emitting substrates 10 provided in any embodiment of this application. The surface of the light-emitting substrate 10 is provided with a plurality of screen areas 100. Each screen area 100 includes a bonding area 101 and a light-emitting area 102. The bonding area 101 is located on one side of the light-emitting area 102. The bonding area 101 includes a lead area 1011 and a non-lead area 1012. A support structure 1013 is provided on the non-lead area 1012. The height of the support structure 1013 is greater than the height of the lead 1014 provided on the lead area 1011.
[0064] In this embodiment, the encapsulation sheet 20 is used to protect the light-emitting unit. Therefore, the encapsulation sheet 20 is provided with preset areas 200 that correspond one-to-one with each screen area 100. The preset areas 200 include a first area 201 corresponding to the bonding area 101 and a second area 202 corresponding to the light-emitting area 102. When the encapsulation sheet 20 is cut, the first area 201 is cut off and falls off, which may scratch the leads. That is, the first area 201 corresponds to the encapsulation strip mentioned in the previous embodiment.
[0065] To further ensure that the lead wire 1014 is not scratched after the encapsulation strip falls off, a first groove 2011 corresponding to the lead wire area 1011 can be provided in the first region 201, and the height of the first groove 2011 along the first preset direction is greater than the height of the lead wire 1014 along the first preset direction, that is, the height of the first groove 2011 is greater than the height of the lead wire 1014. In this way, when the encapsulation strip is cut off, the position on the encapsulation strip corresponding to the lead wire is a groove, which can accommodate the lead wire 1014 without scratching the lead wire.
[0066] In this embodiment, a support structure is provided in the non-lead area of the light-emitting substrate, and the height of the support structure is greater than the height of the lead. A first groove corresponding to the lead area is provided in the first region of the encapsulation sheet, and the height of the first groove is greater than the height of the lead. In this way, when the encapsulation strip is cut off, the support structure can effectively prevent the encapsulation strip from contacting the lead, and the first groove can also increase the distance between the encapsulation strip and the lead.
[0067] A support structure is provided on the light-emitting substrate, and a first groove is provided on the encapsulation sheet. When the support structure is damaged or unable to function due to process reasons, the first groove can effectively ensure that the encapsulation strip does not come into contact with the leads. Similarly, when the encapsulation sheet is damaged or unable to function, the support structure can effectively support the encapsulation strip, ensuring that the encapsulation strip does not come into contact with the leads. The dual design of the support structure and the first groove effectively ensures that the leads will not be scratched after the encapsulation sheet is cut off, thereby ensuring the performance of the light-emitting device and improving product yield.
[0068] In some embodiments, the ratio of the length of the first groove 2011 along the second preset direction to the length of the lead area 1011 along the second preset direction is greater than 1 and less than a preset threshold, wherein the second preset direction is perpendicular to the direction from the first region 201 to the second region 202.
[0069] When a first groove 2011 is provided on the first region 201 of the package 20, it will affect the strength of the package 20 and may cause the package 20 to break during the pressing process. In this embodiment, the length of the first groove 2011 along the second preset direction is limited to improve the strength of the package 20 and prevent the package 20 from breaking during the pressing process.
[0070] Optionally, the preset threshold can be determined based on the fracture ratio of the length of the first groove 2011 along the second preset direction to the length of the lead area 1011 along the second preset direction when the package 20 breaks during the pressing process. The preset threshold is less than the fracture ratio, where the fracture ratio can be 1.5. Therefore, the preset threshold can be set to a value less than 1.5. Preferably, the preset threshold can be 1.1 or 1.05, etc. Furthermore, since the first groove 2011 needs to be able to accommodate the lead 1014 after the package strip is cut off, the ratio of the length of the first groove 2011 along the second preset direction to the length of the lead area 1011 along the second preset direction should be greater than 1. Therefore, the preset threshold is greater than 1.
[0071] Reference Figure 7 When the encapsulation sheet encapsulates each light-emitting unit, the encapsulating adhesive applied to the encapsulation area of screen area A (e.g., the bonding area of screen area A is adjacent to the encapsulation area of screen area B) may overflow into the bonding area of screen area A itself during the encapsulation sheet pressing process. Similarly, the encapsulating adhesive applied to the encapsulation area of screen area B may overflow into the bonding area of screen area A during the encapsulation sheet pressing process. Therefore, to avoid these situations, a first overflow groove and a second overflow groove can be provided on the first area of the encapsulation sheet. Specifically, for screen area A, the first overflow groove on the first area of the corresponding preset area is used to prevent overflow of adhesive from screen area A itself, while the second overflow groove is used to prevent overflow of adhesive from screen area B.
[0072] Thus, the package 20 is provided with a first adhesive overflow groove 2012 and a second adhesive overflow groove 2013. When the package 20 is cut along the cutting line 30 using relevant techniques, see [reference needed]. Figure 9 When the portion of the bonding area corresponding to the package 20 is cut off, it will fall onto the lead 1014, scratching the lead 1014, causing poor performance of the light-emitting device and reducing the product yield.
[0073] For example, Figure 10 This is a partially enlarged view of a light-emitting device provided in an embodiment of this application. Figure 11 It is along Figure 10 A cross-sectional view of section line GG'. It should be noted that... Figure 10 This is a top view of the light-emitting device, primarily showing the package. See also... Figure 10 and Figure 11 When the encapsulation sheet 20 is provided with a first overflow groove 2012 and a second overflow groove 2013, in order to further ensure that the lead wires are not scratched after the encapsulation strip falls off, a first groove 2011 is provided between the first overflow groove 2012 and the second overflow groove 2013 of the encapsulation sheet 20.
[0074] Furthermore, a first overflow groove 2012 and a second overflow groove 2013 are provided on the first region 201. The first overflow groove 2012 is located on the side of the first region 201 closer to the second region 202, and the second overflow groove 2013 is located on the side of the first region 201 away from the second region 202. A first groove 2011 is located between the first overflow groove 2012 and the second overflow groove 2013, and the first groove 2011 communicates with both the first overflow groove 2012 and the second overflow groove 2013.
[0075] That is, when the first overflow groove 2012 and the second overflow groove 2013 are provided on the first region 201 of the encapsulation sheet 20, the first groove 2011 is located between the first overflow groove 2012 and the second overflow groove 2013, and the first groove 2011 is connected to the first overflow groove 2012 and the second overflow groove 2013 respectively. In this way, when the encapsulation strip is cut off, the first groove 2011, the first overflow groove 2012 and the second overflow groove 2013 on the encapsulation strip can accommodate the lead wire 1014 without scratching the lead wire 1014, thus ensuring the performance of the light-emitting device and improving the product yield.
[0076] As mentioned above, providing a first groove 2011 on the first region 201 of the encapsulation sheet will affect the strength of the encapsulation sheet 20. Similarly, in this embodiment, providing a first groove 2011, a first overflow groove 2012, and a second overflow groove 2013 on the first region 201 of the encapsulation sheet 20 will affect the strength of the encapsulation sheet 20 and may cause the encapsulation sheet 20 to break during the pressing process. In this embodiment, the ratio of the length of the first groove 2011 along the second preset direction to the length of the lead area 1011 along the second preset direction is limited to be greater than 1 and less than a preset threshold, that is, the length of the first groove 2011 along the second preset direction is limited, while the length of the protrusion between the two overflow grooves along the second preset direction remains relatively long, thereby improving the strength of the encapsulation sheet 20 and preventing the encapsulation sheet from breaking during the pressing process.
[0077] It should be noted that, as Figures 9-11 As shown. To better accommodate excess glue, the glue overflow groove can extend from the first region 201 to the second region 202. Specifically, the first glue overflow groove 2012 can extend from the first region 201 of the screen area to the second region 202 of the screen area, and the second glue overflow groove 2013 can extend from the first region 201 of the screen area to the second region 202 of the adjacent screen area. Here, the adjacent screen area is the screen area adjacent to the bonding area of the screen area where the second glue overflow groove 2013 is located.
[0078] For example, as can be seen from the foregoing, the light-emitting device may also include multiple light-emitting units, each of which is disposed in a light-emitting area.
[0079] Optionally, the light-emitting unit includes an anode, a light-emitting layer, and a cathode. The anode is disposed on the surface of the light-emitting substrate, the light-emitting layer is disposed on the side of the anode away from the light-emitting substrate, and the cathode is disposed on the side of the light-emitting layer away from the anode. The anode, light-emitting layer, and cathode can be sequentially deposited by vapor deposition.
[0080] In some embodiments, a second groove 2014 is provided on the second region 202, which is used to accommodate the corresponding light-emitting unit. When the light-emitting substrate 10 and the encapsulation sheet 20 are bonded as a whole, the second groove 2014 of the second region 202 of the encapsulation sheet can accommodate the light-emitting unit, preventing the encapsulation sheet 20 from being pressure-pressed onto the light-emitting unit.
[0081] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A light-emitting substrate, characterized in that, The surface of the light-emitting substrate is provided with multiple screen areas, each screen area including a bonding area and a light-emitting area, the bonding area being located on one side of the light-emitting area; The bonding area includes a lead area and a non-lead area; A support structure is provided on the non-lead area, and the height of the support structure is greater than the height of the lead wires provided on the lead area.
2. The light-emitting substrate according to claim 1, characterized in that, The support structure comprises at least two, and the distance between at least two support structures is greater than a preset distance. When the lead wire area is located in the middle of the bonding area, the non-lead wire area is the area on the bonding area other than the lead wire area, and the at least two support structures are respectively disposed on both sides of the lead wire area; When the lead wire area is located at the edge of the bonding area, the non-lead wire area is the area on the bonding area other than the lead wire area, and the at least two support structures are arranged on one side of the lead wire area.
3. The light-emitting substrate according to claim 1, characterized in that, The preset cross-section of the support structure is rectangular or trapezoidal; the preset cross-section is perpendicular to the light-emitting substrate. The material of the support structure is the same as the material of the lead wire.
4. The light-emitting substrate according to claim 1, characterized in that, The light-emitting substrate further includes an encapsulation region surrounding the light-emitting region. A lead wire is provided on the portion of the encapsulation region located between the light-emitting region and the bonding region. The lead wire is used to connect the light-emitting unit and the lead wire region. The support structure extends from the non-lead area to the encapsulation area.
5. A light-emitting device, characterized in that, Includes a packaging sheet and a light-emitting substrate as described in any one of claims 1 to 4; The surface of the encapsulation sheet adjacent to the light-emitting substrate is provided with multiple preset areas, and each preset area corresponds to each screen area; The preset area includes a first area corresponding to the binding area and a second area corresponding to the light-emitting area; The first region is provided with a first groove corresponding to the lead area, and the height of the first groove along a first preset direction is greater than the height of the lead along the first preset direction; the first preset direction is the direction from the light-emitting substrate to the encapsulation sheet.
6. The light-emitting device according to claim 5, characterized in that, The ratio of the length of the first groove along the second preset direction to the length of the lead wire area along the second preset direction is greater than 1 and less than a preset threshold; the second preset direction is perpendicular to the direction from the first region to the second region.
7. The light-emitting device according to claim 5, characterized in that, The first region is provided with a first overflow groove and a second overflow groove; the first overflow groove is located on the side of the first region closer to the second region, and the second overflow groove is located on the side of the first region farther from the second region. The first groove is located between the first overflow groove and the second overflow groove, and the first groove is connected to both the first overflow groove and the second overflow groove.
8. The light-emitting device according to claim 5, characterized in that, The light-emitting device further includes: Multiple light-emitting units are arranged in their respective light-emitting areas.
9. The light-emitting device according to claim 8, characterized in that, The light-emitting unit includes an anode, a light-emitting layer, and a cathode; The anode is disposed on the surface of the light-emitting substrate; The light-emitting layer is disposed on the side of the anode away from the light-emitting substrate; The cathode is disposed on the side of the light-emitting layer away from the anode.
10. The light-emitting device according to claim 8, characterized in that, A second groove is provided on the second region, which is used to accommodate the corresponding light-emitting unit.