Wafer mounting device

Abstract

The utility model relates to the technical field of chip processing and discloses a wafer mounting device which comprises a base, a plurality of placing plates are fixed on the upper portion of the base, a moving device is arranged in the base, the upper portion of the moving device is connected with a film roll in a rotating mode, two electric push rods are fixed in the base, and the two electric push rods are connected with the film roll in a rotating mode. The wafer mounting device has the advantages that the cutting devices are used for automatically cutting a mounted film, so that the problem that after the conventional wafer mounting device finishes the wafer mounting operation, the cutting devices are used for automatically cutting the mounted film is solved, and the wafer mounting efficiency is greatly improved. The problems that in the prior art, follow-up cutting operation needs to be conducted on the pasted film manually, the workload of manual operation is increased, and the overall production efficiency and the automation level are reduced are solved.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically to a wafer mounting device. Background Technology

[0002] A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. It is the fundamental material for manufacturing various integrated circuits and semiconductor devices. The basic raw material for wafers is high-purity silicon, which is processed into thin sheets through a series of complex processes for subsequent microelectronic processing.

[0003] After completing the wafer mounting operation, existing wafer mounting equipment usually requires manual labor to perform subsequent cutting operations on the film, which not only increases the workload of manual operation, but also reduces the overall production efficiency and automation level. Utility Model Content

[0004] To address the aforementioned problems, this invention provides a wafer mounting device that avoids the need for manual labor to perform subsequent dicing operations on the film after the wafer mounting process in existing wafer mounting devices. This not only increases the workload of manual operations but also reduces overall production efficiency and automation levels.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows: a wafer mounting device, including a base, a plurality of placement plates fixed on the upper part of the base, a moving device inside the base, a film roll rotatably connected to the upper part of the moving device, two electric push rods fixed inside the base, a fixed box fixedly connected to the top of the electric push rods, and a plurality of cutting devices inside the fixed box;

[0006] The cutting device includes a drive motor fixed inside a fixed box. The output end of the drive motor is connected to a second rotating shaft. A turntable is fixedly connected to the lower end of the second rotating shaft. Blades are fixed on both sides of the lower part of the turntable.

[0007] As an improvement, the moving device includes a bidirectional motor fixed inside the base. Both output ends of the bidirectional motor are connected to a rotating shaft. A bevel gear is fixed to the end of the two rotating shafts away from the bidirectional motor. A bevel gear is meshed with a bevel gear. A screw is fixedly connected to the axis of the bevel gear, and a support rod is connected through the screw.

[0008] As an improvement, the screw is rotatably connected inside the base.

[0009] As an improvement, the lower part of the support rod is provided with a threaded hole, and the screw is threadedly connected to the support rod.

[0010] As an improvement, a groove is provided on the upper part of the base.

[0011] As an improvement, pressure plates are bolted to the upper part of the base near both sides of the film roll.

[0012] The advantages of this invention compared to the prior art are as follows: after the wafer is mounted by the moving device, the film roll is automatically cut by the cutting device. This avoids the problem that existing wafer mounting devices usually require manual cutting of the film after the wafer mounting operation is completed, which not only increases the workload of manual operation, but also reduces the overall production efficiency and automation level. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a schematic diagram of the mobile device structure of this utility model.

[0015] Figure 3 This is a schematic diagram of the cutting device structure of this utility model.

[0016] As shown in the figure: 1. Base; 2. Placement plate; 3. Moving device; 301. Bidirectional motor; 302. Rotating shaft one; 303. Bevel gear one; 304. Bevel gear two; 305. Screw; 306. Support rod; 4. Film roll; 5. Pressure plate; 6. Electric push rod; 7. Fixing box; 8. Cutting device; 801. Drive motor; 802. Rotating shaft two; 803. Turntable; 804. Blade. Detailed Implementation

[0017] The present invention will now be described in further detail with reference to the accompanying drawings.

[0018] In specific implementation, this utility model is combined with Figures 1 to 3 A wafer mounting device includes a base 1, with a groove on the upper part of the base 1. Multiple placement plates 2 are fixed on the upper part of the base 1 for placing wafers. A moving device 3 is provided inside the base 1 to drive the film roll 4 to move. The film roll 4 is rotatably connected to the upper part of the moving device 3. Pressure plates 5 are fixedly connected to the upper part of the base 1 near the two sides of the film roll 4 by bolts. By rotating the bolts, the pressure plates 5 fix one end of the film roll 4.

[0019] The mobile device 3 includes a bidirectional motor 301 fixed inside the base 1. Both output ends of the bidirectional motor 301 are connected to a rotating shaft 302. A bevel gear 303 is fixed to one end of the two rotating shafts 302 away from the bidirectional motor 301. A bevel gear 304 is meshed with the bevel gear 303. A screw 305 is fixedly connected to the shaft of the bevel gear 304. The screw 305 is rotatably connected inside the base 1. A support rod 306 is connected through the screw 305. A threaded hole is provided at the lower part of the support rod 306. The screw 305 is threadedly connected to the support rod 306.

[0020] In the implementation of this utility model, one end of the film roll 4 is fixed to one side of the base 1 by the pressure plate 5. By starting the bidirectional motor 301, the rotating shaft 302 rotates, which drives the bevel gear 303 to rotate, causing the meshing bevel gear 304 to rotate, which drives the screw 305 to rotate, so that the support rod 306 threadedly connected to the screw 305 drives the upper film roll 4 to move, and apply film to the wafer.

[0021] The base 1 has two electric push rods 6 fixed inside, which can control the height of the cutting device 8. The top of the electric push rod 6 is fixedly connected to a fixed box 7. The fixed box 7 is equipped with multiple cutting devices 8 to cut the film.

[0022] The cutting device 8 includes a drive motor 801 fixed inside the fixed box 7. The output end of the drive motor 801 is connected to a rotating shaft 802. The lower end of the rotating shaft 802 is fixedly connected to a turntable 803. Blades 804 are fixed on both sides of the lower part of the turntable 803.

[0023] In the implementation of this utility model, the height of the fixing box 7 is adjusted by controlling the electric push rod 6, so that the turntable 803 presses the film roll 4 against the wafer on the upper side of the placement plate 2. By starting the drive motor 801, the rotating shaft 802 drives the turntable 803 to rotate, so that the blade 804 cuts the film roll 4, so that the cut blue film is attached to the wafer.

[0024] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A wafer mounting device, characterized in that: Includes a base (1), with multiple placement plates (2) fixed on the upper part of the base (1), a moving device (3) is provided inside the base (1), a film roll (4) is rotatably connected to the upper part of the moving device (3), two electric push rods (6) are fixed inside the base (1), a fixed box (7) is fixedly connected to the top of the electric push rods (6), and multiple cutting devices (8) are provided inside the fixed box (7); The cutting device (8) includes a drive motor (801) fixed inside the fixed box (7). The output end of the drive motor (801) is connected to a rotating shaft (802). The lower end of the rotating shaft (802) is fixedly connected to a turntable (803). Blades (804) are fixed on both sides of the lower part of the turntable (803).

2. The wafer mounting apparatus according to claim 1, characterized in that: The moving device (3) includes a bidirectional motor (301) fixed inside the base (1). Both output ends of the bidirectional motor (301) are connected to a rotating shaft (302). A bevel gear (303) is fixed to one end of the two rotating shafts (302) away from the bidirectional motor (301). The bevel gear (303) is meshed with a bevel gear (304). A screw (305) is fixedly connected to the center of the shaft of the bevel gear (304). A support rod (306) is connected through the screw (305).

3. A wafer mounting apparatus according to claim 2, characterized in that: The screw (305) is rotatably connected inside the base (1).

4. A wafer mounting apparatus according to claim 2, characterized in that: The lower part of the support rod (306) is provided with a threaded hole, and the screw (305) is threadedly connected to the support rod (306).

5. A wafer mounting apparatus according to claim 1, characterized in that: The upper part of the base (1) is provided with a groove.

6. A wafer mounting apparatus according to claim 1, characterized in that: The upper part of the base (1) is fixedly connected to pressure plates (5) on both sides near the film roll (4) by bolts.

Images