Wafer moving device

Abstract

The utility model discloses a wafer moving device. The wafer moving device comprises a measuring assembly, an operating table and a moving assembly, the measuring assembly comprises an upper probe and a lower probe; the upper probe and the lower probe are oppositely arranged, a measuring hole is formed in the position, corresponding to the lower probe, of the operation table, the lower probe is located in the measuring hole, and the upper probe and the lower probe are used for measuring the thickness of materials; the moving assembly comprises a moving mechanism, a rotating mechanism and a material ejecting head. The output end of the moving mechanism is connected with the material ejecting head, the moving mechanism is used for driving the material ejecting head to move horizontally or vertically, the rotating mechanism is used for driving the material ejecting head to rotate, the material ejecting head is used for fixing materials, and a material moving opening is formed in the position, corresponding to the moving path of the material ejecting head, of the operation table. The moving mechanism is used for driving materials on the material ejecting head to move to the position between the upper probe and the lower probe. According to the utility model, the material thickness measurement accuracy can be ensured, and the wafer measurement efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to mobile device technical field, especially relate to a wafer moving device. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon. After high-purity polysilicon is dissolved and incorporated into silicon crystal seeds, single crystal silicon in the form of cylinder is formed by slow pulling. After silicon crystal rods are ground, polished and sliced, silicon wafer is formed. The thickness and thickness deviation of wafer need to be measured during wafer manufacturing process. The traditional thickness measurement method is manual method, which requires operators to manually place wafer between two probes, and then a trigger signal is started to measure the thickness result. However, the speed of manually moving wafer is unstable, which leads to inaccurate measurement result. SUMMARY

[0003] According to the utility model embodiment, a wafer moving device is provided, which comprises a measuring assembly, an operation table and a moving assembly.

[0004] The measuring assembly comprises an upper probe and a lower probe.

[0005] The upper probe and the lower probe are oppositely arranged, the operation table is provided with a measuring hole corresponding to the lower probe, the lower probe is located in the measuring hole, and the upper probe and the lower probe are used for measuring the thickness of the material.

[0006] The moving assembly comprises a moving mechanism, a rotating mechanism and a material lifting head.

[0007] The output end of the moving mechanism is connected with the material lifting head, the moving mechanism is used for driving the material lifting head to move horizontally or vertically, the rotating mechanism is used for driving the material lifting head to rotate, the material lifting head is used for fixing the material, the operation table is provided with a material moving opening corresponding to the moving path of the material lifting head, and the moving mechanism is used for driving the material on the material lifting head to move between the upper probe and the lower probe.

[0008] Further, the moving mechanism comprises a horizontal mechanism and a vertical mechanism.

[0009] The horizontal mechanism is used for driving the material lifting head to move in the material moving opening, and the vertical mechanism is used for driving the material lifting head to move vertically to lift the material upward.

[0010] Further, the horizontal mechanism comprises a horizontal motor, a horizontal screw rod, a moving plate and a fixed plate.

[0011] The horizontal motor is fixed below the operating table, and the output end of the horizontal motor is connected to a horizontal lead screw. The fixed plate is fixed below the operating table, and the horizontal lead screw is located between the horizontal motor and the fixed plate. The movable plate is located on the horizontal lead screw, and the vertical mechanism is located on the movable plate.

[0012] Furthermore, the horizontal mechanism includes: a guide column and a guide plate;

[0013] The guide plate is fixed below the operating table, the first end of the guide column is fixed on the guide plate, the movable plate has a guide hole corresponding to the guide column, and the second end of the guide column passes through the guide hole.

[0014] Furthermore, the vertical mechanism includes: a drive element, a protective cover, and a drive shaft;

[0015] One end of the protective cover is connected to the moving plate, and the other end is provided with a driving component. The output end of the driving component is connected to a driving shaft, and the driving shaft is connected to the top material head.

[0016] Furthermore, the rotating mechanism includes: a rotating motor, a driving wheel, a transmission belt, and a driven wheel;

[0017] The rotating motor is fixed on the moving plate, the output end of the rotating motor is connected to the driving wheel, the driven wheel is located on the drive shaft, and the transmission belt is used to connect the driving wheel and the driven wheel.

[0018] Furthermore, the top material head consists of a vacuum suction cup and a protective layer. The vacuum suction cup is located on the output end of the moving mechanism, and the protective layer is located on the output end of the vacuum suction cup. The protective layer has through holes corresponding to the air holes of the vacuum suction cup.

[0019] Furthermore, the moving component includes: a first calibration plate, a first detector, a second calibration plate, and a second detector;

[0020] The first calibration plate is located on one side of the moving plate, the first detector is set at the first calibration plate, the second calibration plate is located on the drive shaft, the protective cover has an elongated hole at the second calibration plate, and the second detector is set on the protective cover.

[0021] Furthermore, the measuring component includes: an adjustment mechanism;

[0022] The adjustment mechanism is used to adjust the height of the upper probe.

[0023] According to an embodiment of the present invention, a wafer moving device is provided. The moving mechanism drives the top material head to move vertically, lifts the material on the operating table, and fixes the material. The moving mechanism then moves the material between the upper probe and the lower probe. The thickness of the material can be measured by the upper probe and the lower probe. The rotating mechanism rotates the top material head so that the upper probe and the lower probe measure different positions of the material, ensuring the accuracy of the material thickness measurement and improving the measurement efficiency of the wafer.

[0024] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0025] Figure 1 This is a structural diagram of a wafer moving device according to an embodiment of the present invention;

[0026] Figure 2 This is a structural diagram of another wafer moving device according to an embodiment of the present invention;

[0027] Figure 3 This is a front view of a wafer moving device according to an embodiment of the present invention;

[0028] Figure 4 This is a side view of a wafer moving device according to an embodiment of the present invention;

[0029] Figure 5 This is a top view of a wafer moving device according to an embodiment of the present invention;

[0030] Figure 6 This is a bottom view of a wafer moving device according to an embodiment of the present invention;

[0031] Figure 7 This is a cross-sectional view of a wafer moving device according to an embodiment of the present invention;

[0032] Figure 8 This is a cross-sectional view of another wafer moving device according to an embodiment of the present utility model;

[0033] Figure 9 This is a structural diagram of a vertical mechanism of a wafer moving device according to an embodiment of the present invention;

[0034] Figure 10 This is a front view of a vertical mechanism of a wafer moving device according to an embodiment of the present invention.

[0035] In the figure, the following labels are used: 1 is the measuring component, 11 is the upper probe, 12 is the lower probe, 13 is the adjustment mechanism, 2 is the operating table, 3 is the moving mechanism, 31 is the horizontal motor, 32 is the horizontal lead screw, 33 is the moving plate, 34 is the fixed plate, 35 is the guide column, 36 is the guide plate, 37 is the driving component, 38 is the protective cover, 39 is the drive shaft, 4 is the rotating mechanism, 41 is the rotating motor, 42 is the driving wheel, 43 is the driven wheel, 5 is the top material head, 51 is the vacuum suction cup, 52 is the protective layer, 61 is the first calibration plate, 62 is the first detector, 63 is the second calibration plate, and 64 is the second detector. Detailed Implementation

[0036] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.

[0037] First, combine Figures 1-10 This invention describes a wafer moving device according to an embodiment of the present invention, used for automated thickness measurement of wafers.

[0038] like Figures 1-10 As shown, a wafer moving device according to an embodiment of the present invention includes: a measuring component 1, an operating table 2, and a moving component;

[0039] The measurement component 1 includes: an upper probe 11 and a lower probe 12;

[0040] The upper probe 11 and the lower probe 12 are arranged opposite to each other. The operating table 2 has a measuring hole corresponding to the lower probe 12. The lower probe 12 is located in the measuring hole. The upper probe 11 and the lower probe 12 are used to measure the thickness of the material.

[0041] The moving component includes: a moving mechanism 3, a rotating mechanism 4, and a top material head 5;

[0042] The output end of the moving mechanism 3 is connected to the top material head 5. The moving mechanism 3 is used to drive the top material head 5 to move horizontally or vertically. The rotating mechanism 4 is used to drive the top material head 5 to rotate. The top material head 5 is used to fix the material. A material transfer port is opened on the operating table 2 corresponding to the moving path of the top material head 5. The moving mechanism 3 is used to drive the material on the top material head 5 to move between the upper probe 11 and the lower probe 12.

[0043] The moving mechanism 3 drives the top material head 5 to move vertically, lifting the material on the operating table 2 and fixing it. The moving mechanism 3 then moves the material between the upper probe 11 and the lower probe 12. The thickness of the material can be measured by the upper probe 11 and the lower probe 12. The rotating mechanism 4 rotates the top material head 5, so that the upper probe 11 and the lower probe 12 measure different positions of the material, ensuring the accuracy of the material thickness measurement and improving the measurement efficiency of the wafer.

[0044] like Figures 3-8 As shown, the moving mechanism 3 includes: a horizontal mechanism and a vertical mechanism;

[0045] The horizontal mechanism is used to drive the top material head 5 to move in the transfer port, and the vertical mechanism is used to drive the top material head 5 to move vertically and lift the material upward.

[0046] The horizontal mechanism includes: a horizontal motor 31, a horizontal lead screw 32, a moving plate 33, and a fixed plate 34;

[0047] The horizontal motor 31 is fixed below the operating table 2. The output end of the horizontal motor 31 is connected to the horizontal lead screw 32. The fixed plate 34 is fixed below the operating table 2. The horizontal lead screw 32 is located between the horizontal motor 31 and the fixed plate 34. The moving plate 33 is disposed on the horizontal lead screw 32. The vertical mechanism is disposed on the moving plate 33.

[0048] The horizontal mechanism includes: a guide column 35 and a guide plate 36;

[0049] The guide plate 36 is fixed below the operating table 2, the first end of the guide post 35 is fixed on the guide plate 36, the movable plate 33 has a guide hole corresponding to the guide post 35, and the second end of the guide post 35 passes through the guide hole.

[0050] The horizontal motor 31 drives the horizontal lead screw 32 to rotate, causing the moving plate 33 to move on the horizontal lead screw 32. The guide column 35 keeps the moving plate 33 moving in a straight line. By controlling the speed of the horizontal motor 31, the movement speed of the material can be controlled, ensuring the accuracy of the measurement results of the material thickness.

[0051] like Figures 3-8 As shown, the vertical mechanism includes: a drive component 37, a protective cover 38, and a drive shaft 39;

[0052] One end of the protective cover 38 is connected to the moving plate 33, and the other end is provided with a driving component 37. The output end of the driving component 37 is connected to the driving shaft 39, and the driving shaft 39 is connected to the top material head 5.

[0053] The rotating mechanism 4 includes: a rotating motor 41, a driving wheel 42, a transmission belt, and a driven wheel 43;

[0054] The rotating motor 41 is fixed on the moving plate 33. The output end of the rotating motor 41 is connected to the driving wheel 42. The driven wheel 43 is located on the drive shaft 39. The transmission belt is used to connect the driving wheel 42 and the driven wheel 43.

[0055] The drive unit 37 drives the drive shaft 39 to move the top material head 5 vertically upward, causing the top material head 5 to lift the material on the operating table 2 upward. The rotating motor 41 drives the drive wheel 42 to rotate, which in turn drives the driven wheel 43 to rotate through the transmission belt, thereby causing the drive shaft 39 to drive the top material head 5 to rotate, changing the measurement position of the material thickness.

[0056] like Figures 3-8 As shown, the top material head 5 consists of a vacuum suction cup 51 and a protective layer 52. The vacuum suction cup 51 is disposed on the output end of the moving mechanism 3, and the protective layer 52 is disposed on the output end of the vacuum suction cup 51. The protective layer 52 has through holes corresponding to the air holes of the vacuum suction cup 51.

[0057] The vacuum suction cup 51 uses suction to fix the material, and the protective layer 52 can prevent damage to the material during the fixing process.

[0058] like Figures 3-10 As shown, the moving component includes: a first calibration plate 61, a first detector 62, a second calibration plate 63, and a second detector 64;

[0059] The first calibration plate 61 is located on one side of the moving plate 33. The first detector 62 is set at the first calibration plate 61. The second calibration plate 63 is located on the drive shaft 39. The protective cover 38 has an elongated hole at the second calibration plate 63. The second detector 64 is set on the protective cover 38.

[0060] After prolonged use, the horizontal motor 31 and the drive unit 37 may develop certain errors. By detecting the position of the first correction plate 61 through the first detector 62, the horizontal motor 31 can be corrected to ensure that the top material head 5 is in a preset horizontal position. By detecting the position of the second correction plate 63 through the second detector 64, the drive unit 37 can be corrected to ensure that the top material head 5 is in a preset height.

[0061] like Figures 1-3 As shown, the measuring component 1 includes: an adjustment mechanism 13;

[0062] The adjustment mechanism 13 is used to adjust the height of the upper probe 11.

[0063] The adjustment mechanism 13 in this application is a common device in the prior art, which can adjust the height of the upper probe 11.

[0064] Above, refer to Figures 1-10This invention describes a wafer moving device according to an embodiment of the present invention. The moving mechanism 3 drives the top material head 5 to move vertically, lifting and fixing the material on the operating table 2. The moving mechanism 3 then moves the material between the upper probe 11 and the lower probe 12. The thickness of the material can be measured by the upper probe 11 and the lower probe 12. The rotating mechanism 4 rotates the top material head 5, so that the upper probe 11 and the lower probe 12 measure different positions of the material, ensuring the accuracy of the material thickness measurement and improving the measurement efficiency of the wafer.

[0065] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0066] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A wafer moving device, characterized in that, include: Measuring components, control panel, and moving components; The measurement components include: an upper probe and a lower probe; The upper probe and the lower probe are arranged opposite to each other. The operating table has a measuring hole corresponding to the lower probe. The lower probe is located in the measuring hole. The upper probe and the lower probe are used to measure the thickness of the material. The moving component includes: a moving mechanism, a rotating mechanism, and a top feed head; The output end of the moving mechanism is connected to the top material head. The moving mechanism is used to drive the top material head to move horizontally or vertically. The rotating mechanism is used to drive the top material head to rotate. The top material head is used to fix the material. A material transfer port is opened on the operating table corresponding to the moving path of the top material head. The moving mechanism is used to drive the material on the top material head to move between the upper probe and the lower probe.

2. The wafer moving device as described in claim 1, characterized in that, The moving mechanism includes: a horizontal mechanism and a vertical mechanism; The horizontal mechanism is used to drive the top material head to move in the transfer port, and the vertical mechanism is used to drive the top material head to move vertically, lifting the material upward.

3. The wafer moving device as described in claim 2, characterized in that, The horizontal mechanism includes: a horizontal motor, a horizontal lead screw, a moving plate, and a fixed plate; The horizontal motor is fixed below the operating table, and the output end of the horizontal motor is connected to a horizontal lead screw. The fixed plate is fixed below the operating table, and the horizontal lead screw is located between the horizontal motor and the fixed plate. The movable plate is located on the horizontal lead screw, and the vertical mechanism is located on the movable plate.

4. The wafer moving device as described in claim 3, characterized in that, The horizontal mechanism includes: a guide column and a guide plate; The guide plate is fixed below the operating table, the first end of the guide column is fixed on the guide plate, the movable plate has a guide hole corresponding to the guide column, and the second end of the guide column passes through the guide hole.

5. The wafer moving device as described in claim 3, characterized in that, The vertical mechanism includes: a drive component, a protective cover, and a drive shaft; One end of the protective cover is connected to the moving plate, and the other end is provided with a driving component. The output end of the driving component is connected to a driving shaft, and the driving shaft is connected to the top material head.

6. The wafer moving device as described in claim 5, characterized in that, The rotating mechanism includes: a rotating motor, a driving wheel, a transmission belt, and a driven wheel; The rotating motor is fixed on the moving plate, the output end of the rotating motor is connected to the driving wheel, the driven wheel is located on the drive shaft, and the transmission belt is used to connect the driving wheel and the driven wheel.

7. The wafer moving device as described in claim 1, characterized in that, The top material head consists of a vacuum suction cup and a protective layer. The vacuum suction cup is located on the output end of the moving mechanism, and the protective layer is located on the output end of the vacuum suction cup. The protective layer has through holes corresponding to the air holes of the vacuum suction cup.

8. The wafer moving device as described in claim 5, characterized in that, The moving component includes: a first calibration plate, a first detector, a second calibration plate, and a second detector; The first calibration plate is located on one side of the moving plate, the first detector is set at the first calibration plate, the second calibration plate is located on the drive shaft, the protective cover has an elongated hole at the second calibration plate, and the second detector is set on the protective cover.

9. The wafer moving device as described in claim 1, characterized in that, The measuring component includes: an adjustment mechanism; The adjustment mechanism is used to adjust the height of the upper probe.

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