Wafer feeding detection device

Abstract

The utility model discloses a wafer feeding detection device. The wafer feeding detection device comprises a positioning assembly, a material box, a feeding assembly and a detection assembly, the positioning assembly comprises a lifting mechanism and a positioning table; the positioning table is arranged at the output end of the lifting mechanism, the lifting mechanism is used for driving the positioning table to move vertically, the positioning table is used for positioning the material box, and the material box is used for containing materials; the feeding assembly comprises a rotating mechanism, a feeding base, a moving mechanism and a feeding insertion plate. The feeding base is arranged at the output end of the rotating mechanism, the moving mechanism is arranged on the feeding base, the feeding insertion plate is arranged at the output end of the moving mechanism and used for grabbing materials in the material box, and a protective layer is arranged on the feeding insertion plate; the detection assembly is used for detecting the thickness of the wafer. According to the utility model, the automatic feeding of the wafer can be realized, the protection layer on the feeding insertion plate can effectively prevent the wafer from being damaged, and the feeding efficiency of the wafer is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to feeding equipment technical field, especially relate to a wafer feeding detection device. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon. High-purity polysilicon is dissolved and added into silicon crystal seeds, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding and polishing, the silicon crystal rod is cut into slices to form a silicon wafer. Because the wafer surface is easy to be damaged, the conventional feeding device cannot feed the wafer, and the current artificial feeding method also has the risk of damaging the wafer, resulting in low efficiency of artificial feeding and affecting the production efficiency of the wafer. SUMMARY

[0003] According to the utility model embodiment, a wafer feeding detection device is provided, which comprises a positioning assembly, a material box, a feeding assembly and a detection assembly.

[0004] The positioning assembly comprises a lifting mechanism and a positioning table.

[0005] The positioning table is arranged at the output end of the lifting mechanism, the lifting mechanism is used for driving the positioning table to move vertically, the positioning table is used for positioning the material box, and the material box is used for placing materials.

[0006] The feeding assembly comprises a rotating mechanism, a feeding base, a moving mechanism and a feeding plugboard.

[0007] The feeding base is arranged at the output end of the rotating mechanism, the moving mechanism is arranged on the feeding base, and the feeding plugboard is arranged at the output end of the moving mechanism.

[0008] The detection assembly is used for detecting the thickness of the wafer.

[0009] Further, the moving mechanism comprises a moving motor, a transmission belt and a moving plate.

[0010] The moving motor is arranged on the feeding base, the moving motor is used for driving the transmission belt to rotate, the transmission belt is connected with the moving plate, and the feeding plugboard is arranged on the moving plate.

[0011] Further, the feeding assembly comprises a vacuum suction cup, a detection frame, a detection head and a receiving head.

[0012] The vacuum suction cup is installed on the feeding plugboard and used for grabbing materials, the receiving hole is arranged on the feeding plugboard, the receiving head is arranged on the receiving hole, the detection frame is arranged on the moving plate, and the detection head is arranged on the detection frame and the output end faces the receiving head.

[0013] Further, the lifting mechanism comprises a lifting motor, a lifting slide rail, a lifting screw rod and a protection plate.

[0014] The lifting motor is fixed at one end of the lifting slide rail, the output end of the lifting motor is connected with the lifting screw rod, the positioning table is slidably arranged on the lifting slide rail and connected with the lifting screw rod, and the protection plate is arranged on one side of the lifting slide rail and used for protecting the lifting screw rod.

[0015] Further, the positioning table is provided with a first clamping plate and a second clamping plate.

[0016] The first clamping plate is arranged at the opening of the material box, the second clamping plate is arranged at the rear end of the material box, and the first clamping plate and the second clamping plate are both provided with clamping teeth in a stepped shape, and the clamping teeth are used for positioning the material box.

[0017] Further, the material box is provided with a clamping plate, and the clamping plates are uniformly arranged on the inner walls on both sides of the material box, and every two adjacent clamping plates are used for fixing the material.

[0018] Further, the detection assembly comprises a detection mechanism, a detection table, a cross module and a suction head.

[0019] The cross module is arranged below the detection table, the output end of the cross module is connected with the suction head, the detection table is provided with a lifting opening corresponding to the suction head, the detection table is provided with a feeding groove corresponding to the feeding plug plate, the detection mechanism is arranged above the detection table, and the detection mechanism is used for detecting the thickness of the material.

[0020] Further, the feeding assembly comprises a correction plate and a detector.

[0021] The correction plate is fixed on the feeding plug plate, the detector is arranged on the feeding base, and the detector is used for detecting the position of the correction plate.

[0022] According to the wafer feeding and detecting device, the wafer to be detected is placed in the material box, the rotating mechanism drives the feeding base to rotate, the feeding plug plate faces the material box, the moving mechanism drives the feeding plug plate to move, the feeding plug plate moves to the lower side of the wafer, the lifting mechanism drives the positioning table to move downward, the wafer is placed on the feeding plug plate, the wafer is gripped, the rotating mechanism and the moving mechanism are used for moving the feeding plug plate to the detection assembly, and the detection assembly detects the thickness of the wafer. The wafer is automatically fed, the protective layer on the feeding plug plate can effectively prevent the wafer from being damaged, and the wafer feeding efficiency is improved.

[0023] It is to be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further explanation of the subject technology claimed. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 FIG. 1 is a structural diagram of a wafer feeding detection device according to an embodiment of the present application;

[0025] Figure 2 FIG. 2 is a top view of a wafer feeding detection device according to an embodiment of the present application;

[0026] Figure 3 FIG. 3 is a structural diagram of a positioning assembly of a wafer feeding detection device according to an embodiment of the present application;

[0027] Figure 4 FIG. 4 is a front view of a positioning assembly of a wafer feeding detection device according to an embodiment of the present application;

[0028] Figure 5 FIG. 5 is a structural diagram of a positioning table of a wafer feeding detection device according to an embodiment of the present application;

[0029] Figure 6 FIG. 6 is a top view of a positioning table of a wafer feeding detection device according to an embodiment of the present application;

[0030] Figure 7 FIG. 7 is a structural diagram of a feeding assembly of a wafer feeding detection device according to an embodiment of the present application;

[0031] Figure 8 FIG. 8 is a structural diagram of a feeding assembly of a wafer feeding detection device according to an embodiment of the present application;

[0032] Figure 9 FIG. 9 is a side view of a feeding assembly of a wafer feeding detection device according to an embodiment of the present application;

[0033] Figure 10 FIG. 10 is a structural diagram of a detection assembly of a wafer feeding detection device according to an embodiment of the present application.

[0034] In the figure, 1 is a positioning assembly, 11 is a lifting motor, 12 is a lifting slide rail, 13 is a protective plate, 14 is a positioning table, 141 is a first clamping plate, 142 is a second clamping plate, 2 is a material box, 21 is a clamping plate, 3 is a feeding assembly, 31 is a rotating mechanism, 32 is a feeding base, 33 is a feeding plugboard, 34 is a moving motor, 35 is a transmission belt, 36 is a moving plate, 37 is a detection frame, 38 is a detection head, 4 is a detection assembly, 41 is a detection mechanism, 42 is a detection table, 421 is a feeding groove, 43 is a cross module, 44 is a suction head, 51 is a correction plate, and 52 is a detector. DETAILED DESCRIPTION

[0035] The preferred embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0036] Firstly, the preferred embodiments of the present application will be described in detailFigures 1-10 The utility model discloses a wafer loading detection device, be used for to the wafer and detect.

[0037] As Figures 1-10 The utility model discloses a wafer loading detection device, comprising: positioning assembly 1, material box 2, loading assembly 3 and detection assembly 4,

[0038] Positioning assembly 1 includes: lifting mechanism and positioning table 14,

[0039] Positioning table 14 is located at the output end of lifting mechanism, and lifting mechanism is used to drive positioning table 14 to move vertically, and positioning table 14 is used to position material box 2, and material box 2 is used to place material,

[0040] Loading assembly 3 includes: rotating mechanism 31, loading base 32, moving mechanism and loading plugboard 33,

[0041] Loading base 32 is located at the output end of rotating mechanism 31, moving mechanism is located on loading base 32, and loading plugboard 33 is located at the output end of moving mechanism, and loading plugboard 33 is used to grab the material in material box 2, and loading plugboard 33 is provided with a protective layer,

[0042] Detection assembly 4 is used to detect the thickness of wafer.

[0043] The wafer to be detected of the application is placed in material box 2, rotating mechanism 31 drives loading base 32 to rotate, makes loading plugboard 33 towards material box 2, moves loading plugboard 33 through moving mechanism, makes loading plugboard 33 move to the lower side of wafer, lifting mechanism drives positioning table 14 to move downwards, places wafer on loading plugboard 33, realizes the grabbing of wafer, then moves loading plugboard 33 to detection assembly 4 through rotating mechanism 31 and moving mechanism, makes detection assembly 4 detect the thickness of wafer. Realize the automatic loading of wafer, and the protective layer on loading plugboard 33 can effectively avoid damaging wafer, improve the loading efficiency of wafer.

[0044] As Figures 7-9 The moving mechanism includes: moving motor 34, transmission belt 35 and moving plate 36,

[0045] Moving motor 34 is located on loading base 32, and moving motor 34 is used to drive transmission belt 35 to rotate, and transmission belt 35 is connected with moving plate 36, and loading plugboard 33 is located on moving plate 36.

[0046] Loading assembly 3 includes: vacuum chuck, detection frame 37, detection head 38 and receiving head,

[0047] The vacuum chuck is installed on the feeding plug-in board 33 for grabbing the material. The feeding plug-in board 33 is provided with a receiving hole. A receiving head is arranged on the receiving hole. A detection frame 37 is arranged on the moving plate 36. A detection head 38 is arranged on the detection frame 37 and the output end faces the receiving head.

[0048] The moving motor 34 drives the transmission belt 35 to rotate. The moving plate 36 is driven by the transmission belt 35 to move, so that the feeding plug-in board 33 moves linearly. In the process of moving the feeding plug-in board 33 to the material box 2, the detection signal emitted by the detection head 38 is blocked by the wafer. The receiving head cannot receive the signal emitted by the detection head 38, so as to determine that the feeding plug-in board 33 moves to the lower side of the wafer. The wafer is adsorbed by the vacuum chuck to avoid falling in the process of moving the wafer.

[0049] As shown in Figures 3-4 , the lifting mechanism comprises a lifting motor 11, a lifting slide rail 12, a lifting screw rod and a protection plate 13.

[0050] The lifting motor 11 is fixed at one end of the lifting slide rail 12. The output end of the lifting motor 11 is connected with the lifting screw rod. The positioning table 14 is slidably arranged on the lifting slide rail 12 and connected with the lifting screw rod. The protection plate 13 is arranged on one side of the lifting slide rail 12 for protecting the lifting screw rod.

[0051] The lifting motor 11 drives the lifting screw rod to rotate, so that the positioning table 14 moves on the lifting slide rail 12. The wafer in the material box 2 is placed on the feeding plug-in board 33. The protection plate 13 can protect the lifting screw rod from the entry of sundries.

[0052] As shown in Figures 3-6 , the positioning table 14 is provided with a first clamping plate 141 and a second clamping plate 142.

[0053] The first clamping plate 141 is arranged at the opening of the material box 2. The second clamping plate 142 is arranged at the rear end of the material box 2. The first clamping plate 141 and the second clamping plate 142 are both provided with clamping teeth in a stepped shape. The clamping teeth are used for positioning the material box 2.

[0054] The material box 2 is provided with a clamping plate 21. The clamping plates 21 are uniformly arranged on the inner walls on both sides of the material box 2. Every two adjacent clamping plates are used for fixing the material.

[0055] The first clamping plate 141 and the second clamping plate 142 are used for positioning the material box 2. The stepped clamping teeth can be suitable for material boxes 2 of different sizes, so that the positioning table 14 can position material boxes 2 of different sizes.

[0056] As shown in Figure 10 , the detection assembly 4 comprises a detection mechanism 41, a detection table 42, a cross module 43 and a material suction head 44.

[0057] The cross module 43 is arranged below the detection table 42, and an output end of the cross module 43 is connected with the suction head 44; the detection table 42 is provided with a lifting port corresponding to the suction head 44; the detection table 42 is provided with an upper feeding groove 421 corresponding to the upper feeding plug plate 33; and the detection mechanism 41 is arranged above the detection table 42 and is used for detecting the thickness of the material.

[0058] After the wafer is taken off by the moving mechanism driving the upper feeding plug plate 33, the upper feeding plug plate 33 is inserted into the upper feeding groove 421; the cross module 43 drives the suction head 44 to move upward, so as to lift the wafer on the upper feeding plug plate 33 upward and fix the wafer by suction; and the detection mechanism 41 detects the thickness of the wafer.

[0059] In the embodiment, the detection mechanism 41 is a wafer thickness detection device in the prior art, and the cross module 43 can only realize the vertical and horizontal movement of the suction head 44.

[0060] As shown in Figures 7-9 , the upper feeding assembly 3 comprises a correction plate 51 and a detector 52.

[0061] The correction plate 51 is fixed on the upper feeding plug plate 33, and the detector 52 is arranged on the upper feeding base 32 and is used for detecting the position of the correction plate 51.

[0062] After a long time of use, the moving motor 34 will have a certain error; the position of the correction plate 51 is detected by the detector 52, so that the moving motor 34 moves the correction plate 51 to a preset original position, thereby correcting the moving motor 34.

[0063] The wafer feeding detection device according to the embodiment of the utility model is described above. Figures 1-10 The wafer to be detected is placed in the material box 2; the rotating mechanism 31 drives the upper feeding base 32 to rotate, so that the upper feeding plug plate 33 faces the material box 2; the moving mechanism drives the upper feeding plug plate 33 to move, so that the upper feeding plug plate 33 moves to the lower side of the wafer; the lifting mechanism drives the positioning table 14 to move downward, so as to place the wafer on the upper feeding plug plate 33, thereby realizing the grabbing of the wafer; then the rotating mechanism 31 and the moving mechanism move the upper feeding plug plate 33 to the detection assembly 4, so that the detection assembly 4 detects the thickness of the wafer. The wafer is automatically fed; the protective layer on the upper feeding plug plate 33 can effectively avoid damaging the wafer, thereby improving the wafer feeding efficiency.

[0064] It should be noted that in the present specification, the terms "comprising", "containing" or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, the elements defined by the phrase "comprising" do not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the elements.

[0065] Although the content of the present application has been described in detail by the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present application. After reading the above content, various modifications and alternatives of the present application will be apparent to those skilled in the art. Therefore, the protection scope of the present application should be defined by the appended claims.

Claims

1. A wafer loading and inspection device, characterized in that, include: Positioning components, material bins, feeding components, and detection components; The positioning component includes: a lifting mechanism and a positioning platform; The positioning platform is located at the output end of the lifting mechanism. The lifting mechanism is used to drive the positioning platform to move vertically. The positioning platform is used to position the material box. The material box is used to place materials. The feeding assembly includes: a rotating mechanism, a feeding base, a moving mechanism, and a feeding insert plate; The feeding base is located at the output end of the rotating mechanism, the moving mechanism is located on the feeding base, the feeding plate is located at the output end of the moving mechanism, the feeding plate is used to grab the material in the material box, and the feeding plate is provided with a protective layer. The detection component is used to detect the thickness of the wafer.

2. The wafer loading and inspection device as described in claim 1, characterized in that, The moving mechanism includes: a moving motor, a transmission belt, and a moving plate; The mobile motor is mounted on the loading base and is used to drive the transmission belt to rotate. The transmission belt is connected to the mobile plate, and the loading plate is mounted on the mobile plate.

3. The wafer loading and inspection device as described in claim 2, characterized in that, The feeding assembly includes: a vacuum suction cup, a detection frame, a detection head, and a receiving head; The vacuum suction cup is installed on the feeding plate for gripping materials. The feeding plate has a receiving hole, and the receiving head is located on the receiving hole. The detection frame is installed on the moving plate, and the detection head is located on the detection frame with its output end facing the receiving head.

4. The wafer loading and inspection device as described in claim 1, characterized in that, The lifting mechanism includes: a lifting motor, a lifting slide rail, a lifting screw, and a protective plate; The lifting motor is fixed at one end of the lifting slide rail, and the output end of the lifting motor is connected to the lifting screw. The positioning platform is slidably mounted on the lifting slide rail and connected to the lifting screw. The protective plate is located on one side of the lifting slide rail to protect the lifting screw.

5. The wafer loading and inspection device as described in claim 1, characterized in that, The positioning platform is equipped with a first card plate and a second card plate; The first card plate is positioned at the opening of the material box, and the second card plate is positioned at the rear end of the material box. Both the first and second card plates are provided with locking teeth, which are stepped and used to position the material box.

6. The wafer loading and inspection device as described in claim 1, characterized in that, The material box is equipped with a material clamping plate, which is evenly arranged on the inner walls of both sides of the material box. Every two adjacent clamps are used to fix the material.

7. The wafer loading and inspection device as described in claim 1, characterized in that, The detection components include: a detection mechanism, a detection table, a cross module, and a suction head; The cross module is located below the detection platform. The output end of the cross module is connected to the suction head. The detection platform has a lifting port corresponding to the suction head and a feeding slot corresponding to the feeding plate. The detection mechanism is located above the detection platform and is used to detect the thickness of the material.

8. The wafer loading and inspection device as described in claim 1, characterized in that, The feeding assembly includes: a calibration plate and a detector; The calibration plate is fixed on the feeding plate, and the detector is located on the feeding base. The detector is used to detect the position of the calibration plate.

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