Vacuum adsorption disc for wafer

Abstract

The vacuum adsorption disc comprises a horizontally-arranged supporting plate, a connecting part is arranged in the middle of the upper end of the supporting plate, four adsorption mechanisms are distributed on the supporting plate around the connecting part in a rectangular array mode, each adsorption mechanism comprises a sliding hole vertically penetrating through the supporting plate, and a sliding column is arranged in each sliding hole in a matched and sliding mode. A vacuum pipeline is arranged in the sliding column in an up-down penetrating mode, an upper limiting block located below the sliding hole and a lower limiting block located below the sliding hole are fixedly arranged on the outer wall of the sliding column, the sliding column is sleeved with a spring, the upper end and the lower end of the spring are connected with the supporting plate and the lower limiting block respectively, and a first connecting opening communicated with the vacuum pipeline is formed in the upper end of the sliding column; the lower end of the sliding column is provided with an adsorption head, the lower end of the adsorption head is provided with an adsorption port communicated with the vacuum pipeline, and when the adsorption head is in contact with the wafer, the sliding column can slide in the sliding hole so as to contract and is buffered through the spring, so that the collision strength with the wafer can be reduced, and the breakage probability of the wafer is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer adsorption technical field, concretely relates to a vacuum adsorption disc for wafer. BACKGROUND

[0002] Wafer is usually needed to use vacuum adsorption disc when transferring and carrying, but wafer has the characteristic of being fragile, and the rigidity of general vacuum adsorption disc is strong when contacting with object, so when wafer is adsorbed by adsorption disc, if the force of collision is big, wafer is easily broken. UTILITY MODEL CONTENTS

[0003] In order to solve the above-mentioned deficiencies in prior art, the utility model provides a vacuum adsorption disc for wafer.

[0004] In order to realize the above-mentioned technical effect, the utility model adopts the following scheme:

[0005] A vacuum adsorption disc for wafer, including the support plate of horizontal arrangement, the upper end middle part of support plate is equipped with the connecting portion, four adsorption mechanisms are distributed around the connecting portion on the support plate and are in rectangular array, the adsorption mechanism includes the sliding hole of vertical through -going support plate arrangement, the sliding hole is equipped with the sliding column in the matching sliding, the sliding column is equipped with the vacuum pipeline in the upper and lower through -going, the outer wall on the sliding column is fixedly equipped with the upper limit block below the sliding hole and the lower limit block below the sliding hole, the spring is sheathed on the sliding column, and the upper and lower ends of the spring are connected with the support plate and the lower limit block respectively, the upper end of the sliding column is equipped with the first connecting port that communicates with the vacuum pipeline, the lower end of the sliding column is equipped with the adsorption head, and the lower end of the adsorption head is equipped with the adsorption port that communicates with the vacuum pipeline.

[0006] The preferred technical scheme, the adsorption mechanism still includes the connecting head in the upper end of support plate, the second connecting port and the third connecting port are equipped on the connecting head, the second connecting port and the third connecting port are communicated in the interior of connecting head, and the second connecting port is connected with the first connecting port through the hose.

[0007] The preferred technical scheme, the adsorption port is set down and is in the shape of flared.

[0008] The preferred technical scheme, the adsorption head adopts rubber head.

[0009] The preferred technical scheme, the upper end of the adsorption head is fixedly equipped with the metal connecting pipe, the outer wall on the metal connecting pipe is equipped with the external thread, the inner wall on the lower end of the sliding column is equipped with the internal thread matched with the external thread, and the metal connecting pipe is screwed in the sliding column.

[0010] Compared with the prior art, the beneficial effects are:

[0011] The utility model discloses simple structure, convenient to use, the both ends of sliding column are connected vacuum generator and are inhaled wafer through adsorption head respectively, when adsorption head and wafer contact, sliding column can slide in slide hole and contract thereby, buffer through spring, thereby can reduce the collision intensity with wafer, reduce the breakage probability of wafer. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is the cross section schematic drawing of the utility model.

[0013] Figure 2 It is the adsorption head cross section schematic drawing in the utility model.

[0014] Fig. 1 support plate 2, connecting portion 3, slide hole 4, sliding column 5, upper limit block 6, lower limit block 7, spring 8, first connecting port 9, vacuum duct 10, adsorption head 11, adsorption port 12, connecting head 13, second connecting port 14, third connecting port 15, hose 16, metal connecting pipe. DETAILED DESCRIPTION

[0015] The technical scheme in the embodiments of the utility model will be apparently and completely described below in combination with the drawings in the embodiments of the utility model, and apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0016] A kind of vacuum adsorption disc for wafer, including horizontally arranged support plate 1, the upper end middle part of the support plate 1 is equipped with connecting portion 2, four adsorption mechanisms are distributed with rectangular array around connecting portion 2 on the support plate 1, the adsorption mechanism includes the slide hole 3 of vertical through the support plate 1 setting, sliding column 4 is matched and slid in the slide hole 3, vacuum duct 9 is equipped in the upper and lower through-passage of sliding column 4, upper limit block 5 located below slide hole 3 and lower limit block 6 located below slide hole 3 are fixed on the outer wall of sliding column 4, spring 7 is sleeved on the sliding column 4, the upper and lower ends of spring 7 are connected with support plate 1 and lower limit block 6 respectively, the upper end of sliding column 4 is equipped with the first connecting port 8 that communicates with vacuum duct 9, the lower end of sliding column 4 is equipped with adsorption head 10, and the lower end of adsorption head 10 is equipped with adsorption port 11 that communicates with vacuum duct 9.

[0017] Support plate 1 is installed on mechanical arm through connecting portion 2 and moves, the both ends of sliding column 4 are connected vacuum generator and are inhaled wafer through adsorption head 10 respectively, when adsorption head 10 and wafer contact, sliding column 4 can slide in slide hole 3 and contract thereby, buffer through spring 7, thereby can reduce the collision intensity with wafer, reduce the breakage probability of wafer.

[0018] Preferably, the adsorption mechanism further comprises a connecting head 12 arranged on the upper end of the support plate 1, the connecting head 12 is provided with a second connecting port 13 and a third connecting port 14, the second connecting port 13 and the third connecting port 14 are in communication in the connecting head 12, the second connecting port 13 is connected with the first connecting port 8 through a hose 15, and the third connecting port 14 is used for connecting an external vacuum generator. Since the adsorption disc moves, if the first connecting port 8 is directly connected with the vacuum generator through a pipeline, the sliding column 4 is easily pulled by the pipeline, thereby affecting the sliding of the sliding column 4. Through the scheme, the first connecting port 8 is indirectly connected with the vacuum generator through the connecting head 12, and the connecting head 12 is fixed, so that the sliding column 4 is not pulled through the hose 15.

[0019] Preferably, the adsorption port 11 is arranged in an expanding manner downward.

[0020] Preferably, the adsorption head 10 is a rubber head. The rubber head is soft in texture and does not hard contact with the wafer, thereby further avoiding the breakage of the wafer.

[0021] Preferably, a metal connecting pipe 16 is fixedly arranged on the upper end of the adsorption head 10, an outer thread is arranged on the outer wall of the metal connecting pipe 16, an inner thread matched with the outer thread is arranged on the inner wall of the lower end of the sliding column 4, and the metal connecting pipe 16 is screwed in the sliding column 4. The rubber head is easily aged after long time use, and the sealing effect is reduced. Through the mode, the adsorption head 10 and the sliding column 4 are detachably connected, and replacement is facilitated.

[0022] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0023] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0024] Based on the embodiments of the utility model, all other embodiments obtained by the ordinary skilled in the art without making creative labor belong to the range of the utility model protection.

Claims

1. A vacuum chuck for a wafer, characterized by, The device includes a horizontally arranged support plate (1), with a connecting part (2) at the upper center of the support plate (1). Four adsorption mechanisms are arranged in a rectangular array around the connecting part (2) on the support plate (1). Each adsorption mechanism includes a vertically penetrating sliding hole (3) through the support plate (1). A sliding column (4) is slidably arranged inside the sliding hole (3). A vacuum pipe (9) is vertically connected inside the sliding column (4). A device located below the sliding hole (3) is fixed on the outer wall of the sliding column (4). The upper limit block (5) and the lower limit block (6) located below the sliding hole (3) are provided. A spring (7) is sleeved on the sliding column (4). The upper and lower ends of the spring (7) are respectively connected to the support plate (1) and the lower limit block (6). The upper end of the sliding column (4) is provided with a first connection port (8) communicating with the vacuum pipe (9). The lower end of the sliding column (4) is provided with an adsorption head (10). The lower end of the adsorption head (10) is provided with an adsorption port (11) communicating with the vacuum pipe (9).

2. The vacuum chuck for wafer as recited in claim 1, wherein, The adsorption mechanism also includes a connector (12) located at the upper end of the support plate (1). The connector (12) has a second connection port (13) and a third connection port (14). The second connection port (13) and the third connection port (14) are connected inside the connector (12). The second connection port (13) is connected to the first connection port (8) through a flexible tube (15).

3. The vacuum adsorption disk for wafers as described in claim 1, characterized in that, The adsorption port (11) is flared downwards.

4. The vacuum adsorption disk for wafers as described in claim 1, characterized in that, The adsorption head (10) is made of rubber.

5. The vacuum adsorption disk for wafers as described in claim 4, characterized in that, The upper end of the adsorption head (10) is fixedly provided with a metal connecting tube (16), the outer wall of the metal connecting tube (16) is provided with an external thread, the inner wall of the lower end of the sliding column (4) is provided with an internal thread that matches the external thread, and the metal connecting tube (16) is screwed into the sliding column (4).

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