Insulated gate bipolar transistor (IGBT) module protective shell convenient for heat dissipation
By introducing components such as cooling fans, heat dissipation holes, waterproof and breathable membranes, heat sinks and heat pipes into the protective housing of IGBT modules, the problem of poor heat dissipation of IGBT modules is solved, achieving rapid heat dissipation and dust and water resistance, and extending the service life of the modules.
Patent Information
- Application Number
- CN202520203551.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-02-10
AI Technical Summary
Existing IGBT module protective housings have poor heat dissipation during use, leading to increased module temperature, affecting performance and reliability, and even causing heat-induced damage to the module and shortening its service life.
It adopts a combination structure of substrate, shell body, cooling fan, heat dissipation fins, heat dissipation holes, waterproof and breathable membrane, heat sink and heat pipe. The cooling fan assists in heat dissipation, the heat dissipation holes quickly dissipate heat, the heat sink and heat pipe work together to increase the heat dissipation area, the waterproof and breathable membrane isolates water vapor and dust, and the heat dissipation fins dissipate heat into the environment.
This achieves rapid heat dissipation of the IGBT module, improves heat dissipation efficiency, prevents moisture and dust from entering, and extends the module's service life.
Smart Images

Figure CN223829822U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of IGBT module protective housing technology, and specifically to an IGBT module protective housing that facilitates heat dissipation. Background Technology
[0002] IGBT modules are power modules composed of insulated gate bipolar transistors (IGBTs). IGBTs are composite fully controllable voltage-driven power semiconductor devices. IGBT modules are widely used in servo motors, frequency converters, frequency conversion home appliances, etc., such as electric vehicles, servo controllers, UPS, switching power supplies, chopper power supplies, trolleybuses, etc.
[0003] Existing IGBT module protective housings cannot quickly dissipate heat from the internal IGBT modules during use. The heat inside the IGBT modules cannot be dissipated in time, leading to an increase in module temperature. For example, an IGBT module housing disclosed in patent application number CN202023099831.9 does not have a heat dissipation structure to improve the speed of the IGBT modules. As a result, the high temperature inside the housing cannot be dissipated in time, and the excessively high temperature will affect the performance and reliability of the IGBT modules, and may even cause the IGBT modules to be damaged by heat. This accelerates the aging and failure of the IGBT modules and reduces their service life.
[0004] Therefore, it is necessary to invent a heat-dissipating protective housing for IGBT modules to solve the above problems. Summary of the Invention
[0005] The purpose of this invention is to provide a protective housing for IGBT modules that facilitates heat dissipation, thereby solving the problem of poor heat dissipation during use.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a heat-dissipating protective shell for an IGBT module, comprising a substrate, a shell body, a cooling fan, and cooling fins. The shell body is mounted on top of the substrate. A metal base is disposed inside the shell body and fixedly mounted on the substrate. A chip is fixedly mounted on top of the metal base. Cooling fans are fixedly mounted on the inner walls of the left and right sides of the shell body. Heat dissipation holes are provided on the side walls of the shell body. A mounting plate is disposed on one side of the heat dissipation holes and fixedly mounted on the outer wall of the shell body. A waterproof and breathable membrane is disposed inside the mounting plate. A heat sink is disposed on the rear wall of the metal base. Cooling fins are disposed on one side of the heat sink. A heat pipe connects the heat sink and the cooling fins.
[0007] Preferably, the outer shell is a plastic shell, and the outer shell is connected to the substrate by bolts and threads, so that the outer shell is securely installed on the substrate.
[0008] Preferably, two cooling fans are provided, which are located on the left and right sides of the metal base. The two cooling fans are fixed to the outer casing body by four screws, so that the cooling fans can improve the heat dissipation effect inside the outer casing body.
[0009] Preferably, the cooling fan is positioned at the corresponding location of the heat dissipation hole, and there are multiple heat dissipation holes arranged in a rectangular uniform array to accelerate heat dissipation.
[0010] Preferably, a waterproof and breathable membrane is provided at the corresponding position of the heat dissipation hole. Two waterproof and breathable membranes are provided, and the two waterproof and breathable membranes are centrally symmetrical about the outer shell body, so that the waterproof and breathable membranes can prevent water vapor and dust from entering the interior of the outer shell body through the heat dissipation hole.
[0011] Preferably, a dustproof window is provided on one side of the waterproof and breathable membrane. The dustproof window is fixedly installed on the mounting plate by four screws, so that the dustproof window can effectively block external dust, debris and other objects from entering the interior of the outer shell.
[0012] Preferably, two heat sinks are provided, and the two heat sinks are tightly attached to the metal base. The heat sinks are connected to the evaporation end of the heat pipe, so that the heat sinks can transfer the heat generated by the metal base to the heat sinks, and then transfer the heat to one end of the heat pipe through the heat sinks. Then, the heat is transferred to the other end of the heat pipe through the evaporation and condensation process of the heat pipe.
[0013] Preferably, a heat dissipation fin is fixedly installed on the rear outer wall of the outer shell body. The heat dissipation fin is made of aluminum alloy and is connected to the condensation end of the heat pipe, so that the heat dissipation fin can dissipate heat to the surrounding environment.
[0014] The technical effects and advantages provided by this utility model in the above technical solution are as follows:
[0015] 1. With the arrangement of cooling fans and ventilation holes, the two cooling fans blow cool air towards the metal base to assist in heat dissipation, while the ventilation holes can quickly guide and dissipate the heat inside the shell, which can reduce the temperature inside the shell. In addition, the waterproof and breathable membrane set at the ventilation holes can isolate water vapor and dust without affecting heat dissipation, and has waterproof and dustproof effects.
[0016] 2. By setting up the heat sink and heat dissipation fins, the heat sink is in direct contact with the metal base, transferring the heat generated by the metal base to the surface of the heat sink. The heat pipe can absorb the heat and transfer it to the heat dissipation fins. The heat is then transferred to the air through convection heat transfer by the heat dissipation fins, allowing the heat of the IGBT module to dissipate more quickly. This eliminates the need to rely on a single cooling fan for heat dissipation, further improving the heat dissipation efficiency and effect. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0018] Figure 2 This is an exploded three-dimensional structural diagram of the substrate and the outer shell of this utility model;
[0019] Figure 3 This is a three-dimensional structural diagram of the cooling fan of this utility model;
[0020] Figure 4 This is a three-dimensional structural diagram of the heat dissipation hole of this utility model;
[0021] Figure 5 This is a three-dimensional structural diagram of the waterproof and breathable membrane of this utility model;
[0022] Figure 6 This is a schematic diagram of the overall rear-view three-dimensional structure of this utility model;
[0023] Figure 7 This is a three-dimensional structural diagram of the radiator and heat dissipation fins of this utility model.
[0024] Explanation of reference numerals in the attached figures:
[0025] 1. Substrate; 2. Housing body; 3. Metal base; 4. Chip; 5. Cooling fan; 6. Heat dissipation holes; 7. Mounting plate; 8. Waterproof and breathable membrane; 9. Dustproof window; 10. Heat sink; 11. Heat pipe; 12. Heat dissipation fins. Detailed Implementation
[0026] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.
[0027] This utility model provides, for example Figure 1-7 The illustrated IGBT module protective housing for easy heat dissipation includes a substrate 1, a housing body 2 mounted on top of the substrate 1, a metal base 3 disposed inside the housing body 2 and fixedly mounted on the substrate 1, a chip 4 fixedly mounted on top of the metal base 3, cooling fans 5 fixedly mounted on the inner walls of the left and right sides of the housing body 2, heat dissipation holes 6 opened on the side walls of the housing body 2, a mounting plate 7 disposed on one side of the heat dissipation holes 6 and fixedly mounted on the outer wall of the housing body 2, a waterproof and breathable membrane 8 disposed inside the mounting plate 7, a heat sink 10 disposed on the rear wall of the metal base 3, a heat dissipation fin 12 disposed on one side of the heat sink 10, and a heat pipe 11 connecting the heat sink 10 and the heat dissipation fin 12.
[0028] The outer shell 2 is made of plastic and is connected to the base plate 1 by bolts. Two cooling fans 5 are provided, located on the left and right sides of the metal base 3. The two cooling fans 5 are fixed to the outer shell 2 by four screws. The cooling fans 5 are located at the corresponding positions of the heat dissipation holes 6. There are multiple heat dissipation holes 6, which are evenly distributed in a rectangular array. Two waterproof and breathable membranes 8 are provided at the corresponding positions of the heat dissipation holes 6. The two waterproof and breathable membranes 8 are centrally symmetrical about the outer shell 2. A dustproof window 9 is provided on one side of the waterproof and breathable membrane 8. The dustproof window 9 is fixed to the mounting plate 7 by four screws. Two radiators 10 are provided and are tightly fitted to the metal base 3. The radiators 10 are connected to the evaporation end of the heat pipe 11. A heat dissipation fin 12 is fixedly installed on the rear outer wall of the outer shell 2. The heat dissipation fin 12 is made of aluminum alloy and is connected to the condensation end of the heat pipe 11.
[0029] The two cooling fans 5 blow the heat generated by the metal base 3 to the heat dissipation holes 6 for exhaust, thereby quickly reducing the high temperature inside the outer casing 2. The waterproof and breathable membrane 8 and the dustproof window 9 prevent moisture and dust from entering the outer casing 2 through the heat dissipation holes 6. This prevents external moisture and dust from entering the outer casing 2 without affecting the heat dissipation effect of the module. The heat sink 10 absorbs the heat generated by the metal base 3 and transfers it to the heat pipe 11. Then, through the evaporation and condensation process of the heat pipe 11, the heat is transferred to the heat dissipation fins 12. Thus, the heat dissipation fins 12 can dissipate the heat to the surrounding environment, increasing the heat dissipation area and improving the heat dissipation effect.
[0030] Working principle of this utility model:
[0031] Refer to the instruction manual appendix Figure 1-5 When using this device, firstly, the IGBT module is securely installed in a suitable position using the substrate 1. When the IGBT module is in use, heat will be generated inside. If the heat is not dissipated in time, it will affect the service life of the IGBT module. Therefore, two cooling fans 5 can be turned on. The two cooling fans 5 play an auxiliary role in heat dissipation against the metal base 3. Thus, the heat can be dissipated from multiple heat dissipation holes 6 on both sides of the outer casing 2, thereby reducing the internal temperature of the outer casing 2. In order to prevent moisture and dust from entering through the heat dissipation holes 6, the waterproof and breathable membrane 8 and the dustproof window 9 can isolate moisture and dust.
[0032] Refer to the instruction manual appendix Figure 6-7When using this device, if the internal heat of the IGBT module is too high, the heat generated by the metal base 3 can be transferred to the surface of the heat sink 10 through direct contact between the heat sink 10 and the metal base 3. Then, the heat sink 10 transfers the heat to the heat pipe 11, and then the heat is transferred to the heat dissipation fins 12 through the evaporation and condensation process of the heat pipe 11, so that the heat dissipation fins 12 and the heat pipe 11 are dissipated into the outside air. Thus, the heat dissipation fins 12, the heat pipe 11 and the heat sink 10 work together to increase the heat dissipation area and improve the heat dissipation efficiency, which effectively improves the service life of the IGBT module.
Claims
1. A heat-dissipating protective housing for an IGBT module, comprising a substrate (1), a housing body (2), a cooling fan (5), and heat dissipation fins (12), characterized in that: A housing body (2) is mounted on top of the substrate (1). A metal base (3) is disposed inside the housing body (2) and fixedly mounted on the substrate (1). A chip (4) is fixedly mounted on top of the metal base (3). Cooling fans (5) are fixedly mounted on the inner walls of the left and right sides of the housing body (2). A heat dissipation hole (6) is opened on the side wall of the housing body (2). A mounting plate (7) is disposed on one side of the heat dissipation hole (6) and fixedly mounted on the outer wall of the housing body (2). A waterproof and breathable membrane (8) is disposed inside the mounting plate (7). A heat sink (10) is disposed on the rear end wall of the metal base (3). A heat dissipation fin (12) is disposed on one side of the heat sink (10). A heat pipe (11) is connected between the heat sink (10) and the heat dissipation fin (12).
2. The IGBT module protective housing for easy heat dissipation according to claim 1, characterized in that: The outer shell body (2) is a plastic shell, and the outer shell body (2) is connected to the substrate (1) by bolt threads.
3. The IGBT module protective housing for easy heat dissipation according to claim 1, characterized in that: Two cooling fans (5) are provided, and the two cooling fans (5) are located on the left and right sides of the metal base (3). The two cooling fans (5) are fixed to the outer shell body (2) by four screws.
4. The IGBT module protective housing for easy heat dissipation according to claim 1, characterized in that: The cooling fan (5) is located at the corresponding position of the heat dissipation hole (6). There are multiple heat dissipation holes (6), which are distributed in a rectangular uniform array.
5. The IGBT module protective housing for easy heat dissipation according to claim 4, characterized in that: A waterproof and breathable membrane (8) is provided at the corresponding position of the heat dissipation hole (6). There are two waterproof and breathable membranes (8), and the two waterproof and breathable membranes (8) are centrally symmetrical about the outer shell body (2).
6. The IGBT module protective housing for easy heat dissipation according to claim 5, characterized in that: A dustproof window (9) is provided on one side of the waterproof and breathable membrane (8), and the dustproof window (9) is fixedly installed on the mounting plate (7) by four screws.
7. The IGBT module protective housing for easy heat dissipation according to claim 1, characterized in that: Two radiators (10) are provided, and the two radiators (10) are tightly attached to the metal base (3). The radiators (10) are connected to the evaporation end of the heat pipe (11).
8. The IGBT module protective housing for easy heat dissipation according to claim 2, characterized in that: The outer rear wall of the outer shell body (2) is fixedly equipped with heat dissipation fins (12), which are made of aluminum alloy and are connected to the condensation end of the heat pipe (11).
Citation Information
Patent Citations
IGBT (Insulated Gate Bipolar Translator) module shell
CN213782005U