Electronic package and substrate structure thereof

Abstract

An electronic packaging piece and a substrate structure thereof are mainly characterized in that an electronic element is arranged on the substrate structure with a plurality of electrical contact pads and a metal sheet through a soldering tin material, and an insulating protection layer of the substrate structure is provided with an opening for exposing the plurality of electrical contact pads, so that the metal sheet is arranged on the periphery of the electrical contact pads and forms an interval space; therefore, the amount of solder paste expanded by the soldering tin material is reduced, and the problem of short circuit of the electrical contact pads caused by the expansion of the soldering tin material can be avoided.

Description

Technical Field

[0001] This application relates to a semiconductor packaging technology, and more particularly to a flip-chip electronic package and its substrate structure. Background Technology

[0002] With the development of the electronics industry, today's electronic products are trending towards thinner, smaller, and more versatile designs, and semiconductor packaging technology has also developed different packaging forms accordingly. To meet the requirements of high integration and miniaturization of semiconductor devices, in addition to traditional wire bonding semiconductor packaging technology, flip chip technology can also be used to increase wiring density.

[0003] Figure 1 This is a cross-sectional schematic diagram of an existing flip-chip semiconductor package 1. (See attached diagram.) Figure 1 As shown, the insulating protective layer 13 of a packaging substrate 10 has a plurality of openings 130 corresponding to the exposed circuit layer 14, so that the semiconductor chip 11 is bonded to the electrical contact pad 140 of the circuit layer 14 through the openings 130 via a plurality of solder bumps 110 to electrically connect the conductive traces 141 of the circuit layer 14. Then, an undercoat 12 is formed between the semiconductor chip 11 and the packaging substrate 10 to cover the solder bumps 110.

[0004] However, the circuit layer 14 of the existing packaging substrate 10 is of the bump-on-trace (BOT) type. Therefore, when copper material (such as copper sheet or conductive trace 141) is distributed around the electrical contact pad 140 to provide grounding, the solder paste of the solder bump 110 will spread outward, which can easily form short circuits between the electrical contact pads 140, resulting in a decrease in product yield.

[0005] Therefore, overcoming the problems of the existing technologies mentioned above has become a pressing issue that the industry urgently needs to address. Utility Model Content

[0006] In view of the various deficiencies of the prior art, this application provides a substrate structure, including: a substrate body having a plurality of electrical contact pads and a metal sheet, wherein a notch is formed on one side of the metal sheet so that at least one of the electrical contact pads is located in the notch, and the opposite ends of the electrical contact pads contact the metal sheet, thereby forming a gap space between one side of the electrical contact pad and the notch of the metal sheet; and an insulating protective layer formed on the substrate body and having an opening that exposes the plurality of electrical contact pads.

[0007] This application also provides a method for manufacturing a substrate structure, comprising: providing a substrate body having a plurality of electrical contact pads and at least one metal sheet, wherein a notch is formed on one side of the metal sheet so that at least one of the electrical contact pads is located in the notch, and the opposite ends of the electrical contact pads contact the metal sheet, thereby forming a gap space between one side of the electrical contact pad and the notch of the metal sheet; and forming an insulating protective layer on the substrate body, wherein the insulating protective layer has an opening exposing the plurality of electrical contact pads.

[0008] In the aforementioned substrate structure and manufacturing method, the substrate body has an insulating layer to bond the plurality of electrical contact pads and the metal sheet.

[0009] In the aforementioned substrate structure and its manufacturing method, extensions are formed at both ends of the electrical contact pad to be embedded in the metal sheet.

[0010] In the aforementioned substrate structure and manufacturing method, one of the opposite ends of the electrical contact pad is formed with an extension section to be embedded in the metal sheet.

[0011] This application also provides an electronic package, including: a substrate structure as described above; and electronic components, which are attached to and electrically connected to the plurality of electrical contact pads via conductive bumps.

[0012] This application also provides a method for manufacturing an electronic package, comprising: providing a substrate structure as described above; and attaching an electronic component to a plurality of electrical contact pads via a plurality of conductive bumps, thereby electrically connecting the electronic component to the plurality of electrical contact pads.

[0013] In the aforementioned electronic package and its manufacturing method, the plurality of conductive bumps contain solder material.

[0014] As can be seen from the above, the electronic package and its substrate structure of this application mainly reduce the amount of solder paste that expands outward by placing the metal sheet around the electrical contact pad. Therefore, compared with the prior art, each electrical contact pad of the electronic package of this application can avoid the problem of short circuit caused by the expansion of the solder material, thereby improving the product yield. Attached Figure Description

[0015] Figure 1 This is a cross-sectional schematic diagram of an existing semiconductor package.

[0016] Figures 2A to 2C This is a cross-sectional schematic diagram illustrating the manufacturing method of the electronic package of this application.

[0017] Figure 3A for Figure 2A A partial top view diagram.

[0018] Figure 3B and Figure 3C for Figure 3A Partial top view schematic diagram of other embodiments.

[0019] Figure 4 for Figure 2B A partial top view diagram.

[0020] Explanation of reference numerals in the attached figures

[0021] 1 Semiconductor package

[0022] 10 Packaging substrate

[0023] 11 Semiconductor chips

[0024] 110 Solder bump

[0025] 12 Base Rubber

[0026] 13,22 Insulation protective layer

[0027] 130, 220 opening

[0028] 14. Line Layer

[0029] 140, 200 Electrical contact pads

[0030] 141 Conductive traces

[0031] 2 Electronic Packages

[0032] 2a Substrate Structure

[0033] 20 substrate body

[0034] 20a First Surface

[0035] 20b Second Surface

[0036] 201 metal sheet

[0037] 202 Insulation Layer

[0038] 203 gap

[0039] 21 Electronic Components

[0040] 21a Working surface

[0041] 21b Non-operating surface

[0042] 23 Conductive bumps

[0043] 230 Solder Material

[0044] 231 Metal Column

[0045] 300 extension

[0046] S represents the interval space. Detailed Implementation

[0047] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0048] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0049] Figures 2A to 2C This is a cross-sectional schematic diagram illustrating the manufacturing method of the electronic package 2 of this application.

[0050] like Figures 2A to 2B As shown, a substrate structure 2a is fabricated. First, a substrate body 20 is provided, and then an insulating protective layer 22 is formed on the substrate body 20.

[0051] The substrate body 20 has a first surface 20a and a second surface 20b opposite to each other, and a plurality of electrical contact pads 200 and at least one metal sheet 201 are formed on the first surface 20a.

[0052] In this embodiment, the substrate body 20 is a packaging substrate with a core layer and circuit structure, a packaging substrate with a coreless circuit structure, a silicon interposer (TSI) with through-silicon vias (TSVs), or other types of substrates.

[0053] Furthermore, the substrate body 20 is formed using a redistribution layer (RDL) fabrication method, and it has at least one insulating layer 202 to bond the plurality of electrical contact pads 200 and the metal sheet 201. For example, the material forming the electrical contact pads 200 is copper, and the material forming the insulating layer 202 and the metal sheet 201 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP).

[0054] Furthermore, the metal sheet 201 is disposed on the periphery of the electrical contact pad 200, such as... Figure 3A As shown in the top, bottom, and left sides, a notch 203 is formed on one side of the metal sheet 201 so that the electrical contact pad 200 is located in the notch 203, and the opposite ends of the electrical contact pad 200 (e.g., Figure 3A The upper and lower sides (as shown) contact the metal sheet 201, so that a gap space S is formed between one side of the electrical contact pad 200 and the notch 203 of the metal sheet 201.

[0055] Additionally, at least one of the opposite ends of the electrical contact pad 200 may be formed with an extension 300 to be embedded in the metal sheet 201, such as... Figure 3B One end shown is embedded in the metal sheet 201, or Figure 3C The two ends shown are embedded in the metal sheet 201.

[0056] In one embodiment, the edge of the electrical contact pad 200 is not connected to conductive traces or other wiring forms; therefore, the extension 300 is part of the electrical contact pad 200, rather than a conductive trace or wiring form. In one embodiment, the electrical contact pad 200 is in the form of a bump-connected line (BOT).

[0057] The insulating protective layer 22, serving as a solder resist layer such as green paint or graphite, is disposed on the first surface 20a of the substrate body 20 to cover the metal sheet 201, and forms openings 220 exposing a plurality of electrical contact pads 200, such as... Figure 4 As shown.

[0058] like Figure 2C As shown, electronic components 21 are attached to the plurality of electrical contact pads 200 via a plurality of conductive bumps 23.

[0059] The electronic component 21 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, or an inductor.

[0060] In this embodiment, the electronic component 21 is a semiconductor chip with opposing active surfaces 21a and non-active surfaces 21b, and the conductive bump 23 is attached to its active surface 21a.

[0061] Furthermore, the conductive bump 23 includes solder material 230, such as solder paste. For example, the conductive bump 23 has metal pillars 231, such as copper pillars, for bonding the working surface 21a, to form the solder material 230 thereon, so that the electronic component 21 is disposed on the plurality of electrical contact pads 200 in a flip-chip manner.

[0062] Therefore, in the manufacturing method of the electronic package 2 of this application, the metal sheet 201 of the substrate body 20 of the substrate structure 2a is mainly disposed on the periphery of the electrical contact pad 200, so that the electrical contact pad 200 and the metal sheet 201 form the gap space S. When the solder material 230 is bonded, the gap space S can reduce the amount of solder paste that spreads outward from the solder material 230. Therefore, compared with the prior art, the electronic package 2 of this application can prevent the solder material 230 from spreading to other areas, and thus the short circuit problem between each electrical contact pad 200 can be avoided.

[0063] This application also provides a substrate structure 2a, including: a substrate body 20 and an insulating protective layer 22 formed on the substrate body 20.

[0064] The substrate body 20 has a plurality of electrical contact pads 200 and at least one metal sheet 201, such that the metal sheet 201 is disposed around the electrical contact pads 200. A notch 203 is formed on one side of the metal sheet 201, such that at least one electrical contact pad 200 is located in the notch 203, and the opposite ends of the electrical contact pads 200 contact the metal sheet 201, thereby forming a gap space S between one side of the electrical contact pads 200 and the notch 203 of the metal sheet 201.

[0065] The insulating protective layer 22 is formed on the substrate body 20 and has openings 220 that expose the plurality of electrical contact pads 200.

[0066] In one embodiment, the substrate body 20 has an insulating layer 202 to bond the plurality of electrical contact pads 200 and the metal sheet 201.

[0067] In one embodiment, the electrical contact pad 200 has extensions 300 formed at both opposite ends to be embedded in the metal sheet 201.

[0068] In one embodiment, one of the opposite ends of the electrical contact pad 200 is formed with an extension 300 to be embedded in the metal sheet 201.

[0069] This application also provides an electronic package, including: the substrate structure 2a, and at least one electronic component 21 disposed on the substrate structure 2a.

[0070] The electronic component 21 is attached to and electrically connected to the plurality of electrical contact pads 200 via conductive bumps 23.

[0071] In one embodiment, the conductive bump 23 includes solder material 230.

[0072] In summary, the electronic package and its substrate structure of this application, by having the metal sheet disposed around the electrical contact pad, reduces the amount of solder paste that expands outward. Therefore, each electrical contact pad of the electronic package of this application can avoid short circuits caused by the expansion of solder material, thereby improving product yield.

[0073] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. A substrate structure, characterized in that, include: The substrate body has a plurality of electrical contact pads and a metal sheet, wherein a notch is formed on one side of the metal sheet so that at least one of the electrical contact pads is located in the notch, and the opposite ends of the electrical contact pads contact the metal sheet, so that a gap space is formed between one side of the electrical contact pad and the notch of the metal sheet. as well as An insulating protective layer is formed on the substrate body and has openings that expose the plurality of electrical contact pads.

2. The substrate structure as described in claim 1, characterized in that, The substrate body has an insulating layer to bond the plurality of electrical contact pads and the metal sheet.

3. The substrate structure as described in claim 1, characterized in that, The electrical contact pad has extensions at both ends to be embedded in the metal sheet.

4. The substrate structure as described in claim 1, characterized in that, One of the opposite ends of the electrical contact pad has an extension formed to be embedded in the metal sheet.

5. An electronic package, characterized in that, include: The substrate structure as described in any one of claims 1 to 4; as well as Electronic components are attached to and electrically connected to multiple electrical contact pads via multiple conductive bumps.

6. The electronic package as described in claim 5, characterized in that, The multiple conductive bumps contain solder material.

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