Substrate leveling mechanism and coating equipment

Abstract

The utility model belongs to the technical field of coating equipment, and discloses a substrate leveling mechanism and coating equipment. The substrate leveling mechanism comprises a bearing piece and a leveling manipulator, the bearing piece can bear the substrate, and the bearing piece is exposed out of the two sides, parallel to the first direction, of the substrate; the multiple leveling manipulators are arranged on the two sides, parallel to the first direction, of the base plate, the multiple leveling manipulators are arranged in the direction parallel to the first direction, and the leveling manipulators can clamp the edge of the base plate and stretch the base plate so as to level the base plate. According to the base plate leveling mechanism, the base plate is supported through the supporting piece, the two sides, parallel to the first direction, of the bottom of the base plate are suspended, then the base plate can be clamped and stretched through cooperation of the leveling mechanical arms, the warped base plate is leveled, leveling of the base plate is achieved, and the base plate can be evenly coated with paint subsequently.

Description

Technical Field

[0001] This utility model relates to the field of coating equipment technology, and in particular to a substrate leveling mechanism and coating equipment. Background Technology

[0002] The current production of encapsulated glass substrates typically includes processes such as substrate preparation, coating, chip mounting, encapsulation, and post-processing. Among these, the coating process is carried out by coating equipment, which involves spraying liquid onto the surface of the substrate to form a coating film layer, thereby protecting the chip, improving lighting efficiency, and enhancing reliability and stability.

[0003] During the substrate manufacturing process, the substrate may warp to a certain extent due to internal stress or other process factors. When coating a warped substrate, the coating will be uneven. Furthermore, the warping of the substrate will affect the reliability and performance of the finished encapsulated glass substrate, thus causing a series of quality problems. Utility Model Content

[0004] The purpose of this invention is to provide a substrate leveling mechanism and coating equipment to facilitate the leveling of warped substrates, thereby improving the uniformity of substrate coating and enhancing the reliability and performance of the finished encapsulated glass substrate.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A substrate leveling mechanism is used to level a warped substrate, the substrate leveling mechanism comprising:

[0007] A support member capable of supporting the substrate, wherein the substrate protrudes from the support member on both sides parallel to a first direction; and,

[0008] A leveling robot is provided on both sides of the substrate parallel to the first direction, and the multiple leveling robots are arranged along the direction parallel to the first direction. The leveling robot can clamp the edge of the substrate and stretch the substrate to level the substrate.

[0009] Preferably, the substrate leveling mechanism further includes:

[0010] An adsorption element is provided, wherein at least two sets of adsorption elements are spaced apart on the bottom of the substrate, and the adsorption elements are capable of adsorbing the substrate.

[0011] Preferably, the adsorption element is capable of moving along the first direction.

[0012] Preferably, the two sets of adsorption elements are respectively arranged on both sides of the substrate parallel to the first direction.

[0013] Preferably, the adsorption element is arranged in a strip shape and is arranged in a direction parallel to the first direction.

[0014] Preferably, the adsorption element has a notch for each of the leveling robots.

[0015] Preferably, the support is an air-floating plate.

[0016] Preferably, the substrate leveling mechanism further includes:

[0017] A detection element is located above the support element and is configured to detect the position of the substrate and determine the gripping position of the leveling robot. The detection element and the leveling robot are electrically connected.

[0018] A coating apparatus includes a frame and a coating mechanism. The coating apparatus further includes a substrate leveling mechanism, and the substrate leveling mechanism and the coating mechanism are sequentially arranged on the frame.

[0019] Preferably, the coating equipment further includes:

[0020] A feeding conveying mechanism is located on one side of the frame and is configured to convey the substrate to the substrate leveling mechanism along the first direction.

[0021] The beneficial effects of this utility model are:

[0022] The substrate leveling mechanism of this utility model supports the substrate through a support member. At this time, the support member is exposed on both sides of the substrate parallel to the first direction, that is, the bottom of the substrate is suspended on both sides parallel to the first direction. Then, multiple leveling robots simultaneously clamp and stretch the substrate on both sides parallel to the first direction, thereby flattening the warped substrate and achieving the leveling of the substrate, so that the substrate can be uniformly coated with paint in the future.

[0023] The coating equipment of this invention first flattens the substrate by means of a substrate leveling mechanism before coating, so that the warped substrate becomes flatter, thereby improving the uniformity of substrate coating and ultimately improving the quality of the finished product. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the coating equipment of this utility model;

[0025] Figure 2 This is a schematic diagram of the substrate leveling mechanism of this utility model;

[0026] Figure 3 This is a schematic diagram of the structure of the adsorption element of this utility model.

[0027] In the picture:

[0028] 100. Substrate; 1. Support component; 2. Leveling robot; 3. Adsorption component; 31. Adsorption hole; 32. Notch; 4. Inspection component; 5. Frame; 6. Coating mechanism; 7. Feeding and conveying mechanism. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0030] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0033] The following reference Figures 1 to 3 The substrate leveling mechanism and coating equipment provided by this utility model will be described.

[0034] Reference Figure 1The coating equipment includes a frame 5, a substrate leveling mechanism, a coating mechanism 6, and a feeding conveying mechanism 7. The feeding conveying mechanism 7 is located on one side of the frame 5. The feeding conveying mechanism 7, the substrate leveling mechanism, and the coating mechanism 6 are arranged sequentially along a first direction. The substrate leveling mechanism and the coating mechanism 6 are both mounted on the frame 5.

[0035] It should be noted that, in this embodiment, the substrate 100 is an encapsulated glass substrate, and the substrate 100 is square in shape. Specifically, the feeding conveying mechanism 7 is configured to convey the horizontally placed substrate 100 along a first direction. In this embodiment, the first direction is horizontal. The feeding conveying mechanism 7 can be any existing mechanism capable of conveying the substrate 100, such as a roller conveyor or a belt conveyor, etc. The specific type is not limited; in this embodiment, only a belt conveyor is used as an example. The coating mechanism 6 can be any existing mechanism capable of coating the substrate 100. Its specific structure is existing technology and will not be described in detail here.

[0036] Furthermore, the substrate leveling mechanism in this embodiment is designed to level the warped substrate 100, thereby pre-leveling the warped substrate 100 before coating, so that the coating mechanism 6 can uniformly coat the surface of the substrate 100 with coating, thereby improving the production quality of the substrate 100. The specific structure of this substrate leveling mechanism is described below in this embodiment.

[0037] Reference Figure 2 and Figure 3 The substrate leveling mechanism includes a support member 1, a leveling robot 2, a detection member 4, and an adsorption member 3. The support member 1 can support the substrate 100, and the support member 1 is exposed on both sides of the substrate 100 parallel to the first direction. Multiple leveling robots 2 are provided on both sides of the substrate 100 parallel to the first direction, and the multiple leveling robots 2 are arranged along the direction parallel to the first direction. The leveling robots 2 can clamp the edge of the substrate 100 and stretch the substrate 100 to level the substrate 100.

[0038] Specifically, the support member 1 is connected to the frame 5, and the discharge end of the feeding conveying mechanism 7 is connected to the support member 1. In this embodiment, the support member 1 is preferably an air flotation plate. The air flotation plate uses an air film to support the substrate 100, thereby eliminating physical contact between the support member 1 and the substrate 100, greatly reducing friction and wear, and protecting the substrate 100.

[0039] Furthermore, two leveling robots 2 are provided on each side of the substrate 100 parallel to the first direction, and all leveling robots 2 are connected to the frame 5. In this embodiment, the leveling robot 2 is any existing robot capable of gripping the substrate 100, and the robot has flexible grippers to protect the substrate 100 when gripping it. The specific structure of the robot is existing technology and will not be described in detail here. In some other embodiments, the number of leveling robots 2 on one side of the substrate 100 may also be three or more.

[0040] Based on the above, when the feeding conveyor 7 conveys the substrate 100 to the support member 1, the four leveling robots 2 clamp the four corners of the substrate 100 respectively, and then the four corners of the substrate 100 are stretched by the leveling robots 2, thereby flattening the warped substrate 100, so that the surface of the substrate 100 changes from curved to flat, thus achieving the leveling of the substrate 100.

[0041] The detection element 4 is located above the support 1. The detection element 4 is configured to detect the position of the substrate 100 and determine the clamping position of the leveling robot 2. The detection element 4 and the leveling robot 2 are electrically connected. Exemplarily, the detection element 4 in this embodiment is preferably a CCD camera. A CCD camera has high image quality and color reproduction capabilities, and can capture very clear and detailed images even in low light conditions, thus improving image clarity. The CCD camera's lens is positioned downwards, and the CCD camera is connected to the frame 5 via a bracket. The CCD camera has a built-in controller, which is electrically connected to the leveling robot 2. In other embodiments, the CCD camera can also be fixed in other ways; the specific form is not limited.

[0042] As described above, the CCD lens takes a picture of the substrate 100 from directly above it to obtain an image of the frame 5. Then, the controller analyzes the image to identify and locate the four corners of the substrate 100. The controller then controls the leveling robot 2 to clamp the four corners of the substrate 100 to make the clamping position of the leveling robot 2 more accurate and improve the leveling accuracy of the substrate 100.

[0043] Reference Figure 3At least two sets of adsorption elements 3 are spaced apart at the bottom of the substrate 100. The adsorption elements 3 can adsorb the substrate 100, and the two sets of adsorption elements 3 are respectively arranged on both sides of the substrate 100 parallel to the first direction. Specifically, in this embodiment, only one adsorption element 3 is provided in each set of adsorption elements 3, that is, the support element 1 is located between two adsorption elements 3, and each adsorption element 3 is arranged in a strip shape, and each adsorption element 3 is arranged in a direction parallel to the first direction. Adsorption holes 31 are opened vertically at the top of each adsorption element 3, and several adsorption holes 31 are opened along the length of the adsorption element 3. All adsorption holes 31 are connected to a vacuum pump through a vacuum pipeline, and the specific pipeline connection method is not limited.

[0044] Based on the above, after the substrate 100 is flattened by the leveling robot 2 and placed on the support 1, the support 1 releases its support on the substrate 100 and supports the suspended part of the substrate 100 through the two strip-shaped adsorption members 3. At the same time, the vacuum pump evacuates the adsorption hole 31 to generate a vacuum suction force at the adsorption hole 31, thereby adsorbing and positioning the substrate 100, so as to prevent the flattened substrate 100 from shifting and affecting the subsequent coating accuracy.

[0045] Furthermore, the adsorption member 3 can move along the first direction. That is, in this embodiment, the bottom of the adsorption member 3 is slidably connected to the frame 5. The specific sliding structure can adopt any structure in the prior art, so that the adsorption member 3 can drive the substrate 100 to slide below the coating mechanism 6 for precise coating, thereby improving the coating quality.

[0046] In addition, in order to prevent interference between the leveling robot 2 and the adsorption member 3 when the leveling robot 2 is holding or placing the substrate 100, the adsorption member 3 in this embodiment is provided with a notch 32 for each leveling robot 2. That is, two notches 32 are provided on each adsorption member 3 along its own length direction, so that the leveling robot 2 can be inserted into the notch 32 when placing the substrate 100, thus preventing interference between the leveling robot 2 and the adsorption member 3.

[0047] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A substrate leveling mechanism for leveling a warped substrate (100), characterized in that, The substrate leveling mechanism includes: A support member (1) capable of supporting the substrate (100), wherein the substrate (100) has two sides exposed on both sides parallel to the first direction, the support member (1); and, A leveling robot (2) is provided on both sides of the substrate (100) parallel to the first direction. The leveling robot (2) is arranged in a direction parallel to the first direction. The leveling robot (2) can clamp the edge of the substrate (100) and stretch the substrate (100) to level the substrate (100).

2. The substrate leveling mechanism according to claim 1, characterized in that, The substrate leveling mechanism further includes: Adsorption element (3), wherein at least two sets of adsorption elements (3) are provided at intervals on the bottom of the substrate (100), and the adsorption elements (3) are capable of adsorbing the substrate (100).

3. The substrate leveling mechanism according to claim 2, characterized in that, The adsorption element (3) is capable of moving along the first direction.

4. The substrate leveling mechanism according to claim 2, characterized in that, The two sets of adsorption elements (3) are respectively arranged on both sides of the substrate (100) parallel to the first direction.

5. The substrate leveling mechanism according to claim 2, characterized in that, The adsorption element (3) is arranged in a strip shape and is arranged in a direction parallel to the first direction.

6. The substrate leveling mechanism according to claim 2, characterized in that, The adsorption component (3) has a notch (32) for each of the leveling manipulators (2).

7. The substrate leveling mechanism according to claim 1, characterized in that, The support component (1) is an air flotation plate.

8. The substrate leveling mechanism according to claim 1, characterized in that, The substrate leveling mechanism further includes: The detection element (4) is located above the support (1) and is configured to detect the position of the substrate (100) and determine the clamping position of the leveling robot (2). The detection element (4) and the leveling robot (2) are electrically connected.

9. A coating apparatus, comprising a frame (5) and a coating mechanism (6), characterized in that, The coating equipment further includes a substrate leveling mechanism as described in any one of claims 1-8, wherein the substrate leveling mechanism and the coating mechanism (6) are sequentially arranged on the frame (5).

10. The coating equipment according to claim 9, characterized in that, The coating equipment also includes: A feeding conveying mechanism (7) is located on one side of the frame (5) and is configured to convey the substrate (100) to the substrate leveling mechanism along the first direction.

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