Coating device for insulating layer of electronic component

Abstract

The utility model discloses a coating device for an insulating layer of an electronic component, which relates to the field of electronic component processing and comprises a support frame and a coating box, support rods are arranged in the support frame, the coating box is arranged between the two support rods, insulating powder is placed in the coating box, a support plate is arranged in the support frame, and the support plate is arranged on the support frame. A sliding groove is formed in the supporting plate, a movable plate is arranged in the sliding groove in a sliding mode, a connecting plate is rotatably arranged in the groove, a sliding plate is arranged between the two guide blocks, an electronic element is placed in the supporting base, and the height of the supporting base can be adjusted by screwing a screw. The bottoms of the electronic components of different specifications are flush, the bottoms of the electronic components make contact with the epoxy resin which is heated and melted below, the insulating powder adheres to the surfaces of the electronic components to form insulating layers, insulating layer coating can be conducted on the multiple electronic components at the same time, and the coating efficiency of the electronic components is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic component processing, specifically a coating device for the insulating layer of electronic components. Background Technology

[0002] Electronic components are the basic building blocks of electronic circuits and electronic devices. Common electronic components include resistors, capacitors, inductors, potentiometers, transformers, etc. Electronic components are widely used in various electronic devices and systems, including industrial electronic equipment, communication equipment, computers, medical equipment, and home appliances. The insulating layer of an electronic component refers to a layer of material covering the surface or interior of the electronic component, used to isolate charges or electric fields, prevent current leakage and short circuits, thereby improving the stability and safety of the circuit.

[0003] When applying insulating coating to electronic components, semi-finished products need to be sequentially placed into a coating box to apply insulating powder. When coating different types of electronic components, it is inconvenient to put in and take out the components. Moreover, the thickness of the coating required for electronic components varies, making device adjustment troublesome. This affects the thickness and quality of the formed insulating layer, and consequently, the normal use of the electronic components. Utility Model Content

[0004] The purpose of this invention is to provide a coating device for the insulating layer of electronic components to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A coating apparatus for insulating layers of electronic components includes a support frame and further includes:

[0007] A coating box is provided, with support rods inside the support frame, a coating box between two support rods, insulating powder inside the coating box, a support plate inside the support frame, a sliding groove on the support plate, a movable plate slidably disposed inside the sliding groove, telescopic plates on both sides of the movable plate, a groove at the top of the telescopic plate, a connecting plate rotatably disposed inside the groove, a guide block slidably disposed outside the connecting plate, a sliding plate between two guide blocks, a crossbeam between two sliding plates, and the bottom end of the connecting plate passing through the sliding plate and rotatably connected to it.

[0008] A support base is provided below the crossbeam. The support base has a slot for placing electronic components inside. A pressure plate is provided inside the slot. Multiple springs are provided between the pressure plate and the support base. An adjustment block is provided outside the crossbeam. The adjustment block is fixedly connected to the support base. A screw is rotatably provided on the crossbeam. Multiple screw holes are provided on the adjustment block. The screw passes through the screw holes and cooperates with them.

[0009] The lifting mechanism, located at the bottom of the support plate, can drive the crossbeam and the support base to move up and down.

[0010] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0011] In one alternative embodiment: the lifting mechanism includes a lead screw, a nut, and a motor; a fixed frame is provided at the bottom of the support plate; the lead screw is provided inside the fixed frame; a nut that cooperates with the lead screw is provided on the movable plate; a motor is provided on the inner wall of the fixed frame; and the rotating end of the motor is connected to the lead screw.

[0012] In one alternative: a partition is fixedly provided on the inner wall of the support frame, a threaded rod is provided on the partition, the top end of the threaded rod is rotatably connected to the support frame, and a threaded hole that mates with the threaded rod is provided on the support plate.

[0013] In one alternative: a rotating rod is provided inside the support frame, a gear set is provided between the rotating rod and the threaded rod, and one end of the rotating rod extends out of the support frame and is provided with a rotating block.

[0014] In one alternative: a fixed rod is provided inside the sliding groove, and the movable plate is slidably disposed outside the fixed rod.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] The electronic component insulation coating device uses a lifting mechanism to move the crossbeam and support base up and down. The electronic components are placed inside the support base, and the height of the support base can be adjusted by turning the screw, so that the bottoms of electronic components of different specifications are level. The crossbeam drives multiple support bases below to descend, and the bottom of the electronic components comes into contact with the epoxy resin that has been heated and melted below. The insulating powder adheres to the surface of the electronic components to form an insulating layer. The device can coat multiple electronic components with insulating layers at the same time, which improves the coating efficiency and ensures the coating quality. Attached Figure Description

[0017] Figure 1 A schematic diagram of a coating device for insulating layers of electronic components.

[0018] Figure 2 A schematic diagram of the support frame in a coating device for insulating layers of electronic components.

[0019] Figure 3 A schematic diagram of the movable plate in a coating device for insulating layers of electronic components.

[0020] Figure 4 This is a cross-sectional view of the support base in a coating apparatus for insulating layers of electronic components.

[0021] Figure reference numerals: 1-Support frame, 2-Support plate, 201-Sliding groove, 3-Painting box, 4-Support rod, 5-Modible plate, 6-Telescopic plate, 601-Groove, 7-Sliding plate, 8-Connecting plate, 9-Support base, 901-Placement groove, 10-Rotating rod, 11-Gear set, 12-Threaded rod, 13-Pressure plate, 14-Rotating block, 15-Limit pin, 16-Screw rod, 17-Nut, 18-Fixed frame, 19-Motor, 20-Fixed rod, 21-Adjusting block, 22-Screw rod, 23-Guide block, 24-Crossbeam, 25-Spring. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. In the drawings and description, similar or identical parts are referred to by the same reference numerals, and in practical applications, the shape, thickness, or height of each component may be enlarged or reduced. The embodiments listed in this utility model are merely illustrative and not intended to limit the scope of this utility model. Any obvious modifications or changes made to this utility model do not depart from its spirit and scope.

[0023] In one embodiment, such as Figure 1-4 As shown, a coating apparatus for insulating layers of electronic components includes a support frame 1, and further includes:

[0024] The coating box 3 has a support rod 4 vertically arranged inside the support frame 1. The coating box 3 is arranged between two support rods 4. The coating box 3 contains insulating powder. The support frame 1 has a support plate 2 inside. The support plate 2 has a sliding groove 201. The sliding plate 5 is slidably arranged inside the sliding groove 201. The movable plate 6 is arranged on both sides of the movable plate 5. The movable plate 6 can be pulled out from the movable plate 5 and fixed by bolts. The top of the movable plate 6 has a groove 601. The connecting plate 8 is rotatably arranged inside the groove 601. The guide block 23 is slidably arranged outside the connecting plate 6. The sliding plate 7 is arranged between two guide blocks 23. The crossbeam 24 is arranged between two sliding plates 7. The bottom end of the connecting plate 8 passes into the sliding plate 7 and is rotatably connected to it. The movable plate 6 suspends the crossbeam 24 below through the connecting plate 8.

[0025] A support base 9 is provided below the crossbeam 24. The support base 9 has a placement slot 901 for placing electronic components inside. A pressure plate 13 is provided inside the placement slot 901. Multiple springs 25 are provided between the pressure plate 13 and the support base 9. An adjustment block 21 is provided outside the crossbeam 24. The adjustment block 21 is fixedly connected to the support base 9. A screw 22 is rotatably provided on the crossbeam 24. Multiple screw holes are provided on the adjustment block 21. The screw 22 passes through the screw holes and cooperates with them.

[0026] The lifting mechanism is located at the bottom of the support plate 2 and can drive the crossbeam 24 and the support base 9 to move up and down.

[0027] The coating device for the insulating layer of electronic components moves the crossbeam 24 and the support base 9 up and down through the lifting mechanism. The inner wall of the coating box 3 is pre-embedded with heating wires, which can heat the epoxy resin insulating powder. The crossbeam 24 drives the multiple support bases 9 below to descend. The electronic components are placed inside the support bases 9 and are squeezed and fixed by the pressure plate 13. The bottom of the electronic components comes into contact with the epoxy resin below that has been heated and melted. The epoxy resin adheres to the surface of the electronic components to form an insulating layer. The vertical height of the support base 9 can be adjusted by turning the screw 22 so that the bottoms of electronic components of different specifications are flush. As an embodiment, the left, right and up and down positions of the various components shown in the attached figure are only a kind of arrangement. The specific positions are set according to specific needs.

[0028] In one embodiment, such as Figure 1-3 As shown, the lifting mechanism includes a lead screw 16, a nut 17, and a motor 19. A fixed frame 18 is fixedly installed at the bottom of the support plate 2. The lead screw 16 is rotatably installed inside the fixed frame 18. A nut 17 that cooperates with the lead screw 16 is installed on the movable plate 5. The two ends of the lead screw 16 are provided with external threads with opposite directions of rotation. The nut 17 meshes with the external threads of the lead screw 16. A motor 19 is installed on the inner wall of the fixed frame 18. The rotating end of the motor 19 is connected to the lead screw 16. The motor 19 drives the lead screw 16 to rotate. The lead screw 16 drives the two movable plates 5 to move closer or further apart. The movable plates 5 drive the telescopic plate 6 to move.

[0029] In one embodiment, such as Figure 1-4 As shown, a partition 13 is fixedly installed on the inner wall of the support frame 1, and a threaded rod 12 is rotatably installed on the partition 13. The top end of the threaded rod 12 is rotatably connected to the support frame 1. A threaded hole that mates with the threaded rod 12 is opened on the support plate 2. The threaded rod 12 rotates and drives the support plate 2 to move up and down, so as to facilitate the adjustment of the initial height of the support plate 2.

[0030] In one embodiment, such as Figure 1-3As shown, a rotating rod 10 is provided inside the support frame 1, and a gear set 11 is provided between the rotating rod 10 and the threaded rod 12. One end of the rotating rod 10 passes through the support frame 1 and is provided with a rotating block 14. A limit pin 15 is provided on the rotating block 14.

[0031] In one embodiment, such as Figure 1-3 As shown, a fixed rod 20 is provided inside the sliding groove 201, and the movable plate 5 is slidably disposed outside the fixed rod 20.

[0032] The above embodiments of this utility model provide a coating device for the insulating layer of electronic components. The electronic components to be processed are slid into the support base 9 in sequence. The screw 22 is turned to adjust the height of the support base 9 so that the bottoms of multiple electronic components are flush. The motor 19 drives the lead screw 16 to rotate. The lead screw 16 drives the two movable plates 5 to move closer or further apart. The telescopic plate 6 drives the support base 9 to descend through the connecting plate 8. The bottom of the electronic component comes into contact with the epoxy resin below. The epoxy resin and insulating powder adhere to the surface of the electronic component to form an insulating layer.

[0033] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A coating apparatus for insulating layers of electronic components, comprising a support frame, characterized in that, Also includes: A coating box is provided, with support rods inside the support frame, a coating box between two support rods, insulating powder inside the coating box, a support plate inside the support frame, a sliding groove on the support plate, a movable plate slidably disposed inside the sliding groove, telescopic plates on both sides of the movable plate, a groove at the top of the telescopic plate, a connecting plate rotatably disposed inside the groove, a guide block slidably disposed outside the connecting plate, a sliding plate between two guide blocks, a crossbeam between two sliding plates, and the bottom end of the connecting plate passing through the sliding plate and rotatably connected to it. A support base is provided below the crossbeam. The support base has a slot for placing electronic components inside. A pressure plate is provided inside the slot. Multiple springs are provided between the pressure plate and the support base. An adjustment block is provided outside the crossbeam. The adjustment block is fixedly connected to the support base. A screw is rotatably provided on the crossbeam. Multiple screw holes are provided on the adjustment block. The screw passes through the screw holes and cooperates with them. The lifting mechanism, located at the bottom of the support plate, can drive the crossbeam and the support base to move up and down.

2. The coating apparatus for insulating layers of electronic components according to claim 1, characterized in that, The lifting mechanism includes a lead screw, a nut, and a motor. A fixed frame is provided at the bottom of the support plate, and the lead screw is provided inside the fixed frame. A nut that cooperates with the lead screw is provided on the movable plate. A motor is provided on the inner wall of the fixed frame, and the rotating end of the motor is connected to the lead screw.

3. The coating apparatus for insulating layers of electronic components according to claim 1, characterized in that, A partition is fixedly installed on the inner wall of the support frame, and a threaded rod is installed on the partition. The top end of the threaded rod is rotatably connected to the support frame, and a threaded hole that mates with the threaded rod is opened on the support plate.

4. The coating apparatus for insulating layers of electronic components according to claim 3, characterized in that, The support frame is equipped with a rotating rod inside, and a gear set is provided between the rotating rod and the threaded rod. One end of the rotating rod extends out of the support frame and is equipped with a rotating block.

5. The coating apparatus for insulating layers of electronic components according to claim 1, characterized in that, A fixed rod is provided inside the sliding groove, and the movable plate is slidably disposed outside the fixed rod.

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