Dust sticking device of IC (integrated circuit) carrier plate

Abstract

The utility model discloses a dust sticking device for an IC (integrated circuit) carrier plate. The dust sticking device for the IC carrier plate comprises a mounting frame, a dust sticking device and a dust sticking device, the dust sticking structure is connected to the lower portion of the mounting frame in a liftable mode, the dust sticking structure is provided with a dust sticking roller and a flattening roller, the dust sticking roller is suitable for abutting against the IC carrier plate in a rolling mode after the dust sticking structure descends so as to stick dust to the IC carrier plate, the flattening roller and the dust sticking roller are distributed in the movement direction of the IC carrier plate, and the flattening roller is used for flattening the IC carrier plate subjected to dust sticking. According to the dust sticking device of the IC carrier plate, the dust sticking structure is connected to the lower portion of the installation frame in the liftable mode, the dust sticking roller can abut against the IC carrier plate in a rolling mode after descending so as to stick dust to the IC carrier plate, the flattening roller and the dust sticking roller are distributed in the movement direction of the IC carrier plate, the flattening roller can flatten the IC carrier plate subjected to dust sticking, and the dust sticking effect is improved. Therefore, the reliability of identifying the surface defects of the IC carrier plate can be improved, the dust sticking roller can adapt to the IC carrier plates with different thicknesses, and the application range of the dust sticking device of the IC carrier plate can be enlarged.

Description

Technical Field

[0001] This utility model relates to the field of IC carrier board testing technology, and in particular to a dust-adhesion device for IC carrier boards. Background Technology

[0002] IC substrates are crucial semiconductor electronic components, serving as the support for semiconductor chips. IC substrates are increasingly evolving towards miniaturization, density, and integration. During the IC substrate manufacturing process, it is essential to accurately and quickly detect and identify scratches, dents, and other defects on the substrate surface to promptly filter out defective products and prevent them from reaching the customer. Current inspection equipment identifies surface defects by photographing the IC substrate. However, dust removal is necessary before photographing, and after dust removal, some substrates may warp. Furthermore, existing inspection equipment cannot adapt to substrates of varying thicknesses, indicating room for improvement. Utility Model Content

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a dust-adhesion device for IC carrier boards. This device can adhere dust to the IC carrier board and flatten the dust-adhesive IC carrier board, thereby improving the reliability of identifying surface defects of the IC carrier board. Furthermore, it can adapt to IC carrier boards of different thicknesses, thus expanding the applicability of the IC carrier board dust-adhesion device.

[0004] According to an embodiment of the present invention, an IC carrier board dust-adhesion device includes: a mounting frame; a dust-adhesion structure, wherein the dust-adhesion structure is movably connected to the lower part of the mounting frame, the dust-adhesion structure is provided with a dust-adhesion roller and a flattening roller, the dust-adhesion roller is adapted to roll and press against the IC carrier board after the dust-adhesion structure descends to adhere to the IC carrier board, the flattening roller and the dust-adhesion roller are distributed in the direction of movement of the IC carrier board, and the flattening roller is used to flatten the IC carrier board after dust adhesion.

[0005] According to the embodiment of the present invention, the dust-adhesion device for IC carrier boards can be installed on the testing equipment by setting a mounting frame. The dust-adhesion structure is vertically connected to the lower part of the mounting frame, so that the dust-adhesion roller can roll and press against the IC carrier board after descending to adhere to the IC carrier board. The flattening roller and the dust-adhesion roller are distributed along the movement direction of the IC carrier board, so that the flattening roller can flatten the IC carrier board after dust adhesion. This can improve the reliability of identifying surface defects of IC carrier boards, and make the dust-adhesion roller adaptable to IC carrier boards of different thicknesses, thereby increasing the applicability of the dust-adhesion device for IC carrier boards.

[0006] According to some embodiments of the present invention, an IC carrier board dust-adhesion device is provided, wherein the dust-adhesion structure includes a dust-adhesion bracket, the dust-adhesion bracket is vertically and flexibly connected to the mounting frame, and the dust-adhesion roller and the flattening roller are rotatably mounted on the dust-adhesion bracket.

[0007] According to some embodiments of the present invention, the dust-adhesive device for an IC carrier board includes a first lifting groove for the dust-adhesive bracket, and the flattening roller is slidably mounted in the first lifting groove. The dust-adhesive structure further includes an elastic element connected between the dust-adhesive bracket and the flattening roller, and the elastic element is used to elastically pre-tighten the flattening roller downwards.

[0008] According to some embodiments of the present invention, in the dust-adhesion device for IC carrier boards, there are two first lifting grooves, which are open to each other, and the two ends of the flattening roller are slidably supported on the two first lifting grooves in a corresponding manner.

[0009] According to some embodiments of the present invention, in the dust-adhesive device for IC carrier boards, there are two elastic elements, and the two elastic elements are respectively pressed against the top of both ends of the flattening roller.

[0010] According to some embodiments of the present invention, the dust-adhesive device for an IC carrier board includes a second lifting groove, and the dust-adhesive roller is slidably mounted in the second lifting groove.

[0011] According to some embodiments of the present invention, the dust-adhesive device for an IC carrier board includes a lifting drive component at the bottom of the mounting bracket. The output end of the lifting drive component is connected to the dust-adhesive bracket, and the lifting drive component is used to drive the dust-adhesive bracket to lift.

[0012] According to some embodiments of the present invention, in the dust-adhesion device for IC carrier boards, the mounting bracket and the dust-adhesion support are movably connected by a linear bearing, and the linear bearing and the lifting drive are spaced apart in the horizontal direction.

[0013] According to some embodiments of the present invention, in the dust-adhesion device for IC carrier boards, the linear bearings are at least two sets, and the at least two sets of linear bearings are spaced apart and distributed on both sides of the lifting drive component.

[0014] According to some embodiments of the present invention, the dust-adhesion device for an IC carrier board further includes a dust-adhesion paper roll, which is detachably mounted on the dust-adhesion bracket and is used to adhere dust to the dust-adhesion roller.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the structure of the dust-adhesion device for an IC carrier board according to an embodiment of the present invention. Figure 1 ;

[0018] Figure 2 This is a schematic diagram of the structure of the dust-adhesion device for an IC carrier board according to an embodiment of the present invention. Figure 2 .

[0019] Figure label:

[0020] Dust-adhesion device 100 for IC carrier board

[0021] Mounting bracket 1,

[0022] Dust-adhesive structure 2, dust-adhesive roller 21, flattening roller 22, dust-adhesive support 23, first lifting groove 231, second lifting groove 232, elastic element 24, dust-adhesive paper roll 25.

[0023] 3. Lifting drive component; 4. Linear bearing; 5. Ball bearing; 6. Separable retaining ring. Detailed Implementation

[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0025] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] The following is for reference. Figures 1-2 The description of the IC carrier dust-adhesion device 100 according to an embodiment of the present invention describes that the IC carrier dust-adhesion device 100 can be installed on the testing equipment by setting the mounting frame 1, and the dust-adhesion structure 2 is movably connected to the lower part of the mounting frame 1, so that the dust-adhesion roller 21 can roll and press against the IC carrier after descending to adhere to the IC carrier. The flattening roller 22 and the dust-adhesion roller 21 are distributed along the movement direction of the IC carrier, so that the flattening roller 22 can flatten the IC carrier after dust adhesion, thereby improving the reliability of identifying surface defects of the IC carrier and making the dust-adhesion roller 21 adaptable to IC carriers of different thicknesses, thereby increasing the applicability of the IC carrier dust-adhesion device 100.

[0028] like Figures 1-2 As shown, an IC carrier board dust-adhesion device 100 according to an embodiment of the present invention includes: a mounting bracket 1 and a dust-adhesion structure 2.

[0029] The dust-adhesive structure 2 is vertically connected to the bottom of the mounting frame 1. The dust-adhesive structure 2 is equipped with a dust-adhesive roller 21 and a flattening roller 22. The dust-adhesive roller 21 is adapted to roll and press against the IC carrier after the dust-adhesive structure 2 descends to adhere to the IC carrier. The flattening roller 22 and the dust-adhesive roller 21 are distributed in the direction of movement of the IC carrier. The flattening roller 22 is used to flatten the IC carrier after dust adhesion.

[0030] Specifically, the IC carrier dust adhesion device 100 is part of the testing equipment and is located above the carrier stage. It is used to clean dust and other debris from the surface of the IC carrier as it passes by, keeping the surface of the IC carrier clean and improving the reliability of identifying surface defects. The IC carrier dust adhesion device 100 includes a mounting bracket 1 and a dust adhesion structure 2. The mounting bracket 1 is used to install the IC carrier dust adhesion device 100 in the testing equipment. It can be connected to other components in the testing equipment to fix the IC carrier dust adhesion device 100 and ensure its reliable operation. The dust adhesion structure 2 is used to clean the surface of the IC carrier to realize the dust adhesion function of the IC carrier dust adhesion device 100 on the surface of the IC carrier.

[0031] Furthermore, by connecting the dust-adhesive structure 2 to the lower part of the mounting bracket 1 in a height-adjustable manner, the dust-adhesive structure 2 can be connected to the mounting bracket 1 to achieve the installation of the dust-adhesive structure 2, ensuring the reliability of the operation of the dust-adhesive structure 2. The dust-adhesive structure 2 can be raised and lowered relative to the mounting bracket 1 so that it can abut against the IC carrier board located on the carrier board platform when it is lowered, thereby adhering to the surface of the IC carrier board. Moreover, by connecting the dust-adhesive structure 2 to the lower part of the mounting bracket 1, interference from the mounting bracket 1 on the raising and lowering of the dust-adhesive structure 2 can be avoided, thereby improving the reliability of the raising and lowering of the dust-adhesive structure 2 relative to the mounting bracket 1.

[0032] Furthermore, the dust-adhesive structure 2 is equipped with a dust-adhesive roller 21 and a flattening roller 22, both of which are cylindrical in shape. The dust-adhesive roller 21 is used to adhere dust and other contaminants to the surface of the IC carrier board, thereby removing dust and other dirt from the surface of the IC carrier board and keeping the surface of the IC carrier board clean. The flattening roller 22 is used to flatten the IC carrier board, thereby keeping the IC carrier board flat. The dust-adhesive structure 2 is also movable relative to the mounting frame 1, allowing both the dust-adhesive roller 21 and the flattening roller 22 to move relative to the mounting frame 1. This allows the dust-adhesive roller 21 to roll and press against the surface of the IC carrier board after the dust-adhesive structure 2 descends, so that dust and other contaminants on the surface of the IC carrier board can be removed during the rolling process, thus achieving dust adhesion to the IC carrier board. The dust-adhesive roller 21 can be made to have a certain degree of stickiness to improve the reliability of dust adhesion, that is, to improve the reliability of dust adhesion to the IC carrier board.

[0033] Furthermore, by distributing the flattening roller 22 and the dust-adhesive roller 21 along the movement direction of the IC carrier, the extension directions of both the flattening roller 22 and the dust-adhesive roller 21 are perpendicular to the movement direction of the IC carrier. This allows the flattening roller 22 and the dust-adhesive roller 21 to be arranged parallel to each other, and the dust-adhesive roller 21 and the flattening roller 22 to be arranged sequentially along the movement direction of the IC carrier. This allows the IC carrier to pass through the dust-adhesive roller 21 and the flattening roller 22 sequentially during movement, thereby allowing the flattening roller 22 to flatten the IC carrier after dust adhesion, preventing the IC carrier from lifting after dust adhesion, thus improving the reliability of identifying surface defects of the IC carrier.

[0034] It should be noted that the dust-adhesive roller 21 and the flattening roller 22 can be spaced apart along the movement direction of the IC carrier, so that there is a certain distance between them to avoid interference, which would prevent the IC carrier from being properly dusted or flattened, or result in poor dust-adhesive or flattening effects. This improves the reliability of the dust-adhesive roller 21 and the flattening roller 22. Furthermore, by constructing the dust-adhesive structure 2 as a height-adjustable method for dust-adhesive application to the IC carrier, the dust-adhesive roller 21 can adapt to IC carriers of different thicknesses, thereby enabling the dust-adhesive device 100 to adapt to IC carriers of different thicknesses, thus increasing the applicability of the dust-adhesive device 100. Moreover, the flattening roller 22 can be made of sponge material, which is relatively soft and can prevent the flattening roller 22 from scratching the surface of the IC carrier when flattening it.

[0035] According to the embodiment of the present invention, the IC carrier dust-adhesion device 100 can be installed on the testing equipment by setting the mounting frame 1. The dust-adhesion structure 2 is vertically connected to the lower part of the mounting frame 1, so that the dust-adhesion roller 21 can roll and press against the IC carrier after descending to adhere to the IC carrier. The flattening roller 22 and the dust-adhesion roller 21 are distributed along the movement direction of the IC carrier, so that the flattening roller 22 can flatten the IC carrier after dust adhesion, thereby improving the reliability of identifying surface defects of the IC carrier and making the dust-adhesion roller 21 adaptable to IC carriers of different thicknesses, thereby increasing the applicability of the IC carrier dust-adhesion device 100.

[0036] In some embodiments, the dust-adhesive structure 2 includes a dust-adhesive bracket 23, which is vertically and vertically connected to the mounting frame 1. The dust-adhesive roller 21 and the flattening roller 22 are rotatably mounted on the dust-adhesive bracket 23.

[0037] Specifically, the dust-adhesive bracket 23 is used to install the dust-adhesive roller 21 and the flattening roller 22 to ensure their reliable operation. The dust-adhesive roller 21 and the flattening roller 22 are rotatably mounted on the dust-adhesive bracket 23, connecting them to the bracket to install them. Both rollers can rotate relative to the bracket, allowing them to adhere dust or flatten the IC substrate during rotation. The dust-adhesive bracket 23 is also vertically connected to the mounting frame 1, connecting the dust-adhesive structure 2 to the mounting frame 1 and allowing for its installation. The bracket 23 can also lift and lower the dust-adhesive roller 21 and the flattening roller 22 relative to the mounting frame 1, enabling them to adhere dust and flatten the IC substrate after descent.

[0038] In some embodiments, the dust-adhesive bracket 23 is provided with a first lifting groove 231, and the flattening roller 22 is slidably mounted in the first lifting groove 231; wherein, the dust-adhesive structure 2 further includes an elastic element 24, which is connected between the dust-adhesive bracket 23 and the flattening roller 22, and the elastic element 24 is used to elastically pre-tighten the flattening roller 22 downward.

[0039] Specifically, the first lifting groove 231 is used to guide the lifting of the flattening roller 22. The first lifting groove 231 is extended in the vertical direction to improve the accuracy of the movement direction of the flattening roller 22. The flattening roller 22 is slidably mounted in the first lifting groove 231, so that at least part of the flattening roller 22 extends into the first lifting groove 231, so that the flattening roller 22 can slide and cooperate with the first lifting groove 231, thereby allowing the flattening roller 22 to rise and fall along the first lifting groove 231, so that the IC carrier board can be flattened when descending.

[0040] Furthermore, by connecting the elastic element 24 between the dust-adhesive bracket 23 and the flattening roller 22, both ends of the elastic element 24 can be connected to the dust-adhesive bracket 23 and the flattening roller 22 respectively, thereby setting the elastic element 24. The elastic element 24 is used to elastically pre-tighten the flattening roller 22 downwards. The elastic element 24 can be set in the vertical direction, with the upper end of the elastic element 24 connected to the dust-adhesive bracket 23 and the lower end of the elastic element 24 connected to the flattening roller 22, so that the elastic element 24 is in a compressed state. Thus, the elastic element 24 can always provide downward elastic force to the flattening roller 22 under the action of its own restoring force, so as to ensure that the flattening roller 22 can flatten the IC carrier board. The elastic element 24 can be a spring.

[0041] In some embodiments, there are two first lifting grooves 231, which are open to each other, and the two ends of the flattening roller 22 are slidably supported on the two first lifting grooves 231 respectively.

[0042] Specifically, the first lifting groove 231 is used to guide the movement of the flattening roller 22. By setting two first lifting grooves 231, the movement of the flattening roller 22 can be guided by both first lifting grooves 231, which can improve the reliability of guiding the movement of the flattening roller 22. The two ends of the flattening roller 22 are slidably supported on the two first lifting grooves 231 respectively, so that the two first lifting grooves 231 are arranged opposite each other. Then, the two ends of the flattening roller 22 can be extended into the two first lifting grooves 231 respectively, so that the flattening roller 22 can simultaneously slide and cooperate with the two first lifting grooves 231 to flatten the IC carrier by moving up and down along the first lifting grooves 231. Furthermore, by opening the two first lifting grooves 231 towards each other, it is convenient to extend the two ends of the flattening roller 22 into the two first lifting grooves 231 respectively, so that the two first lifting grooves 231 can guide the movement of the flattening roller 22 from the two ends of the flattening roller 22 respectively, which can effectively improve the accuracy of the movement direction of the flattening roller 22.

[0043] In some embodiments, there are two elastic elements 24, and the two elastic elements 24 are respectively pressed against the top of both ends of the flattening roller 22.

[0044] Specifically, the elastic element 24 is used to provide a downward elastic force to the flattening roller 22. By setting two elastic elements 24, the two elastic elements 24 can simultaneously provide a downward elastic force to the flattening roller 22, thereby improving the reliability of the flattening roller 22 in flattening the IC carrier. The two elastic elements 24 are respectively pressed against the top of both ends of the flattening roller 22, so that the two elastic elements 24 are respectively set at both ends of the flattening roller 22. The two elastic elements 24 can be connected in the vertical direction between the dust sticking bracket 23 and the flattening roller 22, so that the two elastic elements 24 can simultaneously provide a downward elastic force to the flattening roller 22 from both ends, so that the two ends of the flattening roller 22 can be balanced by force, thereby improving the stability of the flattening roller 22 in flattening the IC carrier.

[0045] It should be noted that two elastic elements 24 with the same elastic coefficient can be selected so that the two elastic elements 24 can provide the same elastic force to both ends of the flattening roller 22, so as to ensure that the two ends of the flattening roller 22 can be balanced, thereby ensuring the reliability and stability of the flattening roller 22 in flattening the IC carrier.

[0046] In some embodiments, the dust-adhesive bracket 23 is provided with a second lifting groove 232, and the dust-adhesive roller 21 is slidably mounted in the second lifting groove 232.

[0047] Specifically, the second lifting groove 232 is used to guide the lifting and lowering of the dust-adhesive roller 21. The second lifting groove 232 is extended in the vertical direction to improve the accuracy of the movement direction of the dust-adhesive roller 21. The dust-adhesive roller 21 is slidably mounted in the second lifting groove 232, so that at least part of the dust-adhesive roller 21 extends into the second lifting groove 232, so that the dust-adhesive roller 21 can slide and cooperate with the second lifting groove 232, thereby allowing the dust-adhesive roller 21 to rise and fall along the second lifting groove 232, so that it can adhere dust to the IC carrier board when it descends.

[0048] And, as Figures 1-2As shown, there are two second lifting grooves 232. The two second lifting grooves 232 can jointly guide the movement of the dust-adhesive roller 21 to improve the reliability of guiding the movement of the dust-adhesive roller 21. The two second lifting grooves 232 can be arranged opposite each other so that both ends of the dust-adhesive roller 21 can be extended into the two second lifting grooves 232 respectively, so that the dust-adhesive roller 21 can slide and engage with the two second lifting grooves 232 at the same time to lift and lower along the second lifting grooves 232 to adhere dust to the IC carrier board. The two second lifting grooves 232 can be opened to each other so that both ends of the dust-adhesive roller 21 can be extended into the two second lifting grooves 232 respectively, so that the two second lifting grooves 232 can guide the movement of the dust-adhesive roller 21 from both ends, thereby effectively improving the accuracy of the movement direction of the dust-adhesive roller 21.

[0049] Furthermore, each end of the adhesive roller 21 is connected to a ball bearing 5, and the two ball bearings 5 ​​are respectively installed in the two second lifting grooves 232, so that the adhesive roller 21 can be lifted and lowered along the second lifting grooves 232 through the two ball bearings 5, so that it can be used to apply dust to the IC carrier after it is lowered. The upper ends of the two second lifting grooves 232 are both designed to be open upwards, so that when the adhesive roller 21 is worn and fails due to long-term use, it can be moved upwards to be removed from the second lifting grooves 232 for replacement, thereby improving the service life of the IC carrier adhesive device 100 and the effect of applying dust to the IC carrier.

[0050] In some embodiments, the bottom of the mounting bracket 1 is provided with a lifting drive 3, the output end of the lifting drive 3 is connected to the dust sticking bracket 23, and the lifting drive 3 is used to drive the dust sticking bracket 23 to lift.

[0051] Specifically, the lifting drive 3 provides driving force to drive the dust sticking bracket 23 to rise and fall. The output end of the lifting drive 3 can be connected to the dust sticking bracket 23, so that the driving force of the lifting drive 3 can be transmitted to the dust sticking bracket 23. In turn, the dust sticking bracket 23 can drive the dust sticking roller 21 and the flattening roller 22 to rise and fall relative to the mounting frame 1 to stick dust and flatten the IC carrier board. Furthermore, by placing the lifting drive 3 at the bottom of the mounting frame 1, the lifting drive 3 can be connected to the mounting frame 1 for installation, ensuring the reliability of the lifting drive 3. The lifting drive 3 can also be moved closer to the dust sticking bracket 23 to reduce the distance between the lifting drive 3 and the dust sticking bracket 23, which can help shorten the response time and improve the sensitivity of the dust sticking bracket 23. The lifting drive 3 can be constructed as a cylinder.

[0052] In some embodiments, the mounting bracket 1 and the dust-adhesive bracket 23 are movably connected by a linear bearing 4, and the linear bearing 4 and the lifting drive 3 are spaced apart in the horizontal direction.

[0053] Specifically, the dust-adhesive bracket 23 is height-adjustable relative to the mounting frame 1. The mounting frame 1 and the dust-adhesive bracket 23 are movably connected via a linear bearing 4, which extends vertically. Both ends of the linear bearing 4 are connected to the mounting frame 1 and the dust-adhesive bracket 23 respectively, allowing the linear bearing 4 to stably support the mounting frame 1 and the dust-adhesive bracket 23. This enables the dust-adhesive bracket 23 to move linearly vertically relative to the mounting frame 1, i.e., to rise and fall relative to the mounting frame 1. Furthermore, the lifting drive component 3 is also connected to both the mounting frame 1 and the dust-adhesive bracket 23. Both the lifting drive component 3 and the linear bearing 4 are positioned between the mounting frame 1 and the dust-adhesive bracket 23, and the linear bearing 4 and the lifting drive component 3 are spaced apart horizontally. This creates a certain distance between the linear bearing 4 and the lifting drive component 3 in the horizontal direction, preventing interference between them. This would prevent the lifting drive component 3 from driving the dust-adhesive bracket 23 to rise or fall, or the linear bearing 4 from supporting the mounting frame 1 and the dust-adhesive bracket 23, thus improving the reliability of the lifting drive component 3 and the linear bearing 4.

[0054] In some embodiments, there are at least two sets of linear bearings 4, which are spaced apart and distributed on both sides of the lifting drive 3.

[0055] Specifically, the linear bearing 4 is used to provide stable support for the mounting frame 1 and the dust sticking bracket 23, allowing the dust sticking bracket 23 to rise and fall relative to the mounting frame 1. At least two sets of linear bearings 4 are configured, meaning the number of linear bearings 4 can be two, three, or more sets. This allows multiple sets of linear bearings 4 to simultaneously support both the mounting frame 1 and the dust sticking bracket 23, improving the reliability of the support. Furthermore, by distributing at least two sets of linear bearings 4 at intervals on both sides of the lifting drive component 3, the at least two sets of linear bearings 4 can be spaced apart, enabling them to simultaneously support the mounting frame 1 and the dust sticking bracket 23 at multiple locations, thus improving the stability of the support.

[0056] In such Figures 1-2 In the embodiment shown, the linear bearings 4 are configured as two sets, and the two sets of linear bearings 4 are distributed on both sides of the lifting drive 3 at intervals. This allows the mounting frame 1 and the dust sticking bracket 23 to be supported simultaneously on both sides of the lifting drive 3 by the two sets of linear bearings 4, which can improve the reliability and stability of supporting the mounting frame 1 and the dust sticking bracket 23.

[0057] It should be noted that the number of linear bearings 4 is not limited to that described in this embodiment, and can be flexibly set according to actual needs and space.

[0058] In some embodiments, the dust-adhesive structure 2 further includes a dust-adhesive paper roll 25, which is detachably mounted on the dust-adhesive bracket 23 and is used to adhere dust to the dust-adhesive roller 21.

[0059] Specifically, the adhesive paper roll 25 is used to adhere dust to the adhesive roller 21. The adhesive paper roll 25 is positioned against the adhesive roller 21, such as above, to the left of, or diagonally above the adhesive roller 21. This ensures that the adhesive paper roll 25 does not interfere with the adhesive roller 21's application of dust to the IC substrate, while allowing for motion transfer between the adhesive roller 21 and the adhesive paper roll 25. That is, the adhesive roller 21 can drive the adhesive paper roll 25 to move, or the adhesive paper roll 25 can drive the adhesive roller 21 to move. This allows the adhesive paper roll 25 to adhere dust and other contaminants to the adhesive roller 21 while in motion, thus adhering to the adhesive roller 21 and keeping it clean. This ensures the effective application of the adhesive roller 21 to the IC substrate and provides the adhesive paper roll 25 with a certain degree of stickiness, guaranteeing the reliability and effectiveness of the application of dust to the adhesive roller 21.

[0060] Furthermore, the adhesive paper roll 25 can be detachably installed on the adhesive support 23, thereby enabling the installation of the adhesive paper roll 25, ensuring its reliable operation, and facilitating its installation or removal. This allows the adhesive paper roll 25 to adhere to the adhesive roller 21 during installation and facilitates its replacement during removal, ensuring the reliable operation of the adhesive paper roll 25.

[0061] In such Figures 1-2 In the embodiment shown, the adhesive paper roll 25 is mounted above the adhesive roller 21 and in contact with the adhesive roller 21. While the adhesive roller 21 rolls along the surface of the IC substrate to stick dust to the IC substrate, the adhesive roller 21 can drive the adhesive paper roll 25 to rotate, so that the adhesive paper roll 25 can stick dust to the adhesive roller 21, thereby effectively ensuring the effect and reliability of the adhesive roller 21 sticking dust to the IC substrate.

[0062] Furthermore, both ends of the adhesive paper roll 25 extend into the two second lifting grooves 232 and slide in cooperation with them. That is, the adhesive paper roll 25 can rise and fall along the two second lifting grooves 232, and then press against the adhesive roller 21 under the action of gravity to stick dust to the adhesive roller 21. The upper ends of the two second lifting grooves 232 are both designed to be open upwards, so that when the adhesive paper roll 25 fails due to long-term use, it can be moved upwards to be removed from the second lifting grooves 232 for replacement, so as to ensure the effectiveness and reliability of sticking dust to the adhesive roller 21. Both ends of the adhesive paper roll 25 are provided with a separable fixing ring 6, which is used to fix the adhesive paper roll 25 to prevent relative displacement between the adhesive paper roll 25 and the adhesive roller 21, which would result in poor sticking dust to the adhesive roller 21.

[0063] Therefore, with the IC carrier board dust-adhesion device 100 of this application, when it is necessary to dust and flatten the IC carrier board, the dust-adhesion bracket 23 can be driven by the lifting drive 3 to descend smoothly along a straight line under the action of the linear bearing 4. At this time, the dust-adhesion roller 21 and the flattening roller 22 can both abut against the carrier board platform. When the IC carrier board moves to the dust-adhesion roller 21, it can push the dust-adhesion roller 21 to drive the dust-adhesion paper roll 25 to rise a certain distance along the second lifting groove 232. Then, while the IC carrier board moves along the extension direction perpendicular to the dust-adhesion roller 21, the dust-adhesion roller 21 can move along the I The surface of the IC carrier plate is rolled and dust is applied to it. At the same time, the dust-adhesive paper roll 25 can rotate under the drive of the dust-adhesive roller 21 to apply dust to the dust-adhesive roller 21. After that, the IC carrier plate can move to the flattening roller 22 and push the flattening roller 22 to rise a certain distance along the first lifting groove 231. Then, the flattening roller 22 can squeeze the dust-adhesive IC carrier plate under the action of the elastic force provided by the elastic member 24 to flatten the IC carrier plate. After the flattening is completed, the dust-adhesive bracket 23 can be driven by the lifting drive member 3 to drive the dust-adhesive roller 21 and the flattening roller 22 to rise away from the carrier plate platform.

[0064] Furthermore, when it is necessary to replace the adhesive paper roll 25, the adhesive paper roll 25 can be moved upward along the second lifting groove 232 to disengage from the second lifting groove 232, and then the separable fixing ring 6 can be disassembled to easily remove the adhesive paper roll 25 for replacement.

[0065] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0066] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A dust-adhesion device for IC carrier boards, characterized in that, include: Mounting rack; A dust-adhesive structure is vertically and flexibly connected to the lower part of the mounting frame. The dust-adhesive structure is equipped with a dust-adhesive roller and a flattening roller. The dust-adhesive roller is adapted to roll and press against the IC carrier plate after the dust-adhesive structure descends to adhere to the IC carrier plate. The flattening roller is distributed with the dust-adhesive roller in the direction of movement of the IC carrier plate and is used to flatten the IC carrier plate after dust adhesion.

2. The dust-adhesion device for IC carrier boards according to claim 1, characterized in that, The dust-adhesive structure includes a dust-adhesive bracket, which is vertically and flexibly connected to the mounting frame. The dust-adhesive roller and the flattening roller are rotatably mounted on the dust-adhesive bracket.

3. The dust-adhesion device for IC carrier boards according to claim 2, characterized in that, The dust-adhesive bracket is provided with a first lifting groove, and the flattening roller is slidably mounted in the first lifting groove in a height-reducing manner; The dust-adhesive structure further includes an elastic element connected between the dust-adhesive bracket and the flattening roller, which is used to elastically pre-tighten the flattening roller downwards.

4. The dust-adhesion device for IC carrier boards according to claim 3, characterized in that, There are two first lifting grooves, which are open to each other, and the two ends of the flattening roller are slidably supported on the two first lifting grooves respectively.

5. The dust-adhesion device for IC carrier boards according to claim 3, characterized in that, There are two elastic elements, and the two elastic elements press against the top of both ends of the flattening roller.

6. The dust-adhesion device for IC carrier boards according to claim 2, characterized in that, The adhesive support is provided with a second lifting groove, and the adhesive roller is slidably mounted in the second lifting groove.

7. The dust-adhesion device for IC carrier boards according to claim 2, characterized in that, The bottom of the mounting bracket is provided with a lifting drive component, the output end of which is connected to the dust sticking bracket, and the lifting drive component is used to drive the dust sticking bracket to lift.

8. The dust-adhesion device for IC carrier boards according to claim 7, characterized in that, The mounting bracket and the dust-adhesive bracket are movably connected by a linear bearing, and the linear bearing and the lifting drive component are spaced apart in the horizontal direction.

9. The dust-adhesion device for IC carrier boards according to claim 8, characterized in that, The linear bearings are in at least two sets, and the at least two sets of linear bearings are distributed at intervals on both sides of the lifting drive component.

10. The dust-adhesion device for IC carrier boards according to claim 2, characterized in that, The dust-adhesive structure also includes a dust-adhesive paper roll, which is detachably mounted on the dust-adhesive bracket and is used to adhere dust to the dust-adhesive roller.

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