Die machining device capable of preventing die deformation

Abstract

The utility model relates to the technical field of mould processing equipment, in particular to a mould processing device capable of preventing mould deformation, which comprises a rack, a mounting seat is fixedly mounted on the front side of the rack, a hydraulic cylinder is fixedly mounted at the top of the mounting seat, and a mounting plate is fixedly mounted at the driving end of the hydraulic cylinder. A punching plate is movably mounted below the mounting plate, a plurality of buffer assemblies are mounted between the punching plate and the mounting plate, a bearing platform is fixedly mounted at the bottom end of the rack, a cleaning platform is fixedly mounted at the top of the bearing platform, and a protective frame is fixedly mounted at the top of the cleaning platform; by means of the design, stamping force can be buffered, the die can be protected and prevented from deforming, the impact force borne by the bearing platform is reduced, meanwhile, the die is prevented from being scratched by waste scraps left on the surface of the die, and the problems that the die is deformed and the stamping shape is uneven due to the waste scraps are solved.

Description

Technical Field

[0001] This utility model relates to the field of mold processing equipment technology, specifically to a mold processing device that can prevent mold deformation. Background Technology

[0002] Molds are various molds and tools used in industrial production to obtain the desired products through injection molding, blow molding, extrusion, die casting or forging, smelting, stamping and other methods. During the processing of injection molds, due to poor sealing, mold deformation is prone to occur, leading to mold processing failure. In stamping molds, unevenness on the surface of the stamping mold can also cause mold deformation.

[0003] After stamping, existing molds leave a lot of waste on their surface. During the next stamping, this waste can scratch the mold, causing it to deform and scratch the lower surface of the stamping block, resulting in an uneven stamped shape. At the same time, existing molds lack a buffer device. During stamping, the moving mold assembly generates a large stamping force, which puts a lot of pressure on the support table and can easily lead to damage to the support table.

[0004] Therefore, it is of great importance to design a mold processing device that can prevent mold deformation in order to solve the above-mentioned defects. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model designs a mold processing device that can prevent mold deformation. This device aims to solve the technical problems of existing technologies where a lot of waste residue remains on the surface of the mold after stamping, which can lead to mold scratches, mold deformation, uneven stamped shapes, and the lack of a buffer device, which can easily lead to damage to the support platform.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A mold processing device for preventing mold deformation includes a frame, a mounting base fixedly mounted on the front of the frame, a hydraulic cylinder fixedly mounted on the top of the mounting base, a mounting plate fixedly mounted on the drive end of the hydraulic cylinder, a stamping plate movably mounted below the mounting plate, multiple sets of buffer components installed between the stamping plate and the mounting plate, a support platform fixedly mounted at the bottom of the frame, a cleaning platform fixedly mounted on the top of the support platform, a protective frame fixedly mounted on the top of the cleaning platform, air inlets fixedly mounted at both ends inside the protective frame, multiple sets of air blowing heads fixedly mounted on opposite sides of the two sets of air inlets, and a chip removal chamber opened inside the cleaning platform.

[0008] As a preferred embodiment of this utility model, an adjustment plate is fixedly installed at the top of the frame, and the left and right ends of the back of the mounting base are slidably connected to the adjustment plate through sliding grooves. An adjustment screw is threadedly connected to the top of the adjustment plate, and the bottom end of the adjustment screw is rotatably connected to the mounting base.

[0009] As a preferred embodiment of this utility model, the buffer assembly includes multiple sets of sliding columns fixedly connected to the top of the stamping plate, and each set of sliding columns is slidably connected to the mounting plate. A buffer spring is sleeved on the outer side of each set of sliding columns and located between the mounting plate and the stamping plate. A fixing nut is threadedly connected to the top of each set of sliding columns and located at the top of the mounting plate. A washer is sleeved on the outer side of each sliding column and located at the bottom of the fixing nut.

[0010] As a preferred embodiment of this utility model, the top of the support platform is provided with multiple sets of mounting slots, and mounting blocks are fixedly connected to both the left and right sides of the cleaning platform. The multiple sets of mounting blocks are fixedly connected to the mounting slots by mounting bolts.

[0011] As a preferred embodiment of this utility model, cylinders are fixedly installed at both ends of the protective frame, and positioning plates are fixedly installed on the driving ends of the two sets of cylinders and on the inner side of the protective frame. Rubber plates are fixedly connected to the opposite side of the two sets of positioning plates, and the front and rear ends of the positioning plates are slidably connected to the protective frame through sliding rods.

[0012] As a preferred embodiment of this utility model, an air inlet head is fixedly connected to the outside of the air inlet box, and multiple sets of air blowing heads are distributed at equal intervals on the air inlet box.

[0013] As a preferred embodiment of this utility model, both the left and right ends of the top of the cleaning table are provided with chip guide ports, and both sets of chip guide ports are connected to the interior of the chip discharge cavity through chip guide channels, and the chip discharge cavity is inclinedly opened inside the cleaning table.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. In this utility model, through the coordinated design of the frame, mounting base, mounting plate, stamping plate and buffer assembly, the height of the hydraulic cylinder can be adjusted according to the height of the mold before stamping, so as to avoid the maximum stroke pressure of the hydraulic cylinder being too large and causing deformation of the mold. When stamping the mold, the slide column can slide inside the mounting plate, and the buffer spring can absorb the huge stamping pressure brought by the stamping plate through compression buffer, which not only protects the mold from deformation, but also reduces the impact force on the support.

[0016] 2. In this utility model, through the coordinated design of the cleaning table, protective frame, air inlet box, air blowing head and chip removal chamber, the air inlet head is connected to an external compressor through a pipeline. After the die stamping process, the airflow is introduced through the air inlet head, and the airflow is distributed to multiple sets of air blowing heads through the air inlet box to blow out the airflow, thereby blowing the waste chips on the die into the inside of the protective frame. The waste chips blown off the die surface fall into the chip guide port, and then are guided into the inclined chip removal chamber through the chip guide channel. Since the chip removal chamber is inclined inside, only a storage container needs to be placed on its outside, which facilitates the collection and treatment of waste chips, thereby avoiding the problem of waste chips remaining on the die surface scratching the die, as well as the problem of die deformation and uneven stamping shape caused by waste chip residue. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0019] Figure 3 This is a schematic diagram of part of the structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the internal structure of the cleaning table of this utility model.

[0021] In the diagram: 1. Frame; 101. Adjusting plate; 102. Slide groove; 103. Adjusting screw; 2. Mounting base; 3. Hydraulic cylinder; 4. Mounting plate; 5. Stamping plate; 6. Buffer assembly; 601. Sliding column; 602. Buffer spring; 603. Fixing nut; 604. Washer; 7. Support platform; 701. Mounting groove; 702. Mounting block; 8. Cleaning table; 9. Protective frame; 901. Cylinder; 902. Positioning plate; 903. Sliding rod; 10. Air inlet box; 1001. Air inlet head; 11. Air blowing head; 12. Chip discharge chamber; 1201. Chip guide port; 1202. Chip guide channel. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] Example:

[0024] Please see Figures 1-4 This utility model provides a technical solution:

[0025] A mold processing device for preventing mold deformation includes a frame 1, a mounting base 2 fixedly mounted on the front of the frame 1, a hydraulic cylinder 3 fixedly mounted on the top of the mounting base 2, a mounting plate 4 fixedly mounted on the drive end of the hydraulic cylinder 3, a stamping plate 5 movably mounted below the mounting plate 4, multiple sets of buffer components 6 installed between the stamping plate 5 and the mounting plate 4, a support platform 7 fixedly mounted at the bottom of the frame 1, a cleaning platform 8 fixedly mounted on the top of the support platform 7, a protective frame 9 fixedly mounted on the top of the cleaning platform 8, air inlet boxes 10 fixedly mounted at both the left and right ends inside the protective frame 9, multiple sets of air blowing heads 11 fixedly mounted on the opposite side of the two sets of air inlet boxes 10, and a chip removal chamber 12 opened inside the cleaning platform 8.

[0026] First, an adjusting plate 101 is fixedly installed at the top of the frame 1. The left and right ends of the back of the mounting base 2 are slidably connected to the adjusting plate 101 through the sliding groove 102. The top of the adjusting plate 101 is threaded with an adjusting screw 103. The bottom end of the adjusting screw 103 is rotatably connected to the mounting base 2. Before stamping the die, the adjusting screw 103 is rotated according to the height of the die. Under the connection of the sliding groove 102, the height of the mounting base 2 is stably adjusted, thereby adjusting the height of the hydraulic cylinder 3 and avoiding excessive maximum stroke pressure of the hydraulic cylinder 3 from deforming the die.

[0027] Furthermore, the buffer assembly 6 includes multiple sets of sliding pillars 601 fixedly connected to the top of the stamping plate 5, and all sets of sliding pillars 601 are slidably connected to the mounting plate 4. Buffer springs 602 are sleeved on the outer side of each set of sliding pillars 601 and located between the mounting plate 4 and the stamping plate 5. Fixing nuts 603 are threadedly connected to the top of each set of sliding pillars 601 and located at the top of the mounting plate 4. Washers 604 are sleeved on the outer side of each sliding pillar 601 and located at the bottom of the fixing nuts 603. After inserting the multiple sets of sliding pillars 601 on the top of the stamping plate 5 into the holes inside the mounting plate 4, the washers 604 are put on and the fixing nuts 603 are tightened to fix them, thereby installing the stamping plate 5 below the mounting plate 4. When stamping the die, the sliding pillars 601 can slide inside the mounting plate 4. The buffer springs 602 can absorb the huge stamping force brought by the stamping plate 5 through compression buffer, which not only protects the die from deformation but also reduces the impact force on the support 7.

[0028] Then, multiple sets of mounting slots 701 are opened on the top of the foundation 7. Mounting blocks 702 are fixedly connected to both sides of the cleaning platform 8. The multiple sets of mounting blocks 702 are fixedly connected to the mounting slots 701 by mounting bolts. When the cleaning platform 8 is placed on the top of the foundation 7, the mounting blocks 702 are aligned with the mounting slots 701, and then the mounting blocks 702 are fixed by mounting bolts, so that the cleaning platform 8 is installed on the top of the foundation 7 for easy disassembly and maintenance.

[0029] Furthermore, cylinders 901 are fixedly installed at both ends of the protective frame 9. Positioning plates 902 are fixedly installed on the drive ends of the two sets of cylinders 901 and on the inner side of the protective frame 9. Rubber plates are fixedly connected to the opposite side of the two sets of positioning plates 902. The front and rear ends of the positioning plates 902 are slidably connected to the protective frame 9 through slide rods 903. When stamping the mold, the mold is placed on the cleaning table 8 with its back against the rear end of the protective frame 9. Then, the two sets of cylinders 901 are started simultaneously to push the positioning plates 902. Under the connection of the two sets of slide rods 903, the positioning plates 902 are driven to fit against the outer side of the mold for positioning, thereby quickly installing and positioning the mold. At the same time, a rubber plate is provided between the positioning plate 902 and the mold to protect the outer side of the mold and prevent clamping deformation.

[0030] Secondly, an air inlet head 1001 is fixedly connected to the outside of the air inlet box 10, and multiple sets of air blowing heads 11 are evenly distributed on the air inlet box 10. The air inlet head 1001 is connected to an external compressor through a pipeline. After the die stamping process, the airflow is introduced through the air inlet head 1001 and distributed to the multiple sets of air blowing heads 11 through the air inlet box 10 to blow out the airflow, thereby blowing the waste on the die into the interior of the protective frame 9, thus avoiding the problem of the die being scratched by the waste residue on the die surface, as well as the problem of die deformation and uneven stamping shape caused by the waste residue.

[0031] Finally, chip guide ports 1201 are provided at both the left and right ends of the top of the cleaning table 8. Both sets of chip guide ports 1201 are connected to the inside of the chip discharge cavity 12 through the chip guide channel 1202. The chip discharge cavity 12 is inclined inside the cleaning table 8. The waste chips blown off the surface of the mold fall into the chip guide ports 1201 and are then guided into the inclined chip discharge cavity 12 through the chip guide channel 1202. Since the inside of the chip discharge cavity 12 is inclined, only a storage container needs to be placed on its outside, which facilitates the collection and processing of waste chips.

[0032] In this embodiment, the specific implementation scenario is as follows: Before stamping the die, the adjusting screw 103 is rotated according to the die height. Under the connection of the slide groove 102, the height of the mounting base 2 is stably adjusted, thereby adjusting the height of the hydraulic cylinder 3. This prevents excessive maximum stroke pressure of the hydraulic cylinder 3 from deforming the die. After inserting multiple sets of sliding columns 601 on the top of the stamping plate 5 into the holes inside the mounting plate 4, washers 604 are fitted and fixing nuts 603 are tightened for fixation. Thus, the stamping plate 5 is installed below the mounting plate 4. When stamping the die, the sliding columns 601 can slide inside the mounting plate 4. The buffer spring 602 can absorb the enormous stamping pressure brought by the stamping plate 5 through compression buffering. The air inlet 1001 is connected to an external compressor through a pipeline during die stamping processing. Airflow is then introduced through the air inlet 1001 and distributed to multiple air blowers 11 through the air inlet box 10, blowing the waste chips on the mold into the interior of the protective frame 9. The waste chips blown off the mold surface fall into the chip guide port 1201 and then into the inclined chip discharge chamber 12 through the chip guide channel 1202. Since the chip discharge chamber 12 is inclined, only a storage container needs to be placed on its outside, which facilitates the collection and processing of waste chips. The whole operation process is simple and convenient. This utility model can buffer the stamping pressure through its design, which can not only protect the mold from deformation, but also reduce the impact force on the support 7. At the same time, it avoids the problem of scratching the mold due to waste chips remaining on the mold surface, as well as the problem of mold deformation and uneven stamping shape caused by waste chip residue.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A mold processing device for preventing mold deformation, comprising a frame (1), characterized in that: A mounting base (2) is fixedly installed on the front of the frame (1). A hydraulic cylinder (3) is fixedly installed on the top of the mounting base (2). A mounting plate (4) is fixedly installed on the drive end of the hydraulic cylinder (3). A stamping plate (5) is movably installed below the mounting plate (4). Multiple sets of buffer components (6) are installed between the stamping plate (5) and the mounting plate (4). A support platform (7) is fixedly installed at the bottom of the frame (1). A cleaning platform (8) is fixedly installed on the top of the support platform (7). A protective frame (9) is fixedly installed on the top of the cleaning platform (8). An air inlet box (10) is fixedly installed on both the left and right ends inside the protective frame (9). Multiple sets of air blowing heads (11) are fixedly installed on the opposite side of the two sets of air inlets (10). A chip removal chamber (12) is opened inside the cleaning platform (8).

2. The mold processing device for preventing mold deformation according to claim 1, characterized in that: An adjustment plate (101) is fixedly installed at the top of the frame (1). The left and right ends of the back of the mounting base (2) are slidably connected to the adjustment plate (101) through the slide groove (102). An adjustment screw (103) is threadedly connected to the top of the adjustment plate (101). The bottom end of the adjustment screw (103) is rotatably connected to the mounting base (2).

3. The mold processing device for preventing mold deformation according to claim 1, characterized in that: The buffer assembly (6) includes multiple sets of sliding columns (601) fixedly connected to the top of the stamping plate (5), and the multiple sets of sliding columns (601) are slidably connected to the mounting plate (4). Buffer springs (602) are sleeved on the outer side of the multiple sets of sliding columns (601) and between the mounting plate (4) and the stamping plate (5). Fixing nuts (603) are threadedly connected to the top of the multiple sets of sliding columns (601) and at the top of the mounting plate (4). Washers (604) are sleeved on the outer side of the sliding columns (601) and at the bottom of the fixing nuts (603).

4. The mold processing device for preventing mold deformation according to claim 1, characterized in that: The top of the support platform (7) has multiple sets of mounting slots (701), and the left and right sides of the cleaning platform (8) are fixedly connected with mounting blocks (702). The multiple sets of mounting blocks (702) are fixedly connected to the mounting slots (701) by mounting bolts.

5. A mold processing device for preventing mold deformation according to claim 1, characterized in that: Cylinders (901) are fixedly installed at both ends of the protective frame (9). Positioning plates (902) are fixedly installed on the driving ends of the two sets of cylinders (901) and on the inner side of the protective frame (9). Rubber plates are fixedly connected to the opposite side of the two sets of positioning plates (902). The front and rear ends of the positioning plates (902) are slidably connected to the protective frame (9) through slide rods (903).

6. The mold processing device for preventing mold deformation according to claim 1, characterized in that: An air inlet head (1001) is fixedly connected to the outside of the air inlet box (10), and multiple sets of air blowing heads (11) are distributed at equal intervals on the air inlet box (10).

7. A mold processing device for preventing mold deformation according to claim 1, characterized in that: The top of the cleaning table (8) is provided with chip guide ports (1201) at both the left and right ends. Both sets of chip guide ports (1201) are connected to the inside of the chip discharge cavity (12) through the chip guide channel (1202). The chip discharge cavity (12) is inclinedly opened inside the cleaning table (8).

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