Vacuum mechanical arm with vibration monitoring system

Abstract

The utility model discloses a vacuum mechanical arm with a vibration monitoring system, which comprises a front arm and the vibration monitoring system, and the front arm is provided with a bearing part and a connecting part; the vibration monitoring system comprises a signal acquisition module, a signal transmission module and a data analysis module, the signal acquisition module comprises at least one flexible piezoelectric sensor, the flexible piezoelectric sensor is arranged on the bearing part, and the signal transmission module is connected with the signal acquisition module and the data analysis module. Vibration monitoring is carried out on the vacuum mechanical arm based on the flexible piezoelectric sensor, high-sensitivity real-time monitoring and feedback are carried out on the working state of the mechanical arm under the vacuum condition, stable work of transportation equipment is ensured, and meanwhile the flexible piezoelectric sensor has the small size and the light and thin form and can adapt to scenes of different shapes and sizes.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing, and in particular relates to a vacuum robotic arm with a vibration monitoring system. Background Technology

[0002] In the chip manufacturing process, vacuum robotic arms are used to handle wafers. During the handling process, the end of the vacuum robotic arm may vibrate, which may affect the working quality and efficiency of the vacuum robotic arm. Therefore, it is necessary to monitor the vibration of the vacuum robotic arm in real time and adjust the equipment in a timely manner.

[0003] Currently, the sensors used for vibration monitoring in vacuum robotic arms are mainly accelerometers and multi-channel sensors. Accelerometers have limited monitoring capabilities in the horizontal direction, and during wafer transport, some complex vibrations may not be detected in a timely and accurate manner, increasing the risk of wafer damage due to undetected vibrations. Multi-channel sensors compensate for the limitation in detection direction to some extent, enabling multi-directional vibration monitoring; however, the increased sensor size may occupy excessive space in space-constrained wafer transport equipment or environments, affecting equipment layout and operational convenience. Therefore, there is a need for a vacuum robotic arm with a vibration monitoring system to provide highly sensitive real-time monitoring and feedback of the robotic arm's vibrations. Utility Model Content

[0004] The purpose of this invention is to solve all or part of the above-mentioned problems by providing a vacuum robotic arm with a vibration monitoring system, including a forearm and a vibration monitoring system. The forearm has a load-bearing part and a connecting part. A flexible piezoelectric sensor is installed on the load-bearing part. A signal transmission module connects a signal acquisition module and a data analysis module. The system monitors the vibration of the vacuum robotic arm based on the flexible piezoelectric sensor, and performs high-sensitivity real-time monitoring and feedback on the working status of the vacuum robotic arm to ensure the stable operation of the transportation equipment.

[0005] This invention provides a vacuum robotic arm with a vibration monitoring system, including a forearm having a support portion and a connecting portion; and a vibration monitoring system comprising a signal acquisition module, a signal transmission module, and a data analysis module. The signal acquisition module includes at least one flexible piezoelectric sensor disposed on the support portion, and the signal transmission module connects the signal acquisition module and the data analysis module. Real-time vibration monitoring and feedback of the vacuum robotic arm based on the flexible piezoelectric sensor ensures stable operation of the transport equipment.

[0006] The signal transmission module transmits signals to the data analysis module via wires; or the flexible piezoelectric sensor combined with the FPC flexible wireless signal board is adhered to the carrier and transmits signals to the data analysis module wirelessly. The wired or wireless transmission method can be selected according to process requirements. The piezoelectric material layer in the flexible piezoelectric sensor converts mechanical vibration signals into electrical signals through the piezoelectric effect. After the electrical signals are processed by the signal transmission module through filtering, amplification, analog-to-digital conversion, etc., they are output to the data analysis module to analyze parameters such as vibration intensity, frequency, and duration, and compare them with safety thresholds. If the values ​​exceed the range, an alarm is triggered and transportation can be suspended.

[0007] In the wired configuration, the input end of the wire is connected to the flexible piezoelectric sensor, and the output end is connected to the data analysis module, facilitating signal transmission.

[0008] The wire is disposed on the connecting part to facilitate the connection between the flexible piezoelectric sensor and the data analysis module.

[0009] The flexible piezoelectric sensor is a flexible piezoelectric thin film structure made of flexible piezoelectric material. Using piezoelectric materials with excellent piezoelectric properties and good flexibility, the flexible piezoelectric sensor exhibits high sensitivity, multi-directional detection, and a small size and thin shape, making it adaptable to various shapes and sizes, reducing equipment operation and maintenance costs, and decreasing reliance on other expensive monitoring equipment.

[0010] The flexible piezoelectric material is an organic piezoelectric material or a composite piezoelectric material. The organic piezoelectric materials include materials such as polyvinylidene fluoride (PVDF), polylactic acid (PLA), polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE), and polypropylene (PP), which inherently possess certain piezoelectricity and flexibility. The composite piezoelectric material is composed of an elastomer and an inorganic piezoelectric material. The elastomer includes polyurethane (PU) and polydimethylsiloxane (PDMS), etc. The inorganic piezoelectric materials include lead titanate, barium titanate, lead zirconate titanate, barium titanate, lead zirconate titanate, etc. The flexible piezoelectric sensor possesses certain piezoelectricity and flexibility, allowing it to be attached to the surface of various wafer transport devices and adapt to different transport paths and structures.

[0011] The side of the support portion that contacts the wafer is the support surface. The flexible piezoelectric sensor is adhered to the support surface by an adhesive to monitor the slight vibrations of the vacuum robotic arm.

[0012] The flexible piezoelectric sensor has the same shape as the bearing surface; or the flexible piezoelectric sensor is arranged in an array on the bearing surface. The flexible piezoelectric sensor is thin and light, does not occupy too much space, facilitates equipment layout, and does not affect normal operation.

[0013] The thickness of the flexible piezoelectric sensor is greater than 25 μm, and the specific thickness can be adjusted through the manufacturing process.

[0014] The vibration monitoring system is integrated into the wafer manufacturing automation control system and connected to a remote monitoring center, allowing for real-time monitoring and control of parameters during the wafer manufacturing process.

[0015] Compared with existing technologies, the beneficial effects of this utility model are as follows: The vacuum robotic arm with a vibration monitoring system provided by this utility model includes a forearm and a vibration monitoring system. The forearm has a load-bearing part and a connecting part. A flexible piezoelectric sensor is installed on the load-bearing part. A signal transmission module connects a signal acquisition module and a data analysis module. High sensitivity and multi-directional detection are achieved based on the characteristics of flexible piezoelectric materials. At the same time, the flexible piezoelectric sensor has a small size and thin shape, which can adapt to scenarios with different shapes and sizes. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a vacuum robotic arm with a vibration monitoring system.

[0018] Figure 2 A schematic diagram of the bonding structure for a flexible piezoelectric sensor designed according to the shape of the support component.

[0019] Figure 3 This is a schematic diagram of a flexible piezoelectric sensor array bonding structure.

[0020] Figure 4 This is a schematic diagram of a wireless transmission method. Detailed Implementation

[0021] The technical solutions in specific embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0022] Compared to atmospheric pressure robotic arms, vacuum robotic arms do not have adsorption force. During operation, the wafer is simply placed on the vacuum robotic arm. Therefore, placing a sensor between the vacuum robotic arm and the wafer has little impact on the operation of the vacuum robotic arm.

[0023] This embodiment provides a vacuum robotic arm with a vibration monitoring system, such as... Figure 1 As shown, the vacuum robotic arm includes a forearm 1 and a vibration monitoring system 2. The forearm 1 has a support portion 11 and a connecting portion 12. The vacuum robotic arm also includes a displacement module. The forearm 1 is mounted on the displacement module, and the displacement module drives the forearm 1 to move. The vibration monitoring system 2 includes a signal acquisition module 21, a signal transmission module 22, and a data analysis module 23. The signal acquisition module 21 includes at least one flexible piezoelectric sensor. The flexible piezoelectric sensor is disposed on the support portion 11. The side of the support portion 11 that contacts the wafer is the support surface. The flexible piezoelectric sensor is adhered to the support surface by an adhesive. The signal transmission module 22 connects the signal acquisition module 21 and the data analysis module 23.

[0024] Signal transmission can be wired or wireless. Signal transmission module 22 transmits the signal to data analysis module 23 via a wire; or a flexible piezoelectric sensor combined with an FPC flexible wireless signal board is adhered to the carrier. Figure 4 As shown, the signal is transmitted wirelessly to the data analysis module 23. Wired or wireless transmission methods can be selected according to process requirements. In the flexible piezoelectric sensor, the piezoelectric material layer converts mechanical vibration signals into electrical signals through the piezoelectric effect. These electrical signals are then processed by the signal transmission module 22, including filtering, amplification, and analog-to-digital conversion, before being output to the data analysis module 23. The data analysis module 23 analyzes parameters such as vibration intensity, frequency, and duration, comparing them with safety thresholds. If the values ​​exceed the thresholds, an alarm is triggered, and transportation can be suspended. In the wired configuration, the signal transmission module 22 has its input end connected to the flexible piezoelectric sensor and its output end connected to the data analysis module 23. The wire is positioned on the connection part 12.

[0025] Flexible piezoelectric sensors are flexible piezoelectric thin-film structures based on flexible piezoelectric materials. They possess high sensitivity and can perform multi-directional detection. The flexible piezoelectric materials can be organic or composite piezoelectric materials. Organic piezoelectric materials can be materials with inherent piezoelectricity and flexibility, such as polyvinylidene fluoride (PVDF), polylactic acid (PLA), polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE), and polypropylene (PP). Composite piezoelectric materials are composed of an elastomer and an inorganic piezoelectric material. The elastomer can be polyurethane (PU) or polydimethylsiloxane (PDMS), while the inorganic piezoelectric material can be lead titanate, barium titanate, lead zirconate titanate, barium titanate, or lead zirconate titanate. The thickness of the flexible piezoelectric sensor is greater than 25 μm, which can be adjusted through the manufacturing process. The length and width can be cut according to the application scenario. The flexible piezoelectric sensor can conform to the shape of the supporting surface, such as... Figure 2As shown, this ensures contact with the wafer plane, resulting in a larger contact area and maximizing wafer stability for more stable monitoring; or it can be arranged in an array on the support surface, for example... Figure 3 The three-point contact method shown is used for pasting.

[0026] The vibration monitoring system 2 is integrated into the wafer manufacturing automation control system and connected to a remote monitoring center, allowing for real-time monitoring and control of parameters during the wafer manufacturing process.

[0027] The following describes the working principle of a vacuum robotic arm with a vibration monitoring system provided in this embodiment: A flexible piezoelectric sensor is designed and manufactured based on flexible piezoelectric material according to process requirements. It can be designed according to the shape of the bearing part 11 of the forearm 1 and attached to the bearing surface, or designed as a small-volume sensor and attached to the bearing surface in an array. The signal transmission module 22 connects the signal acquisition module 21 and the data analysis module 23. The signal transmission module 22 can transmit signals to the data analysis module 23 via wires, or combine the flexible piezoelectric sensor with an FPC flexible wireless signal board, attaching the entire assembly to the bearing surface to wirelessly transmit signals to the data analysis module 23. In the wired configuration, the input end of the wire is connected to the flexible piezoelectric sensor, and the output end is connected to the data analysis module 23. The wire is located on the connecting part 12. In the flexible piezoelectric sensor, the piezoelectric material layer converts mechanical vibration signals into electrical signals through the piezoelectric effect. After the electrical signals are processed by the signal transmission module 22 through filtering, amplification, analog-to-digital conversion, etc., they are output to the data analysis module 23 to analyze parameters such as vibration intensity, frequency, and duration, and compare them with safety thresholds. If the range is exceeded, an alarm is triggered and transportation can be suspended. The vibration monitoring system 2 can be integrated into the wafer manufacturing automation control system, work in conjunction with other equipment, and can be connected to a remote monitoring center.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A vacuum robotic arm with a vibration monitoring system, characterized in that, include: Forearm (1), the forearm (1) has a support portion (11) and a connecting portion (12); The vibration monitoring system (2) includes a signal acquisition module (21), a signal transmission module (22) and a data analysis module (23). The signal acquisition module (21) includes at least one flexible piezoelectric sensor, which is disposed on the bearing part (11). The signal transmission module (22) connects the signal acquisition module (21) and the data analysis module (23).

2. The vacuum robotic arm with a vibration monitoring system according to claim 1, characterized in that, The signal transmission module (22) transmits the signal to the data analysis module (23) via a wire in a wired manner. Alternatively, the flexible piezoelectric sensor can be combined with the FPC flexible wireless signal board and adhered as a whole to the carrier to wirelessly transmit signals to the data analysis module (23).

3. The vacuum robotic arm with a vibration monitoring system according to claim 2, characterized in that, In the wired configuration state, the input end of the signal transmission module (22) is connected to the flexible piezoelectric sensor, and the output end is connected to the data analysis module (23).

4. The vacuum robotic arm with a vibration monitoring system according to claim 3, characterized in that, The wire is disposed on the connecting part (12).

5. The vacuum robotic arm with a vibration monitoring system according to claim 1, characterized in that, The flexible piezoelectric sensor is a flexible piezoelectric thin film structure made of flexible piezoelectric material.

6. The vacuum robotic arm with a vibration monitoring system according to claim 5, characterized in that, The flexible piezoelectric material is an organic piezoelectric material or a composite piezoelectric material.

7. The vacuum robotic arm with a vibration monitoring system according to claim 1, characterized in that, The side of the carrier (11) that contacts the wafer is the carrier surface, and the flexible piezoelectric sensor is adhered to the carrier surface by an adhesive.

8. The vacuum robotic arm with a vibration monitoring system according to claim 7, characterized in that, The flexible piezoelectric sensor has the same shape as the bearing surface; Alternatively, the flexible piezoelectric sensors may be arranged in an array on the bearing surface.

9. The vacuum robotic arm with a vibration monitoring system according to claim 1, characterized in that, The thickness of the flexible piezoelectric sensor is greater than 25 μm.

10. The vacuum robotic arm with a vibration monitoring system according to claim 1, characterized in that, The vibration monitoring system (2) is integrated into the wafer manufacturing automation control system and connected to the remote monitoring center.

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