Thermal management device, thermal management system and vehicle

Abstract

The utility model discloses a thermal management device, a thermal management system and a vehicle, the thermal management device comprises a compressor assembly, a first heat exchanger assembly and a second heat exchanger assembly, the compressor assembly, the first heat exchanger assembly and the second heat exchanger assembly are distributed along the axis of the compressor assembly; the compressor assembly is arranged between the first heat exchanger assembly and the second heat exchanger assembly, and the compressor assembly, the first heat exchanger assembly and the second heat exchanger assembly are connected to form a refrigerant circulation loop. The heat management device further comprises a control assembly, and the control assembly is arranged on the compressor assembly and electrically connected with the compressor assembly. According to the heat management device, the compressor assembly is arranged between the first heat exchanger assembly and the second heat exchanger assembly, the control assembly is arranged on the compressor assembly, the connecting lengths of the first heat exchanger assembly, the second heat exchanger assembly and the control assembly with the compressor assembly are shortened, and the operation efficiency of the heat management device is improved.

Description

Technical Field

[0001] This utility model relates to the field of thermal management technology, and in particular to a thermal management device, a thermal management system, and a vehicle. Background Technology

[0002] With the development of new energy vehicles and energy storage technologies, thermal management devices are increasingly widely used in electric vehicles and energy storage equipment. As environmental regulations become increasingly stringent in various countries, the use of refrigerants with high global warming potential (GWP) is strictly limited. The design of automotive thermal management systems needs to adapt to the characteristics of new refrigerants, such as highly flammable natural gas R290. The automotive industry has higher requirements for the compactness and efficiency of integrated thermal management modules. Existing thermal management devices have complex internal structures, numerous pipelines, and excessively long connections between multiple components. Utility Model Content

[0003] One objective of this invention is to provide a thermal management device, a thermal management system, and a vehicle, wherein a compressor assembly is disposed between a first heat exchanger assembly and a second heat exchanger assembly, and a control assembly is disposed within the compressor assembly, thereby shortening the connection lengths between the first heat exchanger assembly, the second heat exchanger assembly, and the control assembly and the compressor assembly, and improving the operating efficiency of the thermal management device.

[0004] A thermal management device according to an embodiment of the present invention includes a compressor assembly, a first heat exchanger assembly, and a second heat exchanger assembly. The compressor assembly, the first heat exchanger assembly, and the second heat exchanger assembly are distributed along the axis of the compressor assembly. The compressor assembly is disposed between the first heat exchanger assembly and the second heat exchanger assembly, and the compressor assembly, the first heat exchanger assembly, and the second heat exchanger assembly are connected to form a refrigerant circulation loop. The thermal management device also includes a control assembly, which is disposed on the compressor assembly and electrically connected to the compressor assembly.

[0005] According to the thermal management device of this utility model embodiment, the compressor assembly is disposed between the first heat exchanger assembly and the second heat exchanger assembly, and the control assembly is disposed on the compressor assembly, thereby shortening the connection lengths between the first heat exchanger assembly, the second heat exchanger assembly, and the control assembly and the compressor assembly, and improving the operating efficiency of the thermal management device.

[0006] In addition, the thermal management device according to the above embodiments of the present invention may also have the following additional technical features:

[0007] In some embodiments, the control component is mounted on the compressor assembly and located on the side of the compressor assembly.

[0008] In some embodiments, the control components and the compressor components are distributed along a direction perpendicular to the axis.

[0009] In some embodiments, the control assembly further includes a control box, a low-voltage connector, and a high-voltage connector, wherein the low-voltage connector and the high-voltage connector are respectively provided on both sides of the control box along a direction parallel to the axis.

[0010] In some embodiments, the low-pressure connector is located on the side closer to the second heat exchanger assembly, and the high-pressure connector is located on the side closer to the first heat exchanger assembly.

[0011] In some embodiments, the low-voltage connector extends in a direction parallel to the axis.

[0012] In some embodiments, the high-voltage connector extends in a direction parallel to the axis.

[0013] In some embodiments, the control component further includes capacitors, inductors, an integrated circuit board, and a power module. The capacitors, inductors, integrated circuit board, and power module are integrated within the control box. The capacitors and inductors are distributed alternately. The inductors, integrated circuit board, and power module are stacked along a direction perpendicular to the axis of the compressor assembly. The power module is in contact with the outer wall surface of the compressor assembly.

[0014] In some embodiments, the control component includes a first high-voltage bus and a second high-voltage bus. The first high-voltage bus extends along a direction parallel to the axis of the compressor assembly, and the second high-voltage bus extends along a direction perpendicular to the axis of the compressor assembly. The compressor assembly includes a stator. One end of the first high-voltage bus is connected to the stator, and one end of the second high-voltage bus is connected to the integrated circuit board. The other end of the first high-voltage bus is soldered to the other end of the second high-voltage bus.

[0015] In some embodiments, the compressor assembly has a first end and a second end distributed along the axis, the first end having a high-pressure chamber and the second end having a low-pressure chamber, the first heat exchanger assembly being connected to the first end and the second heat exchanger assembly being connected to the second end.

[0016] In some embodiments, the end face of the first end of the compressor assembly is provided with a first interface, the first interface being connected to the high-pressure chamber, and the first heat exchanger assembly is disposed on the end face of the first end and connected to the first interface.

[0017] In some embodiments, the thermal management device has a connection channel that connects the first heat exchanger assembly and the second heat exchanger assembly.

[0018] In some embodiments, the connection channel is disposed on the compressor assembly, wherein the end face of the first end of the compressor assembly is provided with a second interface, the second interface being connected to the connection channel, and the first heat exchanger assembly is disposed on the end face of the first end and is connected to the second interface.

[0019] In some embodiments, the end face of the second end of the compressor assembly is provided with a third interface, the third interface being connected to the connection channel, and the second heat exchanger assembly is disposed on the end face of the second end and connected to the third interface.

[0020] In some embodiments, the thermal management device further includes a first valve connected in series in the connection channel, the first valve being disposed between the first heat exchanger assembly and the second heat exchanger assembly.

[0021] In some embodiments, the thermal management device has a bypass passage that connects the high-pressure chamber and the second heat exchanger assembly.

[0022] In some embodiments, the bypass channel is disposed in the compressor assembly, wherein the end face of the first end of the compressor assembly is provided with a fourth interface, the fourth interface being connected to the bypass channel, and the high-pressure chamber being connected to the fourth interface.

[0023] In some embodiments, the end face of the second end of the compressor assembly is provided with a fifth interface, the fifth interface being connected to the bypass channel, and the second heat exchanger assembly is disposed on the end face of the second end and connected to the fifth interface.

[0024] In some embodiments, the thermal management device further includes a second valve connected in series with the bypass passage and disposed between the high-pressure chamber and the second heat exchanger assembly.

[0025] In some embodiments, the thermal management device has a reflux channel that connects the second heat exchanger assembly and the low-pressure chamber.

[0026] In some embodiments, the second end of the compressor assembly is provided with a sixth interface, the sixth interface being connected to the return channel, the low-pressure chamber being connected to the sixth interface, and the second heat exchanger assembly being disposed on the end face of the second end and connected to the sixth interface.

[0027] In some embodiments, the return channel includes a first channel and a second channel, the first channel being connected to the second channel, wherein the first channel extends along a direction parallel to the axis of the compressor assembly, and the second channel extends in a vertical direction.

[0028] In some embodiments, the first heat exchanger assembly includes a condenser and a subcooler, the condenser being in communication with the compressor assembly, and the subcooler being in communication with both the condenser and the second heat exchanger assembly.

[0029] In some embodiments, the first heat exchanger assembly further includes a reservoir assembly disposed on a side of the first heat exchanger assembly away from or close to the compressor assembly.

[0030] In some embodiments, the second heat exchanger assembly includes an evaporator connected to the first heat exchanger assembly and the compressor assembly.

[0031] In some embodiments, the first heat exchanger assembly includes a first heat exchange fluid flow path, and the side of the first heat exchanger assembly opposite to the compressor assembly is provided with a first heat exchange fluid inlet and a first heat exchange fluid outlet, and the first heat exchange fluid flow path is connected between the first heat exchange fluid inlet and the first heat exchange fluid outlet.

[0032] In some embodiments, the second heat exchanger assembly includes a second heat exchange fluid flow path, and the side of the second heat exchanger assembly opposite to the compressor assembly is provided with a second heat exchange fluid inlet and a second heat exchange fluid outlet, and the second heat exchange fluid flow path is connected between the second heat exchange fluid inlet and the second heat exchange fluid outlet.

[0033] The thermal management system according to an embodiment of the present invention includes the aforementioned thermal management device.

[0034] The vehicle according to the present invention includes the aforementioned thermal management device; or the aforementioned thermal management system. Attached Figure Description

[0035] Figure 1 This is a perspective view of the thermal management device in some embodiments of the present invention.

[0036] Figure 2 This is a perspective view of the thermal management device in some embodiments of the present invention.

[0037] Figure 3 This is a perspective view of the thermal management device in some embodiments of the present invention.

[0038] Figure 4 This is a perspective view of the thermal management device in some embodiments of the present invention, where the second heat exchanger assembly is not installed.

[0039] Figure 5 This is a perspective view of the thermal management device in some embodiments of the present invention.

[0040] Figure 6This is a perspective view of the thermal management device in some embodiments of the present invention.

[0041] Figure label:

[0042] Thermal management device 100, first flow path 101, second flow path 102, third flow path 103, connecting channel 104, return channel 105, first channel 1051, second channel 1052, bypass channel 106, first heat exchanger assembly 10, condenser 11, subcooler 12, liquid receiver assembly 13, first heat exchange liquid flow path 14, second heat exchanger assembly 20, evaporator 21, second heat exchange liquid flow path 22, compressor assembly 30, first end 301, second end 302, first interface 31 Second interface 32, third interface 33, fifth interface 35, sixth interface 36, first valve 40, second valve 50, control component 60, control box 61, low-voltage connector 62, high-voltage connector 63, capacitor 64, inductor 65, integrated circuit board 66, power module 67, first high-voltage cable 68, second high-voltage cable 69, first balance block 71, second balance block 72, motor 73, scroll plate 74, vibration isolation pad 75, bearing bracket 76, fixing bolt 77, low-voltage housing 78, high-voltage housing 79. Detailed Implementation

[0043] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0044] Combination Figures 1 to 6 The thermal management device 100 according to an embodiment of the present invention includes a compressor assembly 30, a first heat exchanger assembly 10, and a second heat exchanger assembly 20. The compressor assembly 30, the first heat exchanger assembly 10, and the second heat exchanger assembly 20 are distributed along the axis of the compressor assembly 30. The compressor assembly 30 is disposed between the first heat exchanger assembly 10 and the second heat exchanger assembly 20, and the compressor assembly 30, the first heat exchanger assembly 10, and the second heat exchanger assembly 20 are connected to form a refrigerant circulation loop. After being compressed by the compressor assembly 30, the refrigerant flows into the first heat exchanger assembly 10 for heat exchange. After heat exchange, the refrigerant flows out of the first heat exchanger assembly 10 and flows into the second heat exchanger assembly 20 for a second heat exchange. After the second heat exchange, the refrigerant flows back into the compressor assembly 30 and is recompressed by the compressor assembly 30. The compressed refrigerant then re-enters a new cycle of cooling and heating.

[0045] Compared to placing the first heat exchanger assembly 10 and the second heat exchanger assembly 20 on the same side of the compressor assembly 30, the first heat exchanger assembly 10 and the second heat exchanger assembly 20 are respectively placed on opposite sides of the compressor assembly 30. The first heat exchanger assembly 10 is connected to one side of the compressor assembly 30, and the second heat exchanger assembly 20 is connected to the other side of the compressor assembly 30. This shortens the connection length between the first heat exchanger assembly 10 and the compressor assembly 30, and also shortens the connection length between the second heat exchanger assembly 20 and the compressor assembly 30. This simplifies the structure of the connecting pipes, reduces the number of pipes, and thus improves the operating efficiency of the thermal management device 100 and reduces production costs. At the same time, since the first heat exchanger assembly 10 and the second heat exchanger assembly 20 have different operating states and operating environments, separating the first heat exchanger assembly 10 and the second heat exchanger assembly 20 can avoid mutual interference between the operating environments of the first heat exchanger assembly 10 and the second heat exchanger assembly 20, such as temperature factors, thereby improving the operational stability of the thermal management device 100.

[0046] In addition, the thermal management device 100 also includes a control component 60, which is located on the compressor assembly 30. This shortens the connection length between the control component 60 and the compressor assembly 30, reduces energy transfer losses in the connection structure, and lowers the energy loss of the thermal management device 100, thereby improving the reliability of the thermal management device 100. At the same time, the control component 60 is electrically connected to the compressor assembly 30. The control component 60 is used to control the operation of the compressor assembly 30 and receive feedback signals from the compressor assembly 30, thereby determining whether the compressor assembly 30 is in normal operating condition, which improves the safety of the operation of the thermal management device 100.

[0047] According to the thermal management device 100 of this utility model embodiment, the compressor assembly 30 is disposed between the first heat exchanger assembly 10 and the second heat exchanger assembly 20, and the control assembly 60 is disposed on the compressor assembly 30. This shortens the connection length between the first heat exchanger assembly 10, the second heat exchanger assembly 20 and the control assembly 60 and the compressor assembly 30, thereby improving the operating efficiency of the thermal management device 100. At the same time, the compressor assembly 30 is disposed between the first heat exchanger assembly 10 and the second heat exchanger assembly 20, and the control assembly 60 is disposed on the compressor assembly 30 in a box-like structure, which simplifies the assembly structure of the thermal management device 100 and improves the integration level of the thermal management device 100.

[0048] In addition, the thermal management device 100 of this utility model can be used in vehicles or other equipment that requires temperature regulation. This utility model is mainly described in the context of vehicles, but this is not a limitation on the scope of protection of this utility model.

[0049] In some embodiments, the control component 60 is mounted on the compressor assembly 30 and disposed on the side of the compressor assembly 30. Compared to arranging the control component 60 and the compressor assembly 30 along a direction perpendicular to or along the axis, disposing the control component 60 on the side of the compressor assembly 30 can reduce the height of the thermal management device 100 along the direction perpendicular to the axis, and at the same time reduce the length of the thermal management device 100 along the axis, thereby reducing the overall size of the thermal management device 100 and the space occupied by the thermal management device 100.

[0050] In some embodiments, the control component 60 and the compressor component 30 are distributed in a direction perpendicular to the axis. Compared to arranging the control component 60 and the compressor component 30 along the axis, arranging the control component 60 and the compressor component in a direction perpendicular to the axis can reduce the length of the thermal management device 100 along the axis, thereby reducing the overall size of the thermal management device 100 and improving the integration of the thermal management device 100.

[0051] In some embodiments, the control assembly 60 further includes a control box 61, a low-voltage connector 62, and a high-voltage connector 63. The control box 61 has the low-voltage connector 62 and the high-voltage connector 63 on opposite sides along a direction parallel to the axis. The compressor assembly 30 includes a compression component. The high-voltage connector 63 can connect to the vehicle's high-voltage wiring harness to provide high-voltage electricity to the compression component and implement the interlock function of the high-voltage system. The low-voltage connector 62 connects to the vehicle's low-voltage wiring harness to provide a low-voltage control signal to the compression component. The vehicle controls the compression component and receives feedback signals from the compression component through the low-voltage connector 62.

[0052] In some embodiments, the low-pressure connector 62 is located on the side closer to the second heat exchanger assembly 20, and the high-pressure connector 63 is located on the side closer to the first heat exchanger assembly 10, so as to avoid mutual interference between high-pressure and low-pressure electricity during operation and facilitate separate wiring of high-pressure connector 63 and low-pressure connector 62.

[0053] Optionally, the low-voltage connector 62 can extend in a direction parallel to the aforementioned axis. Compared to extending in a direction perpendicular to the axis, extending the low-voltage connector 62 in a direction parallel to the axis can shorten the height of the thermal management device 100 in the direction perpendicular to the axis, thereby reducing the overall size of the thermal management device 100 and reducing the space occupied by the thermal management device 100.

[0054] Optionally, the high-voltage connector 63 can extend in a direction parallel to the aforementioned axis. Compared to extending in a direction perpendicular to the axis, extending the high-voltage connector 63 in a direction parallel to the axis can shorten the height of the thermal management device 100 in the direction perpendicular to the axis, thereby reducing the overall size of the thermal management device 100 and reducing the space occupied by the thermal management device 100.

[0055] In some embodiments, the control component 60 further includes a capacitor 64, an inductor 65, an integrated circuit board 66, and a power module 67. The capacitor 64, inductor 65, integrated circuit board 66, and power module 67 are integrated in the control box 61. The capacitor 64 and inductor 65 are distributed alternately. The inductor 65, integrated circuit board 66, and power module 67 are stacked along the axis perpendicular to the compressor assembly 30. The power module 67 is in contact with the outer wall surface of the compressor assembly 30. The heat generated by the power module 67 during operation can exchange heat with the outer wall surface of the compressor assembly 30, which facilitates the heat dissipation of the functional module.

[0056] For example, the control component 60 is located at the upper end of the low-pressure housing 78, and the power module 67 is connected to the outer wall of the low-pressure housing 78. The outer wall of the low-pressure housing 78 can serve as the heat dissipation surface of the power module 67. The heat generated on the power module 67 can be efficiently conducted through the outer wall of the low-pressure housing 78. The heat conducted to the low-pressure housing 78 is released into the refrigerant through convection heat exchange between the low-pressure housing 78 and the refrigerant, making full use of the heat generated by the power module 67 and reducing the heat loss of the system.

[0057] In some embodiments, the control component 60 is provided with a first high-voltage cable 68 and a second high-voltage cable 69. The first high-voltage cable 68 extends along a direction parallel to the axis of the compressor assembly 30, and the second high-voltage cable 69 extends along a direction perpendicular to the axis of the compressor assembly 30. The compressor assembly 30 includes a motor 73. One end of the first high-voltage cable 68 is connected to the motor 73, and one end of the second high-voltage cable 69 is connected to the integrated circuit board 66. The other end of the first high-voltage cable 68 is soldered to the other end of the second high-voltage cable 69, so that the integrated circuit board 66 can supply power and control the motor 73.

[0058] Specifically, the compression component also includes a motor spindle, a motor 73, a scroll plate 74, a first bearing, a second bearing, a first balance block 71, and a second balance block 72. The integrated circuit board 66 receives control signals from the low-voltage connector 62 and converts the DC power from the high-voltage connector 63 into AC power with adjustable frequency and voltage, generating a rotating magnetic field through the coils of the motor stator. The motor rotor rotates under the influence of this rotating magnetic field, revolving around the axis formed by the first and second bearings. The first balance block 71 and the second balance block 72 are installed at the ends of the motor spindle and the motor rotor, respectively. These two balance blocks counteract the unbalanced forces generated by the movement of the motor rotor and the scroll plate 74, reducing vibration of the compression component. The scroll plate 74 and the motor rotor are connected together via the motor spindle, and the scroll plate 74 undergoes helical translation under the drive of the motor rotor.

[0059] Combination Figure 2In some embodiments, the compressor assembly 30 has a first end 301 and a second end 302 distributed along an axis. The first end 301 has a high-pressure chamber, and the second end 302 has a low-pressure chamber. A first heat exchanger assembly 10 is connected to the first end 301, and a second heat exchanger assembly 20 is connected to the second end 302. The first heat exchanger assembly 10 and the second heat exchanger assembly 20 are located at different ends of the compressor assembly 30, which can avoid the temperature of the first heat exchanger assembly 10 during operation from affecting the temperature of the second heat exchanger assembly 20 during operation, thereby improving the cooling and heating efficiency of the thermal management device 100. In addition, the first heat exchanger assembly 10 is close to the high-pressure chamber, and the second heat exchanger assembly 20 is close to the low-pressure chamber, which shortens the flow path length of the refrigerant in the high-pressure chamber into the first heat exchanger assembly 10 and shortens the flow path length of the refrigerant in the second heat exchanger assembly 20 into the low-pressure chamber, thereby reducing the amount of refrigerant used.

[0060] Optionally, the compressor assembly 30 may include a high-pressure housing 79 and a low-pressure housing 78, which are connected. The high-pressure chamber may be located in the high-pressure housing 79 and the low-pressure chamber may be located in the low-pressure housing 78. This can prevent the high-pressure chamber and the low-pressure chamber of the compressor assembly 30 from affecting each other and improve the integration of the compressor assembly 30.

[0061] Combination Figure 2 In some embodiments, the end face of the first end 301 of the compressor assembly 30 is provided with a first interface 31, which is connected to the high pressure chamber. The first heat exchanger assembly 10 is located on the end face of the first end 301 and is connected to the first interface 31, thereby shortening the flow path of the refrigerant in the high pressure chamber into the first heat exchanger assembly 10 and reducing the amount of refrigerant used.

[0062] For example, the high-pressure chamber is located inside the compressor assembly 30, and the first heat exchanger assembly 10 is connected to the end face of the first end 301 facing away from the high-pressure chamber. The first heat exchanger assembly 10 is connected to the high-pressure chamber, and a first flow path 101 is provided in both the high-pressure chamber and the first heat exchanger assembly 10. One end of the first flow path 101 is connected to the high-pressure chamber, and the other end of the first flow path 101 is connected to the first heat exchanger assembly 10. The first interface 31 can serve as the inlet of the first flow path 101. The refrigerant in the high-pressure chamber can flow into the first heat exchanger assembly 10 through the first flow path 101 and exchange heat, shortening the flow path of the refrigerant from the high-pressure chamber to the first heat exchanger assembly 10, reducing the flow resistance of the refrigerant, and enabling the refrigerant to flow smoothly.

[0063] Optionally, the first interface 31 can be located on the end face of the high-pressure housing 79 near the first heat exchanger assembly 10, which can shorten the length of the first flow path 101 and simplify the flow path structure.

[0064] Combination Figure 5In some embodiments, the thermal management device 100 has a connection channel 104 that connects a first heat exchanger assembly 10 and a second heat exchanger assembly 20. After heat exchange occurs in the first heat exchanger assembly 10, the refrigerant can flow out of the first heat exchanger assembly 10 through the connection channel 104 and flow to the second heat exchanger assembly 20 for the next heat exchange, enabling the refrigerant to flow within the thermal management device 100 and achieving the cooling and heating functions of the thermal management device 100.

[0065] Combination Figure 2 and Figure 4 In some embodiments, the connecting channel 104 is disposed on the compressor assembly 30. The end face of the first end 301 of the compressor assembly 30 is provided with a second interface 32, which connects to the connecting channel 104. The first heat exchanger assembly 10 is disposed on the end face of the first end 301 and connects to the second interface 32. The end face of the second end 302 of the compressor assembly 30 is provided with a third interface 33, which connects to the connecting channel 104. The second heat exchanger assembly 20 is disposed on the end face of the second end 302 and connects to the third interface 33. After heat exchange, the refrigerant in the first heat exchanger assembly 10 can flow into the second heat exchanger assembly 20 through the connecting channel 104, simplifying the flow path structure of the connecting channel 104 and thus completing the cooling and heating process of the thermal management device 100. Furthermore, compared to providing multiple flow paths between the first heat exchanger assembly 10 and the second heat exchanger assembly 20, providing a single connecting channel 104 simplifies the flow path structure, shortens the flow path length, and reduces the flow resistance within the connecting channel 104, allowing for smooth refrigerant flow.

[0066] In addition, the connecting channel 104 passes through the compressor assembly 30 and does not exchange heat with the refrigerant and components inside the compressor assembly 30. This avoids heat exchange between the refrigerant in the connecting channel 104 and the refrigerant and components inside the compressor assembly 30. Some of the liquid refrigerant in the connecting channel 104 may be converted into gaseous refrigerant, reducing the heat exchange effect of the first heat exchanger assembly 10. Moreover, the gaseous refrigerant flows into the second heat exchanger assembly 20, where it cannot absorb heat and occupies the heat exchange area, resulting in a decrease in the cooling and heating effect of the thermal management device 100.

[0067] Optionally, the second interface 32 may be located on the end face of the high-pressure housing 79 near the first heat exchanger assembly 10; the third interface 33 may be located on the end face of the low-pressure housing 78 near the second heat exchanger assembly 20.

[0068] In some embodiments, the thermal management device 100 further includes a first valve 40 connected in series in the connection channel 104 and disposed between the first heat exchanger assembly 10 and the second heat exchanger assembly 20. The first valve 40 is used to control the flow of refrigerant from the first heat exchanger assembly 10 to the second heat exchanger assembly 20. The first valve 40 is located at the inlet of the second heat exchanger assembly 20. On the one hand, it controls the flow rate of refrigerant into the second heat exchanger assembly 20, ensuring that the refrigerant flowing out of the outlet of the second heat exchanger assembly 20 is gaseous, reducing the liquid refrigerant content, thereby reducing the possibility of liquid slugging when the refrigerant enters the compressor assembly 30, and avoiding insufficient cooling due to insufficient refrigerant flow, ensuring the cooling capacity of the second heat exchanger assembly 20 and improving heat exchange efficiency. On the other hand, it can throttle the low-temperature and high-pressure liquid refrigerant through the throttling orifice of the first valve 40 to become a low-temperature and low-pressure mist-like liquid refrigerant, satisfying the evaporation conditions of the liquid refrigerant, thereby improving the evaporation heat absorption efficiency.

[0069] Optionally, the connecting channel 104 may also include a fourth flow path, which is located between the first valve 40 and the second heat exchanger assembly 20. Since the inlet of the first valve 40 is higher than the outlet of the first valve 40, the fourth flow path is needed to connect the first valve 40 and the second heat exchanger assembly 20. The refrigerant can flow through the first valve 40 and then through the fourth flow path into the second heat exchanger assembly 20, so that the first valve 40 can regulate the flow rate of the refrigerant. The first valve 40 may be an electronic expansion valve, a proportional valve, or a throttling valve, etc.

[0070] Combination Figure 5 In some embodiments, the thermal management device 100 has a bypass channel 106 that connects the high-pressure chamber and the second heat exchanger assembly 20. When the normal refrigerant circulation cannot meet the system's cooling and heating requirements, a portion of the refrigerant in the high-pressure chamber can be transported to the second heat exchanger assembly 20 through the bypass channel 106 and mixed with the refrigerant in the second heat exchanger assembly 20, thereby increasing the refrigerant flow rate in the thermal management device 100 and improving its cooling and heating power. Compared to setting multiple flow paths between the high-pressure chamber and the second heat exchanger assembly 20, setting a single bypass channel 106 simplifies the flow path structure and shortens the flow path length. When the refrigerant in the second heat exchanger assembly 20 is insufficient, the refrigerant in the high-pressure chamber can be quickly replenished to the second heat exchanger assembly 20, thereby improving the operating efficiency of the thermal management device 100.

[0071] Combination Figure 4In some embodiments, a bypass channel 106 is provided on the compressor assembly 30. The first end 301 of the compressor assembly 30 has a fourth interface (not shown in the figure) connected to the bypass channel 106, and the high-pressure chamber is connected to the fourth interface. The second end 302 of the compressor assembly 30 has a fifth interface 35 connected to the bypass channel 106. The second heat exchanger assembly 20 is located on the end face of the second end 302 and connected to the fifth interface 35. The fourth interface can serve as the inlet of the bypass channel 106, and the fifth interface 35 can serve as the outlet of the bypass channel 106. Refrigerant in the high-pressure chamber can flow into the second heat exchanger assembly 20 through the bypass channel 106, increasing the refrigerant flow rate in the second heat exchanger assembly 20, simplifying the flow path structure of the bypass channel 106, and thereby enhancing the cooling and heating capabilities of the thermal management device 100.

[0072] Optionally, the fourth interface may be located on the end face of the high-pressure housing 79 near the second heat exchanger assembly 20; the fifth interface 35 may be located on the end face of the low-pressure housing 78 near the second heat exchanger assembly 20.

[0073] In some embodiments, the thermal management device 100 further includes a second valve 50 connected in series with the bypass channel 106 and positioned between the high-pressure chamber and the second heat exchanger assembly 20. The second valve 50 controls whether the refrigerant in the high-pressure chamber flows into the second heat exchanger assembly 20. When the normal refrigerant circulation can meet the system's cooling and heating needs, the second valve 50 is closed, the bypass channel 106 is not open, and the refrigerant in the high-pressure chamber cannot flow into the second heat exchanger assembly 20 through the bypass channel 106. When the normal refrigerant circulation cannot meet the system's cooling and heating needs, the second valve 50 is open, the bypass channel 106 is open, and the refrigerant in the high-pressure chamber can flow into the second heat exchanger assembly 20 through the bypass channel 106 and mix with the refrigerant in the second heat exchanger assembly 20, increasing the refrigerant flow rate within the thermal management device 100, thereby improving the cooling and heating capabilities of the thermal management device 100.

[0074] Optionally, the bypass channel 106 may also include a fifth flow path, which is located between the second valve 50 and the second heat exchanger assembly 20. Since the inlet of the second valve 50 is lower than the outlet of the second valve 50, the fifth flow path is needed to connect the second valve 50 and the second heat exchanger assembly 20. The refrigerant can flow through the second valve 50 and then into the second heat exchanger assembly 20 through the fifth flow path, so that the second valve 50 can regulate the flow rate of the refrigerant. The second valve 50 may be an electronic expansion valve, a proportional valve, or a throttle valve, etc.

[0075] Combination Figure 5In some embodiments, the thermal management device 100 has a return channel 105 that connects the second heat exchanger assembly 20 and the low-pressure chamber. After heat exchange in the second heat exchanger assembly 20, the refrigerant flows into the low-pressure chamber through the return channel 105 and re-enters the compressor assembly 30. The compressor assembly 30 has a compression component that draws air from the suction chamber and compresses the refrigerant, causing the refrigerant to re-enter a new cycle of cooling and heating.

[0076] Combination Figure 4 In some embodiments, the second end 302 of the compressor assembly 30 is provided with a sixth interface 36, which connects to the return channel 105. The low-pressure chamber is also connected to the sixth interface 36. The second heat exchanger assembly 20 is located on the end face of the second end 302 and connects to the sixth interface 36. The sixth interface 36 can serve as the inlet of the return channel 105, allowing the refrigerant in the second heat exchanger assembly 20 to flow into the low-pressure chamber through the return channel 105 and enter a new cycle of cooling and heating.

[0077] Optionally, the sixth interface 36 may be located on the end face of the low-pressure housing 78 near the second heat exchanger assembly 20 to shorten the length of the return channel 105.

[0078] In some embodiments, the return channel 105 includes a first channel 1051 and a second channel 1052, which are connected. The first channel 1051 extends along a direction parallel to the axis of the compressor assembly 30, and the second channel 1052 extends vertically. The compressor assembly 30 includes a compression component that draws in gas from the suction chamber and compresses the refrigerant. The second channel 1052 can transport the gaseous refrigerant in the first channel 1051 to a position closer to the compression component, shortening the suction path of the compression component and thereby improving the compression efficiency of the compressor assembly 30.

[0079] Combination Figure 2 In some embodiments, the first heat exchanger assembly 10 includes a condenser 11 and a subcooler 12, the condenser 11 being connected to the compressor assembly 30, and the subcooler 12 being connected to the condenser 11 and the second heat exchanger assembly 20.

[0080] For example, the condenser 11 is connected to the high-pressure chamber of the compressor assembly 30. The refrigerant in the high-pressure chamber can flow into the condenser 11 for heat exchange. After heat exchange, the refrigerant flows through the liquid receiver assembly 13 and the subcooler 12 in sequence. The subcooler 12 is connected to the second heat exchanger assembly 20. After secondary heat exchange in the subcooler 12, the refrigerant can flow into the second heat exchanger assembly 20 for the next heat exchange, thus realizing the cooling and heating process of the thermal management device 100.

[0081] Combination Figure 2In some embodiments, the first heat exchanger assembly 10 further includes a liquid receiver assembly 13, which is located on the side of the first heat exchanger assembly 10 away from or close to the compressor assembly 30. The liquid receiver assembly 13 is connected to the condenser 11 and the subcooler 12, respectively. The liquid receiver assembly 13 is located outside the condenser 11 and the subcooler 12 away from the compressor assembly 30, which facilitates the disassembly and replacement of the liquid receiver assembly 13.

[0082] The thermal management device 100 of this utility model is mainly described as having a liquid reservoir assembly 13 located on the side of the first heat exchanger assembly 20 away from the compressor assembly 30, but this is not a limitation on the scope of protection of this utility model.

[0083] For example, the condenser 11 and subcooler 12 are connected to the high-pressure shell 79. The first heat exchanger assembly 10 is provided with a first flow path 101, a second flow path 102, and a third flow path 103. The first flow path 101 connects the high-pressure chamber and the condenser 11, the second flow path 102 connects the condenser 11 and the liquid receiver assembly 13, and the third flow path 103 connects the liquid receiver assembly 13 and the subcooler 12. The gaseous refrigerant in the high-pressure chamber flows into the condenser 11 through the first flow path 101 for heat exchange, and part of the gaseous refrigerant is converted into liquid refrigerant. The two-phase refrigerant flows out of the condenser 11 through the second flow path 102 and flows into the liquid receiver. The refrigerant undergoes separation of gaseous and liquid refrigerant in the liquid receiver. The liquid refrigerant flows out of the liquid receiver through the third flow path 103 and flows into the subcooler 12. The liquid refrigerant undergoes secondary heat exchange in the subcooler 12, further reducing the enthalpy of the liquid refrigerant. After the reheating process, the refrigerant flows out from the subcooler 12 and into the second heat exchanger assembly 20 through the connecting channel 104, thereby realizing the cooling and heating process of the thermal management device 100.

[0084] Optionally, the condenser 11 and the subcooler 12 can be welded together to achieve the connection of the internal flow paths of the first heat exchanger component, reduce the number of connecting pipes, improve the integration of the thermal management device 100, thereby reducing the total volume of the flow channels within the thermal management device 100, reducing the risk of refrigerant leakage, reducing the amount of refrigerant added, thus ensuring the safety of the flammable and explosive thermal management system, while increasing the structural strength of the thermal management device 100 and improving the reliability of the thermal management system.

[0085] In some embodiments, the second heat exchanger assembly 20 includes an evaporator 21 connected to the first heat exchanger assembly 10 and the compressor assembly 30. For example, the evaporator 21 is connected to the low-pressure housing 78 of the compressor assembly 30, and is connected to the first heat exchanger assembly 10 via a connecting channel 104 and to the low-pressure chamber of the compressor assembly 30 via a return channel 105. Refrigerant flowing out of the first heat exchanger assembly 10 flows into the evaporator 21 through the connecting channel 104. After heat exchange in the evaporator 21, the refrigerant flows into the low-pressure chamber through the return channel 105, causing the compression component in the compressor assembly 30 to draw in and compress the refrigerant in the low-pressure chamber. After being compressed, the refrigerant re-enters the high-pressure chamber, and a new cooling and heating cycle begins.

[0086] In some embodiments, the first heat exchanger assembly 10 includes a first heat exchange fluid flow path 14. The first heat exchanger assembly 10 has a first heat exchange fluid inlet and a first heat exchange fluid outlet on the side opposite to the compressor assembly 30. The first heat exchange fluid flow path 14 is connected between the first heat exchange fluid inlet and the first heat exchange fluid outlet. The first heat exchange fluid flow path 14 is used to exchange heat with the refrigerant in the first heat exchanger assembly 10.

[0087] Optionally, due to the compact internal structure design of the thermal management device 100, the heat exchanger in the first heat exchanger assembly 10 can be a plate heat exchanger, that is, using stacked plates, with the gaps between adjacent plates forming a first inter-plate flow channel and a second inter-plate flow channel that are not interconnected. The first inter-plate flow channel is configured as a flow path for refrigerant, and the second inter-plate flow channel is configured as a first heat exchange fluid flow path 14 for heat exchange fluid. The refrigerant and heat exchange fluid exchange heat through the plates. The heat exchange fluid can be an aqueous solution, which is readily available and energy-saving and environmentally friendly, thereby reducing the operating cost of the thermal management device 100; it can also be other types of heat exchange fluids such as oil, a mixture of water and ethylene glycol, etc.

[0088] In some embodiments, the second heat exchanger assembly 20 includes a second heat exchange fluid flow path 22. The second heat exchanger assembly 20 has a second heat exchange fluid inlet and a second heat exchange fluid outlet on the side opposite to the compressor assembly 30. The second heat exchange fluid flow path 22 is connected between the second heat exchange fluid inlet and the second heat exchange fluid outlet. The second heat exchange fluid flow path 22 is used to exchange heat with the refrigerant in the second heat exchanger assembly 20.

[0089] Optionally, due to the compact internal structure design of the thermal management device 100, the heat exchanger in the second heat exchanger assembly 20 can be a plate heat exchanger, that is, using stacked plates, with the gaps between adjacent plates forming a third and fourth inter-plate flow channel that are not interconnected. The third inter-plate flow channel is configured as a flow path for refrigerant, and the fourth inter-plate flow channel is configured as a first heat exchange fluid flow path 14 for heat exchange fluid. The refrigerant and heat exchange fluid exchange heat through the plates. The heat exchange fluid can be an aqueous solution, which is readily available and energy-saving and environmentally friendly, thereby reducing the operating cost of the thermal management device 100; or it can be other types of heat exchange fluids such as oil, a mixture of water and ethylene glycol.

[0090] Optionally, the first heat exchange fluid flow path 14 can be used to control the temperature and humidity inside the passenger compartment, and the second heat exchange fluid flow path 22 can be used to control the temperature of the battery system and the temperature and humidity inside the passenger compartment. The heat exchange fluid flow paths in other components can be equipped with independent external radiators and control the temperature of the electric drive system, so as to ensure that the various functional systems of the vehicle reach a good operating state, ensure the driving and riding comfort of the driver and passengers, and also ensure the stable and reliable operation of the vehicle.

[0091] Optionally, a bearing bracket 76 may be provided inside the compressor assembly 30, and a sliding bearing may be installed inside the bearing bracket 76 to support the end of the motor main shaft; multiple brackets may be provided on the low-pressure housing 78 and the high-pressure housing 79, and each bracket may be connected to a vibration isolation pad 75 by bolts. The vibration isolation pad 75 is connected to the thermal management device 100, thereby isolating the vibration generated by the thermal management device 100 during operation and preventing the vibration from being transmitted to the vehicle, thus improving the user experience; the first heat exchanger assembly 10 and the second heat exchanger assembly 20 may be installed on both sides of the compressor assembly 30 by multiple fixing bolts 77, thereby ensuring a stable connection between the first heat exchanger assembly 10 and the compressor assembly 30 and a stable connection between the second heat exchanger assembly 20 and the compressor assembly 30.

[0092] The thermal management system according to the present utility model includes the aforementioned thermal management device 100. The specific structure of the thermal management device 100 is as described in the above embodiments. Since the present thermal management system adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0093] The vehicle according to the present utility model includes the aforementioned thermal management device 100, thermal management system and / or the specific structure of the vehicle refers to the above embodiments. Since the vehicle adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0094] The thermal management device 100 of the present invention is described below with reference to the accompanying drawings.

[0095] Combination Figures 1 to 6 According to an embodiment of the present invention, a thermal management device 100 includes a compressor assembly 30, a first heat exchanger assembly 10, a second heat exchanger assembly 20, a control assembly 60, a first valve 40, a second valve 50, a first heat exchange fluid flow path 14, a second heat exchange fluid flow path 22, and a vibration damping pad 75. The compressor assembly 30 is disposed between the first heat exchanger assembly 10 and the second heat exchanger assembly 20. The first heat exchanger assembly 10 is connected to the first end 301 of the compressor assembly 30 by multiple fixing bolts 77, shortening the flow path length between the first heat exchanger assembly 10 and the compressor assembly 30. The second heat exchanger assembly 20 is connected to the second end 302 of the compressor assembly 30 by multiple fixing bolts 77, shortening the flow path length between the second heat exchanger assembly 20 and the compressor assembly 30. The control assembly 60 is disposed on top of the compressor assembly 30, shortening the connection length between the control assembly 60 and the compressor assembly 30, simplifying the piping structure, and reducing the number of flow paths, thereby improving the operating efficiency of the thermal management device 100 and reducing its cost.

[0096] The first heat exchanger assembly 10 includes a condenser 11, a subcooler 12, an evaporator 21, and a liquid receiver assembly 13. The condenser 11 and the subcooler 12 are integrated into one unit and are connected to the end face of the high-pressure housing 79 away from the compression component. The liquid receiver assembly 13 is located outside the condenser 11 and the subcooler 12 along the axial direction and is connected to the condenser 11 and the subcooler 12. The condenser 11 is connected to the high-pressure chamber. The second heat exchanger assembly 20 includes an evaporator 21, which is connected to the end face of the low-pressure housing 78 away from the compression component. The evaporator connection channel 104 connects the subcooler 12 and the evaporator 21. The bypass channel 106 connects the high-pressure chamber and the evaporator 21. The return channel 105 connects the evaporator 21 and the low-pressure chamber.

[0097] Combination Figure 6In both cooling and heating modes, the pressurized refrigerant flows out of the high-pressure chamber and into the condenser 11 through the first flow path 101 to dissipate heat. The dissipated refrigerant then flows into the liquid receiver assembly 13 through the second flow path 102 for separation of gaseous and liquid refrigerant. The liquid refrigerant flows into the subcooler 12 through the third flow path 103 for secondary heat exchange, increasing the subcooling degree of the liquid refrigerant. After exiting the subcooler 12, the refrigerant flows to the evaporator 21 through the connecting channel 104. A first valve 40 is installed on the connecting channel 104, regulating the refrigerant flow rate within the channel to reduce the refrigerant pressure and convert it into a low-temperature, low-pressure liquid refrigerant. After passing through the first valve 40, the refrigerant flows into the evaporator 21 through the fourth flow path. In the evaporator 21, the refrigerant absorbs heat from the water in the second heat exchange liquid flow path 22 to achieve the cooling function. After heat exchange, the gaseous refrigerant flows into the low-pressure chamber of the compressor assembly 30 through the return channel 105. The refrigerant in the low-pressure chamber is compressed and then re-enters the high-pressure chamber, starting a new cycle of cooling and heating. Meanwhile, the second valve 50 is closed, the bypass channel 106 is not open, and there is no refrigerant flow.

[0098] When the ambient temperature is below the operating temperature range of the compressor assembly 30, the refrigerant in the evaporator 21 cannot evaporate effectively, limiting the refrigerant flow and heating capacity of the thermal management system. The second valve 50 opens, and the bypass channel 106 is open. The high-temperature, high-pressure refrigerant in the high-pressure chamber enters the inlet of the second valve 50 through the bypass channel 106. After flowing through the second valve 50, the refrigerant flows into the evaporator 21 through the fifth flow path. In the evaporator 21, the high-temperature, high-pressure refrigerant mixes with the low-temperature refrigerant flowing in from the first valve 40. After mixing, it enters the low-pressure chamber of the compressor assembly 30 through the return channel 105. The bypass channel 106 enables hot gas bypass, increasing the refrigerant flow within the device, thereby allowing the thermal management device 100 to output greater heating power and improving its heating capacity.

[0099] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0100] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0101] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0102] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0103] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0104] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A thermal management device (100), characterized in that, The system includes a compressor assembly (30), a first heat exchanger assembly (10), and a second heat exchanger assembly (20). The compressor assembly (30), the first heat exchanger assembly (10), and the second heat exchanger assembly (20) are distributed along the axis of the compressor assembly (30). The compressor assembly (30) is located between the first heat exchanger assembly (10) and the second heat exchanger assembly (20), and the compressor assembly (30), the first heat exchanger assembly (10), and the second heat exchanger assembly (20) are connected to form a refrigerant circulation loop. The thermal management device (100) further includes a control component (60) disposed on the compressor assembly (30) and electrically connected to the compressor assembly (30).

2. The thermal management device (100) according to claim 1, characterized in that, The control component (60) is mounted on the compressor assembly (30) and located on the side of the compressor assembly (30).

3. The thermal management device (100) according to claim 1, characterized in that, The control component (60) and the compressor component (30) are distributed in a direction perpendicular to the axis.

4. The thermal management device (100) according to claim 1, characterized in that, The control assembly (60) also includes a control box (61), a low-voltage connector (62), and a high-voltage connector (63). The control box (61) is provided with the low-voltage connector (62) and the high-voltage connector (63) on both sides along the direction parallel to the axis. And / or, the low-pressure connector (62) is located on the side closer to the second heat exchanger assembly (20), and the high-pressure connector (63) is located on the side closer to the first heat exchanger assembly (10); And / or, the low-voltage connector (62) extends in a direction parallel to the axis; And / or, the high-voltage connector (63) extends in a direction parallel to the axis.

5. The thermal management device (100) according to claim 4, characterized in that, The control component (60) further includes a capacitor (64), an inductor (65), an integrated circuit board (66), and a power module (67). The capacitor (64), the inductor (65), the integrated circuit board (66), and the power module (67) are integrated within the control box (61), and the capacitor (64) and the inductor (65) are distributed alternately. The inductor (65), the integrated circuit board (66), and the power module (67) are stacked along an axis perpendicular to the compressor assembly (30), and the power module (67) is in contact with the outer wall surface of the compressor assembly (30).

6. The thermal management device (100) according to claim 5, characterized in that, The control assembly (60) includes a first high-voltage cable (68) and a second high-voltage cable (69). The first high-voltage cable (68) extends in a direction parallel to the axis of the compressor assembly (30), and the second high-voltage cable (69) extends in a direction perpendicular to the axis of the compressor assembly (30). The compressor assembly (30) includes a stator, one end of the first high-voltage cable (68) is connected to the stator, one end of the second high-voltage cable (69) is connected to the integrated circuit board (66), and the other end of the first high-voltage cable (68) is welded to the other end of the second high-voltage cable (69).

7. The thermal management device (100) according to claim 1, characterized in that, The compressor assembly (30) has a first end (301) and a second end (302) distributed along the axis. The first end (301) has a high-pressure chamber, and the second end (302) has a low-pressure chamber. The first heat exchanger assembly (10) is connected to the first end (301), and the second heat exchanger assembly (20) is connected to the second end (302).

8. The thermal management device (100) according to claim 7, characterized in that, The compressor assembly (30) has a first interface (31) on the end face of the first end (301) connected to the high pressure chamber. The first heat exchanger assembly (10) is located on the end face of the first end (301) and connected to the first interface (31).

9. The thermal management device (100) according to claim 7, characterized in that, The thermal management device (100) has a connection channel (104) that connects the first heat exchanger assembly (10) and the second heat exchanger assembly (20).

10. The thermal management device (100) according to claim 9, characterized in that, The connection channel (104) is located in the compressor assembly (30). Wherein, the end face of the first end (301) of the compressor assembly (30) is provided with a second interface (32), the second interface (32) is connected to the connection channel (104), the first heat exchanger assembly (10) is located on the end face of the first end (301) and is connected to the second interface (32); and / or, the end face of the second end (302) of the compressor assembly (30) is provided with a third interface (33), the third interface (33) is connected to the connection channel (104), the second heat exchanger assembly (20) is located on the end face of the second end (302) and is connected to the third interface (33).

11. The thermal management device (100) according to claim 9, characterized in that, The thermal management device (100) further includes a first valve (40), which is connected in series in the connection channel (104) and is connected in series between the first heat exchanger assembly (10) and the second heat exchanger assembly (20).

12. The thermal management device (100) according to claim 7, characterized in that, The thermal management device (100) has a bypass channel (106) that connects the high-pressure chamber and the second heat exchanger assembly (20).

13. The thermal management device (100) according to claim 12, characterized in that, The bypass channel (106) is located in the compressor assembly (30). The compressor assembly (30) has a fourth interface on the end face of the first end (301) connected to the bypass channel (106), and the high-pressure chamber is connected to the fourth interface; and / or, the compressor assembly (30) has a fifth interface (35) on the end face of the second end (302) connected to the bypass channel (106), and the second heat exchanger assembly (20) is located on the end face of the second end (302) and connected to the fifth interface (35).

14. The thermal management device (100) according to claim 12, characterized in that, The thermal management device (100) further includes a second valve (50), which is connected in series in the bypass channel (106) and is located between the high-pressure chamber and the second heat exchanger assembly (20).

15. The thermal management device (100) according to claim 7, characterized in that, The thermal management device (100) has a reflux channel (105) that connects the second heat exchanger assembly (20) and the low-pressure chamber.

16. The thermal management device (100) according to claim 15, characterized in that, The second end (302) of the compressor assembly (30) is provided with a sixth interface (36), which is connected to the return channel (105). The second heat exchanger assembly (20) is located on the end face of the second end (302) and is connected to the sixth interface (36).

17. The thermal management device (100) according to claim 15, characterized in that, The return channel (105) includes a first channel (1051) and a second channel (1052). The first channel (1051) is connected to the second channel (1052). The first channel (1051) extends along the axis parallel to the compressor assembly (30), and the second channel (1052) extends in the vertical direction.

18. The thermal management device (100) according to claim 1, characterized in that, The first heat exchanger assembly (10) includes a condenser (11) and a subcooler (12). The condenser (11) is connected to the compressor assembly (30), and the subcooler (12) is connected to the condenser (11) and the second heat exchanger assembly (20).

19. The thermal management device (100) according to claim 1, characterized in that, The first heat exchanger assembly (10) further includes a reservoir assembly (13) disposed on the side of the first heat exchanger assembly (10) away from or near the compressor assembly (30).

20. The thermal management device (100) according to claim 1, characterized in that, The second heat exchanger assembly (20) includes an evaporator (21) that connects the first heat exchanger assembly (10) and the compressor assembly (30).

21. The thermal management device (100) according to claim 1, characterized in that, The first heat exchanger assembly (10) includes a first heat exchange fluid flow path (14). The first heat exchanger assembly (10) has a first heat exchange fluid inlet and a first heat exchange fluid outlet on the side away from the compressor assembly (30). The first heat exchange fluid flow path (14) is connected between the first heat exchange fluid inlet and the first heat exchange fluid outlet. And / or, the second heat exchanger assembly (20) includes a second heat exchange fluid flow path (22), and the second heat exchanger assembly (20) has a second heat exchange fluid inlet and a second heat exchange fluid outlet on the side opposite to the compressor assembly (30), and the second heat exchange fluid flow path (22) is connected between the second heat exchange fluid inlet and the second heat exchange fluid outlet.

22. A thermal management system, characterized in that, Includes the thermal management device (100) as described in any one of claims 1-21.

23. A vehicle, characterized in that, Includes the thermal management device (100) as described in any one of claims 1-21; or the thermal management system as described in claim 22.

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