Spraying plate with adjustable airflow

Abstract

The embodiment of the utility model provides an airflow-adjustable spraying plate, and relates to the technical field of semiconductor processing. The airflow-adjustable spraying plate comprises the spraying plate body and the plugs, the spraying holes distributed at intervals are formed in the spraying plate body, the plugs are detachably arranged on the spraying plate body and connected with at least one spraying hole in an inserted mode so as to be used for plugging the spraying holes, and the flow distribution of gas passing through the spraying plate body can be adjusted conveniently. The utility model has the effect of improving the uniformity of the film on the substrate in the LPCVD processing technology.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and more specifically, to an adjustable airflow spray plate. Background Technology

[0002] LPCVD is a chemical vapor deposition technique that introduces reactive gases into a reaction chamber under low pressure. By using methods such as heating and plasma excitation, the reactive gases are decomposed and chemically reacted on the substrate surface, thereby depositing the desired thin film material on the substrate surface.

[0003] In the LPCVD process, the uniformity of the film is greatly affected by temperature. The temperature uniformity of each heating plate is different, and the temperature positions are different. Currently, when using a standard distribution of spray plates to spray the substrate with reactive gases, it will lead to large differences in the uniformity of the film. Utility Model Content

[0004] The purpose of this invention is to provide an airflow adjustable spray plate that can improve the uniformity of the film on the substrate in the LPCVD process.

[0005] The embodiments of this utility model can be implemented as follows:

[0006] In a first aspect, this utility model provides an airflow-adjustable spray plate, comprising:

[0007] The spray plate body has multiple spray holes spaced apart.

[0008] A plug is detachably mounted on the spray plate body and inserted into at least one of the spray holes to seal the spray holes.

[0009] In an optional embodiment, the plug has a first surface, a second surface, and a sealing portion. The first surface is provided with a first preset number of sealing portions for insertion into a first preset number of spray holes. The second surface is provided with a second preset number of sealing portions for insertion into a second preset number of spray holes, wherein the second preset number is greater than the first preset number.

[0010] In an optional embodiment, the first surface and the second surface are disposed opposite to each other on the plug.

[0011] In an optional embodiment, the plug further has a first stepped portion and a second stepped portion, the first stepped portion and the second stepped portion are connected, the first surface is located on the side of the first stepped portion away from the second stepped portion, and the second surface is located on the side of the second stepped portion away from the first stepped portion.

[0012] The plug has a symmetrical axis, and the plugs on the first and second surfaces are symmetrically arranged along the symmetrical axis. The distance between the edge of the second step and the symmetrical axis is less than the distance between any two adjacent spray holes.

[0013] The beneficial effects of the adjustable airflow spray plate provided in this embodiment of the utility model include:

[0014] By setting a detachable plug structure, the spray holes on the spray plate body can be selectively blocked to adjust the gas flow distribution below the spray plate body, thereby adjusting the flow distribution of the reactive gas sprayed on the substrate and improving the film uniformity on the substrate. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the spray plate body provided in this embodiment;

[0017] Figure 2 This is a schematic diagram of the plug from a first-view perspective provided in this embodiment;

[0018] Figure 3 This is a schematic diagram of the plug from a second perspective in this embodiment.

[0019] Icons: 100 - Spray plate body; 110 - Spray hole; 200 - Plug; 210 - First side; 220 - Second side; 230 - Sealing part; 240 - First step part; 250 - Second step part. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0026] LPCVD, or low-pressure chemical vapor deposition, is an important thin film deposition technique. It involves introducing reactive gases into a reaction chamber under low pressure, and then using methods such as heating or plasma excitation to decompose the gases and induce a chemical reaction on the substrate surface. The resulting material forms a thin film that is uniformly deposited on the substrate. LPCVD offers advantages such as high film quality, suppression of impurities, and self-doping, and is widely used in semiconductor manufacturing, photovoltaics, and MEMS device manufacturing.

[0027] In LPCVD processes, film uniformity is significantly affected by the heating plates. Due to variations in temperature uniformity across different processing techniques and the varying temperature distribution of each heating plate, the temperature distribution on the substrate also differs, leading to varying reaction rates of the reactive gases. Using the same standard spray plate to uniformly spray the reactive gases onto the substrate surface results in significant and difficult-to-adjust film uniformity. Customizing different spray plates for different heating plates is necessary, but this prevents plate interchangeability, increases costs, and lengthens the customization and replacement cycle, ultimately impacting production efficiency.

[0028] To address the aforementioned technical problems, this utility model provides an adjustable airflow spray plate, used to regulate the gas flow distribution passing through the spray plate, so that the gas flow distribution passing through the spray plate is adapted to the temperature distribution of the substrate surface, thereby improving the uniformity of the film on the substrate. Furthermore, it allows one spray plate to be matched with multiple different heating plates, improving the compatibility and applicability of the spray plate.

[0029] The following describes in detail the overall structure, working principle, and technical effects of the adjustable airflow spray plate provided by this utility model through embodiments and in conjunction with the accompanying drawings.

[0030] Please refer to Figure 1 - Figure 3 This utility model provides an adjustable airflow spray plate for use in LPCVD process. The adjustable airflow spray plate is set in the reaction chamber, and the reaction gas is sprayed onto the substrate through the adjustable airflow spray plate to carry out the reaction.

[0031] The airflow adjustable spray plate includes a spray plate body 100 and a plug 200. The spray plate body 100 has a conventional spray plate structure with multiple spray holes 110 spaced apart. During LPCVD processing of the substrate, the reaction gas is sprayed onto the substrate through the spray holes 110 on the spray plate body 100. The plug 200 is detachably mounted on the spray plate body 100 and is inserted into at least one spray hole 110, thereby sealing the spray hole 110.

[0032] In actual production, uneven temperature distribution on the substrate leads to uneven reaction rates of the reacting gases. The reacting gases react rapidly in high-temperature regions and slowly in low-temperature regions, resulting in significant differences in the uniformity of the film formed on the substrate. By installing plugs 200 on the spray plate body 100 in areas corresponding to the high-temperature regions of the substrate, the gas flow rate of the reacting gases at these locations on the spray plate body 100 is reduced, thereby decreasing the concentration of reacting gases in the high-temperature regions of the substrate and thus reducing the reaction rate of the reacting gases in these regions. This balances the overall reaction rate of the reacting gases on the substrate, improving the uniformity of the film formed on the substrate.

[0033] Furthermore, by setting a detachable plug 200 structure, the spray holes 110 on the spray plate body 100 can be selectively blocked, making it easy to adjust the blocking position of the plug 200 to adjust the gas flow distribution below the spray plate body 100, thereby adjusting the flow distribution of the reactive gas sprayed on the substrate and improving the uniformity of the film generated on the substrate.

[0034] Please refer to Figure 2 and Figure 3In some optional embodiments, the plug 200 has a first surface 210, a second surface 220, and a sealing portion 230. The sealing portion 230 is a cylindrical structure adapted to fit the spray holes 110. A first preset number of sealing portions 230 are provided on the first surface 210 for inserting into and sealing the first preset number of spray holes 110. A second preset number of sealing portions 230 are provided on the second surface 220 for inserting into and sealing the second preset number of spray holes 110. The second preset number is greater than the first preset number.

[0035] In this embodiment, an example is provided with one sealing part 230 on the first surface 210 and two sealing parts 230 on the second surface 220. One sealing part 230 is provided on the first surface 210 for insertion into a single spray hole 110; at least two sealing parts 230 are provided on the second surface 220, and the spacing between the sealing parts 230 is adapted to the spacing of the spray holes 110 on the spray plate body 100, so that at least two sealing parts 230 on the second surface 220 are used for insertion into at least two adjacent spray holes 110.

[0036] By providing a sealing part 230 on the first surface 210 and at least two sealing parts 230 on the second surface 220 of the plug 200, when adjusting the gas flow distribution through the spray plate, as needed, when sealing a single spray hole 110, the sealing part 230 on the first surface 210 is inserted into the spray hole 110 to be sealed; when sealing multiple adjacent spray holes 110, the sealing part 230 on the second surface 220 is inserted into the spray holes 110 to be sealed. Furthermore, since the number of sealing parts 230 on the second surface 220 is limited, in actual operation, multiple plugs 200 can be used in combination, and the first surface 210 and the second surface 220 of multiple plugs 200 can be used in combination to meet different sealing requirements of the spray plate body 100.

[0037] Please refer to Figure 2 and Figure 3 Furthermore, during the process of adjusting the airflow distribution through the spray plate body 100, it may be necessary to use multiple plugs 200 to seal multiple adjacent spray holes 110. It may also be possible to encounter situations where one of two adjacent plugs 200 is sealed using the sealing part 230 on the first surface 210, and the other using the sealing part 230 on the second surface 220. Therefore, to avoid interference between adjacent plugs 200, the first surface 210 and the second surface 220 are positioned opposite each other on the plug 200, that is, the sealing part 230 on the first surface 210 and the sealing part 230 on the second surface 220 are positioned at 180°.

[0038] Furthermore, the plug 200 also has a first stepped portion 240 and a second stepped portion 250, which are connected. A first surface 210 is located on the side of the first stepped portion 240 opposite to the second stepped portion 250, and a second surface 220 is located on the side of the second stepped portion 250 opposite to the first stepped portion 240. The first stepped portion 240 and the second stepped portion 250 have the same height. When the sealing portion 230 on the first surface 210 is inserted into the spray hole 110, the first stepped portion 240 abuts against the surface of the spray plate body 100; when the sealing portion 230 on the second surface 220 is inserted into the spray hole 110, the second stepped portion 250 abuts against the surface of the spray plate body 100. Furthermore, the plug 200 has an axis of symmetry, which coincides with the axis of the sealing portion 230 on the first surface 210, and the sealing portions 230 on the second surface 220 are symmetrically arranged along the axis of symmetry.

[0039] By setting the first step portion 240 and the second step portion 250, when the two plugs 200 are arranged adjacently and are in a centrally symmetrical state, that is, when the first surface 210 of one plug 200 is attached to the spray plate body 100 and the second surface 220 of the other plug 200 is attached to the spray plate body 100, the first step portion 240 and the second step portion 250 overlap to avoid interference between adjacent plugs 200.

[0040] It is understandable that the distance between the edge of the second step portion 250 and the axis of symmetry is less than the distance between any two adjacent spray holes 110, so that when the sealing portion 230 on the first surface 210 is inserted into the spray hole 110, the second step portion 250 is prevented from blocking the surrounding spray holes 110 and affecting the passage of the reaction gas through the spray plate.

[0041] Furthermore, in order to facilitate the insertion of the sealing part 230 into the spray hole 110 on the spray plate body 100, the end of the sealing part 230 is chamfered to facilitate the insertion of the sealing part 230 into the spray hole 110.

[0042] In summary, the implementation principle of the adjustable airflow spray plate provided by this utility model is as follows: a detachable plug 200 structure is provided, which can selectively block the spray holes 110 on the spray plate body 100 to adjust the gas flow distribution below the spray plate body 100, thereby adjusting the flow distribution of the reactive gas sprayed on the substrate and improving the film uniformity on the substrate.

[0043] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. An airflow-adjustable spray plate, characterized in that, include: The spray plate body has multiple spray holes spaced apart. A plug is detachably mounted on the spray plate body and inserted into at least one of the spray holes to seal the spray holes; The plug has a first surface, a second surface, and a sealing portion. The first surface is provided with a first preset number of sealing portions for insertion into a first preset number of spray holes. The second surface is provided with a second preset number of sealing portions for insertion into a second preset number of spray holes, wherein the second preset number is greater than the first preset number.

2. The airflow adjustable spray plate according to claim 1, characterized in that, The first surface and the second surface are positioned opposite to each other on the plug.

3. The airflow adjustable spray plate according to claim 1, characterized in that, The plug also has a first stepped portion and a second stepped portion, the first stepped portion and the second stepped portion are connected, the first surface is located on the side of the first stepped portion away from the second stepped portion, and the second surface is located on the side of the second stepped portion away from the first stepped portion; The plug has a symmetrical axis, and the plugs on the first and second surfaces are symmetrically arranged along the symmetrical axis. The distance between the edge of the second step and the symmetrical axis is less than the distance between any two adjacent spray holes.

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