Backpack-shaped large-area air cooling device

Abstract

The backpack-shaped large-area air cooling device comprises a hollow containing device and a binding device, the binding device is connected with the containing device, the binding device is used for binding the containing device and a human body, an inner cavity is formed in the containing device and provided with an inner layer and an outer layer, and an opening and closing device is arranged between the inner layer and the outer layer and used for opening and closing the inner layer and the outer layer. The inner layer is of a mesh-shaped structure and is tightly attached to the human body, a low-temperature device is arranged in the inner cavity, the mesh-shaped structure is directly communicated with the inner cavity, no less than one fan hole is formed in the outer layer, a fan is correspondingly installed in the fan hole and used for enabling air in the inner cavity to circulate, and then large-area cooling is conducted on the human body through meshes in the inner layer. The inner layer of the side, close to the human body, of the air cooling device is designed to be of the mesh structure, due to the good ventilation effect of the meshes, the meshes are closely attached to the back or the chest of the human body in a large area, the fan is used for driving air to flow in a large range, heat exchange of the human body is conveniently achieved, and better experience feeling is brought.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to a large-area air-cooling device in the shape of a backpack. Background Technology

[0002] One problem encountered when using cooling backpacks or similar products in summer is the lack of heat dissipation between the backpack and the back. This is because the back of the backpack often uses materials like foam padding, which hinders heat dissipation, frequently causing the back of clothing to become soaked with sweat – unsightly and uncomfortable. Subsequently, various technologies have emerged that add cooling devices to the back side of the backpack. For example, there is Japanese Patent No. 3246328. However, in practical use, because it relies solely on semiconductor cooling technology, the area where the semiconductor cooling chip contacts the back of the user achieves good cooling, but the areas without the semiconductor cooling chip in contact with the user still fail to achieve adequate cooling due to the foam padding hindering heat dissipation.

[0003] Therefore, it is necessary to design a cooling device that can dissipate heat over a large area of ​​the back to avoid the high temperature generated by close contact between the back of the human body and the back of the backpack. Summary of the Invention

[0004] The purpose of this invention is to address the deficiencies in the prior art by providing a backpack-shaped, large-area air-cooling device that can dissipate heat over a large area of ​​the human back, thereby avoiding the inconvenience caused by carrying a backpack in the summer.

[0005] The objective of this utility model is achieved through the following means:

[0006] A backpack-shaped large-area air-cooling device includes a hollow housing and a restraining device. The restraining device is connected to the housing and is used to restrain the housing and the human body. The interior of the housing is an inner cavity with an inner layer and an outer layer. An opening and closing device is provided between the inner and outer layers for opening and closing the two. The inner layer has a mesh structure that fits tightly to the human body. A low-temperature device is provided in the inner cavity. The mesh structure is directly connected to the inner cavity. The outer layer has at least one fan hole, and a fan is installed in the corresponding fan hole to allow air to circulate in the inner cavity, thereby cooling the human body over a large area through the mesh on the inner layer.

[0007] By designing the inner layer of the cooling unit, which is closer to the body, as a mesh structure, the design avoids the heat dissipation drawbacks of the foam padding used in existing backpacks. The excellent breathability of the mesh, combined with its close contact with the back or chest over a large area, along with the fan driving a wide airflow, facilitates heat exchange and provides a better user experience.

[0008] In the above description, as a preferred embodiment, the low-temperature device is used to directly cool the human body. The fan holes are located on the outer layer, and the fan is located around the low-temperature device to cool the human body while dispersing the cold air around the low-temperature device.

[0009] In the above description, as a preferred embodiment, two fan holes are provided on the left and right sides of the lower end of the receiving device, and a fan is provided on the corresponding fan hole. The opening and closing device is provided on the top or sides of the receiving device, allowing the user to place items and change the direction of airflow.

[0010] In the above description, as a preferred embodiment, the cryogenic device is a phase change material or a semiconductor refrigeration device.

[0011] In the above description, as a preferred embodiment, the fan body and the engaging part are fastened together by an engaging structure.

[0012] In the above description, as a preferred embodiment, the fan body and the engaging part are locked together as one unit by screws.

[0013] In the above description, as a preferred embodiment, the fan body and the engaging part are fastened together by an engaging structure.

[0014] In the above description, as a preferred embodiment, the edges of the fan body and the engaging part are provided with corresponding threads, and the two are locked together by rotation.

[0015] The beneficial effects of this utility model are as follows: Through this design, external air can be introduced into the inner cavity of the device through a fan. With the inner layer being a mesh structure, the airflow cools the human body over a large area. Furthermore, the low temperature generated by the low-temperature device allows the flowing air to deliver the low-temperature gas to a wider range. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the external front view of Embodiment 1;

[0017] Figure 2 This is an external side view schematic diagram of Embodiment 1;

[0018] Figure 3 This is an external rear view schematic diagram of Embodiment 1;

[0019] Figure 4 This is a cross-sectional view of the internal installation in one example of this embodiment;

[0020] Figure 5 This is a schematic diagram of the three-dimensional structure of the refrigeration device;

[0021] Figure 6 This is a schematic diagram of the exploded structure of the refrigeration unit;

[0022] Figure 7 A schematic diagram showing the installation of the fan and fan hole;

[0023] Figure 8 Front view of Example 2

[0024] Figure 9 Rear view of Example 2

[0025] Figure 10 This is a schematic diagram of Example 2, where the item is suspended in front of the chest.

[0026] Figure 11 This is a schematic diagram of Example 2, showing the device suspended on the back.

[0027] In the diagram, 1 is the hollow housing, 2 is the side, 3 is the outer layer, 4 is the inner layer, 5 is the shoulder strap, 6 is the chest strap, 7 is the fan hole, 8 is the fan, 801 is the fan body, 802 is the locking part, 9 is the cooling device, 901 is the cooling semiconductor, 902 is the temperature conducting plate, 903 is the heat sink, 904 is the cooling fan, 905 is the housing, 10 is the opening and closing device, and 11 is the electronic control switch. Detailed Implementation

[0028] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0029] Example 1: A large-area air-cooling device in the shape of a backpack. Its structure is backpack-like, including a hollow housing 1 and a restraining device. In this example, the restraining device consists of shoulder straps 5 and a chest strap 6. Its unique design features a mesh-like structure for the inner layer 4 and two sides 2 of the hollow housing 1, while the outer layer 3 is made of densely woven fabric. A fan hole 7 is located above the outer layer 3, and a fan 8 is installed in the fan hole 7. Driven by electricity, the fan 8 injects air from outside the hollow housing 1 into its internal cavity. Because the inner layer 4 has a mesh-like structure and is directly connected to the internal cavity, airflow is created when the fan 8 operates. The airflow moves from top to bottom, cooling the back of the body through the mesh of the inner layer 4. The shoulder straps 5 hang from the shoulders for restraint.

[0030] Simultaneously, a low-temperature device is installed on the inner layer 4. The low-temperature device is a semiconductor cooling device 9. The temperature-conducting plate 902 on the cooling device 9 is exposed on the inner layer 4, facing the back of the human body, and in direct contact with the back of the human body. The housing 905 of the cooling device 9 is hidden inside the inner cavity.

[0031] The cooling device 9 utilizes the Peltier effect. It includes a cooling semiconductor 901, a temperature-conducting plate 902, a heat sink 903, a cooling fan 904, and a housing 905. The cooling semiconductor 901 has two functional surfaces, one for heating and the other for cooling. When an electric current drives the cooling semiconductor 901, one surface cools while the other heats. The cooling surface and the temperature-conducting plate 902 are in direct, close contact, directly conducting the low temperature to the back of the user, providing comfort. The heat sink 903 is tightly attached to the heating surface. The heat sink 903 is typically made of a high-efficiency thermally conductive metal (such as aluminum alloy or copper alloy). The heat sink 903 conducts and dissipates the heat generated by the heating surface of the cooling semiconductor 901, maintaining stable operation of the semiconductor. To further improve heat dissipation, a cooling fan 904 is installed on the heat sink 903. The cooling fan 904 promotes airflow, quickly carrying away the heat from the heat sink 903. The cooling semiconductor 901, heat sink 903, and cooling fan 904 are all housed inside the housing 905. The temperature-conducting plate 902 is located on the outside of the housing 905, with a gap between it and the housing 905. A through-hole is provided on the inner layer 4 to allow the temperature-conducting plate 902 to engage with it. The edge of the through-hole engages within the gap between the temperature-conducting plate 902 and the housing 905, thus securing the entire cooling device 9 to the inner layer 4. The through-hole on the housing 905 facilitates air entry and exit.

[0032] The inner cavity also houses a power bank and an electronic control switch 11. The power bank provides power to the fan 8 and the semiconductor cooling device 9, while the electronic control switch 11 controls the fan 8 and the semiconductor cooling device 9 to turn on or off. Alternatively, for ease of use, the electronic control switch 11 can be mounted on the shoulder strap 5, and a conductive wire can be used to connect the electronic control switch 11 and the power bank.

[0033] The fan 8 is divided into a fan body 801 and a locking part 802, which are engaged by a snap-fit ​​mechanism. The fan body 801 and the locking part 802 are respectively located on the inner and outer sides of the fan hole 7. During installation, the fabric layer of the hollow receiving device 1 is clamped by the snap-fit ​​mechanism, thus fixing the fan 8 above the hollow receiving device 1. Similarly, the fan body 801 and the locking part 802 can be detachably connected by screws. A third method is to use a threaded connection between the locking part 802 and the fan body 801 for assembly and disassembly. (See reference...) Figure 7The corresponding clips are replaced with internal and external threads, and the engaging part 802 and the fan body part 801 are engaged by rotation. This detachable structure has two advantages over the integrated connection of the fan 8 and the hollow housing 1. First, it facilitates repair and replacement in case of electrical failures during production, reducing production costs. Second, it facilitates subsequent cleaning of the air-cooling unit. When cleaning the air-cooling unit, the fan 8, cooling unit 9, and other electronic components such as the power bank can be directly removed from the air-cooling unit, allowing for direct water washing.

[0034] When using a backpack-shaped large-area air-cooling device, the fan 8 and cooling unit 9 are mounted on the air-cooling device and electrically connected to a power bank and an electronic control switch 11. The air-cooling device is secured to the body via the shoulder straps 5 and chest straps 6. After the power is turned on using the electronic control switch 11, the cooling unit 9 begins to cool, directly cooling the back area through the heat-conducting plate 902. Simultaneously, the fan 8 blows air into the hollow housing 1, creating an airflow that carries away heat from the back of the body as it passes through the mesh. This airflow also provides more fresh air to the cooling fan 904 of the cooling unit 9, accelerating the expulsion of heat generated by the cooling unit 9 through the mesh on both sides of the hollow housing 1. Furthermore, the air blown by the fan 8 also diffuses the coolness generated by the heat-conducting plate in all directions, making the entire back feel cool. This achieves the purpose of dissipating heat from the back of the body.

[0035] In this embodiment, the low-temperature device is a semiconductor cooling device 9. Alternatively, an ice pack made of phase change material (PCM material) or pure water can be used. The ice pack is placed on one side near the inner layer. Although the cooling effect of this device is not as long-lasting as that of the semiconductor cooling device 9, it has lower operating costs, is simple to manufacture, and can be reused repeatedly. The fan 8 blows the cold air around the ice pack to other parts of the back, improving the cooling effect.

[0036] The structural feature of Embodiment 2 is that the edges of the inner layer 4 and the outer layer 3 are sewn together. The inner layer 4 has small mesh openings. A fan hole 7 is located on each of the left and right sides below the outer layer 3, and a fan 8 is installed in each fan hole 7, in the same way as in Embodiment 1. Similarly, a back strap 5 and a chest strap 6 are provided on the edges for binding the body, thus ensuring the inner layer 4 fits snugly against the body. A special design feature of Embodiment 2 is that the opening and closing device 10 is located at the top of the outer layer. The opening and closing device 10 can be a zipper sewn onto the outer layer, or a Velcro structure, snap fastener structure, etc. In this embodiment, a zipper structure is used. The advantage of placing it at the top is that when the cooling device is worn on the back, if only cooling of the back is needed, the fan 8 blows air, and because the inner layer 4 has a mesh structure, a large circulating airflow is formed on the back. Because fan 8 is located at the bottom, the airflow moves upward. For users with long hair, to dissipate heat from the back of the neck, the zipper can be opened. Because the mesh structure fits snugly against the body, opening the zipper guides the airflow generated by fan 8 upward, spraying it upward from the opening, thus cooling the back of the neck. Similarly, placing this air-cooling device on the chest can also cool the face.

[0037] If the zipper is located on the left or right sides of the center, airflow will escape from under the armpits when the zipper is opened, thus cooling the armpits. Alternatively, it can be combined with the aforementioned top zipper for easier direction adjustment.

[0038] This design, which places the fan at the bottom and a zipper at the top, allows for both strong airflow to cool the body and easy control and adjustment of the airflow direction.

[0039] To further enhance the cooling effect, an ice pack or semiconductor cooling device 9 made of phase change material (PCM material) is also provided on the side of the inner cavity near the inner layer 4. When the airflow blown out by the fan 8 passes through the ice pack or semiconductor cooling device 9, it will bring the cold air around the ice pack or semiconductor cooling device 9 to the body, increasing the feeling of comfort.

[0040] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A backpack-shaped large-area air-cooling device, comprising a hollow housing and a restraining device, the restraining device being connected to the housing, the restraining device being used to restrain the housing and the human body, the interior of the housing being an inner cavity, characterized in that: It has an inner layer and an outer layer, with an opening and closing device between the inner and outer layers for opening and closing. The inner layer has a mesh structure that fits closely to the human body. A low-temperature device is installed in the inner cavity. The mesh structure is directly connected to the inner cavity. The outer layer has at least one fan hole, and a fan is installed in the corresponding fan hole to allow air to circulate in the inner cavity, thereby cooling the human body over a large area through the mesh on the inner layer.

2. The backpack-shaped large-area air-cooling device according to claim 1, characterized in that: The low-temperature device is used to directly cool the human body. The fan holes are located on the outer layer, and the fan is located around the low-temperature device to cool the human body while dispersing the cold air around the low-temperature device.

3. The backpack-shaped large-area air-cooling device according to claim 1, characterized in that: Two fan holes are provided on the left and right sides of the lower end of the container, and a fan is provided on the corresponding fan hole. The opening and closing device is provided on the top or sides of the container and is used to place items and change the direction of airflow.

4. The backpack-shaped large-area air-cooling device according to claim 1, characterized in that: The cryogenic device is a phase change material or semiconductor refrigeration device.

5. The backpack-shaped large-area air-cooling device according to claim 2, 3, or 4, characterized in that: The fan is connected to the fan hole by a detachable structure. The fan includes a fan body and a locking part, which are respectively located on the inner and outer sides of the fan hole.

6. The backpack-shaped large-area air-cooling device according to claim 5, characterized in that: The fan-shaped part and the locking part are fastened together by a locking structure.

7. The backpack-shaped large-area air-cooling device according to claim 5, characterized in that: The fan-shaped part and the engaging part are locked together by screws.

8. The backpack-shaped large-area air-cooling device according to claim 5, characterized in that: The fan body and the locking part are provided with corresponding threads, and the two are locked together by rotation.

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