Surface heat radiation testing device
By setting a thermocouple structure for the transmitting and receiving substrates within a fixed support, the problem of poor repeatability in surface thermal emissivity testing equipment was solved, resulting in more accurate and repeatable test results.
Patent Information
- Application Number
- CN202520537185.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-03-25
AI Technical Summary
Existing surface thermal emissivity testing equipment suffers from poor repeatability when testing materials, mainly due to the inhomogeneity inside the radiative heat source and the influence of metal structural components on the conduction of thermal radiation.
A thermocouple structure is formed by a transmitting substrate and a receiving substrate within a fixed bracket. The surface thermal radiation value of the material under test is calculated by measuring the substrate temperature. The center alignment of the substrates is ensured, and non-thermal conductive materials are used to reduce the influence of the frame, ensuring that the conditions are consistent for each test.
It improves the accuracy and repeatability of surface thermal radiation testing, reduces test randomness, and ensures the reproducibility of each test result.
Smart Images
Figure CN223841336U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of thermal radiation testing equipment technology, and more particularly to a surface thermal radiation testing device. Background Technology
[0002] Existing surface thermal emissivity testing equipment typically involves placing a radiation receiving device at an arbitrary height on the same radiative heat source, placing the material to be tested between the radiative heat source and the radiation receiving device, and then simultaneously measuring the surface thermal emissivity of the material to be tested.
[0003] However, even with the same radiative heat source, the internal thermal radiation is uneven and inconsistent. The location of the radiative heat source relative to the radiation receiving device varies, resulting in different test conditions for each test. Furthermore, this method requires placing the radiation receiving device at any height above the radiation source, overcoming gravity. Therefore, high-strength materials are needed for fixation, typically metal structural components. However, metal structural components significantly affect the conduction of thermal radiation, thus impacting the accuracy and efficiency of the thermal emissivity test.
[0004] Therefore, existing surface thermal emissivity testing equipment suffers from poor repeatability when testing materials. Utility Model Content
[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a surface thermal radiation testing device, which aims to solve the problem of poor repeatability when testing materials in existing surface thermal emissivity testing equipment.
[0006] The technical solution adopted by this application to solve the technical problem is as follows: This application provides a surface thermal radiation testing device, including:
[0007] A fixed bracket, wherein the fixed bracket is provided with a hollow cavity;
[0008] An emitting substrate is vertically disposed within the hollow cavity; the emitting substrate is used to emit thermal radiation; a first signal line and a second signal line are respectively disposed at both ends of the emitting substrate; the first signal line, the second signal line, and the emitting substrate constitute a thermocouple structure for measuring the temperature of the emitting substrate;
[0009] A first receiving substrate is located on one side of the transmitting substrate and is vertically disposed within the fixed bracket; a first test space is formed between the transmitting substrate and the first receiving substrate; a third signal line and a fourth signal line are respectively disposed at both ends of the first receiving substrate; the third signal line, the fourth signal line, and the first receiving substrate constitute a thermocouple structure for measuring the temperature of the first receiving substrate.
[0010] By comparing the temperature of the transmitting substrate with the temperature of the first receiving substrate, the surface thermal radiation value of the material to be tested placed in the first test space is calculated.
[0011] Optionally, the surface thermal radiation testing device further includes a second receiving substrate, which is vertically located on the side of the emitting substrate opposite to the first receiving substrate, and is vertically disposed within the fixed bracket; a second testing space is formed between the emitting substrate and the second receiving substrate; a fifth signal line and a sixth signal line are respectively provided at both ends of the second receiving substrate; the fifth signal line, the sixth signal line, and the second receiving substrate constitute a thermocouple structure for measuring the temperature of the second receiving substrate; by comparing the temperature of the first receiving substrate and the temperature of the second receiving substrate, the strength of the emissivity performance of the material to be tested placed in the first testing space and the second testing space is obtained.
[0012] Optionally, the distance between the first signal line and the second signal line on the transmitting substrate is the diameter of the transmitting substrate; the distance between the third signal line and the fourth signal line on the first receiving substrate is the diameter of the first receiving substrate; and the distance between the fifth signal line and the sixth signal line on the second receiving substrate is the diameter of the second receiving substrate.
[0013] Optionally, the surface thermal radiation testing device further includes a first substrate support and a second substrate support, wherein the first substrate support abuts against the side of the first receiving substrate away from the emitting substrate, and the second substrate support abuts against the side of the second receiving substrate away from the emitting substrate.
[0014] A first receiving pad is disposed between the first receiving substrate and the transmitting substrate, and the first receiving pad, the transmitting substrate, and the first receiving substrate together constitute the first test space;
[0015] A second receiving pad is disposed between the second receiving substrate and the transmitting substrate, and the second receiving pad, the transmitting substrate, and the second receiving substrate together constitute the second test space.
[0016] Optionally, the surface thermal radiation testing device further includes a first substrate support and a second substrate support, wherein the first substrate support abuts against the side of the first receiving substrate away from the emitting substrate, and the second substrate support abuts against the side of the emitting substrate away from the first receiving substrate.
[0017] A first receiving pad is disposed between the first receiving substrate and the transmitting substrate, and the first receiving pad, the transmitting substrate, and the first receiving substrate together constitute the first test space.
[0018] Optionally, the transmitting substrate is further provided with a power line for supplying power to the transmitting substrate.
[0019] Optionally, the fixing bracket is provided with a notch, which is used to allow the power line, the first signal line, the second signal line, the third signal line, the fourth signal line, the fifth signal line and the sixth signal line to extend from the inside of the fixing bracket to the outside of the fixing bracket.
[0020] Optionally, the second substrate support includes a locking ring and several limiting members. The inner wall of the fixed support is provided with a groove corresponding to the locking ring, and the several limiting members are all disposed on the side of the locking ring away from the second receiving substrate.
[0021] Optionally, several of the limiting members intersect on the center line of the engaging ring.
[0022] Optionally, the engaging ring is provided with engaging grooves corresponding to the fifth signal line and the sixth signal line.
[0023] Optionally, a bracket base is provided at the bottom of the fixed bracket.
[0024] Compared with the prior art, this application provides a surface thermal radiation testing device, including a fixed bracket, a transmitting substrate, and a first receiving substrate. A first signal line and a second signal line are connected to the transmitting substrate, and a third signal line and a fourth signal line are connected to the first receiving substrate, such that the transmitting substrate and the first receiving substrate each form a thermocouple structure. The first and second signal lines can receive the change signal of the integral average of the temperature on the transmitting substrate with respect to the area; the third and fourth signal lines can receive the change signal of the integral average of the temperature on the first receiving substrate with respect to the area. By comparing the received signals and calculating, the surface thermal radiation value of the material to be tested placed in the first test space can be obtained. The transmitting substrate and the first receiving substrate are both vertically arranged in a hollow cavity, and their centers are aligned on the same axis. The fixed bracket can be placed horizontally, which has low requirements for the material of the fixed bracket and can ensure that the material to be tested placed in the first test space corresponds to the same position of the transmitting substrate in each test, ensuring that the results of each test are repeatable and reproducible. Attached Figure Description
[0025] Figure 1 This is an exploded view of one embodiment of the surface thermal radiation testing device provided in this application;
[0026] Figure 2 This is an exploded view of another embodiment of the surface thermal radiation testing device provided in this application;
[0027] Figure 3 This is a schematic diagram of the surface thermal radiation testing device provided in this application;
[0028] Figure 4 These are a side view and an AA cross-sectional view of the surface thermal radiation testing device provided in this application;
[0029] Figure 5 This is a schematic diagram of the second substrate support of the surface thermal radiation testing device provided in this application.
[0030] Explanation of reference numerals in the attached figures:
[0031] 1. Transmitting substrate; 2. First receiving substrate; 3. Second receiving substrate; 4. First substrate support; 5. Second substrate support; 6. Fixing bracket; 11. Heating film; 12. Power line; 13. First signal line; 14. Second signal line; 21. First receiving pad; 22. Third signal line; 23. Fourth signal line; 31. Second receiving pad; 32. Fifth signal line; 33. Sixth signal line; 51. Engaging ring; 52. Limiting member; 53. Through hole; 61. Support base; 62. Notch; 511. Engaging groove. Detailed Implementation
[0032] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0033] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0035] Reference Figure 1 , Figure 2 and Figure 3 The first embodiment of this application provides a surface thermal radiation testing device, including: a fixed support 6, an emitting substrate 1, and a first receiving substrate 2. The fixed support 6 is provided with a hollow cavity; the emitting substrate 1 is vertically disposed in the hollow cavity; the emitting substrate 1 is used to emit thermal radiation; a first signal line 13 and a second signal line 14 are respectively disposed at both ends of the emitting substrate 1; the first signal line 13, the second signal line 14 and the emitting substrate 1 form a thermocouple structure for measuring the temperature of the emitting substrate 1; the first receiving substrate 2 is located on one side of the emitting substrate 1 and is vertically disposed in the fixed support 6; a first test space is formed between the emitting substrate 1 and the first receiving substrate 2; a third signal line 22 and a fourth signal line 23 are respectively disposed at both ends of the first receiving substrate 2; the third signal line 22, the fourth signal line 23 and the first receiving substrate 2 form a thermocouple structure for measuring the temperature of the first receiving substrate 2; by comparing the temperature of the emitting substrate 1 and the temperature of the first receiving substrate 2, the surface thermal radiation value of the material to be tested placed in the first test space is calculated.
[0036] The fixing bracket 6 may be provided with grooves or protrusions corresponding to the transmitting substrate 1 and the first receiving substrate 2, so as to engage and fix the positions of the transmitting substrate 1 and the first receiving substrate 2. The fixing bracket 6 is horizontally arranged, has a hollow structure with a hollow cavity, and both ends are open for communication. Furthermore, the surface thermal radiation testing device can ensure that the centers of the first receiving substrate 2 and the transmitting substrate 1 are aligned on the same axis while being placed horizontally, which reduces the material requirements of the fixing bracket 6; the material of the fixing bracket 6 is preferably a non-thermal conductive material, which can reduce the impact of the frame's thermal conductivity on the test and improve the accuracy of the test.
[0037] To facilitate the fixation of the material to be tested, the material to be tested, placed in the first test space, can specifically cover the surface of the transmitting substrate 1 near the first receiving substrate 2, and / or cover the surface of the first receiving substrate 2 near the transmitting substrate 1. By measuring the integral mean of the temperature on the transmitting substrate 1 with respect to the area, and the integral mean of the temperature on the first receiving substrate 2 with respect to the area, the surface thermal radiation value of the material to be tested, i.e., emissivity or absorptivity, can be calculated. Specifically, the material to be tested can be adhered to the transmitting substrate 1 and / or the first receiving substrate 2.
[0038] The transmitting substrate 1 and the first receiving substrate 2 have circular cross-sections. The spacing between the first signal line 13 and the second signal line 14 on the transmitting substrate 1 is preferably the diameter of the transmitting substrate 1. The first signal line 13 and the second signal line 14 connect the transmitting substrate 1 to an external temperature measuring instrument, ensuring that the measured temperature is the average value of the temperature integral across the entire surface of the transmitting substrate 1, reducing the randomness of the test, and improving the accuracy of the measured temperature. The spacing between the third signal line 22 and the fourth signal line 23 on the first receiving substrate 2 is preferably the diameter of the first receiving substrate 2. The third signal line 22 and the fourth signal line 23 connect the first receiving substrate 2 to an external temperature measuring instrument, ensuring that the measured temperature is the average value of the temperature integral across the entire surface of the first receiving substrate 2, reducing the randomness of the test, and improving the accuracy of the measured temperature.
[0039] The transmitting substrate 1 has a structure in which a heating film 11 is sandwiched between two aluminum plates. That is, both sides of the heating film 11 are attached to the aluminum plates and then bonded together to form the transmitting substrate 1. The aluminum plates can be replaced with other metal plates or alloy plates with good thermal conductivity. The first receiving substrate 2 is made of a metal plate or alloy plate with good thermal conductivity, or it can be an aluminum plate. The first signal line 13 is connected to the aluminum plates on both sides of the heating film 11, and the second signal line 14 is also connected to the aluminum plates on both sides of the heating film 11. That is, the first signal line 13, the second signal line 14, the transmitting substrate 1 and the external temperature measuring instrument are connected in series to form a temperature measuring circuit, and the two aluminum plates are connected in parallel in this series circuit. The heating film 11 is not directly connected to the first signal line 13 and the second signal line 14, but is connected to the first signal line 13 and the second signal line 14 through the aluminum plates on both sides.
[0040] The first receiving substrate 2 is arranged parallel to one side of the transmitting substrate 1. The first test space is composed of the first receiving substrate 2 and the transmitting substrate 1. Each time, the material to be tested is placed in the first test space at the same position on the transmitting substrate 1, that is, the corresponding thermal radiation emission source is the same. Only by adjusting the distance between the first receiving substrate 2 and the transmitting substrate 1 to be the same, the test conditions of the two can be made exactly the same; thus, the test is reproducible and the detection accuracy is improved.
[0041] The first signal line 13 and the second signal line 14 of the transmitting substrate 1 are made of different metal materials; the third signal line 22 and the fourth signal line 23 of the first receiving substrate 2 are also made of different metal materials, thus forming a thermocouple structure. Specifically, the first signal line 13 and the second signal line 14 of the transmitting substrate 1 are pure copper wire and copper-nickel alloy wire, respectively. The third signal line 22 and the fourth signal line 23 of the first receiving substrate 2 are also pure copper wire and copper-nickel alloy wire, respectively.
[0042] The heating film 11 of the transmitting substrate 1 is heated by the constant power setting of the digital power supply. By measuring the integral average of the temperature on the transmitting substrate 1 and the first receiving substrate 2 with respect to their area, the temperature difference between the two can be obtained. Combining Joule's thermal power and the Stefan-Boltzmann law, the emissivity or absorptivity of the material under test can be calculated from the known emissivity of the aluminum plate and the absorption area, as shown in the following formula: Formula 1.
[0043] In Formula 1, ε2 is the known emissivity of the surface of the receiving substrate (i.e., the first receiving substrate 2); U is the voltage applied to the transmitting substrate 1, in V; I is the current applied to the transmitting substrate 1, in A; ε1 is the emissivity or absorptivity of the material to be tested on the transmitting substrate 1; σ is the Stefan-Boltzmann constant, 5.67 × 10⁻⁶. -8 W / (m 2 ·K 4 A represents the equivalent absorption area when the surface of the material under test interacts with the surface of the absorbing substrate, in meters (m²). 2 T2 is the temperature of the receiving substrate (i.e., the first receiving substrate 2), in K; T sur T1 represents the ambient temperature in Kelvin (K); T2 represents the temperature of the emitting substrate 1 in Kelvin (K).
[0044] A surface thermal radiation testing device according to this embodiment includes a fixed bracket 6, an emitting substrate 1, and a first receiving substrate 2. A first signal line 13 and a second signal line 14 are respectively connected to a third signal line 22 and a fourth signal line 23, forming a thermocouple structure between the emitting substrate 1 and the first receiving substrate 2. The first signal line 13 and the second signal line 14 are connected to the emitting substrate 1, and the third signal line 22 and the fourth signal line 23 are connected to the first receiving substrate 2, so that the emitting substrate 1 and the first receiving substrate 2 each form a thermocouple structure. The first signal line 13 and the second signal line 14 can receive signals from the emitting substrate 1. The signal is received by the first receiving substrate 2, which is the integral average of the temperature on the substrate 1 with respect to the area. The third signal line 22 and the fourth signal line 23 can receive the signal is received by the first receiving substrate 2, which is the integral average of the temperature on the substrate 2 with respect to the area. The surface thermal radiation value of the material to be tested placed in the first test space can be obtained by receiving the signal and calculating. The transmitting substrate 1 and the first receiving substrate 2 are both vertically arranged in the hollow cavity, and their centers are aligned on the same axis. This ensures that the material to be tested placed in the first test space corresponds to the same position on the transmitting substrate 1 in each test, and ensures that the results of each test are repeatable and reproducible.
[0045] In some embodiments, the surface thermal radiation testing device further includes a second receiving substrate 3, which is vertically located on the side of the emitting substrate 1 opposite to the first receiving substrate 2, and is vertically disposed within the fixed support 6; a second testing space is formed between the emitting substrate 1 and the second receiving substrate 3; a fifth signal line 32 and a sixth signal line 33 are respectively provided at both ends of the second receiving substrate 3; the fifth signal line 32, the sixth signal line 33, and the second receiving substrate 3 constitute a thermocouple structure for measuring the temperature of the second receiving substrate 3; by comparing the temperature of the first receiving substrate 2 and the temperature of the second receiving substrate 3, the strength of the emissivity performance of the material to be tested placed in the first testing space and the second testing space is obtained.
[0046] When a first receiving substrate 2 and a second receiving substrate 3 are respectively disposed on both sides of the transmitting substrate 1, and two materials to be tested are respectively placed in the first test space and the second test space, the first formula becomes invalid and cannot be calculated because the transmitting substrate 1 emits heat to the two receiving substrates. In this case, it is suitable for comparing materials to be tested with similar emissivity. Specifically, by connecting an external thermometer or spot thermometer to the signal line, the temperatures of the first receiving substrate 2 and the second receiving substrate 3 are measured respectively. By comparing the temperatures, the difference in performance (including emissivity and absorptivity) of the two materials to be tested under the same experimental conditions, environment, and time is obtained. The material to be tested placed in the test space corresponding to the receiving substrate with higher temperature has stronger emissivity and better performance.
[0047] To facilitate the fixation of the material to be tested, the material to be tested placed in the second test space can cover the surface of the transmitting substrate 1 near the second receiving substrate 3, and / or cover the surface of the second receiving substrate 3 near the transmitting substrate 1. By comparing the intensity of the change signal of the integral mean of temperature with respect to area on the receiving and transmitting substrate 1 and the intensity of the change signal of the integral mean of temperature with respect to area on the second receiving substrate 3, the intensity of the emissivity of the material to be tested located in the first test space and the second test space can be obtained.
[0048] Specifically, while placing the material to be tested in the first detection space, a material to be tested is also placed in the second detection space to compare the performance differences between the two materials. During the process, placing it in the first detection space specifically means placing it on the side of the transmitting substrate 1 close to the first receiving substrate 2, or placing it on the side of the first receiving substrate 2 close to the transmitting substrate 1. Placing it in the second detection space specifically means placing it on the side of the transmitting substrate 1 close to the second receiving substrate 3, or placing it on the side of the second receiving substrate 3 close to the transmitting substrate 1. The distance between the two materials to be tested and the transmitting substrate 1 is the same to ensure consistent detection conditions and improve performance contrast.
[0049] The fifth signal line 32 and the sixth signal line 33 of the second receiving substrate 3 are also made of different metal materials. Specifically, the fifth signal line 32 and the sixth signal line 33 of the second receiving substrate 3 are pure copper wire and copper-nickel alloy wire, respectively.
[0050] The cross-section of the second receiving substrate 3 is preferably circular, and its size is the same as that of the first receiving substrate 2 and the transmitting substrate 1. The spacing between the fifth signal line 32 and the sixth signal line 33 on the second receiving substrate 3 is preferably the diameter of the second receiving substrate 3. The fifth signal line 32 and the sixth signal line 33 connect the second receiving substrate 3 to the external temperature measuring instrument, which can ensure that the measured temperature is the average value of the temperature integral of the entire surface of the second receiving substrate 3, reduce the randomness of the test, and make the measured temperature accurate. The fixing bracket 6 may be provided with a groove or protrusion corresponding to the second receiving substrate 3, so as to engage and fix the position of the second receiving substrate 3.
[0051] The first receiving substrate 2 and the second receiving substrate 3 are arranged parallel to each other on both sides of the transmitting substrate 1, corresponding to the same position on the transmitting substrate 1. That is, the first receiving substrate 2 and the second receiving substrate 3 correspond to the same thermal radiation emission source. When the material to be tested is fixedly set at the same distance from the transmitting substrate 1 in the first detection space and the second detection space, it is only necessary to adjust the distance between the first receiving substrate 2 and the transmitting substrate 1, and the distance between the second receiving substrate 3 and the transmitting substrate 1 to be the same, so that the testing conditions are exactly the same for both. This allows for comparison of the surface thermal radiation performance of the two tested materials, improving detection contrast and accuracy. The material of the second receiving substrate 3 is a metal plate or alloy plate with good thermal conductivity, or it can be an aluminum plate. When comparing the two tested materials, the material of the second receiving substrate 3 is the same as that of the first receiving substrate 2, which improves detection contrast.
[0052] In some embodiments, the distance between the first signal line 13 and the second signal line 14 on the transmitting substrate 1 is the diameter of the transmitting substrate 1; the distance between the third signal line 22 and the fourth signal line 23 on the first receiving substrate 2 is the diameter of the first receiving substrate 2; and the distance between the fifth signal line 32 and the sixth signal line 33 on the second receiving substrate 3 is the diameter of the second receiving substrate 3.
[0053] Furthermore, the surface thermal radiation testing device also includes a first substrate support 4 and a second substrate support 5. The first substrate support 4 abuts against the side of the first receiving substrate 2 opposite to the emitting substrate 1, and the second substrate support 5 abuts against the side of the second receiving substrate 3 opposite to the emitting substrate 1. A first receiving pad 21 is disposed between the first receiving substrate 2 and the emitting substrate 1, and the first receiving pad 21, the emitting substrate 1, and the first receiving substrate 2 together constitute the first test space. A second receiving pad 31 is disposed between the second receiving substrate 3 and the emitting substrate 1, and the second receiving pad 31, the emitting substrate 1, and the second receiving substrate 3 together constitute the second test space. The first substrate support 4 and the second substrate support 5 abut against the emitting substrate 1 through the first receiving pad 21 and the second receiving pad 31, thereby respectively constituting the first test space and the second test space.
[0054] The first substrate support 4 abuts against the first receiving substrate 2, thereby fixing the position of the first receiving substrate 2; the second substrate support 5 abuts against the second receiving substrate 3, thereby fixing the position of the second receiving substrate 3.
[0055] The first receiving pad 21 prevents the first receiving substrate 2 from external thermal interference, ensuring that the first receiving substrate 2 stably receives the radiation emitted by the transmitting substrate 1. It also provides shock absorption for the first receiving substrate 2, further stabilizing its position. Furthermore, the first receiving pad 21 isolates the first receiving substrate 2 from electrical connections with other components, preventing short circuits and leakage.
[0056] The second receiving pad 31 prevents the second receiving substrate 3 from external thermal interference, ensuring that the second receiving substrate 3 stably receives the radiation emitted by the transmitting substrate 1. It also provides shock absorption for the second receiving substrate 3, further stabilizing its position. Furthermore, the second receiving pad 31 isolates the second receiving substrate 3 from electrical connections with other components, preventing short circuits and leakage.
[0057] The first receiving pad 21 and the second receiving pad 31 are used to separate the transmitting substrate 1 and the first receiving substrate 2, and to separate the transmitting substrate 1 and the second receiving substrate 3, respectively. The first receiving pad 21 and the second receiving pad 31 can both be equidistant pads, so that the second receiving substrate 3 and the first receiving substrate 2 receive the same thermal radiation conditions when the material to be tested is heated by the transmitting substrate 1, which facilitates the simultaneous comparative testing of the two materials to be tested.
[0058] Both the first receiving pad 21 and the second receiving pad 31 are made of non-conductive materials to reduce the impact on heat radiation conduction and improve the accuracy and reliability of the test. The first receiving pad 21 and the second receiving pad 31 are preferably pads with small contact areas, effectively reducing heat conduction with almost no impact on the infrared radiation path area.
[0059] In some embodiments, the surface thermal radiation testing device further includes a first substrate support 4 and a second substrate support 5. The first substrate support 4 abuts against the side of the first receiving substrate 2 away from the emitting substrate 1, and the second substrate support 5 abuts against the side of the emitting substrate 1 away from the first receiving substrate 2. A first receiving pad 21 is disposed between the first receiving substrate 2 and the emitting substrate 1. The first receiving pad 21, the emitting substrate 1, and the first receiving substrate 2 together constitute the first testing space.
[0060] The first substrate support 4 abuts against the first receiving substrate 2, thereby fixing the position of the first receiving substrate 2; the second substrate support 5 abuts against the transmitting substrate 1, thereby fixing the position of the transmitting substrate 1.
[0061] The first receiving pad 21 is used to separate the transmitting substrate 1 and the first receiving substrate 2, and together with the transmitting substrate 1 and the first receiving substrate 2, it forms the first test space; at this time, there is only a single test space, and a single material to be tested can be tested.
[0062] In some embodiments, a power line 12 is also provided on the transmitting substrate 1; the power line 12 is used to supply power to the transmitting substrate 1.
[0063] Specifically, the heating film 11 on the emitting substrate 1 is powered by a power line 12; and there are two power lines 12, one positive and one negative, both of which are connected to the heating film 11.
[0064] In some embodiments, the mounting bracket 6 is provided with a notch 62, which allows the power line 12, the first signal line 13, the second signal line 14, the third signal line 22, the fourth signal line 23, the fifth signal line 32, and the sixth signal line 33 to extend from the inside of the mounting bracket 6 to the outside. Simultaneously, the size of the notch 62 matches the dimensions of the power line 12, the first signal line 13, the second signal line 14, the third signal line 22, the fourth signal line 23, the fifth signal line 32, and the sixth signal line 33, thus preventing the interior of the mounting bracket 6 from being affected by external thermal interference.
[0065] Reference Figure 4 and Figure 5 In some embodiments, the second substrate support 5 includes a locking ring 51 and a plurality of limiting members 52. The inner wall of the fixing bracket 6 is provided with a groove corresponding to the locking ring 51, and the plurality of limiting members 52 are all disposed on the side of the locking ring 51 away from the second receiving substrate 3.
[0066] A limiting member 52 is provided on the side of the locking ring 51 away from the second receiving substrate 3. The locking ring 51 is connected to the outer edge of the second receiving substrate 3 and is used to fix the outer edge of the second receiving substrate 3 to the inner wall of the fixing bracket 6. The limiting member 52 is used to abut against the second receiving substrate 3 in the horizontal direction to prevent it from shifting. The locking ring 51 and the limiting member 52 can further fix the position of the second receiving substrate 3.
[0067] The first substrate support 4 preferably has the same structure as the second substrate support 5, both including a locking ring 51 and several limiting members 52, and the limiting members 52 on the first substrate support 4 are all disposed on the side of the locking ring 51 away from the first receiving substrate 2. That is, the locking ring 51 of the first substrate support 4 is connected to the outer edge of the first receiving substrate 2, and the inner wall of the fixing bracket 6 is provided with a groove corresponding to the locking ring 51, which can fix the outer edge of the first receiving substrate 2 to the inner wall of the fixing bracket 6; the limiting members 52 of the first substrate support 4 are used to abut against the first receiving substrate 2 in the horizontal direction to prevent it from shifting, and the position of the first receiving substrate 2 can be further fixed by the locking ring 51 and the limiting members 52.
[0068] When the surface thermal radiation testing device includes a second receiving substrate 3, the engaging ring 51 of the second receiving substrate 3 is located between the first receiving substrate 2 and the inner wall of the fixed support 6, and the engaging ring 51 of the first substrate support 4 is located between the second receiving substrate 3 and the inner wall of the fixed support 6. When the surface thermal radiation testing device does not include a second receiving substrate 3, the engaging ring 51 of the second receiving substrate 3 is located between the emitting substrate 1 and the inner wall of the fixed support 6, and the engaging ring 51 of the first substrate support 4 is located between the second receiving substrate 3 and the inner wall of the fixed support 6. In some embodiments, a plurality of the limiting members 52 intersect at the center line of the engaging ring 51. That is, the limiting members 52 can abut against the center of the second receiving substrate 3, thereby providing support for the second receiving substrate 3 and fixing the position of the second receiving substrate 3.
[0069] In addition, a number of limiting members 52 of the first substrate support 4 are preferably intersecting on the center line of the locking ring 51 of the first substrate support 4, thereby providing support for the first receiving substrate 2 and fixing the position of the first receiving substrate 2.
[0070] In some embodiments, the engaging ring 51 is provided with engaging grooves 511 corresponding to the fifth signal line 32 and the sixth signal line 33, so as to facilitate the passage of the fifth signal line 32 and the sixth signal line 33; similarly, the engaging ring 51 of the first substrate support 4 is provided with engaging grooves 511 corresponding to the third signal line 22 and the fourth signal line 23, so as to facilitate the passage of the third signal line 22 and the fourth signal line 23.
[0071] In some embodiments, both the first substrate support 4 and the second substrate support 5 are provided with a plurality of through holes 53. The through holes 53 facilitate heat dissipation inside the device, preventing excessively high temperatures in the first test space formed by the transmitting substrate 1 and the first receiving substrate 2, and the second test space formed by the transmitting substrate 1 and the second receiving substrate 3, which could damage the device. Furthermore, the through holes 53 reduce the weight of the first substrate support 4 and the second substrate support 5, lightening the overall weight of the surface thermal radiation testing device and facilitating its movement and transportation. Both the first substrate support 4 and the second substrate support 5 are made of non-thermal-conducting materials, reducing the impact on heat radiation conduction and improving the accuracy and reliability of the test.
[0072] The first substrate support 4 can be fixed to the second substrate support 5 by screws or bolts, thereby fixing the transmitting substrate 1, the first receiving substrate 2 and the second receiving substrate 3 between the first substrate support 4 and the second substrate support 5, further stabilizing the positions of the transmitting substrate 1, the first receiving substrate 2 and the second receiving substrate 3; and the transmitting substrate 1 and the first receiving substrate 2 are separated by the first receiving pad 21, and the transmitting substrate 1 and the second receiving substrate 3 are separated by the second receiving pad 31.
[0073] The bottom of the fixed bracket 6 may also be provided with a bracket base 61. The bracket base 61 can make the position of the fixed bracket 6 stable.
[0074] In some embodiments, the surface thermal radiation testing device also includes a vacuum chamber, in which the fixed bracket 6 is placed for use. That is, the surface thermal radiation testing device operates and is used under vacuum conditions, which can eliminate the influence of air convection and further improve the accuracy of the test.
[0075] In summary, the surface thermal radiation testing device provided in this application includes a fixed support, a transmitting substrate, and a first receiving substrate. A first signal line and a second signal line are connected to the transmitting substrate, and a third signal line and a fourth signal line are connected to the first receiving substrate, such that the transmitting substrate and the first receiving substrate each form a thermocouple structure. The first and second signal lines can receive the change signal of the integral average of the temperature on the transmitting substrate with respect to the area. The third and fourth signal lines can receive the change signal of the integral average of the temperature on the first receiving substrate with respect to the area. By receiving the signals and calculating, the surface thermal radiation value of the material to be tested placed in the first test space can be obtained. The transmitting substrate and the first receiving substrate are both vertically arranged in a hollow cavity, and their centers are aligned on the same axis, which can ensure that the material to be tested placed in the first test space corresponds to the same position on the transmitting substrate in each test, ensuring that the results of each test are repeatable and reproducible.
[0076] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing examples, or make equivalent substitutions for some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions in the examples of this application.
Claims
1. A surface thermal radiation testing device, characterized in that, include: A fixed bracket, wherein the fixed bracket is provided with a hollow cavity; An emitting substrate, wherein the emitting substrate is vertically disposed within the hollow cavity; The emitting substrate is used to emit thermal radiation; a first signal line and a second signal line are respectively provided at both ends of the emitting substrate; the first signal line, the second signal line and the emitting substrate form a thermocouple structure for measuring the temperature of the emitting substrate; A first receiving substrate is located on one side of the transmitting substrate and is vertically disposed within the fixed bracket. A first test space is formed between the transmitting substrate and the first receiving substrate; a third signal line and a fourth signal line are respectively provided at both ends of the first receiving substrate; the third signal line, the fourth signal line and the first receiving substrate constitute a thermocouple structure for measuring the temperature of the first receiving substrate; By comparing the temperature of the transmitting substrate with the temperature of the first receiving substrate, the surface thermal radiation value of the material to be tested placed in the first test space is calculated.
2. The surface thermal radiation testing device according to claim 1, characterized in that, The surface thermal radiation testing device further includes a second receiving substrate, which is vertically located on the side of the emitting substrate away from the first receiving substrate, and is vertically disposed within the fixed bracket. A second test space is formed between the transmitting substrate and the second receiving substrate; The second receiving substrate has a fifth signal line and a sixth signal line respectively at its two ends; the fifth signal line and the sixth signal line together with the second receiving substrate form a thermocouple structure for measuring the temperature of the second receiving substrate; by comparing the temperature of the first receiving substrate and the temperature of the second receiving substrate, the strength of the emissivity performance of the material to be tested placed in the first test space and the second test space respectively can be obtained.
3. The surface thermal radiation testing device according to claim 2, characterized in that, The distance between the first signal line and the second signal line on the transmitting substrate is equal to the diameter of the transmitting substrate; the distance between the third signal line and the fourth signal line on the first receiving substrate is equal to the diameter of the first receiving substrate; and the distance between the fifth signal line and the sixth signal line on the second receiving substrate is equal to the diameter of the second receiving substrate.
4. The surface thermal radiation testing device according to claim 3, characterized in that, The surface thermal radiation testing device further includes a first substrate support and a second substrate support, wherein the first substrate support abuts against the side of the first receiving substrate away from the emitting substrate, and the second substrate support abuts against the side of the second receiving substrate away from the emitting substrate. A first receiving pad is disposed between the first receiving substrate and the transmitting substrate, and the first receiving pad, the transmitting substrate, and the first receiving substrate together constitute the first test space; A second receiving pad is disposed between the second receiving substrate and the transmitting substrate, and the second receiving pad, the transmitting substrate, and the second receiving substrate together constitute the second test space.
5. The surface thermal radiation testing device according to claim 1, characterized in that, The surface thermal radiation testing device further includes a first substrate support and a second substrate support, wherein the first substrate support abuts against the side of the first receiving substrate away from the emitting substrate, and the second substrate support abuts against the side of the emitting substrate away from the first receiving substrate. A first receiving pad is disposed between the first receiving substrate and the transmitting substrate, and the first receiving pad, the transmitting substrate, and the first receiving substrate together constitute the first test space.
6. The surface thermal radiation testing device according to claim 4, characterized in that, The transmitting substrate is also provided with a power line, which is used to supply power to the transmitting substrate.
7. The surface thermal radiation testing device according to claim 6, characterized in that, The fixed bracket is provided with a notch, which is used to allow the power line, the first signal line, the second signal line, the third signal line, the fourth signal line, the fifth signal line and the sixth signal line to extend from the inside of the fixed bracket to the outside of the fixed bracket.
8. The surface thermal radiation testing device according to claim 6, characterized in that, The second substrate support includes a locking ring and several limiting members. The inner wall of the fixed support is provided with a groove corresponding to the locking ring, and the several limiting members are all provided on the side of the locking ring away from the second receiving substrate.
9. The surface thermal radiation testing device according to claim 8, characterized in that, Several of the limiting members intersect on the center line of the engaging ring.
10. The surface thermal radiation testing device according to claim 9, characterized in that, The engaging ring is provided with engaging grooves corresponding to the fifth signal line and the sixth signal line.