Device for detecting defects of silicon wafers in flower basket

Abstract

The utility model relates to the technical field of silicon wafer defect detection, and provides a silicon wafer defect detection device in a flower basket, which comprises a detection workbench, a support frame, a gripper X-direction moving module, a gripper Y-direction moving module, a gripper Z-direction moving module, a mechanical gripper, a camera X-direction moving module and a plurality of cameras, the supporting frame is erected at the input end of the detection workbench. A gripper X-direction moving module and a camera X-direction moving module are arranged on a cross beam of the supporting frame. A gripper Y-direction moving module is arranged on the gripper X-direction moving module in a sliding mode. A gripper Z-direction moving module is arranged on the gripper Y-direction moving module in a sliding mode. A mechanical gripper is arranged on the gripper Z-direction moving module in a sliding manner; and a plurality of cameras are movably arranged on the camera X-direction moving module. According to the utility model, automatic image acquisition, automatic grabbing of abnormal flower baskets and automatic blanking can be realized, and the detection efficiency and the productivity are improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer defect detection technology, and in particular to a silicon wafer defect detection device inside a flower basket. Background Technology

[0002] After photovoltaic silicon wafers are processed, they undergo cleaning and wafer insertion (inserting the wafers into baskets). The inserted wafers are then loaded into baskets, with each basket containing several hundred wafers (e.g., ...). Figure 1 (As shown). During the wafer insertion process, because the silicon wafers are very thin (only 0.15mm) and brittle, they are prone to breakage, stacking, misalignment, and fragmentation. Therefore, subsequent processes need to detect these abnormalities to prevent defective silicon wafers from entering subsequent work stages and affecting production efficiency and quality.

[0003] Currently, the detection method for the aforementioned silicon wafer anomalies is manual inspection, which requires manual visual inspection of all silicon wafers in the basket for any abnormalities. This method has the following problems:

[0004] 1. Manual inspection is prone to missed detections and false positives.

[0005] 2. The number of silicon wafers is too large. A typical factory can produce tens or even millions of wafers per day. The workload of manual inspection is huge, and workers are prone to fatigue. Therefore, factories need to be equipped with enough people to meet the needs of full inspection.

[0006] 3. Manual detection methods cannot establish an efficient information transmission process, and relying on manual data collection of anomalies cannot achieve the goals of efficiency and speed. Utility Model Content

[0007] This invention primarily addresses the technical problems of existing technologies that rely on manual inspection of silicon wafers for defects, which are prone to missed or false detections and involve a huge workload. It proposes a silicon wafer defect detection device within a basket to achieve automatic image acquisition, automatic picking of abnormal baskets, and automatic unloading, thereby improving inspection efficiency and production capacity.

[0008] This utility model provides a silicon wafer defect detection device in a flower basket, including: a detection workbench, a support frame, a gripper X-axis moving module, a gripper Y-axis moving module, a gripper Z-axis moving module, a mechanical gripper, a camera X-axis moving module, and multiple cameras;

[0009] The support frame is mounted on the input end of the testing workbench;

[0010] The X-axis moving module of the gripper and the X-axis moving module of the camera are arranged on the crossbeam of the support frame.

[0011] A gripper Y-axis moving module can be slidably mounted on the gripper X-axis moving module; a gripper Z-axis moving module can be slidably mounted on the gripper Y-axis moving module; and a mechanical gripper can be slidably mounted on the gripper Z-axis moving module.

[0012] Multiple cameras can be movably mounted on the camera X-axis moving module.

[0013] Preferably, multiple cameras are movably mounted on the camera X-axis moving module via a camera moving bracket.

[0014] Preferably, a light source is also provided on the camera moving frame.

[0015] Preferably, a material unloading workbench is arranged on one side of the testing workbench, and an operating device is arranged on the other side;

[0016] A material unloading robot is installed on one side of the output end of the testing workbench; the material unloading robot is located close to the material unloading workbench.

[0017] Preferably, the operating device has multiple processing stations; protective railings are installed above the multiple processing stations.

[0018] Preferably, the operating device is equipped with a PLC control system;

[0019] The PLC control system is electrically connected to the gripper X-axis movement module, gripper Y-axis movement module, gripper Z-axis movement module, mechanical gripper, camera X-axis movement module, and unloading robot.

[0020] Preferably, a vision controller is provided within the operating device;

[0021] The vision controller is electrically connected to the camera.

[0022] The silicon wafer defect detection device inside the basket provided by this utility model has the following advantages compared with the prior art:

[0023] 1. Two flower baskets to be inspected are transferred from the front-end process to the input end of the inspection workbench; the camera and light source are moved along the X-axis by the camera X-axis moving module, and images are acquired in the two image acquisition areas in sequence. The flower baskets can be automatically placed in the image detection area to realize automatic image acquisition.

[0024] 2. When an abnormality is detected in the silicon wafers inside the basket, the mechanical gripper is moved by the X-axis, Y-axis, and Z-axis movement modules of the gripper to pick up the basket containing the abnormal silicon wafers and place it in an empty processing station, thus realizing the automatic picking of abnormal baskets.

[0025] 3. The operating device has multiple processing stations, which can handle abnormal flower baskets in a timely manner. After processing, the flower baskets are automatically returned by mechanical grippers.

[0026] 4. The present invention can achieve automatic image acquisition, automatic grasping of abnormal flower baskets, and automatic blanking. The equipment runs and detects at high speed, greatly improving the detection efficiency and production capacity. Each component is electrically connected to the PLC control system, and each part can be联动. The PLC control system can form a record of abnormal situations. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of the flower basket;

[0028] Figure 2 is a schematic structural diagram of the silicon wafer defect detection device in the flower basket provided by the present utility model;

[0029] Figure 3 is a schematic structural diagram of the main part of the silicon wafer defect detection device in the flower basket provided by the present utility model;

[0030] Figure 4 is Figure 3 an enlarged schematic diagram of the mechanical gripper part in;

[0031] Figure 5 is Figure 3 an enlarged schematic diagram of the camera moving frame, camera, and light source parts in.

[0032] Reference numerals: 1 - flower basket, 2 - silicon wafer, 3 - support frame, 4 - gripper X-direction moving module, 5 - gripper Y-direction moving module, 6 - gripper Z-direction moving module, 7 - camera X-direction moving module, 8 - mechanical gripper, 9 - camera, 10 - light source, 11 - vision controller, 12 - PLC control system, 13 - disposal station, 14 - guardrail, 15 - detection workbench, 16 - blanking workbench, 17 - blanking robot, 18 - camera moving frame. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] To make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model and are not intended to limit the present utility model. Additionally, it should be noted that for the sake of description, only parts related to the present utility model are shown in the drawings and not all of the content.

[0034] As Figure 2-3 ​​​Multiple silicon wafers to be inspected are stored in baskets 1, with six baskets 1 forming a group of baskets to be inspected. These baskets are transferred from the upstream process to the input end of the inspection workbench 15. The inspection workbench 15 can be equipped with two conveyor belts; the input ends of these two conveyor belts serve as the image acquisition area for the basket groups to be inspected. Multiple cameras 9, movable along the X-axis, acquire images. Specifically, three cameras 9 can be set, each acquiring images of two baskets 1, and the three cameras 9 complete the image acquisition for one basket group to be inspected. The output ends of the two conveyor belts serve as the unloading area. In other words, the inspection workbench 15 has two image acquisition areas and two unloading areas.

[0036] The support frame 3 is mounted on the input end of the testing workbench 15; the length direction of the support frame 3 is perpendicular to the length direction of the testing workbench 15; the crossbeam of the support frame 3 is located above the input end of the testing workbench 15; the two ends of the crossbeam of the support frame 3 are supported by columns.

[0037] A gripper X-axis moving module 4 and a camera X-axis moving module 7 are arranged on the crossbeam of the support frame 3; the X-axis moving module 4 and the camera X-axis moving module 7 are arranged in parallel. A gripper Y-axis moving module 5 is slidably mounted on the gripper X-axis moving module 4; a gripper Z-axis moving module 6 is slidably mounted on the gripper Y-axis moving module 5; and a mechanical gripper 8 is slidably mounted on the gripper Z-axis moving module 6. The gripper X-axis moving module 4 can drive the gripper Y-axis moving module 5 and its components to move along the X-axis direction; the gripper Y-axis moving module 5 can drive the gripper Z-axis moving module 6 and its components to move along the Y-axis direction; and the gripper Z-axis moving module 6 can drive the mechanical gripper 8 to move along the Z-axis direction, thereby realizing the three-axis movement of the mechanical gripper 8.

[0038] like Figure 4 As shown, the mechanical gripper 8 is realized by a gripper frame and cylinders set at both ends of the gripper frame. Each cylinder has a clamping plate on its telescopic rod. The two clamping plates move towards each other to grasp the flower basket 1.

[0039] like Figure 5 As shown, multiple cameras 9 are movably mounted on the camera X-axis moving module 7 via a camera moving frame 18. A light source 10 is also mounted on the camera moving frame 18. Two light sources 10 can be installed, and each light source 10 can illuminate the six flower baskets 1 below. The camera X-axis moving module 7 can drive the camera moving frame 18 and the cameras 9 and light sources 10 on it to move along the X-axis.

[0040] The Y-axis moving module 5 and the mechanical gripper 8 extend along the length of the detection worktable 15, and their movement covers the input ends of the two conveyor belts, enabling the acquisition of flower basket images in two image acquisition areas. The X-axis moving module 4, Y-axis moving module 5, Z-axis moving module 6, and X-axis moving module 7 are each composed of their respective motors, gear racks, and guide rails / slider components, enabling linear movement. Each of these modules is equipped with a bellows cover to protect it without affecting the slider movement.

[0041] A material unloading workbench 16 is arranged on one side of the inspection workbench 15, and an operating device is arranged on the other side; a material unloading robot 17 is arranged on one side of the output end of the inspection workbench 15; the material unloading robot 17 is close to the material unloading workbench 16.

[0042] The operating device has multiple processing stations 13; protective railings 14 are installed above the multiple processing stations 13. There are a total of 4 processing stations 13, which can be operated simultaneously in parallel.

[0043] The operating device is equipped with a PLC control system 12. The PLC control system 12 is electrically connected to the gripper X-axis movement module 4, gripper Y-axis movement module 5, gripper Z-axis movement module 6, mechanical gripper 8, camera X-axis movement module 7, and unloading robot 17. The PLC control system 12 controls the movement of each module to realize material transfer and signal interaction.

[0044] The operating device is equipped with a vision controller 11; the vision controller 11 is electrically connected to the camera 9 and the light source 10. The images captured by the camera 9 are sent to the vision controller 11, which can be manually judged or automatically judged by automated software; it sends instructions to the PLC control system 12 to execute relevant grasping actions when abnormal situations occur.

[0045] The working process of this utility model is as follows: Two baskets to be inspected are transferred from the front-end process to the input end of the inspection workbench 15, located directly below the camera 9. The camera X-axis moving module 7 drives the camera 9 and the light source 10 to move along the X-axis, sequentially acquiring images of the two image acquisition areas. When an abnormality is detected in the silicon wafer 2 inside the basket 1, the mechanical gripper 8 is moved by the gripper X-axis moving module 4, gripper Y-axis moving module 5, and gripper Z-axis moving module 6 to pick up the basket 1 containing the abnormal silicon wafer 2 and place it in an empty processing station 13 for manual processing. After the abnormal silicon wafer 2 is removed, the mechanical gripper 8 picks up the processed basket 1 and places it back on the inspection workbench 15. Once all abnormal baskets 1 have been processed, and the image acquisition area contains only qualified silicon wafers 2, the inspection workbench 15 transports the baskets 1 to the unloading area. The unloading robot 17 sequentially picks up the baskets 1 and places them onto the unloading workbench 16 for unloading, proceeding to the next step of the process.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications to the technical solutions described in the foregoing embodiments, or equivalent substitutions for some or all of the technical features, do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A device for detecting defects in silicon wafers inside a flower basket, characterized in that, include: Inspection workbench (15), support frame (3), gripper X-axis moving module (4), gripper Y-axis moving module (5), gripper Z-axis moving module (6), mechanical gripper (8), camera X-axis moving module (7) and multiple cameras (9); The support frame (3) is mounted on the input end of the testing workbench (15); The gripper X-axis moving module (4) and the camera X-axis moving module (7) are arranged on the crossbeam of the support frame (3); A gripper Y-axis moving module (5) can be slidably mounted on the gripper X-axis moving module (4); a gripper Z-axis moving module (6) can be slidably mounted on the gripper Y-axis moving module (5); a mechanical gripper (8) can be slidably mounted on the gripper Z-axis moving module (6); Multiple cameras (9) can be movably mounted on the camera X-axis moving module (7).

2. The silicon wafer defect detection device in the flower basket according to claim 1, characterized in that, Multiple cameras (9) can be movably mounted on the camera X-axis moving module (7) via a camera moving bracket (18).

3. The silicon wafer defect detection device in the flower basket according to claim 2, characterized in that, A light source (10) is also provided on the camera moving frame (18).

4. The silicon wafer defect detection device in the flower basket according to claim 1, characterized in that, A material unloading workbench (16) is arranged on one side of the testing workbench (15), and an operating device is arranged on the other side; A material unloading robot (17) is installed on one side of the output end of the inspection workbench (15); the material unloading robot (17) is close to the material unloading workbench (16).

5. The silicon wafer defect detection device in the flower basket according to claim 4, characterized in that, The operating device has multiple processing stations (13); protective railings (14) are installed above the multiple processing stations (13).

6. The silicon wafer defect detection device in the flower basket according to claim 5, characterized in that, The operating device is equipped with a PLC control system (12); The PLC control system (12) is electrically connected to the gripper X-axis moving module (4), gripper Y-axis moving module (5), gripper Z-axis moving module (6), mechanical gripper (8), camera X-axis moving module (7), and unloading robot (17).

7. The silicon wafer defect detection device in the flower basket according to claim 5, characterized in that, The operating device is equipped with a vision controller (11); The vision controller (11) is electrically connected to the camera (9).

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