Electronic component verification platform
By designing an electronic component verification platform, fully automated multi-temperature and pressure combination testing was achieved, solving the problem of low efficiency in existing technologies and improving testing accuracy and efficiency.
Patent Information
- Application Number
- CN202520335047.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-02-27
AI Technical Summary
In existing technologies, electronic components need to be placed in different constant temperature chambers for pressure testing when subjected to various temperatures and pressures, resulting in low efficiency and reliance on manual operation.
An electronic component calibration platform was designed, including a frame, a cavity unit, a test unit, a temperature control unit, and a pressure control unit. Multiple sets of different pressure and temperature values can be set and switched through the pressure control unit and the temperature control unit to achieve fully automated testing.
It improves testing efficiency, reduces testing time, and enables the testing of the same electronic component under various temperatures and pressures without the need for different constant temperature chambers, thus improving testing accuracy and efficiency.
Smart Images
Figure CN223842047U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component testing technology, and in particular to an electronic component verification platform. Background Technology
[0002] In the production and testing phase of some electronic components, electronic products are typically tested. The reliable contact of the testing equipment is crucial to the stability of production yield. When testing some precision electronic products, such as chips, it is necessary to test their performance under different temperatures and pressures, such as high-temperature testing, low-temperature testing, high-pressure testing, and low-pressure testing.
[0003] Currently, when electronic components undergo various temperature and pressure tests, they need to be placed in different constant temperature chambers for pressure testing. The time required for switching the temperature between different constant temperature chambers is long, which is inefficient and mostly done manually, making it highly dependent on personnel.
[0004] To improve testing efficiency and achieve full automation of testing, a pressure calibration platform capable of combining multiple temperatures and pressures is required. Utility Model Content
[0005] In view of this, the purpose of this utility model is to provide an electronic component verification platform to solve the technical problem in the prior art that electronic components need to be placed in different constant temperature chambers for pressure testing when undergoing tests at various temperatures and pressures, resulting in low efficiency.
[0006] To achieve the above objectives, this utility model provides an electronic component verification platform, including a rack, and further comprising:
[0007] The cavity unit is used to provide the temperature and pressure environment required by the product under test;
[0008] The test unit is used to hold the product under test, provide electrical connections to the product under test, and complete the testing and programming.
[0009] A temperature control unit, used to provide the temperature required for testing, is located above the cavity unit and can move towards or away from the cavity unit;
[0010] A pressure control unit, used to provide the pressure required for testing, is located below the cavity unit and connected to the lower cavity component of the cavity unit, providing the pressure required for testing to the cavity unit and precisely controlling it.
[0011] Optionally, the cavity unit includes an upper cavity component, a lower cavity component, and a mold closing mechanism. The upper cavity component is mounted on the mold closing mechanism, the lower cavity component is fixed, and the upper cavity component moves up and down with the mold closing mechanism to achieve mold opening / closing.
[0012] When opening the mold, loading / unloading operations are performed;
[0013] During mold closing, different temperature and pressure environments are formed between the upper cavity component and the lower cavity component.
[0014] Optionally, the test unit includes a socket, a PCB board, a data acquisition board, and a host computer. The socket is mounted on the PCB board, which is installed in the lower cavity component of the cavity unit and electrically connected to both the socket and the data acquisition board. The data acquisition board is electrically connected to the host computer and is used to collect various data of the product under test and upload them to the host computer for processing.
[0015] Optionally, the area of the PCB board is larger than the transverse cross-section of the cavity unit, and the portion of the PCB board connected to the acquisition board is located outside the cavity unit.
[0016] Optionally, the socket includes multiple sets of acupoint modules, each set of acupoint modules containing a central acupoint for mounting a temperature sensor and multiple test acupoints for mounting the product to be tested.
[0017] Optionally, the test acupoints are distributed around the central acupoint at equal intervals.
[0018] Optionally, the temperature control unit includes a TEC temperature control platform, a water-cooled control unit, and a heat-conducting plate. The TEC temperature control platform is installed in the lower cavity component of the cavity unit and is used to generate and quickly switch the required test temperature as needed. The water-cooled control unit is electrically connected to the TEC temperature control platform and is used to provide cooling water and control functions to the TEC temperature control platform. The heat-conducting plate is installed on the lower surface of the TEC temperature control platform.
[0019] Optionally, it also includes a thermal pad disposed between the TEC temperature control platform and the heat-conducting plate, for transferring the temperature generated by the TEC temperature control platform to the product under test.
[0020] Optionally, the heat-conducting plate is provided with multiple sets of protrusions, the number of which corresponds to the number of the central acupoint and the test acupoint. During testing, the protrusions on the heat-conducting plate can directly transmit the temperature of the TEC temperature control platform to the product under test and the temperature sensor on the Socket, and press the product under test and the temperature sensor to make them electrically connected to the Socket.
[0021] Optionally, the TEC temperature control platform has a heat-conducting pad adapted to the number of sockets, and the heat-conducting pad is provided with a heat-conducting plate adapted to the number of acupoint modules.
[0022] The electronic component verification platform provided by this utility model has the following technical effects:
[0023] This type of calibration platform mainly consists of a frame, a cavity unit, a testing unit, a temperature control unit, and a pressure control unit. Multiple different pressure and temperature values can be set and switched through the pressure control unit and the temperature control unit. The testing unit completes the testing and programming of the product under test. The cavity unit opens the mold, and the product is unloaded after testing / programming. Since the temperature control unit and the pressure control unit are arranged one above the other, the entire calibration platform is relatively compact. When the same electronic component is tested at multiple temperatures and pressures, it does not need to enter different constant temperature chambers for pressurization testing, thereby improving testing efficiency. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0025] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the electronic component verification platform of this utility model;
[0026] Figure 2 yes Figure 1 A schematic diagram of the cavity unit and test unit of the China Electronic Components Verification Platform;
[0027] Figure 3 yes Figure 1 A schematic diagram of the structure of some test units of the China Electronic Components Verification Platform;
[0028] Figure 4 yes Figure 3 A schematic diagram of the socket structure of the test unit;
[0029] Figure 5 yes Figure 1 A schematic diagram of the temperature control unit of the electronic component verification platform;
[0030] Figure 6 yes Figure 5 A magnified structural diagram of point A in the middle.
[0031] in, Figures 1-6 :
[0032] 1. Rack;
[0033] 2. Cavity unit; 21. Upper cavity component; 22. Lower cavity component; 23. Mold closing mechanism;
[0034] 3. Test unit; 31. Socket; 311. Acupoint module; 3111. Central acupoint; 3112. Test acupoint; 32. PCB board; 33. Data acquisition board; 34. Host computer;
[0035] 4. Pressure control unit;
[0036] 5. Temperature control unit; 51. TEC temperature control platform; 52. Water-cooled control unit; 53. Heat-conducting plate; 531. Bump; 54. Heat-conducting pad. Detailed Implementation
[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0038] Based on the shortcomings of existing technologies, the following section combines specific examples. Figure 1-4 A preferred embodiment of the electronic component verification platform of this utility model is described in detail.
[0039] like Figure 1-4 As shown, this utility model provides a structural schematic diagram of a preferred embodiment of an electronic component verification platform. This electronic component verification platform includes a frame 1, a cavity unit 2, a testing unit 3, a temperature control unit 5, and a pressure control unit 4. A protective cover is installed outside the frame 1. The frame 1 and the protective cover are used to install the complete set of equipment and provide necessary safety protection for the operator. The cavity unit 2, the testing unit 3, the temperature control unit 5, and the pressure control unit 4 are all installed inside the frame 1.
[0040] The entire calibration platform of this invention has a compact structure. When the same electronic component is tested under various temperatures and pressures, it does not need to be placed in different constant temperature chambers for pressurization testing, nor does it need to be moved around, thereby improving the testing accuracy and efficiency.
[0041] Specifically, such as Figure 2As shown, cavity unit 2 is used to provide the temperature and pressure environment required for the product under test. It includes an upper cavity component 21, a lower cavity component 22, and a mold closing mechanism 23. The upper cavity component 21 is mounted on the mold closing mechanism 23, while the lower cavity component 22 is fixed. The upper cavity component 21 moves up and down with the mold closing mechanism 23 to achieve mold opening / closing. When the mold is opened, loading / unloading operations are performed. When the mold is closed, different temperature and pressure environments are formed between the upper cavity component 21 and the lower cavity component 22.
[0042] The mold closing mechanism 23 here can be a cylinder or a linear motor. As long as it drives the upper cavity component 21 to move up and down, it is within the protection scope of this utility model.
[0043] The relationship between the upper cavity component 21 and the lower cavity component 22 is equivalent to the relationship between a box lid and a box body. That is, the lower cavity component 22 has a hollow cavity with a top opening, and the upper cavity component 21 can cover the lower cavity component 22.
[0044] See also Figure 3 As shown, the test unit 3 is used to carry the product under test, provide electrical connection for the product under test, and complete the testing and programming. It includes a socket 31, a PCB board 32, a data acquisition board 33, and a host computer 34. The socket 31 is mounted on the PCB board 32, which is installed in the lower cavity component 22 of the cavity unit 2 and is electrically connected to the socket 31 and the data acquisition board 33 respectively. The data acquisition board 33 is electrically connected to the host computer 34 and is used to collect various data of the product under test and upload them to the host computer 34 for processing.
[0045] In this embodiment, the area of the PCB board 32 is larger than the transverse cross-section of the lower cavity component 22, and the portion of the PCB board 32 connected to the acquisition board 33 is located outside the cavity unit 2, such as... Figure 3 As shown, the acquisition board 33 is located below the end of the PCB board 32. There are multiple acquisition boards 33, which are stacked together.
[0046] like Figure 3 and Figure 4 As shown, the socket 31 preferably includes 16 units, 4 horizontally and 4 vertically, evenly distributed within the lower cavity component 22. Each socket 31 includes multiple sets of acupoint modules 311. In this embodiment, it is preferred to include four sets of acupoint modules 311. Each set of acupoint modules 311 contains a central acupoint 3111 and four test acupoints 3112. The central acupoint 3111 is used to mount a temperature sensor, and the test acupoints 3112 are used to mount the test acupoints 3112 of the product to be tested. The test acupoints 3112 are distributed around the central acupoint 3111 at equal intervals.
[0047] like Figure 4As shown, each of the four test acupoints 3112 contains one product to be tested, and the central acupoint 3111 contains one temperature sensor. During testing, since the central acupoint 3111 is closer to the test acupoints 3112, the temperature value measured by the temperature sensor in the central acupoint 3111 is very close to the real-time temperature of the product to be tested in the test acupoint 3112, and the two can be considered equal. When the equipment is running, the temperature sensor is always installed in the central acupoint 3111 and is not removed or placed in as the product to be tested is loaded or unloaded.
[0048] like Figure 1 As shown, the pressure control unit 4 is used to provide the pressure required for the test. It is installed below the cavity unit 2 and connected to the lower cavity component 22 of the cavity unit 2. It provides the pressure required for the test to the cavity unit 2 and controls it precisely. It mainly includes a high-precision pressure controller and auxiliary gas pipelines.
[0049] Temperature control unit 5, which provides the temperature required for testing, is located above cavity unit 2 and can move toward or away from the lower cavity component 22 of cavity unit 2.
[0050] Detailed, such as Figure 5 As shown, the temperature control unit 5 includes a TEC temperature control platform 51, a water-cooled control unit 52, and a heat-conducting plate 53. The TEC temperature control platform 51 is installed in the lower cavity component 22 of the cavity unit 2 and is used to generate and quickly switch the required test temperature as needed. The water-cooled control unit 52 is electrically connected to the TEC temperature control platform 51 and is used to provide cooling water and control functions for the TEC temperature control platform 51. The heat-conducting plate 53 is installed on the lower surface of the TEC temperature control platform 51.
[0051] As a preferred embodiment, it also includes thermal pads 54. The TEC temperature control platform 51 has thermal pads 54 that are adapted to the number of Socket 31. That is, the thermal pads 54 in this embodiment also include 16 pieces, 4 horizontally and 4 vertically, which is the same as the distribution of Socket 31 in the lower cavity component 22.
[0052] The heat-conducting plate 53 is mounted on the heat-conducting pad 54. Each heat-conducting pad 54 has four heat-conducting plates 53. That is, the heat-conducting pad 54 is located between the TEC temperature control platform 51 and the heat-conducting plate 53, and is used to transfer the temperature generated by the TEC temperature control platform 51 to the product under test.
[0053] In this embodiment, the heat-conducting plate 53 is preferably made of thermally conductive silicone grease, which can transfer the temperature generated by the TEC temperature control platform 51 to the product under test and press down on the product under test to complete the electrical connection between the product under test and the socket 31.
[0054] As a more preferred implementation method, such as Figure 6As shown, the heat-conducting plate 53 is provided with multiple sets of protrusions 531. The number of protrusions 531 corresponds to the number of central acupoints 3111 and test acupoints 3112. That is, there are 5 protrusions 531, one of which corresponds to the central acupoint 3111 and the remaining 4 protrusions 531 correspond to the test acupoints 3112. During testing, the protrusions 531 on the heat-conducting plate 53 can directly transfer the temperature of the TEC temperature control platform 51 to the product under test and the temperature sensor on the Socket 31, and press the product under test and the temperature sensor to make them electrically connected to the Socket 31.
[0055] The specific process is as follows:
[0056] (1) After the product under test is loaded, the cavity unit 2 closes the mold, and the protrusion 531 on the heat-conducting plate 53 presses the product under test and the temperature sensor on the Socket 31, so that the product under test and the temperature sensor are electrically connected to the Socket 31.
[0057] (2) Temperature control unit 5 is activated, and the product under test and temperature sensor are heated / cooled to the required temperature value;
[0058] (3) The pressure control unit 4 is activated, and the cavity unit 2 reaches the required pressure value.
[0059] (4) By setting and switching multiple different pressure and temperature values through pressure control unit 4 and temperature control unit 5, test unit 3 completes the testing and programming of the product under test;
[0060] (5) Open the mold of cavity unit 2 and unload the product after testing / burning.
[0061] In the description of this utility model, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0062] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0063] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.
Claims
1. An electronic component verification platform, comprising a rack, characterized in that, Also includes: The cavity unit is used to provide the temperature and pressure environment required by the product under test; The test unit is used to hold the product under test, provide electrical connections to the product under test, and complete the testing and programming. A temperature control unit, used to provide the temperature required for testing, is located above the cavity unit and can move towards or away from the cavity unit; A pressure control unit, used to provide the pressure required for testing, is located below the cavity unit and connected to the lower cavity component of the cavity unit, providing the pressure required for testing to the cavity unit and precisely controlling it.
2. The electronic component verification platform according to claim 1, characterized in that, The cavity unit includes an upper cavity component, a lower cavity component, and a mold closing mechanism. The upper cavity component is mounted on the mold closing mechanism, and the lower cavity component is fixed. The upper cavity component moves up and down with the mold closing mechanism to achieve mold opening / closing. When opening the mold, loading / unloading operations are performed; During mold closing, different temperature and pressure environments are formed between the upper cavity component and the lower cavity component.
3. The electronic component verification platform according to claim 1 or 2, characterized in that, The test unit includes a socket, a PCB board, a data acquisition board, and a host computer. The socket is mounted on the PCB board, which is installed in the lower cavity component of the cavity unit and electrically connected to both the socket and the data acquisition board. The data acquisition board is electrically connected to the host computer and is used to collect various data of the product under test and upload them to the host computer for processing.
4. The electronic component verification platform according to claim 3, characterized in that, The area of the PCB board is larger than the transverse cross-section of the cavity unit, and the part of the PCB board that connects to the acquisition board is located outside the cavity unit.
5. The electronic component verification platform according to claim 3, characterized in that, The socket includes multiple sets of acupoint modules. Each set of acupoint modules contains a central acupoint for mounting a temperature sensor and multiple test acupoints for mounting the product to be tested.
6. The electronic component verification platform according to claim 5, characterized in that, The test acupoints are distributed around the central acupoint at equal intervals.
7. The electronic component verification platform according to claim 5, characterized in that, The temperature control unit includes a TEC temperature control platform, a water-cooled control unit, and a heat-conducting plate. The TEC temperature control platform is installed in the lower cavity component of the cavity unit and is used to generate and quickly switch the required test temperature as needed. The water-cooled control unit is electrically connected to the TEC temperature control platform and is used to provide cooling water and control functions for the TEC temperature control platform. The heat-conducting plate is installed on the lower surface of the TEC temperature control platform.
8. The electronic component verification platform according to claim 7, characterized in that, It also includes a thermal pad, which is disposed between the TEC temperature control platform and the heat-conducting plate, for transferring the temperature generated by the TEC temperature control platform to the product under test.
9. The electronic component verification platform according to claim 8, characterized in that, The heat-conducting plate is provided with multiple sets of protrusions. The number of protrusions corresponds to the number of central acupoints and test acupoints. During testing, the protrusions on the heat-conducting plate can directly transmit the temperature of the TEC temperature control platform to the product under test and the temperature sensor on the Socket, and press the product under test and the temperature sensor to make them electrically connected to the Socket.
10. The electronic component verification platform according to claim 8, characterized in that, The TEC temperature control platform has a heat-conducting pad adapted to the number of sockets, and the heat-conducting pad is provided with a heat-conducting plate adapted to the number of acupoint modules.