Testing device

Abstract

The utility model discloses a testing device, and relates to the technical field of chip testing, the testing device comprises a box body and a PCB machine frame arranged in the box body, one side of the PCB machine frame is provided with a fixing plate, and one side, facing the inner wall of the box body, of the fixing plate is provided with two back plates; a communication station used for installing a communication board is formed in the PCB machine frame, and one side of the communication board installed on the communication station can be matched with the back boards in an inserted mode at the same time. A plurality of board card stations used for installing resource boards are arranged in the PCB machine frame, the communication station and the board card stations are arranged side by side and are vertically connected with the back board, and the board card stations are evenly distributed on the two sides of the communication station. According to the testing device provided by the invention, the structural design that the double-backboard structure and the communication board can be inserted at the same time is adopted, fly line connection between internal parts of the testing device can be effectively reduced, the structure is simplified, meanwhile, the integration degree of the testing device can be improved, and the size of the testing device is reduced.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a testing device. Background Technology

[0002] Due to the intricate structure, complex manufacturing process, and cumbersome procedures involved in chip production, potential defects are inevitably left behind. This can prevent the finished chips from meeting standard requirements and lead to malfunctions at any time due to various reasons. Therefore, manufacturers typically test the packaged chips during the manufacturing process. Specifically, a testing system is used to test the chips. The testing device within the system contacts the chip's pins and applies a signal source to perform the testing.

[0003] In the prior art, the test device includes multiple backplanes and multiple boards (such as communication boards, resource boards, etc.). Each backplane is independent of the others, and the boards are mostly connected to each backplane by flying wires. The operation is relatively complicated, and it is not convenient to install and maintain. It also makes the overall size of the test device large and the integration low. Utility Model Content

[0004] The purpose of this application is to provide a testing device that can improve the integration of the testing device and reduce its size.

[0005] One embodiment of this application provides a testing device, including a housing and a PCB frame disposed within the housing. A fixing plate is provided on one side of the PCB frame, and two back plates are provided on the side of the fixing plate facing the inner wall of the housing. A communication station for mounting a communication board is formed inside the PCB frame, and one side of the communication board mounted at the communication station can simultaneously plug into each of the back plates. The PCB frame contains multiple board mounting stations for mounting resource boards. The communication station and each of the board mounting stations are arranged side-by-side and perpendicular to the back plates, and multiple board mounting stations are arranged on both sides of the communication station.

[0006] As one feasible approach, the two backplates are arranged in a centrally symmetrical manner within the plane of the fixed plate; an equal number of the board card workstations are arranged on both sides of the communication workstation.

[0007] As one feasible approach, an air-cooling component and a water-cooling component are provided between the inner wall of the housing and the outer side of the PCB frame, with the air-cooling component and the water-cooling component respectively located on opposite sides of the PCB frame.

[0008] As one possible implementation, the PCB frame includes a first cutout plate and a second cutout plate arranged relatively parallel to each other, the air-cooling component is disposed between the outer side wall of the first cutout plate and the housing, and the water-cooling component is disposed between the outer side wall of the second cutout plate and the housing.

[0009] As one possible implementation, the frame further includes a pair of side plates for connecting the two ends of the first and second cutout plates on the same side. Each side plate has a clamping hole on its outer side wall. The housing has a through hole corresponding to each clamping hole, so that the clamping arm of the external device can be inserted into the through hole and the corresponding clamping hole in sequence and fixed to the side plate to clamp the PCB frame.

[0010] As one possible implementation, a pair of grooves are formed on the outer side of the housing, each groove being located on opposite sides of the housing, and each groove having a through hole on its bottom surface, and the groove being adapted to the clamping arm.

[0011] As one possible approach, the housing has multiple recessed mounting spaces, each of which contains an operating handle for connecting to the water-cooling component and the air-cooling component.

[0012] As one possible implementation, a temperature and humidity sensor is also provided inside the chamber, and a display connected to the temperature and humidity sensor is provided on the outside of the chamber; and / or, the testing device further includes a power supply, and an indicator connected to the power supply is provided in the chamber.

[0013] The beneficial effects of the embodiments of this application include:

[0014] The testing device provided in this application includes a housing and a PCB frame disposed inside the housing. A fixing plate is provided on one side of the PCB frame, and two back plates are provided on the side of the fixing plate facing the inner wall of the housing. A communication station for mounting a communication board is formed inside the PCB frame. The same side of the communication board can be inserted and mated with the two back plates. This arrangement can replace the flying wire connection between the two back plates and the communication board, simplify the internal structure, reduce the overall size of the device, and effectively improve the integration of the testing device. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1This is a schematic diagram of the structure of a testing device provided in an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of another view of the structure of a testing device provided in an embodiment of this application;

[0018] Figure 3 This is one of the partial structural schematic diagrams of a testing device provided in an embodiment of this application;

[0019] Figure 4 This is a second partial structural schematic diagram of a testing device provided in an embodiment of this application;

[0020] Figure 5 This is the third partial structural schematic diagram of a testing device provided in an embodiment of this application;

[0021] Figure 6 This is a schematic diagram of the structure of a chassis provided in an embodiment of this application. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0024] In the description of this application, it should be noted that the terms "center", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] like Figures 1 to 4As shown in the figure, this application provides a testing device 100 for chip testing, which includes a housing 110 and a PCB frame 130 disposed within the housing 110. A fixing plate 120 is disposed on one side of the PCB frame 130, and two back plates 121 are fixedly disposed on the side of the fixing plate 120 facing the inner wall of the housing 110. A communication station for mounting a communication board is formed inside the PCB frame 130, and the same side of the communication board mounted at the communication station can be simultaneously plugged into and cooperate with the two back plates 121 to realize communication. In addition, multiple board mounting stations for mounting resource boards are also provided inside the PCB frame 130. The communication station and each board mounting station are arranged side by side and are all arranged perpendicular to the back plates 121. It can be understood that resource boards can be inserted at each board mounting station as needed, and the side of each resource board facing the back plate 121 can be plugged into and cooperate with a corresponding back plate 121.

[0026] Compared to existing technologies, the testing device 100 in this embodiment of the application provides a fixing plate 120 on one side of the PCB chassis 130 and installs two backplates 121 on the fixing plate 120. A communication board installed inside the PCB chassis 130 can simultaneously plug and cooperate with the two backplates 121 on the fixing plate 120, and multiple resource boards inside the PCB chassis 130 can each plug and cooperate with a backplate 121. This configuration can effectively avoid the problem of connecting various boards through jumpers due to the independence of the two backplates 121, simplifying the internal structure, improving testing efficiency, and reducing the overall size of the device.

[0027] In one embodiment, such as Figure 3 As shown, in the plane where the fixed plate 120 is located, the two back plates 121 are arranged symmetrically at the center, and an equal number of board stations are arranged on both sides of the communication station. This arrangement allows the communication board to be located in the middle of the two back plates 121, and each resource board inserted on both sides of the communication board can be plugged into one of the back plates 121. This arrangement simplifies the connection structure between the boards, optimizes the use of the internal space of the test device 100, and reduces the size while improving efficiency.

[0028] In one embodiment, an air-cooling component 140 and a water-cooling component 150 are provided between the inner wall of the enclosure 110 and the PCB frame 130. The air-cooling component 140 and the water-cooling component 150 are respectively located on opposite sides of the PCB frame 130. This arrangement allows for the combined use of air and water cooling to dissipate heat from components such as the resource board, communication board, and backplate 121 inside the enclosure 110, effectively improving heat dissipation efficiency. In addition, the fact that the air-cooling component 140 and the water-cooling component 150 are respectively located on opposite sides of the PCB frame 130 facilitates modular installation.

[0029] To further improve heat dissipation, the two opposite sides of the PCB frame 130 can be cut out, such as... Figure 4 and Figure 6 As shown. In this way, the heat generated by components such as the resource board, communication board, and backplane can be directly dissipated through the perforations, improving heat dissipation efficiency.

[0030] Understandable, Figure 4 and Figure 5 To more clearly demonstrate the specific structures of the water-cooled assembly 150 and the air-cooled assembly 140, Figure 4 and Figure 5 Box 110 is not shown in the diagram.

[0031] In one embodiment, the water-cooling assembly 150 includes multiple water-cooling plates, which are arranged in parallel at intervals within the PCB frame 130. A water-cooling plate is provided between any adjacent board workstations to facilitate the dissipation of heat from the resource boards inserted into the board workstations using water cooling, thus achieving good heat dissipation efficiency.

[0032] Specifically, the water-cooling assembly 150 includes a busbar connected to each water-cooling plate and a control system for controlling the flow rate of water within the water-cooling plate. The busbar and control system are located between the outer side of the PCB frame 130 and the inner wall of the housing 110. This arrangement allows for real-time adjustment of the flow rate of water within the water-cooling plate according to actual conditions, thereby achieving the purpose of controlling the heat dissipation effect.

[0033] In one embodiment, such as Figure 4 , Figure 5 and Figure 6 As shown, the PCB frame 130 includes a first cutout plate 131 and a second cutout plate 132 arranged relatively parallel to each other. The air-cooling component 140 is disposed between the outer side wall of the first cutout plate 131 and the housing 110, and the water-cooling component 150 is disposed between the outer side wall of the second cutout plate 132 and the housing 110. That is, the air-cooling component 140 and the water-cooling component 150 are disposed on opposite sides of the PCB frame 130 and between the PCB frame 130 and the housing 110, which facilitates modular installation and improves heat dissipation based on the cutout structure.

[0034] Understandably, the arrangement of the first cutout plate 131 and the second cutout plate 132 allows the heat inside the PCB frame 130 to escape through the cutout positions of the first cutout plate 131 and the second cutout plate 132. This means that the air-cooling component 140 can directly act on components such as resource boards and communication boards over a larger area, thereby improving the air-cooling effect.

[0035] In one embodiment, the PCB frame 130 further includes a pair of side plates 133, which are arranged parallel to each other and spaced apart. They are connected to the same-side ends of the first cutout plate 131 and the second cutout plate 132, such that the first cutout plate 131, one side plate 133, the second cutout plate 132, and the other side plate 133 are connected end-to-end to form a receiving cavity for accommodating the resource board and the communication board. One side of the receiving cavity is sealed by a fixing plate 120. Figure 6 As shown.

[0036] In one embodiment, the PCB frame 130 includes a pair of side plates 133 for connecting the two same-side ends of the first cutout plate 131 and the second cutout plate 132. Each side plate 133 has a clamping hole 134 on its outer side wall. The housing 110 has a through hole 115 corresponding to the position of each clamping hole 134. When the testing device 100 moves, the clamping arm of the external device can sequentially extend into the through hole 115 and the corresponding clamping hole 134 and be fixed to the corresponding side plate 133 to clamp the PCB frame 130. Thus, the housing 110 can be transported and its position adjusted based on the clamping of the PCB frame 130 inside the housing 110.

[0037] During chip testing, the testing device 100 inevitably needs to move. To facilitate the movement of the testing device 100, in one embodiment, through holes 115 and clamping holes 134 are respectively provided on the housing 110 and the side plate 133, so that the clamping arm can sequentially extend into the through hole 115 and the corresponding clamping hole 134 to clamp the PCB frame 130. Specifically, as shown... Figure 1 As shown, a pair of grooves 116 are formed on the outer side of the housing 110. Each groove 116 is located on opposite sides of the housing 110. The bottom surface of each groove 116 has multiple through holes 115. The through holes 115 in the two grooves 116 are also arranged in a one-to-one correspondence, so that the clamping arms on both sides of the housing 110 are on the same horizontal line. The grooves 116 are adapted to the shape of the clamping arms. When clamping is required, the clamping arms extend from the outside to the inside into the through holes 115 and clamping holes 134 to clamp the testing device 100, and then move the testing device 100 along with it. It can be understood that the clamping arms need to clamp from both sides of the housing 110, that is, the side plates 133 on both sides are provided with clamping holes 134, and the corresponding sides of the housing 110 are provided with through holes 115.

[0038] In this embodiment, the through hole 115 is set in the groove of the housing 110. In this way, a clamping arm with a smaller clamping distance can be selected to clamp the test device 100, and the point of action of the clamping arm is on the PCB frame 130. This can improve the stability of clamping and avoid the housing 110 from the PCB frame 130 due to the large mass of the PCB frame 130 and the board material.

[0039] Optional, such as Figure 1 and Figure 2 As shown, the outer side of the housing 110 has a recessed area with multiple installation spaces 111, and each installation space 111 is used to install an operating handle 112 that is connected to the water-cooling component 150 and the air-cooling component 140 respectively.

[0040] The operating handle 112 is located inside the installation space 111, which allows the operating handle 112 to be located on the inner side of the side of the housing 110. This avoids the problem of increased volume caused by the outward protrusion of the operating handle 112, and also prevents accidental touches that could lead to incorrect input commands.

[0041] In one embodiment, in order to monitor the environmental information inside the enclosure 110 in real time, a temperature and humidity sensor for real-time monitoring of temperature and humidity information is also provided inside the enclosure 110, and a display device electrically connected to the temperature and humidity sensor is provided on the outside of the enclosure 110. With this configuration, the staff can obtain the internal environmental information of the enclosure 110 based on the information displayed on the display device, which is convenient for adaptive adjustments based on the internal environmental information.

[0042] In one embodiment, such as Figure 1 As shown, the test device 100 also includes a power supply, which is located inside the housing 110. An indicator 114 connected to the power supply is also provided on the outer side of the housing 110.

[0043] The indicator 114 is used to indicate the operating status of the internal power supply. Specifically, the specific structure of the power supply indicator 114 is not limited in this embodiment; for example, it can be as follows: Figure 1 As shown, three indicator lights of different colors are set, and one of the indicator lights can be selected to light up under different conditions.

[0044] In addition, to improve the safety of using the testing device 100, it is possible to... Figure 1 An emergency stop button connected to the power supply is provided. In the event of an unsafe accident, the power supply can be cut off by the emergency stop button, causing the testing device 100 to stop. To avoid accidental activation, the emergency stop button is located on the same side of the housing 110 as the indicator 114.

[0045] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A testing device, characterized in that, The device includes a housing and a PCB frame disposed within the housing. A fixing plate is provided on one side of the PCB frame, and two back plates are provided on the side of the fixing plate facing the inner wall of the housing. A communication station for mounting a communication board is formed inside the PCB frame, and one side of the communication board mounted at the communication station can simultaneously plug into each of the back plates. The PCB frame contains multiple board mounting stations for mounting resource boards. The communication station and each of the board mounting stations are arranged side-by-side and perpendicularly connected to the back plates, with multiple board mounting stations arranged on both sides of the communication station.

2. The testing apparatus according to claim 1, characterized in that, Within the plane of the fixed plate, the two back plates are arranged symmetrically at the center; an equal number of the board card workstations are arranged on both sides of the communication workstation.

3. The testing apparatus according to claim 1, characterized in that, An air-cooling component and a water-cooling component are provided between the inner wall of the housing and the outer side of the PCB frame, and the air-cooling component and the water-cooling component are respectively located on opposite sides of the PCB frame.

4. The testing apparatus according to claim 3, characterized in that, The PCB frame includes a first cutout plate and a second cutout plate arranged relatively parallel to each other. The air-cooling component is disposed between the outer side wall of the first cutout plate and the housing, and the water-cooling component is disposed between the outer side wall of the second cutout plate and the housing.

5. The testing apparatus according to claim 4, characterized in that, The frame also includes a pair of side plates for connecting the two ends of the first and second cutout plates on the same side. Each side plate has a clamping hole on its outer side wall. The housing has a through hole corresponding to each clamping hole, so that the clamping arm of the external device can be inserted into the through hole and the corresponding clamping hole in sequence and fixed to the side plate to clamp the PCB frame.

6. The testing apparatus according to claim 5, characterized in that, A pair of grooves are formed on the outer side of the box, each groove being located on opposite sides of the box, and each groove having a through hole on its bottom surface, and the grooves being adapted to the clamping arms.

7. The testing apparatus according to claim 3, characterized in that, The housing has multiple recessed mounting spaces, each of which contains an operating handle for connecting to the water-cooling component and the air-cooling component.

8. The testing apparatus according to claim 7, characterized in that, The enclosure is also equipped with a temperature and humidity sensor, and the outside of the enclosure is equipped with a display connected to the temperature and humidity sensor; and / or, The testing device also includes a power supply, and the housing is equipped with an indicator connected to the power supply.

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