Optical module assembly for server and server

Abstract

The embodiment of the utility model provides an optical module assembly used for a server and the server, the optical module assembly used for the server comprises an optical module, a circuit board, a heat dissipation piece and a locking accessory, the circuit board is provided with a mounting shell, the mounting shell is provided with a mounting cavity used for mounting the optical module, the mounting cavity is provided with a first side and a second side which are arranged at an angle, the first side and the second side are both open sides; the heat dissipation piece is arranged on the first side and the second side for the optical module to enter and exit; the heat dissipation piece and the circuit board are connected through a lock accessory, and the lock accessory provides force for the heat dissipation piece to be close to the optical module. According to the embodiment, the problem that the heat dissipation effect of the optical module is poor is solved.

Description

Technical Field

[0001] This application relates to the field of computers, and more specifically, to an optical module component for a server and a server. Background Technology

[0002] As the transmission rate of optical modules increases, so does their power consumption, making heat dissipation a major challenge for server cooling. Currently, 800G optical modules consume around 16W, making traditional air cooling insufficient, especially for rear-mounted network cards where the incoming air is preheated by the system, further worsening heat dissipation. High temperatures not only cause optical modules to disconnect but also lead to high fan speeds, impacting the cooling efficiency of the server room.

[0003] Currently, optical module cooling primarily relies on the heatsink cage on the network card. Due to space limitations, the heatsink fins of these cages are very small, resulting in limited cooling capacity. The optical module and heatsink cage are freely plugged in and out, leading to significant contact thermal resistance and reduced heat dissipation performance. Furthermore, manufacturing tolerances can cause the gap between the optical module and the cage to widen further, resulting in a smaller contact area and even greater thermal resistance. Liquid cooling, which uses heat pipes connected to the cage, also exists, but this doesn't solve the contact thermal resistance issue between the module and the cage. Additionally, cold plate solutions are complex, costly, and negatively impact server maintenance and upkeep. Utility Model Content

[0004] This application provides an optical module component and a server for a server, in order to at least solve the problem of poor heat dissipation of the optical module.

[0005] According to one aspect of this application, an optical module assembly for a server is provided, comprising: an optical module, a circuit board, a heat sink, and a locking accessory. The circuit board has a mounting shell, the mounting shell has a mounting cavity for mounting the optical module, the mounting cavity has a first side and a second side arranged at an angle, both the first side and the second side being open sides; the heat sink is disposed on the first side, and the second side allows the optical module to enter and exit; the heat sink and the circuit board are connected by the locking accessory, and the locking accessory provides a force to the heat sink to approach the optical module.

[0006] Furthermore, the lock accessory includes: a connector and an elastic member. The connector connects the heat sink and the circuit board. The elastic member is sleeved on the outside of the connector and abuts against the heat sink or the circuit board. The elastic member provides a force to the heat sink to approach the optical module.

[0007] Furthermore, the connector includes a first large-diameter section, a small-diameter section, and a second large-diameter section connected axially in sequence. The heat sink and the circuit board both have mounting holes for the connector to pass through. The diameter of the mounting holes is larger than the diameter of the small-diameter section but smaller than the diameter of the first and second large-diameter sections. The elastic element is sleeved on the outside of the small-diameter section.

[0008] Furthermore, the heat sink includes a heat sink base, which includes a heat sink area for heat exchange with the optical module and a mounting area located at the peripheral edge of the heat sink area. The heat sink area is disposed opposite to the mounting cavity, and the mounting area protrudes from the peripheral side of the mounting shell. The locking accessory passes through the mounting area.

[0009] Furthermore, the central region of the heat dissipation substrate facing the optical module has a recess, which is recessed in the direction away from the optical module, forming a heat dissipation area.

[0010] Furthermore, the optical module assembly also includes a thermally conductive layer, which is disposed within the heat dissipation area and transfers heat with the optical module.

[0011] Furthermore, the heat-conducting layer is a phase change material layer, which has a solid state and a liquid state. When the phase change material layer is in the liquid state, it expands and flows within the recess.

[0012] Furthermore, the optical module assembly also includes a protective layer, which is disposed on the side of the thermally conductive layer close to the optical module.

[0013] Furthermore, the locking accessory includes a connector and an elastic element. The connector connects the heat sink and the circuit board. The elastic element is sleeved on the outside of the connector and abuts against the side of the heat sink away from the optical module. The elastic element provides a force to the heat sink that is close to the optical module. The extension and retraction direction of the elastic element is perpendicular to the direction in which the optical module enters and exits the mounting housing. The heat sink includes a heat sink base and heat sink fins. The heat sink fins are located on the side of the heat sink base away from the optical module. The heat sink base includes a heat dissipation area that exchanges heat with the optical module and an installation area located at the peripheral edge of the heat dissipation area. The heat dissipation area is opposite to the mounting cavity. The installation area protrudes from the periphery of the mounting housing. The locking accessory passes through the installation area. There are multiple locking accessories, and each corner of the installation area is equipped with a locking accessory. The optical module assembly also includes a thermally conductive layer and a protective layer. The thermally conductive layer is located in the heat dissipation area and transfers heat with the optical module. The thermally conductive layer is a phase change material layer, and the protective layer is a stainless steel layer. The protective layer is located on the side of the thermally conductive layer that is close to the optical module.

[0014] According to another aspect of this application, a server is provided, including the aforementioned optical module component for a server.

[0015] The technical solution of this application sets the optical module inside the mounting housing and uses a locking accessory to provide a force close to the optical module for the heat sink, thereby enabling the optical module to make full contact with the heat sinks on both sides and the mounting housing. This reduces contact thermal resistance, improves heat dissipation efficiency, and effectively lowers the temperature of the optical module. Simultaneously, it reduces the fan speed of the server system, saving energy. Furthermore, this embodiment features a mounting cavity with two angled openings, ensuring that the optical module does not interfere with the heat sink when entering or exiting the mounting cavity. This eliminates the need to remove the heat sink simultaneously when installing or removing the optical module, allowing the heat sink to continuously provide heat dissipation. This further improves the heat dissipation efficiency of the optical module assembly and increases the efficiency of installation and removal. Moreover, this embodiment improves the heat dissipation performance of the optical module assembly with minimal modification and low cost, offering high operability and avoiding the cost and maintenance difficulties associated with traditional solutions. Attached Figure Description

[0016] Figure 1 This is an exploded view of the optical module assembly of this application;

[0017] Figure 2 This is a schematic diagram of the optical module assembly of this application;

[0018] Figure 3 This is a cross-sectional view of the optical module assembly of this application;

[0019] Figure 4 This is a schematic diagram of the heat sink component of this application;

[0020] Figure 5 This is a schematic diagram of the structure of the thermally conductive layer and the protective layer of this application.

[0021] 10. Optical module; 20. Circuit board; 21. Mounting shell; 30. Heat sink; 31. Heat sink base; 311. Heat sink area; 312. Mounting area; 32. Heat sink fins; 40. Locking accessory; 41. Connector; 42. Elastic component; 50. Thermal conductive layer; 60. Protective layer. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0024] In this utility model, unless otherwise stated, directional terms such as "upper", "lower", "top", and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0025] To address the issue of poor heat dissipation in optical modules, this application provides an optical module component for a server and a server, wherein the server includes the optical module component described below.

[0026] like Figures 1 to 5 An optical module assembly for a server is shown, comprising: an optical module 10, a circuit board 20, a heat sink 30, and a locking accessory 40. The circuit board 20 has a mounting shell 21, which has a mounting cavity for mounting the optical module 10. The mounting cavity has a first side and a second side arranged at an angle, both of which are open sides. The heat sink 30 is disposed on the first side, and the second side allows the optical module 10 to enter and exit. The heat sink 30 and the circuit board 20 are connected by the locking accessory 40, and the locking accessory 40 provides a force to the heat sink 30 to approach the optical module 10.

[0027] This embodiment, on the one hand, by setting the optical module 10 inside the mounting housing 21 and the locking accessory 40 providing a force close to the heat sink 30, allows the optical module 10 to make full contact with both sides of the heat sink 30 and the mounting housing 21, thereby reducing contact thermal resistance, improving heat dissipation efficiency, and effectively reducing the temperature of the optical module 10. Simultaneously, it reduces the fan speed of the server system, saving energy. On the other hand, this embodiment sets the mounting cavity with two angled openings, ensuring that the optical module 10 does not interfere with the heat sink 30 when entering or exiting the mounting cavity. This eliminates the need to remove the heat sink 30 simultaneously when installing or removing the optical module 10, allowing the heat sink 30 to continuously provide heat dissipation. This improves the heat dissipation efficiency of the optical module assembly and increases the installation and removal efficiency of the optical module 10. Furthermore, this embodiment improves the heat dissipation performance of the optical module assembly with minimal modification and low cost, offering high operability and avoiding the cost and maintenance difficulties associated with traditional solutions.

[0028] like Figure 1 , Figure 2As shown, in this embodiment, the lock accessory 40 includes a connector 41 and an elastic member 42. The connector 41 connects the heat sink 30 and the circuit board 20. The elastic member 42 is sleeved on the outside of the connector 41 and abuts against the heat sink 30 or the circuit board 20. The elastic member 42 provides a force to the heat sink 30 to approach the optical module 10, thereby enabling the heat sink 30 and the optical module 10 to make full contact, thereby reducing the contact thermal resistance between the optical module 10 and the heat sink 30, and thus improving the heat dissipation efficiency. Specifically, the circuit board 20 in this embodiment includes a main board and a mounting shell 21. The mounting shell 21 is configured as a rectangular box with openings on the first and second sides, such as... Figure 2 As shown, the second side of the mounting shell 21 is located at one edge of the main board to facilitate the entry and exit of the optical module 10 from the opening on the second side into the mounting cavity. The mounting shell 21 can be fixed to the main board by welding, riveting, or other methods. The mounting shell 21 is located between the heat sink 30 and the main board, and the first side of the mounting cavity is located on the side of the mounting cavity away from the main board to facilitate the placement of the heat sink 30. Considering that the presence of the mounting shell 21 will affect the heat conduction efficiency between the heat sink 30 and the optical module 10, the first side is also set as an opening so that the heat generated by the optical module 10 can be quickly transferred to the heat sink 30. The mounting shell 21 is fixed to the main board by the connector 41 to prevent the heat sink 30 from falling off and the optical module 10 from falling off the first side. After the locking accessory 40 is installed, the elastic member 42 is located on the side of the heat sink 30 away from the mounting shell 21, or on the side of the main board away from the mounting shell 21. Thus, the elastic force of the elastic member 42 can provide a force to bring the heat sink 30 and the main board closer together, thereby ensuring effective contact between the heat sink and the optical module 10.

[0029] Compared to traditional optical module assemblies where the heat sink is riveted to the mounting housing 21 using metal rivets, the locking accessory 40 in this embodiment not only has a high locking force, but the elastic element 42's extension and contraction in the extension direction of the connector 41 further facilitates the entry and exit of the optical module 10 into the mounting cavity. This effectively avoids problems caused by processing errors in the optical module 10 or mounting housing 21, such as inadequate fit between the optical module 10 and the heat sink or between the optical module 10 and the mounting housing 21. Thus, even during server operation, vibrations can maintain tight contact between the heat sink 30 and the optical module 10, thereby improving the stability and efficiency of heat dissipation and preventing a decrease in heat dissipation efficiency due to poor contact, thus maintaining stable server operation. Optionally, the elastic element 42 can be a spring or a ring-shaped washer with good resilience.

[0030] In this embodiment, the connector 41 includes a first large-diameter section, a small-diameter section, and a second large-diameter section connected axially in sequence. Both the heat sink 30 and the circuit board 20 have mounting holes for the connector 41 to pass through. The diameter of the mounting hole is larger than the diameter of the small-diameter section but smaller than the diameters of the first and second large-diameter sections. The elastic member 42 is sleeved on the outside of the small-diameter section. Specifically, in this embodiment, the connector 41 is configured as a cylinder with larger diameters at both ends and a smaller diameter in the middle, thereby allowing the elastic member 42 to be confined within the small-diameter section. The first large-diameter section serves as the head of the connector 41, and the second large-diameter section is the part that first extends into the mounting hole when the connector 41 is installed. The second large-diameter section can be configured as a deformable cone or frustum shape, with the smaller diameter end of the cone or frustum shape located away from the first large-diameter section. When the end of the second large-diameter section, furthest from the first large-diameter section, extends into the mounting hole, it gradually extends into the mounting hole along a conical or frustum-shaped contour and elastically deforms under the pressure of the mounting hole. After the second large-diameter section passes through the mounting hole, it returns to its original shape, thus achieving self-locking of the connector to prevent the second large-diameter section from detaching from the mounting hole. This also simplifies the installation process. The outer diameter of the elastic element 42 is set larger than the diameter of the mounting hole. When the small-diameter section extends into the mounting hole, the elastic element 42 is obstructed by the mounting hole and cannot pass through. After the locking accessory 40 is installed, the first large-diameter section and the elastic element 42 are located on the side of the heat sink 30 furthest from the optical module 10, the small-diameter section is located between the heat sink 30 and the main board, and the second large-diameter section is located on the side of the main board furthest from the heat sink 30. The design of this connector 41 not only ensures a firm connection between the heat sink 30 and the main board, guaranteeing effective contact between the heat sink 30 and the optical module 10, but also simplifies the assembly process. This allows the optical module assembly to remain stable during long-term operation, reducing the failure rate caused by connection problems and thus lowering server maintenance costs. Of course, depending on the actual situation, the positions of the first and second large-diameter sections can be interchanged without affecting the performance. The structure of the connector 41 is not limited to this; it can also be configured in other structural forms, as long as it can pass smoothly through the mounting hole and limit the elastic element 42 in the middle position of the connector 41 to provide elastic force. For example, the connector 41 can also be configured as a bolt and nut structure, with the elastic element 42 sleeved on the outer periphery of the screw, the bolt passing through the mounting hole, and the elastic element 42 limited to the side of the heat sink 30 away from the circuit board 20. After the bolt passes through the mounting hole of the circuit board 20, it can be fixed with a nut.

[0031] In this embodiment, the heat sink 30 includes a heat sink base 31, which includes a heat sink area 311 for heat exchange with the optical module 10 and a mounting area 312 located at the peripheral edge of the heat sink area 311. The heat sink area 311 is disposed opposite to the mounting cavity, and the mounting area 312 protrudes from the periphery of the mounting shell 21. The locking accessory 40 passes through the mounting area 312, thereby enabling the heat sink 30 to have a large heat sink area 311 that can fully contact the optical module 10, while also having the mounting area 312 to achieve a reliable connection with the main board, thus ensuring effective contact between the heat sink area 311 and the optical module 10. Specifically, in this embodiment, the heat sink base 31 is configured as a rectangular plate structure, the heat sink area 311 is configured as a rectangular shape corresponding to the first side of the mounting cavity, and the mounting area 312 is disposed around the heat sink area 311. On the one hand, it supports the heat sink area 311, and on the other hand, it provides a suspended area between the main board and the heat sink 30 that does not pass through the mounting shell 21 and the optical module 10, thereby providing space for the installation of the locking accessory 40. This structural design allows the heat sink 30 to absorb the heat generated by the optical module 10 more effectively, while the protruding mounting area 312 ensures the stable installation of the heat sink 30.

[0032] In this embodiment, the heat dissipation substrate 31 has a recess in the central region facing the optical module 10. The recess is recessed away from the optical module 10, forming a heat dissipation area 311. This allows a heat-conducting layer 50 with better heat transfer performance to be disposed within the recess, thereby further improving the heat dissipation efficiency between the heat dissipation component 30 and the optical module 10. Simultaneously, it reduces friction when the optical module 10 enters and exits the mounting cavity, thus extending the service life of both the optical module 10 and the heat dissipation component 30. Specifically, in this embodiment, the recess and the first side of the mounting cavity are configured with the same shape, also rectangular, to facilitate the placement of the heat-conducting layer 50 within the recess to improve heat conduction efficiency. The size of the recess should not be larger than the size of the opening on the first side of the mounting cavity. The recess should be aligned with the opening on the first side, and the edge of the recess should not extend beyond the edge of the mounting shell 21. This allows the recess to accommodate a heat transfer layer with better heat transfer performance while ensuring that the mounting area 312 near the heat dissipation area 311 can abut against the edge of the mounting shell 21. This ensures the effectiveness of the recess and prevents the edge of the recess from extending beyond or partially extending beyond the opening on the first side, which could lead to the recess failing.

[0033] In this embodiment, the optical module assembly further includes a thermally conductive layer 50, which is disposed within the heat dissipation area 311 and transfers heat with the optical module 10, thereby further improving the heat conduction efficiency of the optical module 10 and the heat sink 30. In this embodiment, the thermally conductive layer 50 is configured to match the size and shape of the recess, and its thickness can also be set to be the same, so that the thermally conductive layer 50 can just fill the recess. This allows the side of the heat sink 31 closest to the optical module 10 and the thermally conductive layer 50 to form a plane parallel to the first side after installation. This ensures that, on the one hand, when the optical module 10 enters or exits the mounting cavity, the edge of the optical module 10 contacts the mounting area 312, thus preventing the sharp corners of the edge of the optical module 10 from directly contacting the thermally conductive layer 50 and causing scratch damage to the thermally conductive layer 50. On the other hand, after the thermally conductive layer 50 fills the recess, it forms a plane with the heat sink 31 to ensure sufficient contact with the optical module 10. In this way, the thermal conductive layer 50 further enhances the heat conduction capability, thereby ensuring that the heat of the optical module 10 can be quickly and evenly transferred to the heat sink 30, thus avoiding overheating of the optical module 10 and improving the overall performance and reliability of the server.

[0034] In this embodiment, the thermally conductive layer 50 is a phase change material layer. The phase change material layer has a solid state and a liquid state. When the phase change material layer is in the liquid state, the phase change material layer expands and flows within the recess. Specifically, when the heat-conducting layer 50 is below a certain temperature, it is in a solid state. As the temperature of the optical module 10 increases, the heat is transferred to the heat-conducting layer 50, causing its temperature to rise accordingly. When the heat-conducting layer 50 reaches its phase change temperature, it expands and changes phase to a liquid state, thereby squeezing the recess and the optical module 10. On the one hand, this allows the heat sink to make more sufficient contact with the optical module 10 through the heat-conducting layer 50, thereby further reducing the contact thermal resistance and improving the heat conduction efficiency. On the other hand, the optical module 10 generates a lot of heat during insertion and removal, that is, during the process of entering and leaving the mounting cavity. The expansion of the heat-conducting layer 50 in the recess causes the squeezing force generated by the heat-conducting layer 50 to be concentrated in the recess, thus preventing the mounting shell 21 from bursting due to the heat-conducting layer 50 being located in the mounting cavity. Moreover, after the heat-conducting layer 50 changes phase to a liquid state, it has a certain fluidity, which can effectively fill the small gaps between the optical module 10 and the mounting shell 21, thus further facilitating heat dissipation. Furthermore, when the thermally conductive layer 50 changes from a solid to a liquid state, it can absorb a large amount of heat. This allows it to absorb more heat during the heating and venting of the optical module 10, thus alleviating the overheating phenomenon. Different phase change materials have different phase change temperatures; a suitable material can be selected based on the specific circumstances. In this embodiment, the thermally conductive layer 50 is in direct contact with the optical module 10. To avoid adverse effects on the optical module 10, a phase change material with poor fluidity after high-temperature phase change can be selected. This ensures that when the thermally conductive layer 50 changes to a liquid state, it fills the gaps while preventing it from penetrating into the optical module 10.

[0035] In this embodiment, the optical module assembly further includes a protective layer 60, which is disposed on the side of the thermally conductive layer 50 near the optical module 10. Figure 5 As shown, the protective layer 60 and the heat-conducting layer 50 are of the same shape and size, but the protective layer 60 is thinner. The protective layer 60 is disposed on the surface of the heat-conducting layer 50, protecting the heat-conducting layer 50 when the optical module 10 enters or exits the mounting cavity. Thus, when the optical module 10 enters or exits the mounting cavity, it contacts the edge of the mounting area 312 near the heat dissipation area 311 and the protective layer 60, effectively protecting the heat-conducting layer 50. Optionally, the protective layer 60 can be made of stainless steel. Since the coefficient of friction of stainless steel is lower than that of tempered glass, the stainless steel layer can reduce frictional resistance, thereby preventing the optical module 10 from damaging the surface of the heat-conducting layer 50. Secondly, since stainless steel has a high thermal conductivity, the protective layer 60 can improve the stability of the system without affecting heat dissipation. This allows for wear-free insertion and removal of the optical module 10 without affecting the contact effect, resulting in high reliability. The protective layer 60 can also be made of other materials that ensure a low coefficient of friction and high thermal conductivity.

[0036] In this embodiment, the extension and retraction direction of the elastic element 42 is perpendicular to the direction in which the optical module 10 enters and exits the mounting housing 21. This allows the elastic element 42 to improve the heat conduction efficiency of the heat sink 30 of the optical module 10 without affecting the entry and exit of the optical module 10 into the mounting cavity, thereby improving the flexibility of the optical module assembly. Specifically, the elastic element 42 in this embodiment is a spring, which is sleeved on the small-diameter section of the connector 41. Since the connector 41 is arranged along the arrangement direction of the heat sink 30 and the optical module 10, the extension and retraction direction of the spring is the same as the arrangement direction of the heat sink 30 and the optical module 10. That is, the extension and retraction direction of the spring is perpendicular to the first side of the mounting cavity, while the optical module 10 enters and exits the mounting housing 21 on the second side. This ensures that when the optical module 10 is inside the mounting housing 21, it can fully transfer heat to the heat sink 30 through the heat transfer layer. On the other hand, the optical module 10 enters and exits the mounting cavity on the second side of the mounting cavity, thus preventing interference with the heat sink 30 and making it more convenient for the optical module 10 to enter and exit the mounting cavity.

[0037] In this embodiment, the heat sink 30 further includes heat sink fins 32, which are disposed on the side of the heat sink substrate 31 away from the optical module 10. Figure 3 , Figure 4As shown, the heat sink fins 32 may include multiple heat sink fins connected sequentially and arranged on the side of the heat sink base 31 away from the optical module 10. The heat sink fins can be U-shaped, with the bottom of the U-shaped structure connected to the side of the heat sink base 31 away from the optical module 10, and the two ends of the U-shaped structure set as two spaced rectangular plates, thereby increasing the heat dissipation area of ​​the heat sink fins 32 and improving heat dissipation efficiency. This allows for more effective transfer of heat from the optical module 10 to the heat sink 30 to the air or other cooling medium. Optionally, to ensure the heat dissipation efficiency of the heat sink fins 32, materials such as copper and aluminum can be selected to ensure heat dissipation efficiency while considering cost. For even higher heat dissipation efficiency, other metals with higher heat dissipation efficiency, such as silver, can also be used. Of course, the structure of the heat sink fins 32 is not unique. Depending on the actual situation, the heat dissipation efficiency can be improved by optimizing the shape and spacing of the heat sink fins and selecting appropriate materials, thereby ensuring that the optical module 10 can maintain a stable operating temperature under high load. Optionally, the heat on the surface of the heat sink fins can be removed by the server's internal fan or liquid cooling system.

[0038] In this embodiment, multiple locking attachments 40 are provided at the corners of the mounting area 312, thereby improving the reliability of the connection between the heat sink 30 and the circuit board 20. Specifically, the mounting area 312 in this embodiment is rectangular, allowing locking attachments 40 to be provided at the four corners of the mounting area 312. This ensures that the heat sink 30 can make uniform contact with the optical module 10, guaranteeing uniform heat dissipation of the optical module 10 and preventing localized overheating. Of course, depending on the actual situation, the locking attachments 40 can also be placed in other positions of the mounting area 312, as long as they are offset from the areas aligned vertically with the mounting cavity. For example, the locking attachments 40 can be placed in the middle of each mounting edge of the mounting area 312, that is, between two adjacent corners, avoiding the position aligned with the mounting cavity, which can still fix the heat sink 30 and the circuit board 20. Considering the reliability of fixing the heat sink 30 and the circuit board 20, more locking accessories 40 can be provided. In order to ensure uniform contact between the optical module 10 and the mounting shell 21 and the heat sink 30, it is preferable that each locking accessory 40 is symmetrically arranged or evenly distributed along the periphery of the mounting area 312.

[0039] It should be noted that this embodiment uses a rectangular box shape for the mounting shell 21, and rectangular shapes for the recess of the heat sink 30, the heat-conducting layer 50, and the protective layer 60. However, other shapes can be used depending on the actual situation. For example, when the optical module is triangular or pentagonal, the mounting shell can also be triangular or pentagonal. Correspondingly, the recess, heat-conducting layer 50, and protective layer 60 can be triangular or pentagonal. The heat sink 30 can be located on the bottom surface of the triangular or pentagonal prism, and the optical module 10 can enter and exit the mounting cavity from one side of the triangular or pentagonal prism. The edge of the heat sink 30, i.e., the mounting area 312, can also be set to other shapes according to actual space requirements, as long as it does not affect the installation of the heat sink area 311 and the locking accessory 40.

[0040] It should be noted that "multiple" in the above embodiments refers to at least two.

[0041] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0042] 1. Solved the problem of poor heat dissipation of the optical module;

[0043] 2. By setting the optical module inside the mounting housing and using the locking accessories to provide a force close to the optical module for the heat sink, the optical module can make full contact with the heat sinks on both sides and the mounting housing, thereby reducing contact thermal resistance, improving heat dissipation efficiency, effectively reducing the temperature of the optical module, and at the same time reducing the fan speed of the server system, saving energy.

[0044] 3. In this embodiment, the mounting cavity has two angled openings, which prevents the optical module from interfering with the heat sink when entering or exiting the mounting cavity. This eliminates the need to remove the heat sink when installing or removing the optical module, allowing the heat sink to continuously provide heat dissipation and improving the heat dissipation efficiency of the optical module assembly. It also improves the installation and removal efficiency of the optical module. Furthermore, while improving the heat dissipation performance of the optical module assembly in this embodiment, the modification is minimal, the modification cost is low, and the operability is high, avoiding the cost and maintenance difficulties of traditional solutions.

[0045] 4. The addition of a heat-conducting layer further enhances the heat conduction capability, thereby ensuring that the heat from the optical module can be quickly and evenly transferred to the heat sink, thus preventing the optical module from overheating and improving the overall performance and reliability of the server.

[0046] 5. Since the coefficient of friction of the stainless steel layer is lower than that of the tempered film, the stainless steel layer can reduce frictional resistance, thereby preventing the optical module from puncturing the surface of the heat-conducting layer. Secondly, since stainless steel has a high thermal conductivity, the protective layer can improve the stability of the system without affecting heat dissipation.

[0047] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0048] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0049] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0050] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An optical module component for a server, characterized in that, include: Optical module (10); The circuit board (20) has a mounting shell (21) with a mounting cavity for mounting the optical module (10), the mounting cavity having a first side and a second side set at an angle, the first side and the second side being open sides; A heat sink (30) is disposed on the first side, and the second side is for the optical module (10) to enter and exit; Locking accessory (40), the heat sink (30) and the circuit board (20) are connected by the locking accessory (40), and the locking accessory (40) provides the heat sink (30) with a force close to the optical module (10).

2. The optical module assembly for a server according to claim 1, characterized in that, The lock accessory (40) includes: A connector (41) connects the heat sink (30) and the circuit board (20); An elastic element (42) is sleeved on the outside of the connector (41) and abuts against the heat sink (30) or the circuit board (20). The elastic element (42) provides the heat sink (30) with a force close to the optical module (10).

3. The optical module assembly for a server according to claim 2, characterized in that, The connector (41) includes a first large diameter section, a small diameter section and a second large diameter section connected axially in sequence. The heat sink (30) and the circuit board (20) both have mounting holes for the connector (41) to pass through. The diameter of the mounting hole is larger than the diameter of the small diameter section and smaller than the diameters of the first large diameter section and the second large diameter section. The elastic member (42) is sleeved on the outside of the small diameter section.

4. The optical module assembly for a server according to claim 1, characterized in that, The heat sink (30) includes a heat sink base (31), which includes a heat sink area (311) that exchanges heat with the optical module (10) and a mounting area (312) located at the peripheral edge of the heat sink area (311). The heat sink area (311) is disposed opposite to the mounting cavity. The mounting area (312) protrudes from the peripheral side of the mounting shell (21). The locking accessory (40) passes through the mounting area (312).

5. The optical module assembly for a server according to claim 4, characterized in that, The heat dissipation substrate (31) has a recess in the middle region facing the optical module (10), the recess is recessed in a direction away from the optical module (10), and the recess forms the heat dissipation area (311).

6. The optical module assembly for a server according to claim 5, characterized in that, The optical module assembly also includes a heat-conducting layer (50), which is disposed within the heat dissipation area (311) and transfers heat with the optical module (10).

7. The optical module assembly for a server according to claim 6, characterized in that, The thermally conductive layer (50) is a phase change material layer. The phase change material layer has a solid state and a liquid state. When the phase change material layer is in the liquid state, the phase change material layer expands and flows within the recess.

8. The optical module assembly for a server according to claim 6, characterized in that, The optical module assembly also includes a protective layer (60), which is disposed on the side of the thermally conductive layer (50) near the optical module (10).

9. The optical module assembly for a server according to claim 1, characterized in that, The lock accessory (40) includes a connector (41) and an elastic member (42). The connector (41) connects the heat sink (30) and the circuit board (20). The elastic member (42) is sleeved on the outside of the connector (41) and abuts against the side of the heat sink (30) away from the optical module (10). The elastic member (42) provides the heat sink (30) with a force close to the optical module (10). The extension and retraction direction of the elastic element (42) is perpendicular to the direction in which the optical module (10) enters and exits the mounting shell (21); The heat sink (30) includes a heat sink base (31) and heat sink fins (32). The heat sink fins (32) are disposed on the side of the heat sink base (31) away from the optical module (10). The heat sink base (31) includes a heat sink area (311) that exchanges heat with the optical module (10) and a mounting area (312) located at the peripheral edge of the heat sink area (311). The heat sink area (311) is disposed opposite to the mounting cavity. The mounting area (312) protrudes from the peripheral side of the mounting shell (21). The locking accessory (40) passes through the mounting area (312). There are multiple lock accessories (40), and each lock accessory (40) is provided at a corner of the installation area (312); The optical module assembly further includes a thermally conductive layer (50) and a protective layer (60). The thermally conductive layer (50) is disposed in the heat dissipation area (311) and transfers heat with the optical module (10). The thermally conductive layer (50) is a phase change material layer, and the protective layer (60) is a stainless steel layer. The protective layer (60) is disposed on the side of the thermally conductive layer (50) close to the optical module (10).

10. A server, characterized in that, Includes the optical module component for a server as described in any one of claims 1 to 9.

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