800G DR8 silicon optical module
By setting protective blocks on both sides of the PD chip array and using a 45° reflective fiber array, the chip damage problem caused by fiber array collision in the traditional 800G DR8 silicon photonics module is solved, and the coupling efficiency and responsiveness are improved.
Patent Information
- Application Number
- CN202520524644.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-03-24
AI Technical Summary
In traditional 800G DR8 silicon photonics modules, the excessive thickness of the cover plate of the RX fiber array leads to a decrease in coupling efficiency. Furthermore, if the fiber array coupling clamp is not properly aligned, the tip of the RX fiber array is prone to colliding with the PD chip array, causing chip damage.
Protective blocks are set on both sides of the PD chip array, with their upper surfaces higher than the PD chip array. The height of the protective blocks is 160μm to 180μm to prevent the tip of the RX fiber array from colliding with the PD chip array. A fiber array with a 45° reflective surface is used.
It effectively protects the PD chip array from damage, maintains coupling efficiency, and ensures that the responsiveness does not decrease.
Smart Images
Figure CN223842193U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical module technology, specifically to an 800G DR8 silicon optical module. Background Technology
[0002] A traditional 800G DR8 silicon photonics module has one transmitter (TX) and two receivers (RX). Its structure includes at least: a PCB board; tungsten copper substrates are arranged in through-holes on the PCB board; optical transmitters are mounted on the tungsten copper substrates; silicon photonic chips in the optical transmitters are bonded to the PCB board with gold wires; on each side of the optical transmitter on the PCB board, there is a PD chip array, an RX fiber array, and a TIA chip. The PD chip array, RX fiber array, and TIA chip each have four channels. The RX fiber array uses a fiber array with a 45° reflective surface. The cover plate in the RX fiber array is fixed to the PCB board by adhesive bonding. The RX fiber array is coupled to the PD chip array on the PCB board, and the PD chip array is located below the substrate tip of the RX fiber array. Each PD chip array is bonded to a TIA chip with gold wires, and each TIA chip is bonded to the PCB board with gold wires. Specifically... Figure 1 , Figure 2 As shown, the height of a conventional PD chip array is 150μm, while the cover plate thickness in an RX fiber array is approximately 170μm. If the cover plate is too thick, the RX fibers in the RX fiber array will be too far from the PD chip array, causing a rapid decrease in coupling efficiency and resulting in unacceptable responsivity. In actual production, there are cases where the fiber array coupling clamps are not level. In this situation, the tip of the RX fiber array is prone to touching the PD chip array, specifically as follows... Figure 3 As shown, this caused damage to the PD chip array. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide an 800G DR8 silicon photonics module to overcome the shortcomings of the prior art.
[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:
[0005] An 800G DR8 silicon photonics module includes: a PCB board and an RX fiber array. At least one PD chip array is fixed on the PCB board. Each PD chip array is coupled to an RX fiber array. A cover plate in the RX fiber array is fixed to the PCB board. A protective block fixed to the PCB board is arranged on both sides of each PD chip array. A portion of each protective block is located below the substrate tip of the RX fiber array coupled to the PD chip array. The upper surface of the protective block is higher than the PD chip array.
[0006] Based on the above technical solution, the present invention can be further improved as follows.
[0007] Furthermore, the height of the protective block is 160μm to 180μm.
[0008] Furthermore, the height of the protective block is 170 μm.
[0009] Furthermore, the side of the protective block adjacent to the RX fiber array is located between the cover plate and the PD chip array in the RX fiber array.
[0010] Furthermore, the RX fiber array employs a fiber array with a 45° reflective surface.
[0011] Furthermore, the PD chip array is a four-channel PD chip array, and the RX fiber array is a four-channel RX fiber array.
[0012] Furthermore, the PCB board is equipped with TIA chips, each PD chip array is bonded to a TIA chip with gold wire, and each TIA chip is bonded to the PCB board with gold wire.
[0013] Furthermore, the PCB board is equipped with two PD chip arrays, two RX fiber arrays, and two TIA chips.
[0014] Furthermore, a tungsten copper base is installed in the through-hole on the PCB board, and a light emitting end is provided on the tungsten copper base.
[0015] Furthermore, on each side of the optical transmitter on the PCB board, there is a PD chip array, an RX fiber array, and a TIA chip.
[0016] The beneficial effects of this utility model are:
[0017] 1) A protective block is arranged on both sides of each PD chip array, and a portion of each protective block is located below the substrate tip of the RX fiber array coupled to the PD chip array. The upper surface of the protective block is higher than the PD chip array. In actual production, even if the fiber array coupling clamp is not level, the tip of the RX fiber array will only touch the protective block and not the PD chip array, thus protecting the PD chip array and preventing damage to the PD chip array.
[0018] 2) The height of the protective block 4 is 160μm~180μm. The reason is that if it is too thin, it will not be able to play the anti-collision function. If it is too thick, the cover plate 310 of the X fiber array 3 will be too thick, which will lead to a decrease in responsiveness. Attached Figure Description
[0019] Figure 1 This is a structural diagram of an 800G DR8 silicon photonics module in the prior art;
[0020] Figure 2 This is a partial enlarged view of an existing 800G DR8 silicon photonics module;
[0021] Figure 3 This is a collision state diagram of RX fiber array and PD chip array in the existing technology;
[0022] Figure 4 This is a structural diagram of the 800G DR8 silicon photonics module in this utility model;
[0023] Figure 5 This is a partial top-view enlarged view of the 800G DR8 silicon photonics module of this utility model;
[0024] Figure 6 This is a partial enlarged side view of the 800G DR8 silicon photonics module of this utility model;
[0025] Figure 7 This is a collision state diagram of the RX fiber array and the PD chip array in this utility model.
[0026] The attached diagram lists the components represented by each number as follows:
[0027] 1. PCB board, 2. PD chip array, 3. RX fiber array, 310. Cover plate, 4. Protective block, 5. TIA chip, 6. Tungsten copper base, 7. Optical emitter. Detailed Implementation
[0028] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0029] Example 1
[0030] like Figure 4 , Figure 5 , Figure 6 , Figure 7As shown, an 800G DR8 silicon photonics module includes: a PCB board 1, a PD chip array 2, and an RX fiber array 3. At least one PD chip array 2 is fixed on the PCB board 1. Each PD chip array 2 is coupled to an RX fiber array 3, and a cover plate 310 in the RX fiber array 3 is fixed to the PCB board 1. Specifically, the cover plate 310 in the RX fiber array 3 is fixed to the PCB board 1 by adhesive bonding. A protective block 4, fixed to the PCB board 1, is arranged on both sides of each PD chip array 2. The protective blocks 4 can be optionally fixed to the PCB board 1 by adhesive bonding, and each protective block 4 has a portion of its area connected to the PD chip array 2. In the coupled RX fiber array 3, the substrate tip is located below the substrate tip, or in each protective block 4 located on the side of each PD chip array 2, a portion of the protective block 4 is located below the substrate tip of the coupled RX fiber array 3. That is, the upper surface of the protective block 4 is lower than or flush with the upper surface of the cover plate 310. At the same time, the upper surface of the protective block 4 is higher than the PD chip array 2. In the actual production process, even if the fiber array coupling clamp is not level, the tip of the RX fiber array 3 will only touch the protective block 4 and will not touch the PD chip array 2, thereby protecting the PD chip array 2 and preventing damage to the PD chip array 2.
[0031] Example 2
[0032] like Figure 5 , Figure 6 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:
[0033] The height of the protective block 4 is 160μm to 180μm. The reason is that if it is too thin, it will not be able to play a collision protection function. If it is too thick, the cover plate 310 of the X-fiber array 3 will also be too thick, resulting in a decrease in responsiveness. As a preferred solution, the height of the protective block 4 is preferably 170μm, so that the cover plate 310 in the X-fiber array 3 can still be maintained at the original thickness.
[0034] Furthermore, the material of the protective block 4 is preferably ceramic. Of course, other materials are not excluded; this is just one example.
[0035] Each protective block 4 is located on the side of the RX fiber array 3 adjacent to the cover plate 310 and the PD chip array 2 in the RX fiber array 3, while the side of each protective block 4 away from the RX fiber array 3 extends beyond or is flush with the side of the PD chip array 2 away from the RX fiber array 3.
[0036] Example 3
[0037] like Figure 6As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:
[0038] The RX fiber array 3 uses a fiber array with a 45° reflective surface, meaning that the RX fiber array 3 still uses the same type of fiber array as existing technologies.
[0039] Example 4
[0040] like Figure 4 , Figure 5 , Figure 6 As shown, this embodiment is a further improvement on any one of embodiments 1 to 3, as detailed below:
[0041] PD chip array 2 is a four-channel PD chip array, and RX fiber array 3 is a four-channel RX fiber array. That is, the number of channels of PD chip array 2 and RX fiber array 3 remains consistent with the existing technology.
[0042] The PCB board 1 is equipped with a TIA chip 5, and each PD chip array 2 is bonded to a TIA chip 5 with gold wire. Each TIA chip 5 is bonded to the PCB board 1 with gold wire, that is, the connection relationship remains consistent with the existing technology.
[0043] The PCB board 1 is equipped with two PD chip arrays 2, two RX fiber arrays 3, and two T IA chips 5, which can meet the requirements of eight-channel optical reception.
[0044] Example 5
[0045] like Figure 4 As shown, this embodiment is a further improvement on embodiment 4, as detailed below:
[0046] A tungsten copper base 6 is arranged in the through hole on the PCB board 1. A light emitting end 7 is provided on the tungsten copper base 6. The silicon photonic chip in the light emitting end 7 is bonded to the gold wire of the PCB board 1. The light emitting end 7 is consistent with the existing technology, so it will not be described in detail here.
[0047] On the PCB board 1, a PD chip array 2, an RX fiber array 3, and a TIA chip 5 are distributed on each side of the optical transmitter 7, which means that the layout is still consistent with the existing technology.
[0048] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. An 800G DR8 silicon photonics module, characterized in that, include: The PCB board (1) and the RX fiber array (3) are provided. At least one PD chip array (2) is fixed on the PCB board (1). Each PD chip array (2) is coupled to an RX fiber array (3). The cover plate (310) in the RX fiber array (3) is fixed to the PCB board (1). A protective block (4) fixed to the PCB board (1) is arranged on both sides of each PD chip array (2). Each protective block (4) has a part of its area located below the substrate tip in the RX fiber array (3) coupled to the PD chip array (2). The upper surface of the protective block (4) is higher than the PD chip array (2).
2. The 800G DR8 silicon photonics module according to claim 1, characterized in that, The height of the protective block (4) is 160μm to 180μm.
3. An 800G DR8 silicon photonics module according to claim 2, characterized in that, The height of the protective block (4) is 170 μm.
4. An 800G DR8 silicon photonics module according to claim 1, characterized in that, The protective block (4) is located on the side of the RX fiber array (3) between the cover plate (310) and the PD chip array (2) in the RX fiber array (3).
5. An 800G DR8 silicon photonics module according to claim 1, characterized in that, The RX fiber array (3) is a fiber array with a 45° reflective surface.
6. An 800G DR8 silicon photonics module according to any one of claims 1 to 5, characterized in that, The PD chip array (2) is a four-channel PD chip array, and the RX fiber array (3) is a four-channel RX fiber array.
7. An 800G DR8 silicon photonics module according to claim 6, characterized in that, The PCB board (1) is provided with TIA chips (5), each PD chip array (2) is bonded to a TIA chip (5) with gold wire, and each TIA chip (5) is bonded to the PCB board (1) with gold wire.
8. An 800G DR8 silicon photonics module according to claim 7, characterized in that, The PCB board (1) is provided with two PD chip arrays (2), two RX fiber arrays (3) and two TIA chips (5).
9. An 800G DR8 silicon photonics module according to claim 8, characterized in that, A tungsten copper base (6) is arranged in the through hole on the PCB board (1), and a light emitting end (7) is provided on the tungsten copper base (6).
10. An 800G DR8 silicon photonics module according to claim 9, characterized in that, On the PCB board (1), a PD chip array (2), an RX fiber array (3), and a TIA chip (5) are distributed on each side of the optical transmitter (7).