FPC and electronic equipment
By replacing the cover film with non-conductive superelastic coatings on both the front and back of the FPC, the risk of breakage during FPC bending is solved, bending performance and production efficiency are improved, and miniaturization requirements are met.
Patent Information
- Application Number
- CN202423115121.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Conventional FPCs are prone to breakage when bent, resulting in defects such as damage to the bonding area and FPC warping, which affect production efficiency and product reliability. Moreover, the requirements for the protruding part during bending are becoming smaller and smaller.
The front and back non-conductive superelastic coatings are used to replace the cover film, improving tensile recovery and bending performance.
Reducing bending protrusions lowers bending stress, improves the bending performance and production efficiency of FPC, and enhances product reliability.
Smart Images
Figure CN223843942U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic equipment technology, and in particular to an FPC and an electronic device. Background Technology
[0002] A standard FPC consists of five layers. When bent in the bending area, the FPC is relatively stiff, with strong bending stress, making it prone to damage. Excessive bending carries the risk of breaking the traces. However, many electronic products now require FPCs to be bent. The protruding part of the bend directly affects the overall bezel size (screen ratio). Customers are increasingly demanding smaller protruding parts of the FPC, and defects such as bonding point damage and FPC warping caused by bending stress occur frequently, seriously affecting production efficiency and yield, and greatly impacting product reliability.
[0003] How to reduce protruding points during bending and reduce bending stress has become a technical problem that urgently needs to be solved in the industry. Summary of the Invention
[0004] In order to at least solve the above-mentioned technical problems, the purpose of this utility model is to provide an FPC that replaces the cover film of the existing solution with a non-conductive superelastic coating on the front and a non-conductive superelastic coating on the back, thereby improving tensile recovery performance and bending performance.
[0005] To achieve the above objectives, the FPC provided in this application includes:
[0006] Component area, bending area, and gold finger area;
[0007] The bending area connects the component area and the gold finger area;
[0008] The bending area is provided with a substrate layer, a first copper foil layer, and a second copper foil layer;
[0009] The first copper foil layer is disposed on one side of the front of the substrate layer, and the second copper foil layer is disposed on the back of the substrate layer.
[0010] The bending area also includes a front non-conductive superelastic coating and a back non-conductive superelastic coating;
[0011] The non-conductive superelastic coating is applied to the side of the first copper foil layer facing away from the substrate layer.
[0012] The non-conductive superelastic coating is applied to the side of the second copper foil layer facing away from the substrate layer.
[0013] Furthermore, the front non-conductive superelastic coating covers the first copper foil layer;
[0014] The reverse side has a non-conductive superelastic coating covering the second copper foil layer.
[0015] Furthermore, the component area includes a substrate layer, a first copper foil layer, a second copper foil layer, a front cover film, and a back cover film;
[0016] A front cover film is applied to the side of the first copper foil layer that faces away from the substrate layer.
[0017] A reverse cover film is applied to the side of the second copper foil layer that faces away from the substrate layer.
[0018] Furthermore, the non-conductive elastomer coating on the front side is connected to the front cover film.
[0019] Furthermore, the non-conductive superelastic coating on the reverse side is connected to the reverse covering surface.
[0020] Furthermore, a component mounting area is provided in the component area, which is located on the side of the first copper foil layer facing away from the substrate layer.
[0021] Furthermore, a reinforcing plate is provided in the component area, which is located on the side of the reverse cover film facing away from the substrate layer.
[0022] Furthermore, the reinforcing plate includes steel sheet reinforcing plates.
[0023] Furthermore, the size of the first copper foil layer within the bending area is smaller than the size of the second copper foil layer.
[0024] To achieve the above objectives, the electronic device provided in this application includes the aforementioned FPC.
[0025] The FPC of this application embodiment includes: a component area, a bending area, and a gold finger area; the bending area connects the component area and the gold finger area; the bending area is provided with a substrate layer, a first copper foil layer, and a second copper foil layer; the first copper foil layer is disposed on the front side of the substrate layer, and the second copper foil layer is disposed on the back side of the substrate layer; the bending area also includes a front non-conductive elastomer coating and a back non-conductive elastomer coating; the front non-conductive elastomer coating is disposed on the side of the first copper foil layer facing away from the substrate layer; the back non-conductive elastomer coating is disposed on the side of the second copper foil layer facing away from the substrate layer. By replacing the cover film of the prior art with the front non-conductive elastomer coating and the back non-conductive elastomer coating, the tensile recovery performance and bending performance are improved. Attached Figure Description
[0026] The accompanying drawings are provided to further illustrate the present application and form part of the specification. Together with the embodiments of the present application, they serve to explain the present application but do not constitute a limitation thereof. In the drawings:
[0027] Figure 1 This is a schematic diagram of the side structure of the FPC according to an embodiment of this application.
[0028] Explanation of reference numerals in the attached figures:
[0029] 101-Front cover film; 102-First copper foil layer; 103-Substrate layer; 104-Second copper foil layer; 105-Reverse cover film; 106-Reinforcing plate; 107-Front non-conductive elastomer coating; 108-Reverse non-conductive elastomer coating. Detailed Implementation
[0030] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While some embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this application. It should be understood that the drawings and embodiments of this application are for illustrative purposes only and are not intended to limit the scope of protection of this application.
[0031] It should be understood that the steps described in the method embodiments of this application may be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of this application is not limited in this respect.
[0032] The term "comprising" and its variations as used herein are open-ended inclusions, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the description below.
[0033] It should be noted that the terms "one" and "multiple" used in this application are illustrative rather than restrictive, and those skilled in the art should understand that, unless explicitly stated otherwise in the context, they should be understood as "one or more". "Multiple" should be understood as two or more.
[0034] The embodiments of this application will now be described in detail with reference to the accompanying drawings.
[0035] This application provides an FPC, including:
[0036] Component area, bending area, and gold finger area;
[0037] The bending area connects the component area and the gold finger area;
[0038] The bending area is provided with a substrate layer, a first copper foil layer, and a second copper foil layer;
[0039] The first copper foil layer is disposed on one side of the front of the substrate layer, and the second copper foil layer is disposed on the back of the substrate layer.
[0040] The bending area also includes a front non-conductive superelastic coating and a back non-conductive superelastic coating;
[0041] The non-conductive superelastic coating is applied to the side of the first copper foil layer facing away from the substrate layer.
[0042] The non-conductive superelastic coating is applied to the side of the second copper foil layer facing away from the substrate layer.
[0043] Example 1
[0044] Figure 1 This is a schematic diagram of the FPC side structure according to an embodiment of this application. The following will be combined with... Figure 1 The FPC structure of the embodiments of this application will be described in detail.
[0045] In one exemplary embodiment, the FPC of this application includes a component area, a bending area, and a gold finger area.
[0046] In one exemplary embodiment, the bending area connects the component area and the gold finger area.
[0047] In one exemplary embodiment, the bending area is provided with a substrate layer 103, a first copper foil layer 102, and a second copper foil layer 104.
[0048] In one exemplary embodiment, the first copper foil layer 102 is disposed on the front side of the substrate layer 103; it can be understood that one side of the first copper foil layer 102 is the front side.
[0049] In one exemplary embodiment, the second copper foil layer 104 is disposed on the reverse side of the substrate layer 103; it can be understood that one side of the second copper foil layer 104 is the reverse side.
[0050] In one exemplary embodiment, the bending region further includes a front non-conductive superelastic coating 107 and a back non-conductive superelastic coating 108.
[0051] In one exemplary embodiment, a non-conductive superelastic coating 107 is disposed on the side of the first copper foil layer 102 facing away from the substrate layer 103.
[0052] In one exemplary embodiment, a non-conductive superelastic coating 108 is disposed on the side of the second copper foil layer 104 facing away from the substrate layer 103.
[0053] In one exemplary embodiment, a non-conductive superelastic coating 107 on the front side covers the first copper foil layer 102.
[0054] In one exemplary embodiment, the reverse non-conductive superelastic coating 108 covers the second copper foil layer 104.
[0055] In one exemplary embodiment, the component area includes a substrate layer 103, a first copper foil layer 102, a second copper foil layer 104, a front cover film 101, and a back cover film 105.
[0056] In one exemplary embodiment, a front cover film 101 covers the side of the first copper foil layer 102 facing away from the substrate layer 103.
[0057] In one exemplary embodiment, a reverse cover film 105 covers the side of the second copper foil layer 104 facing away from the substrate layer 103.
[0058] In one exemplary embodiment, the bending area and the component area share a substrate layer 103, a first copper foil layer 102, and a second copper foil layer 104.
[0059] In one exemplary embodiment, the front non-conductive superelastic coating 107 is connected to the front cover film 101.
[0060] In one exemplary embodiment, the reverse non-conductive superelastic coating 108 is connected to the reverse cover surface.
[0061] In one exemplary embodiment, the size of the first copper foil layer 102 within the bending region is smaller than the size of the second copper foil layer 104.
[0062] In one exemplary embodiment, it can be understood that the traditional design of providing a covering layer on both the front and back sides in the bending area is eliminated. Instead, a non-conductive superelastic coating 107 is provided on the front side and a non-conductive superelastic coating 108 is provided on the back side to improve the tensile recovery performance.
[0063] In one exemplary embodiment, a component mounting area is provided on the component area, and the component mounting area is disposed on the side of the first copper foil layer 102 facing away from the substrate layer 103.
[0064] In some exemplary embodiments, components are mounted in the component mounting area, including capacitors and / or resistors and / or diodes.
[0065] In some exemplary implementations, the capacitor serves to stabilize voltage or filter.
[0066] In some exemplary embodiments, the resistor serves as a pull-up resistor or an electrostatic discharge protector.
[0067] In some exemplary embodiments, the diode serves as electrostatic protection or to prevent voltage reverse flow.
[0068] In one exemplary embodiment, a reinforcing plate 106 is further provided on the component area, and the reinforcing plate 106 is disposed on the side of the reverse cover film 105 facing away from the substrate layer 103.
[0069] In one exemplary embodiment, the reinforcing plate 106 includes a steel sheet reinforcing plate.
[0070] In one exemplary embodiment, the thickness of the reinforcing plate 106 is 0.15 mm.
[0071] In one exemplary embodiment, the reinforcing plate 106 may also be a PI reinforcing plate if necessary.
[0072] In some exemplary embodiments, an FPC (Flexible Printed Circuit) is a highly reliable and extremely flexible printed circuit board made with polyimide or polyester film as a substrate.
[0073] In some exemplary embodiments, FPCs have the characteristics of high wiring density, light weight, thin thickness, and good flexibility.
[0074] In some exemplary implementations, the gold finger area can be understood as an interface.
[0075] Example 2
[0076] Example 2 is an electronic device that includes the FPC described in the above examples.
[0077] Although the embodiments disclosed in this utility model are as described above, the content is only for the purpose of facilitating understanding of this utility model and is not intended to limit this utility model. Any person skilled in the art to which this utility model pertains may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in this utility model, but the patent protection scope of this utility model shall still be determined by the scope defined in the appended claims.
Claims
1. An FPC, characterized in that, include: Component area, bending area, and gold finger area; The bending area connects the component area and the gold finger area; The bending area is provided with a substrate layer, a first copper foil layer, and a second copper foil layer; The first copper foil layer is disposed on one side of the front of the substrate layer, and the second copper foil layer is disposed on the back of the substrate layer; The bending area also includes a front non-conductive superelastic coating and a back non-conductive superelastic coating. The non-conductive superelastic coating is applied to the side of the first copper foil layer facing away from the substrate layer. The non-conductive superelastic coating is applied to the side of the second copper foil layer facing away from the substrate layer.
2. The FPC according to claim 1, characterized in that, The non-conductive superelastic coating on the front side covers the first copper foil layer; The non-conductive superelastic coating on the reverse side covers the second copper foil layer.
3. The FPC according to claim 2, characterized in that, The component area is provided with the substrate layer, the first copper foil layer, the second copper foil layer, the front cover film, and the back cover film; The front cover film covers the side of the first copper foil layer that faces away from the substrate layer; The reverse cover film covers the side of the second copper foil layer that faces away from the substrate layer.
4. The FPC according to claim 3, characterized in that, The non-conductive superelastic coating on the front side is connected to the front cover film.
5. The FPC according to claim 4, characterized in that, The non-conductive superelastic coating on the reverse side is connected to the reverse covering surface.
6. The FPC according to claim 5, characterized in that, A component mounting area is provided on the component area, and the component mounting area is arranged on the side of the first copper foil layer facing away from the substrate layer.
7. The FPC according to claim 6, characterized in that, A reinforcing plate is also provided on the component area, and the reinforcing plate is arranged on the side of the reverse cover film facing away from the substrate layer.
8. The FPC according to claim 7, characterized in that, The reinforcing plate includes a steel sheet reinforcing plate.
9. The FPC according to claim 8, characterized in that, The size of the first copper foil layer within the bending area is smaller than the size of the second copper foil layer.
10. An electronic device, characterized in that, Includes the FPC as described in any one of claims 1-9.