Single-layer wiring structure of TFT FPC (Thin Film Transistor Flexible Printed Circuit) bending area

Abstract

The utility model discloses a TFT FPC (Thin Film Transistor Flexible Printed Circuit) bending area single-layer wiring structure, which comprises an LCD (Liquid Crystal Display) module, a TFT FPC is bound at the bottom of the LCD module, the TFT FPC is provided with a first binding end and a second binding end, and the TFT FPC is bound with the LCD module through the first binding end. According to the single-layer wiring structure of the TFT FPC bending area provided by the utility model, in the single-layer wiring bending area of the TFT FPC bending area, part of wire bodies at the centers of the two sides and the center of the top and the bottom in a conventional rectangular bending area are reserved, so that a left side edge section, a right side edge section, a top edge section and a bottom edge section are formed; according to the utility model, the plurality of wires are arranged on the substrate and are connected through the edge separation sections, and the trend of the edge separation sections is located in the conventional rectangular bending area, so that the wires closer to two sides can be exposed outside less, and more wires are covered by the second layer of ground in other areas, and only the wires close to the middle position are exposed outside just like the original design.

Description

Technical Field

[0001] This utility model relates to the field of TFT FPC technology, and in particular to a single-layer wiring structure in the bending area of ​​a TFT FPC. Background Technology

[0002] TFT stands for Thin Film Transistor, meaning that each liquid crystal pixel is driven by a thin film transistor integrated behind the pixel. This allows for high-speed, high-brightness, and high-contrast display of screen information, making it one of the best LCD color display devices. Its effect is close to that of a CRT monitor, and it is the mainstream display device for laptops and desktops.

[0003] like Figure 5 As shown, TFT FPC1-2 often needs to be bent to the back to connect with the customer's motherboard. The bending area 1-1 needs to adopt a single-layer trace design because the single-layer trace area is relatively thin and flexible, easy to bend, and has a small rebound force after bending, which is also very helpful for TFT MURA. However, the disadvantage is that the trace in this position does not have GND (ground) coverage protection and is more susceptible to ESD interference, and has poor anti-static capability. Therefore, a single-layer trace structure for the bending area of ​​TFT FPC is proposed. Utility Model Content

[0004] Based on this, it is necessary to provide a single-layer trace structure for the bending area of ​​a TFT FPC to address the above-mentioned technical problems. The rectangular shape of the single-layer trace design area in the bending area of ​​the FPC is changed to an elliptical shape, so that the traces closer to the two sides are less exposed, thus appropriately improving the ESD resistance.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A single-layer wiring structure for a TFT FPC bending area includes an LCD module. A TFT FPC is bonded to the bottom of the LCD module. The TFT FPC has a first bonding end and a second bonding end. The TFT FPC is bonded to the LCD module through the first bonding end. A single-layer wiring bending area is located on the surface of the TFT FPC near the first bonding end.

[0007] The single-layer wiring bending area includes the left edge segment, the right edge segment, the top edge segment, and the bottom edge segment;

[0008] The left edge segment, top edge segment, right edge segment, and bottom edge segment are connected end to end by edge separators to form the single-layer wiring bending area. The TFT FPC can be bent along the left edge segment and the right edge segment.

[0009] Furthermore, the left edge segment, top edge segment, right edge segment, and bottom edge segment are all arc-shaped.

[0010] Furthermore, the edge separating segment is an outer arc-shaped separating segment;

[0011] The outer arc-shaped dividing segment causes the left edge segment, right edge segment, top edge segment, and bottom edge segment to combine and form an "elliptical" single-layer wiring bend area.

[0012] Furthermore, the edge dividing segment is a straight line dividing segment;

[0013] The outer arc-shaped dividing segment causes the left edge segment, right edge segment, top edge segment, and bottom edge segment to combine and form a single-layer wiring bend area in the shape of a regular octagon.

[0014] Furthermore, the edge separating segment is an inner arc-shaped separating segment;

[0015] The outer arc-shaped dividing segment causes the left edge segment, right edge segment, top edge segment, and bottom edge segment to combine and form an "inner octagon" single-layer wiring bending area.

[0016] Furthermore, the effective single-layer cabling area of ​​the "elliptical" single-layer cabling bending area, the "regular octagonal" single-layer cabling bending area, and the "inner octagonal" single-layer cabling bending area decreases sequentially.

[0017] Furthermore, the TFT FPC includes a wiring section and a multilayer wiring lead-out section, wherein the wiring section and the multilayer wiring lead-out section are connected end to end to form the TFT FPC;

[0018] The first binding end and the second binding end are respectively located at the outer ends of the wiring section and the multi-layer wiring lead-out section, and the single-layer wiring bending area is located inside the wiring section.

[0019] Furthermore, the wiring section, except for the single-layer wiring bending area, consists entirely of multi-layer wiring areas.

[0020] Furthermore, GND is pre-embedded in both the multi-layer routing area and the multi-layer routing lead-out section.

[0021] Furthermore, the LCD module has a bonding part, and the TFT FPC is bonded to the bonding part on the LCD module through a first bonding end thereon.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The single-layer trace structure in the bending area of ​​the TFT FPC provided by this utility model retains part of the traces at the center of both sides and the center of the top and bottom of the conventional rectangular bending area, forming left edge segment, right edge segment, top edge segment and bottom edge segment, which are connected by edge separator segments. The direction of the edge separator segments is located within the bending area of ​​the conventional rectangle. In this way, the traces closer to the two sides can be less exposed and more covered by the ground of the second layer of other areas. Only the traces near the middle are exposed as originally designed. By routing the important power and signal lines to the side to increase their coverage, the ESD resistance can be increased.

[0024] Meanwhile, since the bending location is within the left and right edge segments of the center line of the single-layer wiring bending area, the bending effect is basically unaffected, and it can also appropriately improve the ESD resistance. Attached Figure Description

[0025] Figure 1 A schematic diagram of the single-layer trace structure in the bending region of the TFT FPC provided by this utility model;

[0026] Figure 2 A schematic diagram of the single-layer trace bending region structure in Embodiment 1 of the TFT FPC bending region single-layer trace structure provided by this utility model;

[0027] Figure 3 A schematic diagram of the single-layer trace bending region in Embodiment 2 of the TFT FPC bending region single-layer trace structure provided by this utility model;

[0028] Figure 4 A schematic diagram of the single-layer trace bending region in Embodiment 3 of the TFT FPC bending region single-layer trace structure provided by this utility model;

[0029] Figure 5 This is a schematic diagram of the structure of a single-layer trace in the bending region of a conventional TFT FPC, which is provided as background technology for this utility model.

[0030] The markings in the diagram are explained as follows:

[0031] LCD module 1, bonding part 11;

[0032] TFT FPC2, first bonding end 21, second bonding end 22, single-layer trace bending area 23;

[0033] Left edge segment 230, right edge segment 231, top edge segment 232, bottom edge segment 233, edge separator segment 234;

[0034] Wiring section 3;

[0035] Multi-layer wiring lead-out section 4. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0037] As described in the background art, such as Figure 5 As shown, TFT FPC1-2 often needs to be bent to the back to connect with the customer's motherboard. The bending area 1-1 needs to adopt a single-layer trace design because the single-layer trace area is thinner and more flexible, making it easier to bend. After bending, the rebound force is smaller, which is also very helpful for TFT MURA. However, the downside is that the trace in this position does not have GND (ground) coverage protection, making it more susceptible to ESD interference and having poor anti-static capability.

[0038] To solve this technical problem, this utility model provides a single-layer wiring structure for the bending area of ​​a TFT FPC, which is applied to TFT FPC.

[0039] For details, please refer to Figures 1-5 The single-layer wiring structure of the TFT FPC bending area specifically includes an LCD module 1. A TFT FPC 2 is bonded to the bottom of the LCD module 1. The TFT FPC 2 has a first bonding end 21 and a second bonding end 22. The TFT FPC 2 is bonded to the LCD module 1 through the first bonding end 21. The surface of the TFT FPC 2 has a single-layer wiring bending area 23 near the first bonding end 21.

[0040] The single-layer wiring bending area 23 includes a left edge segment 230, a right edge segment 231, a top edge segment 232, and a bottom edge segment 233;

[0041] The left edge segment 230, top edge segment 232, right edge segment 231 and bottom edge segment 233 are connected end to end by edge separators 234 to form the single-layer wiring bending area 23. The TFTFPC2 can be bent along the left edge segment 230 and the right edge segment 231.

[0042] The single-layer trace structure in the bending area of ​​the TFT FPC provided by this utility model retains part of the traces at the center of both sides and the center of the top and bottom of the conventional rectangular bending area in the single-layer trace bending area 23, forming a left edge segment 230, a right edge segment 231, a top edge segment 232 and a bottom edge segment 233, which are connected by edge separation segments 234. The direction of the edge separation segments 234 is located within the bending area of ​​the conventional rectangle. In this way, the traces closer to the two sides can be less exposed to the outside and more covered by the ground of the second layer of other areas. Only the traces near the middle position are exposed to the outside as originally designed. By routing the important power and signal lines to the side and increasing their coverage, the ESD resistance can be increased.

[0043] Meanwhile, since the bending location is within the left edge segment 230 and right edge segment 231 on the center line of the single-layer wiring bending area 23, the bending effect will not be affected, and the ESD resistance can be appropriately improved.

[0044] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0045] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0046] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0047] Example 1

[0048] Please refer to Figures 1-2 A single-layer wiring structure for a TFT FPC bending area includes an LCD module 1, a TFT FPC 2 bonded to the bottom of the LCD module 1, the TFT FPC 2 having a first bonding end 21 and a second bonding end 22, the TFT FPC 2 being bonded to the LCD module 1 through the first bonding end 21, and the surface of the TFT FPC 2 having a single-layer wiring bending area 23 near the first bonding end 21;

[0049] like Figure 2As shown, the single-layer trace bending area 23 includes a left edge segment 230, a right edge segment 231, a top edge segment 232, and a bottom edge segment 233. The left edge segment 230, the top edge segment 232, the right edge segment 231, and the bottom edge segment 233 are connected end to end by edge separators 234 to form the single-layer trace bending area 23. The TFT FPC2 can be bent along the left edge segment 230 and the right edge segment 231.

[0050] In this embodiment, the left edge segment 230, top edge segment 232, right edge segment 231, and bottom edge segment 233 are all arc-shaped. In actual design, the left edge segment 230, top edge segment 232, right edge segment 231, and bottom edge segment 233 can also be designed as straight lines. The purpose of using arc shapes in this embodiment is twofold: firstly, to ensure a more natural connection at the junction with the adjacent edge separation segment 234; and secondly, to better disperse stress when the TFT FPC2 is bent along the left edge segment 230 and right edge segment 231, thereby further improving its bending effect.

[0051] like Figure 2 As shown, the edge dividing segment 234 in this embodiment is an outer arc-shaped dividing segment. Due to the action of the outer arc-shaped dividing segment, the left edge segment 230, the right edge segment 231, the top edge segment 232 and the bottom edge segment 233 together form an "elliptical" single-layer wiring bending area 23.

[0052] In this embodiment, the arc-shaped dividing segment adopts an outward arc-shaped expansion method. This effectively reduces the area of ​​a single layer of wiring compared to the conventional rectangular bending area, allowing more areas to be covered, while retaining the bending requirements of the bending area.

[0053] In practical applications, important power and signal lines can be routed to the sides, that is, to the sides. This way, the lines closer to the sides are less exposed and are more covered by the ground of the multilayer routing area 31. Only the lines near the middle are exposed as originally designed, thereby increasing the ESD resistance of the TFT FPC.

[0054] Example 2

[0055] The single-layer trace structure in the bending region of the TFT FPC provided in Embodiment 1 is further optimized, specifically, as follows: Figure 3 As shown, the edge dividing segment 234 is a straight dividing segment;

[0056] The outer arc-shaped dividing segment causes the left edge segment 230, right edge segment 231, top edge segment 232 and bottom edge segment 233 to surround and form a single-layer wiring bending area 23 in the shape of a regular octagon;

[0057] The difference between this embodiment and Embodiment 1 is that the edge separating segment 234 in this embodiment is a straight line separating segment, such as... Figure 3 The straight line segment shown is as follows Figure 2 Compared to the outer arc-shaped dividing section shown, the single-layer routing area of ​​the single-layer routing bending area 23 is further reduced, which increases the area of ​​the multi-layer routing area 31, allowing the multi-layer routing area 31 to cover more of it and achieve better ESD resistance.

[0058] Example 3

[0059] The single-layer trace structure in the bending region of the TFT FPC provided in Embodiment 1 or 2 is further optimized, such as... Figure 4 As shown, the edge dividing segment 234 is an inner arc-shaped dividing segment;

[0060] The outer arc-shaped dividing segment causes the left edge segment 230, right edge segment 231, top edge segment 232 and bottom edge segment 233 to surround and form an "inner octagon" single-layer wiring bending area 23;

[0061] The difference between this embodiment and Embodiments 1 and 2 is that the edge separating segment 234 is designed as follows: Figure 4 The inner arc-shaped dividing section shown, compared with embodiment two, further reduces the internal area of ​​the single-layer wiring bend area 23, leaving a larger area for the outer multi-layer wiring area 31, which can better cover it and further improve the ESD resistance.

[0062] The effective single-layer cabling area of ​​the "elliptical" single-layer cabling bending area 23, the "regular octagonal" single-layer cabling bending area 23, and the "inner octagonal" single-layer cabling bending area 23 decreases sequentially.

[0063] As mentioned above, the single-layer trace bending regions 23 of different shapes contain only a single layer of traces. The purpose is to ensure the signal conduction of the TFT FPC2 itself while reducing the thickness of the bending region, making it more flexible and easier to bend. The rebound force after bending is relatively small, which is also very helpful for TFT MURA. The specific shape of the single-layer trace bending region 23 should be selected according to the actual application.

[0064] Example 4

[0065] The single-layer trace structure in the bending region of the TFT FPC provided in Example 3 has been further optimized, such as... Figure 2 As shown, the TFT FPC2 includes a wiring section 3 and a multilayer wiring lead-out section 4, which are connected end to end to form the TFT FPC2.

[0066] The first binding end 21 and the second binding end 22 are respectively located at the outer ends of the wiring section 3 and the multi-layer wiring lead-out section 4, and the single-layer wiring bending area 23 is located inside the wiring section 3.

[0067] Except for the single-layer wiring bending area 23, the wiring section 3 consists of multi-layer wiring areas 31. Both the multi-layer wiring areas 31 and the multi-layer wiring lead-out section 4 have GND embedded in them. The single-layer wiring bending area 23 can meet the bending requirements of the TFT FPC2 as a whole, while the multi-layer wiring areas 31 can cover the single-layer wiring bending area 23 as much as possible. Thus, the GND in the multi-layer wiring areas 31 can conduct static electricity and minimize the interference of static electricity on the TFT FPC2.

[0068] Example 5

[0069] The single-layer trace structure in the bending region of the TFT FPC provided in Embodiment 4 is further optimized, such as... Figure 1 As shown, the LCD module 1 has a bonding part 11, and the TFT FPC2 is bonded to the bonding part 11 on the LCD module 1 through its first bonding end 21.

[0070] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0071] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A single-layer wiring structure for a TFT FPC bending area, comprising an LCD module (1), wherein a TFT FPC (2) is bonded to the bottom of the LCD module (1), the TFT FPC (2) having a first bonding end (21) and a second bonding end (22), the TFT FPC (2) being bonded to the LCD module (1) through the first bonding end (21), characterized in that, The TFT FPC (2) has a single-layer wiring bend area (23) near the first bonding end (21) on its surface; The single-layer wiring bend area (23) includes a left edge segment (230), a right edge segment (231), a top edge segment (232), and a bottom edge segment (233); The left edge segment (230), top edge segment (232), right edge segment (231) and bottom edge segment (233) are connected end to end by edge separators (234) to form the single-layer wiring bending area (23), and the TFT FPC (2) can be bent along the left edge segment (230) and right edge segment (231).

2. The single-layer trace structure in the bending region of the TFT FPC according to claim 1, characterized in that, The left edge segment (230), top edge segment (232), right edge segment (231) and bottom edge segment (233) are all arc-shaped.

3. The single-layer trace structure in the bending region of the TFT FPC according to claim 2, characterized in that, The edge dividing segment (234) is an outer arc-shaped dividing segment; The outer arc-shaped dividing segment causes the left edge segment (230), right edge segment (231), top edge segment (232) and bottom edge segment (233) to surround and form an "elliptical" single-layer wiring bending area (23).

4. The single-layer trace structure in the bending region of the TFT FPC according to claim 3, characterized in that, The edge dividing segment (234) is a straight dividing segment; The outer arc-shaped dividing segment causes the left edge segment (230), right edge segment (231), top edge segment (232) and bottom edge segment (233) to surround and form a single-layer wiring bending area (23) in the shape of an "octagon".

5. The single-layer trace structure in the bending region of the TFT FPC according to claim 4, characterized in that, The edge dividing segment (234) is an inner arc-shaped dividing segment; The outer arc-shaped dividing segment causes the left edge segment (230), right edge segment (231), top edge segment (232) and bottom edge segment (233) to surround and form an "inner octagon" single-layer wiring bending area (23).

6. The single-layer trace structure in the bending region of the TFT FPC according to claim 5, characterized in that, The effective single-layer cabling area of ​​the single-layer cabling bending area (23) in the "elliptical" shape, the single-layer cabling bending area (23) in the "regular octagon" shape, and the single-layer cabling bending area (23) in the "inner octagon" shape decreases sequentially.

7. The single-layer trace structure in the bending region of the TFT FPC according to claim 1, characterized in that, The TFT FPC (2) includes a wiring section (3) and a multilayer wiring lead-out section (4), which are connected end to end to form the TFT FPC (2); The first binding end (21) and the second binding end (22) are respectively located at the outer ends of the wiring section (3) and the multi-layer wiring lead-out section (4), and the single-layer wiring bending area (23) is located within the wiring section (3).

8. The single-layer trace structure in the bending region of the TFT FPC according to claim 7, characterized in that, Except for the single-layer wiring bend area (23), the wiring section (3) consists of a multi-layer wiring area (31).

9. The single-layer trace structure in the bending region of the TFT FPC according to claim 8, characterized in that, GND is pre-embedded in both the multi-layer wiring area (31) and the multi-layer wiring lead-out part (4).

10. The single-layer trace structure in the bending region of the TFT FPC according to claim 1, characterized in that, The LCD module (1) has a bonding part (11), and the TFT FPC (2) is bonded to the bonding part (11) on the LCD module (1) through its first bonding end (21).

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