Flexible circuit board easy to measure impedance and liquid crystal display screen

Abstract

The utility model discloses a flexible circuit board easy to measure impedance and a liquid crystal display screen, the flexible circuit board comprises a flexible circuit board, the back surface of the flexible circuit board is provided with a bending area, a film pasting area and a test area, the bending area is arranged at the binding position close to the back surface of the flexible circuit board, and the film pasting area is arranged at the binding position close to the back surface of the flexible circuit board. The bending area is arranged on one side of the back face of the flexible circuit board, the testing area is arranged on one side of the back face of the flexible circuit board, the film pasting areas are arranged on the front face and the back face of the flexible circuit board, and the bending area, the film pasting areas and the testing area are opposite in position. According to the flexible circuit board, the bending area, the film pasting area and the testing area are arranged on the back face of the flexible circuit board, and the bending area is not provided with a film, so that the flexibility of the bending area is increased, and the bounce of the flexible circuit board is reduced, and therefore, when the testing area is arranged on the back face of the flexible circuit board and the flexible circuit board is bent, the testing area is not exposed, and the testing effect is improved. Therefore, film protection is not needed, the film on the surface does not need to be scraped off in the test area, and the integrity of the test area is further guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a flexible circuit board and liquid crystal display screen that are easy to measure impedance. Background Technology

[0002] Currently, conventional LCD displays have test points designed on their PFC (Power Factor Control) to measure the impedance after the flexible circuit board is bonded and to detect related performance issues. These test points are typically placed on the same side as the display screen (e.g., ...). Figure 1 And its surface is covered with a PI film to prevent short circuits.

[0003] However, existing test point designs have some shortcomings. The hardness of the PI film and the relatively small size of the test points make it extremely difficult to scrape off the PI film to expose the copper surface during actual operation. This not only affects the efficiency and accuracy of the testing operation but also increases the risk of damage to the test points, and may even lead to short circuit failures, affecting product usability.

[0004] For example, Chinese invention patent (CN117896892A) discloses a flexible circuit board for a display module, including a non-bending portion and a bending portion. The non-bending portion and the bending portion are integrally formed, and a bending connection area is provided between the non-bending portion and the bending portion. The bending connection area is subjected to a flexibility pretreatment, and / or the flexible circuit board is covered with a PI cover film. Based on this, the flexibility of the flexible circuit board can be improved, the bending stress of the flexible circuit board can be reduced, and the flexible circuit board can still be used normally after bending.

[0005] However, when the inventors implemented this device, they found the following defects: the surface PI film needs to be scraped off to expose the copper surface for detection. Since the PI film is hard and the test point is small, the surface PI film is not easy to remove in actual operation. Utility Model Content

[0006] Based on this, it is necessary to provide a flexible circuit board and liquid crystal display screen that are easy to measure impedance, addressing the aforementioned technical problems. By setting a bending area, a film-coating area, and a test area on the back of the flexible circuit board, the flexibility of the bending area is increased and the rebound force of the flexible circuit board is reduced since no film is placed on the bending area. Therefore, when the test area is set on the back of the flexible circuit board, the test area will not be exposed when the flexible circuit board is bent, so no film protection is required. Thus, it is not necessary to scrape off the surface film in the test area, further ensuring the integrity of the test area.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0008] A flexible circuit board that is easy to measure impedance.

[0009] The flexible circuit board that facilitates impedance measurement specifically includes:

[0010] A flexible circuit board, wherein a bending area, a film-applying area and a testing area are provided on the back side of the flexible circuit board, the bending area is located at the bonding point near the back side of the flexible circuit board, the testing area is located on one side of the back side of the flexible circuit board, and the film-applying area is located on the front and back sides of the flexible circuit board, and the bending area, the film-applying area and the testing area are positioned opposite each other.

[0011] A covering film is disposed on the film application area;

[0012] A solder resist layer is sprayed onto the bending area.

[0013] As a preferred embodiment of the flexible circuit board with easily measurable impedance provided by this utility model, the test area is provided with test points for measuring the impedance of the flexible circuit board after bonding.

[0014] In a preferred embodiment of the flexible circuit board for easy impedance measurement provided by this utility model, the number of test areas is at least one.

[0015] As a preferred embodiment of the flexible circuit board for easy impedance measurement provided by this utility model, each of the test areas is provided with a test point.

[0016] In a preferred embodiment of the flexible circuit board for easy impedance measurement provided by this utility model, the solder mask layer is also disposed on the test point.

[0017] As a preferred embodiment of the flexible circuit board with easily measurable impedance provided by this utility model, the covering film is a PI film, a PC film, or a PET film.

[0018] In a preferred embodiment of the flexible circuit board with easily measurable impedance provided by this utility model, the solder mask layer is green solder mask.

[0019] On the other hand, this utility model embodiment also provides a liquid crystal display screen, which includes a display module and the aforementioned flexible circuit board for easy impedance measurement, wherein the flexible circuit board for easy impedance measurement is bonded to the display module.

[0020] In a preferred embodiment of the liquid crystal display screen provided by this utility model, the display module includes, from bottom to top, a lower polarizer, a lower glass, an upper glass, and an upper polarizer, and the flexible circuit board that is easy to measure impedance is bonded to the bonding position of the lower glass.

[0021] In a preferred embodiment of the liquid crystal display screen provided by this utility model, the lower glass is provided with an IC.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The flexible circuit board and liquid crystal display screen provided by this utility model, which are easy to measure impedance, have a bending area, a film-coating area and a test area set on the back of the flexible circuit board. Since the bending area is not covered with a film, the flexibility of the bending area is increased and the rebound force of the flexible circuit board is reduced. Therefore, when the test area is set on the back of the flexible circuit board, the test area will not be exposed when the flexible circuit board is bent, so there is no need for film protection. Therefore, there is no need to scrape off the film on the surface of the test area, which further ensures the integrity of the test area. Attached Figure Description

[0024] To more clearly illustrate the solutions in this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the existing technology;

[0026] Figure 2 A schematic diagram of the structure of the flexible circuit board provided by this utility model;

[0027] Figure 3 A schematic diagram of the structure of the flexible circuit board for easy impedance measurement provided by this utility model;

[0028] Figure 4 for Figure 3 The test image.

[0029] The markings in the diagram are explained as follows:

[0030] Flexible circuit board 100, bending area 110, film application area 120, testing area 130, cover film 140, solder resist layer 150, test point 160; display module 200, lower polarizer 210, lower glass 220, upper glass 230, upper polarizer 240; IC 250. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0032] As in the background technology, when using it, it is necessary to scrape off the surface PI film to expose the copper surface for detection. Since the PI film is relatively hard and the test point 160 is small, the surface PI film is not easy to remove in actual operation.

[0033] To solve this technical problem, this utility model provides a flexible circuit board that is easy to measure impedance.

[0034] For details, please refer to Figure 2-4 Flexible circuit boards that are easy to measure impedance specifically include:

[0035] The flexible circuit board 100 has a bending area 110, a film-applying area 120, and a testing area 130 on its back side. The bending area 110 is located at the bonding area near the back side of the flexible circuit board 100, the testing area 130 is located on one side of the back side of the flexible circuit board 100, and the film-applying area 120 is located on both the front and back sides of the flexible circuit board 100. The bending area 110, the film-applying area 120, and the testing area 130 are positioned opposite each other.

[0036] Covering film 140 is disposed on film application area 120;

[0037] A solder resist layer 150 is sprayed onto the bending area 110.

[0038] The flexible circuit board for easy impedance measurement provided by this utility model has a bending area 110, a film-coating area 120, and a test area 130 on the back side of the flexible circuit board 100. Since the bending area 110 is not covered with a film, the flexibility of the bending area 110 is increased and the rebound force of the flexible circuit board 100 is reduced. Therefore, when the test area 130 is set on the back side of the flexible circuit board 100, the test area 130 will not be exposed after the flexible circuit board 100 is bent, so there is no need for film protection. Therefore, there is no need to scrape off the film on the surface of the test area 130, which further ensures the integrity of the test area 130.

[0039] This utility model provides a liquid crystal display screen.

[0040] For details, please refer to Figure 2-4 The LCD screen specifically includes:

[0041] The display module 200 is bonded to the aforementioned flexible circuit board for easy impedance measurement.

[0042] The liquid crystal display screen provided by this utility model has a bending area 110, a film application area 120 and a test area 130 set on the back of the flexible circuit board 100. Since the bending area 110 is not covered with a film, the flexibility of the bending area 110 is increased and the rebound force of the flexible circuit board 100 is reduced. Therefore, when the test area 130 is set on the back of the flexible circuit board 100, the test area 130 will not be exposed after the flexible circuit board 100 is bent. Therefore, no film protection is required, and there is no need to scrape off the film on the surface of the test area 130, which further ensures the integrity of the test area 130.

[0043] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0044] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0045] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0046] Example 1

[0047] Please refer to Figure 2-4 A flexible circuit board for easy impedance measurement includes a flexible circuit board 100. The back side of the flexible circuit board 100 is provided with a bending area 110, a film-applying area 120 and a test area 130. The bending area 110 is located at the bonding point near the back side of the flexible circuit board 100. The test area 130 is located on one side of the back side of the flexible circuit board 100. The film-applying area 120 is located on the front and back sides of the flexible circuit board 100. The bending area 110, the film-applying area 120 and the test area 130 are positioned opposite each other.

[0048] Covering film 140 is disposed on film application area 120;

[0049] A solder resist layer 150 is sprayed onto the bending area 110.

[0050] With the above structural design, the bending area 110 is a single-layer area for the traces. Its surface has no cover film 140. However, in order to prevent oxidation and short circuits of the traces on the surface of the flexible circuit board 100, a solder mask layer 150 is printed on the surface of the single-layer area. At the same time, the cover film 140 is also removed from the surface of the test layer. In order to prevent short circuits and oxidation, a solder mask layer 150 is also printed on the surface of the test layer. It is easy to identify visually and easy to find during testing. The surface solder mask layer 150 is relatively thin, so it is easy to scratch off to expose the copper surface for testing. By setting a bending area 110, a film-coating area 120, and a test area 130 on the back of the flexible circuit board 100, the flexibility of the bending area 110 is increased and the rebound force of the flexible circuit board 100 is reduced because no film is applied to the bending area 110. Therefore, when the test area 130 is set on the back of the flexible circuit board 100, the test area 130 will not be exposed after the flexible circuit board 100 is bent, so no film protection is required. Therefore, it is not necessary to scrape off the film on the surface of the test area 130, which further ensures the integrity of the test area 130.

[0051] Specifically, test points 160 are provided on the test area 130 for measuring the impedance of the flexible circuit board 100 after bonding.

[0052] With the above structural design, test point 160 is used to measure the impedance of the flexible circuit board 100 after bonding and to detect related performance issues of the product.

[0053] Specifically, the number of test areas 130 is at least one.

[0054] Through the above structural design, test area 130 is the location for setting up test point 160.

[0055] Specifically, each test area 130 has a test point 160.

[0056] Through the above structural design, by setting a bending area 110, a film-coating area 120, and a test area 130 on the back of the flexible circuit board 100, the flexibility of the bending area 110 is increased and the rebound force of the flexible circuit board 100 is reduced because no film is applied to the bending area 110. Therefore, when the test area 130 is set on the back of the flexible circuit board 100, the test area 130 will not be exposed after the flexible circuit board 100 is bent, so no film protection is required. Therefore, it is not necessary to scrape off the film on the surface of the test area 130, further ensuring the integrity of the test area 130.

[0057] Specifically, the solder mask layer 150 is also disposed on the test point 160.

[0058] With the above structural design, the cover film 140 is removed from the surface of test point 160. In order to prevent short circuits and oxidation, a solder mask layer 150 is also printed on the surface of test point 160. It is easy to identify in appearance and easy to find during testing. The surface solder mask layer 150 is relatively thin, so it is easy to scrape it open to expose the copper surface for testing.

[0059] Example 2

[0060] The flexible circuit board for easy impedance measurement provided in Example 1 is further optimized, specifically, as follows: Figure 2-4 As shown, the cover film 140 is a PI film, PC film, or PET film.

[0061] Through the above structural design, in this embodiment, the cover film 140 is a PI film.

[0062] Specifically, solder mask layer 150 is green solder mask.

[0063] Through the above structural design, the solder mask layer 150 is green solder mask, which can cover conductors other than solder pads, and can prevent short circuits during use and extend the service life of PCB. It is generally called solder mask or solder resist.

[0064] Example 3

[0065] The flexible circuit board provided in Embodiment 1 or 2, which facilitates impedance measurement, is further optimized, such as... Figure 2-4 As shown, this utility model embodiment also provides a liquid crystal display screen, which includes a display module 200 and the aforementioned flexible circuit board for easy impedance measurement. The flexible circuit board for easy impedance measurement is bonded to the display module 200.

[0066] Specifically, the display module 200 includes, from bottom to top, a lower polarizer 210, a lower glass 220, an upper glass 230, and an upper polarizer 240210. A flexible circuit board that is easy to measure impedance is bonded to the bonding position of the lower glass 220.

[0067] Through the above structural design, by placing the flexible circuit board 100 on the display module 200, it is beneficial to bend the flexible circuit board 100 to the back of the display module 200. It is also beneficial that when the test area 130 is placed on the back of the flexible circuit board 100, the test area 130 will not be exposed after the flexible circuit board 100 is bent, so there is no need for a protective film. Therefore, there is no need to scrape off the film on the surface of the test area 130, which further ensures the integrity of the test area 130.

[0068] Specifically, the lower glass 220 is equipped with IC250.

[0069] Based on the above structural design, IC250 in the lower glass 220 refers to an integrated circuit (IC250) manufactured using a glass substrate.

[0070] The flexible circuit board and LCD screen for easy impedance measurement provided by this utility model are used as follows:

[0071] By setting a bending area 110, a film-coating area 120, and a test area 130 on the back of the flexible circuit board 100, the flexibility of the bending area 110 is increased and the rebound force of the flexible circuit board 100 is reduced because no film is applied to the bending area 110. Therefore, when the test area 130 is set on the back of the flexible circuit board 100, the test area 130 will not be exposed after the flexible circuit board 100 is bent, so no film protection is required. Therefore, it is not necessary to scrape off the film on the surface of the test area 130, which further ensures the integrity of the test area 130.

[0072] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0073] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A flexible circuit board for easy impedance measurement, characterized in that, It includes: A flexible circuit board (100) has a bending area (110), a film-applying area (120), and a testing area (130) on its back side. The bending area (110) is located near the bonding area on the back side of the flexible circuit board (100), the testing area (130) is located on one side of the back side of the flexible circuit board (100), and the film-applying area (120) is located on both the front and back sides of the flexible circuit board (100). The bending area (110), the film-applying area (120), and the testing area (130) are positioned opposite each other. A cover film (140) is disposed on the film application area (120); A solder resist layer (150) is sprayed onto the bending area (110).

2. The flexible circuit board for easy impedance measurement according to claim 1, characterized in that, The test area (130) is provided with test points (160) for measuring the impedance of the flexible circuit board after bonding.

3. The flexible circuit board for easy impedance measurement according to claim 2, characterized in that, The number of test areas (130) is at least one.

4. The flexible circuit board for easy impedance measurement according to claim 3, characterized in that, Each of the test areas (130) is provided with one of the test points (160).

5. The flexible circuit board for easy impedance measurement according to claim 4, characterized in that, The solder resist layer (150) is also disposed on the test point (160).

6. The flexible circuit board for easy impedance measurement according to claim 1, characterized in that, The covering film (140) is a PI film, a PC film, or a PET film.

7. The flexible circuit board for easy impedance measurement according to claim 1, characterized in that, The solder resist layer (150) is green oil.

8. A liquid crystal display screen, characterized in that, It includes a display module (200) and a flexible circuit board for easy impedance measurement as described in any one of claims 1-7, the flexible circuit board for easy impedance measurement being bonded to the display module (200).

9. The liquid crystal display screen according to claim 8, characterized in that, The display module (200) includes, from bottom to top, a lower polarizer (210), a lower glass (220), an upper glass (230), and an upper polarizer (240). The flexible circuit board, which is easy to measure impedance, is bonded to the bonding position of the lower glass (220).

10. The liquid crystal display screen according to claim 9, characterized in that, The lower glass (220) is provided with an IC (250).

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