Pad structure, circuit board, display panel and electronic equipment

Abstract

The utility model relates to a bonding pad structure, a circuit board, a display panel and electronic equipment, the bonding pad structure comprises a first bonding pad and a second bonding pad, the first bonding pad comprises a first welding part and a first connecting part which are connected, and the first connecting part is provided with at least one first triangular area; the second bonding pad comprises a second welding part and a second connecting part which are connected, and the second connecting part is provided with at least one second triangular area; the edge, close to the second bonding pad, of the first bonding pad is a first edge line, the edge, close to the first bonding pad, of the second bonding pad is a second edge line, and an electric gap is formed between the first edge line and the second edge line and extends in the linear direction; one side of the first triangular area is a first edge line or a part of the first edge line, and one side of the second triangular area is a second edge line or a part of the second edge line. The bonding pad structure not only can replace a zero ohmic resistor to realize a circuit conduction function, but also can realize the problems of welding a component on the bonding pad and modifying the resistance value at the position.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and more particularly to a pad structure, circuit board, display panel, and electronic device. Background Technology

[0002] Zero-ohm resistors are widely used components on circuit boards. They have very low resistance and can only serve as wire connections. However, with the increasing production volume of circuit boards, the large number of zero-ohm resistors on each board leads to cost waste. To solve this problem, two solder pads are brought closer together on the existing pads on the circuit board, and the solder paste on the pads is heated to melt, thus replacing the zero-ohm resistor. However, this method cannot be used to solder other components onto these pads or replace them with resistors of different resistance values. Utility Model Content

[0003] The purpose of this application is to provide a pad structure, circuit board, display panel and electronic device. The pad structure can replace the zero-ohm resistor to realize the circuit conduction function, and can also solve the problems of soldering components on the pad and modifying the resistance value.

[0004] Therefore, in a first aspect, embodiments of this application provide a pad structure, including:

[0005] A first pad includes a first solder portion and a first connecting portion connected together, the first connecting portion having at least one first triangular region; and

[0006] The second pad includes a second soldering portion and a second connecting portion connected together, wherein the second connecting portion has at least one second triangular region;

[0007] The edge of the first pad near the edge of the second pad is a first edge line, and the edge of the second pad near the edge of the first pad is a second edge line. An electrical gap is formed between the first edge line and the second edge line, and the electrical gap extends in a straight line.

[0008] One side of the first triangular region is the first edge line or a part of the first edge line, and one side of the second triangular region is the second edge line or a part of the second edge line.

[0009] In one possible implementation, the first welded portion has a rectangular projection shape, the first connecting portion has a first triangular area, the first triangular area has a right-angled triangle projection shape, one of the right-angled triangles is collinear with one of the long sides of the rectangle, and the hypotenuse of the right-angled triangle is the first edge line.

[0010] In one possible implementation, the projected shape of the first welded part is a rectangle, the projected shape of the first connecting part is a trapezoid, the upper base of the trapezoid is collinear with one of the long sides of the rectangle, and the lower base of the trapezoid is the first edge line.

[0011] In one possible implementation, the upper base of the trapezoid is a portion of the long side of the rectangle that is collinear with it; or, the upper base of the trapezoid is the long side of the rectangle that is collinear with it.

[0012] In one possible implementation, the first welded portion has a rectangular projection shape, the first connecting portion includes a first triangular area and a first connecting area, the first triangular area has a triangular projection shape, one side of the triangle is the first edge line, and the first connecting area connects the first triangular area and the first welded portion.

[0013] In one possible implementation, both the first pad and the second pad are provided with vias.

[0014] In one possible implementation, the first pad and the second pad are arranged axially or centrally symmetrically about the electrical clearance.

[0015] Secondly, embodiments of this application provide a circuit board, which includes a substrate and a pad structure as described in the first aspect, wherein at least one mounting position is formed on the substrate, and the pad structure is disposed within the mounting position.

[0016] Thirdly, embodiments of this application provide a display panel, including a display substrate and a circuit board as described in the second aspect, wherein the display substrate is used to display images and the circuit board is electrically connected to the display substrate.

[0017] Fourthly, embodiments of this application provide an electronic device that includes the pad structure described in the first aspect.

[0018] According to the pad structure, circuit board, display panel and electronic device provided in the embodiments of this application, when the pad structure is covered with a steel mesh and coated with solder paste, the electrical gap between the first pad and the second pad is small, and the first pad and the second pad can be connected by shorting the solder on the pad structure, thereby replacing the zero-ohm electroplating to achieve the circuit conduction function.

[0019] When soldering components onto the pad structure, one pin of the component is soldered to the first pad, and the other pin is soldered to the second pad. Specifically, the areas close to each other on the first and second pads are the first and second triangular regions, respectively. Components cannot be soldered into the triangular regions of the pads. Therefore, one pin of the component is soldered to the first soldering portion of the first pad, and the other pin is soldered to the second soldering portion of the second pad. Since the first and second soldering portions are located on opposite sides of the first and second pads, the distance between the two pins is sufficiently large during soldering, thus ensuring soldering reliability.

[0020] In summary, the pad structure provided in this application embodiment can not only replace the zero-ohm resistor to achieve circuit conduction, but also enable the mounting of components and modification of resistance values ​​on it. This pad structure does not require remanufacturing, which can solve the cost waste caused by the zero-ohm resistor in the prior art, and solve the problem that ordinary solder bridge pads cannot mount components or change resistance values. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In addition, in the drawings, the same parts use the same reference numerals, and the drawings are not drawn to scale.

[0022] Figure 1 This illustration shows a schematic diagram (I) of a pad structure provided in an embodiment of this application;

[0023] Figure 2 Show Figure 1 A schematic diagram of the solder bridge design structure for the pad structure shown;

[0024] Figure 3 Show Figure 1 The schematic diagram of the component design structure for the pad structure shown is shown.

[0025] Figure 4 This document shows a schematic diagram (II) of a pad structure provided in an embodiment of this application;

[0026] Figure 5 Show Figure 4 A schematic diagram of the solder bridge design structure for the pad structure shown;

[0027] Figure 6 Show Figure 4 The schematic diagram of the component design structure for the pad structure shown is shown.

[0028] Figure 7 This document shows a schematic diagram (III) of a pad structure provided in an embodiment of this application;

[0029] Figure 8 Show Figure 7 A schematic diagram of the solder bridge design structure for the pad structure shown;

[0030] Figure 9 Show Figure 7 The schematic diagram of the component design structure for the pad structure shown is shown.

[0031] Figure 10 This document shows a schematic diagram (fourth) of a pad structure provided in an embodiment of this application;

[0032] Figure 11 Show Figure 10 A schematic diagram of the solder bridge design structure for the pad structure shown;

[0033] Figure 12 Show Figure 10 The schematic diagram of the component design structure for the pad structure shown is shown.

[0034] Figure 13 This illustration shows a schematic diagram of a circuit board structure provided in an embodiment of this application;

[0035] Figure 14 This illustration shows a structural schematic diagram of a display panel provided in an embodiment of this application;

[0036] Figure 15 This diagram illustrates the structure of an electronic device provided in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. First pad;

[0039] 11. First welding section;

[0040] 12. First connecting part; 121. First triangular area; 122. First connecting area;

[0041] 13. First edge line;

[0042] 2. Second pad;

[0043] 21. Second welding section;

[0044] 22. Second connecting part; 221. Second triangular area; 222. Second connecting area;

[0045] 23. Second edge line;

[0046] 3. Electrical clearance; 4. Via; 5. Circuit board; 51. Silkscreen area; 52. Substrate; 6. Stencil layer; 7. Display substrate; 8. Backlight assembly;

[0047] 100. Display panel; 200. Electronic device. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0049] First Embodiment

[0050] like Figures 1-12 As shown, this application provides a pad structure, including:

[0051] A first solder pad 1 includes a first soldering portion 11 and a first connecting portion 12 connected together, the first connecting portion 12 having at least one first triangular region 121; and

[0052] The second pad 2 includes a second soldering portion 21 and a second connecting portion 22 connected together, the second connecting portion 22 having at least one second triangular region 221;

[0053] The edge of the first pad 1 near the edge of the second pad 2 is a first edge line 13, and the edge of the second pad 2 near the edge of the first pad 1 is a second edge line 23. An electrical gap 3 is formed between the first edge line 13 and the second edge line 23, and the electrical gap 3 extends in a straight line.

[0054] One side of the first triangular region 121 is the first edge line 13 or a part of the first edge line 13, and one side of the second triangular region 221 is the second edge line 23 or a part of the second edge line 23.

[0055] When a steel mesh is laid on the orthographic projection of the pad structure and solder paste is applied, the electrical gap 3 between the first pad 1 and the second pad 2 is small. The first pad 1 and the second pad 2 can be connected by shorting the solder on the pad structure, which can replace zero-ohm electroplating to achieve the circuit conduction function.

[0056] When soldering components onto the pad structure, one pin of the component is soldered to the first pad 1, and the other pin is soldered to the second pad 2. Specifically, the areas close to each other on the first pad 1 and the second pad 2 are the first triangular area 121 and the second triangular area 221, respectively. Components cannot be soldered into the triangular areas on the pads. Therefore, the first soldering part 11 of the first pad 1 is soldered to one pin of the component, and the second soldering part 21 of the second pad 2 is soldered to the other pin of the component. Since the first soldering part 11 and the second soldering part 21 are located on opposite sides of the first pad 1 and the second pad 2, the distance between the two pins of the component during soldering is sufficiently large, thus ensuring the reliability of the soldering.

[0057] In summary, the pad structure provided in this application embodiment can not only replace the zero-ohm resistor to achieve circuit conduction, but also enable the mounting of components and modification of resistance values ​​on it. This pad structure does not require remanufacturing, which can solve the cost waste caused by the zero-ohm resistor in the prior art, and solve the problem that ordinary solder bridge pads cannot mount components or change resistance values.

[0058] Specifically, in actual use, the component assembly plant prepares two sets of stencils. First, during the solder bridge design, the stencil covers the entire pad structure to ensure the connectivity of the first pad 1 and the second pad 2, acting as a zero-ohm resistor and reducing the cost of component 5 on the circuit board. When designing for component assembly, another set of stencils is used. The mesh openings of this stencil correspond to the first soldering portion 11 of the first pad 1 and the second soldering portion 21 of the second pad 2. This means the stencil in this case needs to be smaller than the one used in the solder bridge design to ensure that the solder paste does not cover the entire pad structure, but only the necessary areas. This reduces the risk of short circuits caused by solder paste flowing together on the first pad 1 and the second pad 2 during hot air soldering, while also ensuring that there is sufficient solder paste on both pads 1 and 2 to hold the components in place.

[0059] Reference Figures 1 to 3 In some embodiments, the projected shape of the first soldering portion 11 is rectangular, and the first connecting portion 12 has a first triangular area 121, which is also the first connecting portion 12. The projected shape of the first triangular area 121 is a right triangle, with one leg of the right triangle collinear with one of the longer sides of the rectangle, and the hypotenuse of the right triangle being the first edge line 13. That is, the orthographic projection shape of the first pad 1 is a right trapezoid, and the hypotenuse of the right trapezoid is the hypotenuse of the right triangle, which is also the first edge line 13 of the first pad 1. When the first pad 1 is used to solder components, the first soldering portion 11 is used to solder the pins of the components.

[0060] The first pad 1 and the second pad 2 are arranged axially or centrally symmetrically about the electrical gap 3. That is, when the first pad 1 has the above structure, the orthographic projection shape of the second pad 2 is also a right trapezoid, the projection shape of the second welding part 21 is a rectangle, and there is one second triangular area 221, whose projection shape is a right triangle. The second triangular area 221 is also the second connecting part 22, and one of the right-angled sides of the second triangular area 221 coincides with one of the long sides of the rectangle of the second welding part 21. The hypotenuse of the second triangular area 221 is the second edge line 23. The electrical gap 3 is between the hypotenuse of the first triangular area 121 and the hypotenuse of the second triangular area 221. At this time, the orthographic projection shape of the electrical gap 3 includes an isosceles trapezoid and a parallelogram. Since the isosceles trapezoidal structure makes the distance between the first pad 1 and the second pad 2 very close in one part and far apart in another part, the connection effect is difficult to guarantee when it is necessary to replace the zero-ohm resistor. Therefore, the first pad 1 has the above structure, and in this embodiment, the electrical gap 3 is preferably arranged as a parallelogram.

[0061] Figure 2 The diagram shown is a schematic of the solder bridge design for the solder pad structure. Figure 1 and Figure 2 When the pad structure needs to act as a zero-ohm resistor, the stencil layer 6 covers the entire pad structure to ensure the connectivity between the first pad 1 and the second pad 2.

[0062] Figure 3 The diagram shown is a schematic of the pad structure component design. Figure 1 and Figure 3 When components need to be mounted on the pad structure, the stencil layer 6, corresponding to the first soldering part 11 and the second soldering part 21, ensures that the solder paste does not completely cover the first soldering pad 1 and the second soldering pad 2. This reduces the risk of short circuits caused by solder paste flowing together in adjacent areas of the first soldering pad 1 and the second soldering pad 2 during subsequent hot air soldering. At the same time, it ensures the amount of solder paste in the first soldering part 11 and the second soldering part 21, ensuring the stability of the components soldered on them.

[0063] Reference Figures 4 to 9 In some embodiments, the projected shape of the first welding part 11 is a rectangle, and the projected shape of the first connecting part 12 is a trapezoid. The upper base of the trapezoid is collinear with one of the long sides of the rectangle, and the lower base of the trapezoid is the first edge line 13. At this time, the first connecting part 12 has two first triangular areas 121 and one first rectangular area. The first rectangular area is located in the middle, and the two first triangular areas 121 are located on both sides of the length direction of the first rectangular area, thereby forming a trapezoidal shape for the projected shape of the first connecting part 12.

[0064] The first pad 1 and the second pad 2 are arranged symmetrically or centrally about the electrical clearance 3. That is, when the first pad 1 has the above structure, the projected shape of the second soldering part 21 is rectangular, and the projected shape of the second connecting part 22 is trapezoidal. The upper base of the trapezoid is collinear with one of the long sides of the rectangle, and the lower base of the trapezoid is the second edge line 23. At this time, the second connecting part 22 has two second triangular areas 221 and one second rectangular area. The second rectangular area is located in the middle, and the two second triangular areas 221 are located on both sides of the length direction of the second rectangular area, thereby forming a trapezoidal projected shape of the second connecting part 22.

[0065] In the above situation, such as Figures 4 to 6 As shown, the upper base of the trapezoid can be a portion of the longer side of the rectangle that is collinear with it; or, as... Figures 7 to 9 As shown, the upper base of the trapezoid is the long side of the rectangle that is collinear with it.

[0066] Figure 5 and Figure 8 The diagram shown is a schematic of the solder bridge design for the solder pad structure. Figures 4 to 8 When the pad structure needs to act as a zero-ohm resistor, the stencil layer 6 covers the entire pad structure to ensure the connectivity between the first pad 1 and the second pad 2.

[0067] Figure 6 and Figure 9 The diagram shown is a schematic of the pad structure component design. Figures 4 to 9 When components need to be mounted on the pad structure, the stencil layer 6, corresponding to the first soldering part 11 and the second soldering part 21, ensures that the solder paste does not completely cover the first soldering pad 1 and the second soldering pad 2. This reduces the risk of short circuits caused by solder paste flowing together in adjacent areas of the first soldering pad 1 and the second soldering pad 2 during subsequent hot air soldering. At the same time, it ensures the amount of solder paste in the first soldering part 11 and the second soldering part 21, ensuring the stability of the components soldered on them.

[0068] Reference Figures 10-12 In some embodiments, the projected shape of the first welding portion 11 is rectangular, and the first connecting portion 12 includes a first triangular region 121 and a first connecting region 122. The projected shape of the first triangular region 121 is triangular, with one side of the triangle being the first edge line 13. The first connecting region 122 connects the first triangular region 121 and the first welding portion 11. The projected shape of the first connecting region 122 can be any shape, such as a rectangle, trapezoid, parallelogram, or triangle. Of course, the first connecting region 122 can be connected to any position within the first triangular region 121 or to any position within the first welding portion 11.

[0069] Optionally, the first connection area 122 is connected to the side of the first welding part 11 near the second welding pad 2.

[0070] Optionally, the first connecting area 122 is connected to any corner of the first triangular area 121, or the first connecting area 122 is connected to any part of the side of the first triangular area 121.

[0071] For example, the projected shape of the first connection area 122 is a right trapezoid, the vertical waist of the first connection area 122 coincides with part of the long side of the first welding part 11, the sloping waist of the first connection area 122 coincides with part of the side of the first triangular area 121, and the end of the sloping waist of the first connection area 122 coincides with one of the corners of the first triangular area 121.

[0072] Figure 11 The diagram shown is a schematic of the solder bridge design for the solder pad structure. Figure 10 and Figure 11 When the pad structure needs to act as a zero-ohm resistor, the stencil layer 6 covers the entire pad structure to ensure the connectivity between the first pad 1 and the second pad 2.

[0073] Figure 12 The diagram shown is a schematic of the pad structure component design. Figure 10 and Figure 12 When components need to be mounted on the pad structure, the stencil layer 6, corresponding to the first soldering part 11 and the second soldering part 21, ensures that the solder paste does not completely cover the first soldering pad 1 and the second soldering pad 2. This reduces the risk of short circuits caused by solder paste flowing together in adjacent areas of the first soldering pad 1 and the second soldering pad 2 during subsequent hot air soldering. At the same time, it ensures the amount of solder paste in the first soldering part 11 and the second soldering part 21, ensuring the stability of the components soldered on them.

[0074] In some embodiments, to ensure the short-circuiting effect of the solder bridge connection in the pad structure, in addition to the distance between the first edge line 13 and the second edge line 23 being sufficiently close, the lengths of both the first edge line 13 and the second edge line 23 are sufficiently long; that is, the first edge line 13 is the longest side of the first connecting portion 12, and the second edge line 23 is the longest side of the second connecting portion 22. Alternatively, the first edge line 13 can be arranged parallel to and spaced apart from the second edge line 23 to ensure the distance between the first pad 1 and the second pad 2, facilitating short-circuiting.

[0075] Reference Figures 1-12 Both the first pad 1 and the second pad 2 are provided with drain holes 4. When there is too much solder paste on the first pad 1 or the second pad 2, the excess solder paste can flow down through the corresponding drain holes 4, thereby preventing the solder paste from flowing erratically and avoiding short circuits when soldering devices on the pad structure.

[0076] Optionally, the two holes 4 are respectively disposed at the first connecting portion 12 of the first pad 1 and the second connecting portion 22 of the second pad 2. Of course, the holes 4 in the first pad 1 can also be located between the first connecting portion 12 and the first soldering portion 11, and the holes 4 in the second pad 2 can also be located between the second connecting portion 22 and the second soldering portion 21.

[0077] Similarly, the orthographic projection shape of the via 4 is not limited in this embodiment. It can be adaptively adjusted according to the shape of the first pad 1 or the second pad 2. For example, the orthographic projection shape of the via 4 can be a rectangle, a circle, a parallelogram or other polygonal structure.

[0078] In summary, the pad structure provided in this application is simple, easy to manufacture, and low in cost. This pad structure can replace a zero-ohm resistor to achieve circuit continuity, and can also be used for component mounting and resistance value modification. It solves the cost waste caused by using zero-ohm resistors in existing pads, and addresses the problems of ordinary solder bridge pads being unable to solder components or change resistance values.

[0079] Second Embodiment

[0080] like Figures 1-13 As shown, this application embodiment also provides a circuit board 5, which includes a substrate 52 and a pad structure as described in the foregoing embodiment. At least one silkscreen area 51 is formed on the substrate 52, and at least one pad structure is provided, with each pad structure correspondingly disposed in each silkscreen area 51.

[0081] Third Embodiment

[0082] like Figures 1-14 As shown in the illustration, this application embodiment also provides a display panel, including:

[0083] It includes a display substrate 7, a backlight assembly 8, and a circuit board 5. The display substrate 7 is used to display images, and the circuit board 5 is electrically connected to the display substrate 7; wherein, the circuit board 5 is the circuit board 5 described in the above embodiment, and will not be described again here.

[0084] Specifically, the display panel 100 can be either an LED display panel 100 or an LCD display panel 100, whichever is required. The backlight assembly 8 includes light-emitting devices, which can be light-emitting field-effect transistors, light-emitting diodes, etc., arranged or set in a certain way. Combined with the light guide devices set in the backlight assembly 8, a relatively uniform backlight is generated under the action of the backlight signal, serving as the light source for the display device. The display substrate 7 may also include an array substrate, a color filter substrate, and a liquid crystal layer. The color filter substrate and the array substrate are arranged opposite to each other, and the liquid crystal layer is disposed between the color filter substrate and the array substrate. The array substrate can be divided into a display area and a non-display area. The array substrate includes: a substrate and a peripheral wiring layer, a color resist layer, and multiple spacers disposed on the substrate corresponding to the non-display area. The peripheral color resist layer is disposed on the substrate and includes multiple peripheral color resists. The peripheral wiring layer includes multiple peripheral wirings. The peripheral color resists and peripheral wirings do not coincide on the projection of the substrate. The multiple spacers are disposed on the multiple peripheral color resists.

[0085] Fourth embodiment

[0086] Reference Figure 15 This application also discloses an electronic device 200, which includes the circuit board 5 described above, and will not be repeated here.

[0087] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0088] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0089] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0090] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A pad structure, characterized in that, include: The first pad includes a first soldering portion and a first connecting portion connected together, wherein the first connecting portion has at least one first triangular region; as well as The second pad includes a second soldering portion and a second connecting portion connected together, wherein the second connecting portion has at least one second triangular region; The edge of the first pad near the edge of the second pad is a first edge line, and the edge of the second pad near the edge of the first pad is a second edge line. An electrical gap is formed between the first edge line and the second edge line, and the electrical gap extends in a straight line. One side of the first triangular region is the first edge line or a part of the first edge line, and one side of the second triangular region is the second edge line or a part of the second edge line.

2. The pad structure according to claim 1, characterized in that, The first welded part has a rectangular projection shape, and the first connecting part has a first triangular area. The projection shape of the first triangular area is a right triangle, one of the right-angled sides of the right triangle is collinear with one of the long sides of the rectangle, and the hypotenuse of the right triangle is the first edge line.

3. The pad structure according to claim 1, characterized in that, The first welded part has a rectangular projection shape, and the first connecting part has a trapezoidal projection shape. The upper base of the trapezoid is collinear with one of the long sides of the rectangle, and the lower base of the trapezoid is the first edge line.

4. The pad structure according to claim 3, characterized in that, The upper base of the trapezoid is part of the long side of the rectangle that is collinear with it; or, the upper base of the trapezoid is the long side of the rectangle that is collinear with it.

5. The pad structure according to claim 1, characterized in that, The first welded part has a rectangular projection shape, and the first connecting part includes a first triangular area and a first connecting area. The first triangular area has a triangular projection shape, one side of which is the first edge line. The first connecting area connects the first triangular area and the first welded part.

6. The pad structure according to any one of claims 1-5, characterized in that, Both the first pad and the second pad have vias.

7. The pad structure according to any one of claims 1-5, characterized in that, The first pad and the second pad are arranged symmetrically or centrally about the electrical clearance.

8. A circuit board, characterized in that, include: A substrate having at least one screen printing area formed thereon; The pad structure as described in any one of claims 1-7, wherein the pad structure is disposed within the silkscreen area.

9. A display panel, characterized in that, include: Display substrate, used to display images; as well as The circuit board as described in claim 8 is electrically connected to the display substrate.

10. An electronic device, characterized in that, Includes the circuit board as described in claim 8.

Images