Mounting structure for power supply chip

Abstract

The utility model provides an installation structure for a power supply chip, which relates to the technical field of power supply chip installation, and comprises a bottom plate, the outer wall of the upper end of the bottom plate is fixedly connected with a chip body, the outer walls of the two sides of the chip body are fixedly connected with pins, and the outer wall of the upper end of the chip body is connected with a heat conduction block. The outer wall of one side of the heat conduction block is fixedly connected with a heat conduction piece, the outer wall of the upper end of the bottom plate is fixedly connected with a limiting block, and a clamping groove is formed in the outer wall of one side of the limiting block. The utility model solves the problems that the design of an existing power supply chip installation heat dissipation path is not efficient enough, the heat dissipation efficiency is limited, heat generated by a chip cannot be quickly transmitted out due to the fact that a single radiator or a single heat dissipation sheet is directly contacted with the chip, and the chip lacks effective protection measures, so that the heat dissipation efficiency is poor. And the chip body is easily damaged by external dust, collision and other environmental factors.

Description

Technical Field

[0001] This utility model relates to the field of power chip mounting technology, and in particular to a mounting structure for power chips. Background Technology

[0002] Power supply chips are indispensable core components in electronic devices, widely used in communication equipment, industrial control, and consumer electronics. With the continuous increase in the functions and performance of electronic devices, the power consumption of power supply chips also increases, resulting in a large amount of heat generated during operation. If the heat dissipation performance of the power supply chip is insufficient, heat accumulation will directly affect the chip's stability and lifespan, and may even lead to performance degradation or equipment failure. Therefore, how to effectively dissipate heat from power supply chips has become a critical problem that urgently needs to be solved in the design of current electronic devices.

[0003] Existing power chip mounting structures generally suffer from deficiencies in heat dissipation and protection. On one hand, the heat dissipation path design is inefficient, often relying on a single heatsink or fin directly contacting the chip, resulting in limited heat dissipation efficiency and an inability to quickly transfer the heat generated by the chip. Especially in densely integrated electronic devices, poor heat dissipation can lead to thermal damage to the chip due to high temperatures, affecting the overall performance of the device. On the other hand, existing mounting structures also fall short in protecting the chip, lacking effective protective measures. The chip itself is susceptible to environmental factors such as dust and impacts, which can cause surface damage or even functional failure. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a mounting structure for power chips.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a mounting structure for a power chip, comprising: a base plate, a chip body fixedly connected to the upper outer wall of the base plate, pins fixedly connected to both outer walls of the chip body, a heat-conducting block connected to the upper outer wall of the chip body, a heat-conducting sheet fixedly connected to one outer wall of the heat-conducting block, a limiting block fixedly connected to the upper outer wall of the base plate, and a slot formed on one outer wall of the limiting block.

[0006] In a preferred embodiment, a cover plate is movably connected to the upper outer wall of the base plate, a heat dissipation plate is fixedly connected to the middle of the upper outer wall of the cover plate, heat dissipation holes are provided on the outer wall of the cover plate, and connecting grooves are provided on both outer walls of the cover plate. A partition plate is fixedly connected to one side of the inner wall of the cover plate, and mounting grooves are provided on both outer walls of the cover plate. A connecting shaft is movably connected to one side of the inner wall of the mounting groove, a locking block is fixedly connected to the outer wall of the connecting shaft, and a spring is fixedly connected to one side of the locking block.

[0007] In a preferred embodiment, the locking block is fixedly connected to the mounting groove on the outer wall of the base plate by a spring.

[0008] In a preferred embodiment, the outer wall of the cover plate is provided with a plurality of heat dissipation holes, and the plurality of heat dissipation holes are all connected to the cavity formed between the partition and the cover plate.

[0009] In a preferred embodiment, the lower end of a pin on one side of the chip body is connected to the upper end of the base plate.

[0010] In a preferred embodiment, the upper end of the chip body is connected to a plurality of heat-conducting blocks and heat-conducting sheets, and the upper end of the heat-conducting sheets is correspondingly connected to the lower end of a partition provided on one side of the inner wall of the cover plate.

[0011] In a preferred embodiment, the locking block connected to one side of the inner wall of the mounting groove via a connecting shaft engages with the locking groove on the outer wall of one side of the limiting block.

[0012] In a preferred embodiment, the pins on the outer walls of both sides of the chip body are connected to the connecting slots on the outer walls of both sides of the cover plate.

[0013] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0014] 1. In use, the heat block and heat-conducting sheet are made of materials with good thermal conductivity, which can quickly transfer the heat generated by the chip body during operation. The heat is conducted to the partition through the heat-conducting block and heat-conducting sheet, and then dissipated by the partition through the heat sink, forming an efficient heat conduction path. The heat dissipation holes on the outer wall of the cover plate further promote the air circulation in the inner cavity, accelerate heat dissipation, and improve heat dissipation efficiency.

[0015] 2. When in use, the cover plate covers the outside of the chip body, which can effectively protect the chip from damage caused by the external environment, such as dust and collisions, and extend the service life of the chip. The cover plate is fixed by the slot on one side of the locking block and the limiting block, ensuring that the chip body is stably protected during operation.

[0016] 3. When in use, the cover plate of this utility model not only has a protective function, but also integrates a heat sink and heat dissipation holes, which cleverly combines the functions of protection and heat dissipation, saves equipment space, and improves overall performance. The partition forms an inner cavity on the one hand, providing a heat dissipation air circulation channel, and on the other hand, it serves as a heat transfer path to optimize the heat dissipation effect. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the external structure of a mounting structure for a power chip provided by this utility model.

[0018] Figure 2This is a structural disassembly diagram of a power chip mounting structure provided by this utility model.

[0019] Figure 3 This is a partial structural diagram of a mounting structure for a power chip provided by this utility model.

[0020] Figure 4 This is a cross-sectional disassembly diagram of a power chip mounting structure provided by this utility model.

[0021] Legend:

[0022] 1. Base plate; 2. Chip body; 3. Pins; 4. Heat-conducting block; 5. Heat-conducting sheet; 6. Limiting block; 7. Slot; 8. Cover plate; 9. Heat sink; 10. Heat dissipation hole; 11. Connecting slot; 12. Partition plate; 13. Mounting slot; 14. Connecting shaft; 15. Locking block; 16. Spring. Detailed Implementation

[0023] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings and examples.

[0024] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0025] Furthermore, it should be understood in the description of this utility model that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two main bodies at the connection point are not connected through a transitional structure, but are simply connected to form a whole through a connecting structure. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0027] In this utility model, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] Example 1: As Figure 1-3 As shown, this utility model provides a technical solution: a mounting structure for a power chip, comprising: a base plate 1, a chip body 2 fixedly connected to the upper outer wall of the base plate 1, pins 3 fixedly connected to both outer walls of the chip body 2, the lower end of the pin 3 on one side of the chip body 2 connected to the upper end of the base plate 1, a heat-conducting block 4 connected to the upper outer wall of the chip body 2, a heat-conducting sheet 5 fixedly connected to one outer wall of the heat-conducting block 4, a limiting block 6 fixedly connected to the upper outer wall of the base plate 1, and a slot 7 formed on one outer wall of the limiting block 6.

[0029] In this embodiment, a base plate 1 is designed, and a chip body 2 is welded to the upper end of the base plate 1. Five pins 3 are fixedly connected to both sides of the chip body 2, and the five pins 3 on both sides of the chip body 2 can be connected to the upper end of the base plate 1. Therefore, the pins 3 can connect the internal circuit of the chip body 2 with the external circuit to enable operation. A heat-conducting sheet 5 is fixedly connected to the upper outer wall of the chip body 2 through a heat-conducting block 4. Several heat-conducting blocks 4 and heat-conducting sheets 5 are provided as a group, and both heat-conducting blocks 4 and heat-conducting sheets 5 are made of materials with good thermal conductivity. The heat-conducting sheet 5 has a certain elasticity and can be bent and rebound. A limiting block 6 is fixedly connected to each of the four corners of the base plate 1, and a slot 7 is opened on one side of the outer wall of the limiting block 6.

[0030] Example 2: Figure 1-4As shown, a cover plate 8 is movably connected to the upper outer wall of the base plate 1. A heat sink 9 is fixedly connected to the middle of the upper outer wall of the cover plate 8. Heat dissipation holes 10 are provided on the outer wall of the cover plate 8. Connecting slots 11 are provided on both sides of the outer wall of the cover plate 8. The pins 3 on both sides of the outer wall of the chip body 2 are correspondingly connected to the connecting slots 11 on both sides of the outer wall of the cover plate 8. A partition 12 is fixedly connected to one side of the inner wall of the cover plate 8. Several heat-conducting blocks 4 and heat-conducting sheets 5 are connected to the upper end of the chip body 2. The upper end of the heat-conducting sheet 5 is correspondingly connected to the lower end of the partition 12 on one side of the inner wall of the cover plate 8. Heat dissipation holes 10 are provided on the outer wall of the cover plate 8. There are several heat dissipation holes 10, and each of the several heat dissipation holes 10 is connected to the cavity formed between the partition plate 12 and the cover plate 8. The outer walls on both sides of the cover plate 8 are provided with mounting grooves 13. A connecting shaft 14 is movably connected to one side of the inner wall of the mounting groove 13. A locking block 15 is fixedly connected to the outer wall of the connecting shaft 14. The locking block 15 connected to the inner wall of the mounting groove 13 via the connecting shaft 14 engages with the locking groove 7 opened on one side of the outer wall of the limiting block 6. A spring 16 is fixedly connected to one side of the locking block 15. The locking block 15 is fixedly connected to the mounting groove 13 opened on the outer wall of the base plate 1 via the spring 16.

[0031] In this embodiment, a cover plate 8 is provided on the upper outer wall of the base plate 1, and a heat sink 9 is fixedly connected to the middle of the cover plate 8. A partition 12 is fixedly connected to one side of the inner wall of the cover plate 8, forming an inner cavity between the cover plate 8 and the partition 12. Several heat dissipation holes 10 are provided on the side wall of the inner cavity. A heat-conducting block 4 and a heat-conducting sheet 5 are provided on the upper outer wall of the chip body 2. The heat-conducting sheet 5 can be connected to the lower end of the partition 12. Therefore, the heat generated by the chip body 2 during operation can be conducted to the partition 12 through the heat-conducting block 4 and the heat-conducting sheet 5. At this time, the partition 12 will dissipate the heat through the heat sink 9. The heat dissipation holes 10 on the outer wall of the cover plate 8 can accelerate the air circulation in the inner cavity between the partition 12 and the cover plate 8, thereby accelerating the heat dissipation. The cover plate 8 is located on the upper outer wall of the chip body 2, so the cover plate 8 can protect the chip body 2. However, the cover plate 8 will wear out after long-term use and needs to be replaced. Therefore, two mounting slots 13 are provided on both sides of the cover plate 8. A locking block 15 is connected to one side of the inner wall of the two mounting slots 13 via a connecting shaft 14. One side of the locking block 15 is fixedly connected to one side of the inner wall of the mounting slot 13 via a spring 16. The locking block 15 can engage with the locking groove 7 provided on the outer wall of the limiting block 6. When the locking block 15 is connected to the base plate 1, it will squeeze the heat-conducting sheet 5. The heat-conducting sheet 5 will bend due to the pressure of the partition 12 provided on one side of the inner wall of the cover plate 8. Thus, when the locking block 15 is pressed, the locking block 15 will squeeze the spring 16. At this time, the locking block 15 will retract into the mounting slot 13 and leave the limiting block 6 and the locking groove 7. At this time, the cover plate 8 will be ejected upward by the reaction force of the heat-conducting sheet 5, so that the cover plate 8 can be replaced. Conversely, the cover plate 8 can be fixed to the base plate 1 by the engagement of the locking block 15 and the locking groove 7, thereby protecting the chip body 2.

[0032] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples; under the concept of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in the details for the sake of brevity.

[0033] This utility model is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A mounting structure for a power chip, comprising a base plate (1), characterized in that: The chip body (2) is fixedly connected to the upper outer wall of the base plate (1). Pins (3) are fixedly connected to both outer walls of the chip body (2). A heat-conducting block (4) is connected to the upper outer wall of the chip body (2). A heat-conducting sheet (5) is fixedly connected to one outer wall of the heat-conducting block (4). A limit block (6) is fixedly connected to the upper outer wall of the base plate (1). A slot (7) is opened on one outer wall of the limit block (6).

2. The mounting structure for a power chip according to claim 1, characterized in that: A cover plate (8) is movably connected to the upper outer wall of the base plate (1). A heat dissipation plate (9) is fixedly connected to the middle of the upper outer wall of the cover plate (8). A heat dissipation hole (10) is opened on the outer wall of the cover plate (8). A connecting groove (11) is opened on both sides of the outer wall of the cover plate (8). A partition plate (12) is fixedly connected to one side of the inner wall of the cover plate (8). An installation groove (13) is opened on both sides of the outer wall of the cover plate (8). A connecting shaft (14) is movably connected to one side of the inner wall of the installation groove (13). A locking block (15) is fixedly connected to the outer wall of the connecting shaft (14). A spring (16) is fixedly connected to one side of the locking block (15).

3. The mounting structure for a power chip according to claim 2, characterized in that: The card block (15) is fixedly connected to the mounting groove (13) opened on the outer wall of the base plate (1) by a spring (16).

4. The mounting structure for a power chip according to claim 2, characterized in that: The outer wall of the cover plate (8) is provided with a number of heat dissipation holes (10), and the number of heat dissipation holes (10) are all connected to the cavity formed between the partition plate (12) and the cover plate (8).

5. The mounting structure for a power chip according to claim 1, characterized in that: The lower end of the pin (3) on one side of the chip body (2) is connected to the upper end of the base plate (1).

6. The mounting structure for a power chip according to claim 2, characterized in that: The upper end of the chip body (2) is connected to several heat-conducting blocks (4) and heat-conducting sheets (5), and the upper end of the heat-conducting sheet (5) is correspondingly connected to the lower end of the partition (12) provided on one side of the inner wall of the cover plate (8).

7. The mounting structure for a power chip according to claim 2, characterized in that: The locking block (15) connected to one side of the inner wall of the mounting groove (13) via the connecting shaft (14) engages with the locking groove (7) opened on the outer wall of one side of the limiting block (6).

8. The mounting structure for a power chip according to claim 2, characterized in that: The pins (3) on both sides of the outer wall of the chip body (2) are connected to the connecting slots (11) on both sides of the outer wall of the cover plate (8).

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