Capacitor bank and busbar packaging structure
By combining a silicone-encapsulated magnetic ring and a magnetic core into a bus structure, the problem of difficult soldering of Ceralink capacitors to traditional copper busbars is solved, achieving efficient and safe capacitor bank and bus encapsulation, and improving filtering performance.
Patent Information
- Application Number
- CN202520099277.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-16
AI Technical Summary
In existing technologies, Ceralink capacitors are difficult to weld to traditional copper busbars, and the solder joints have poor reliability, which affects packaging efficiency and safety.
A bus structure with a fixed magnetic ring encapsulated in silicone is used. Combined with a magnetic core and PCB board, a soldering station is formed by electroplating and electrically connected to the copper busbar. EMC filtering performance is integrated to achieve the encapsulation of multi-layer components.
It improves packaging efficiency and safety, enhances soldering reliability, eliminates the need for an external EMC filter, and improves filtering performance.
Smart Images
Figure CN223844016U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic device construction and design technology, and in particular to a packaging structure for capacitor banks and busbars. Background Technology
[0002] The core of an electric vehicle is its three-electric system: battery, motor, and controller. Capacitors are crucial components in both the motor and controller, primarily functioning to filter and smooth signals.
[0003] Currently, film capacitors are widely used in the automotive field, but their poor current handling capacity and large size limit their application and hinder industry development. Ceralink capacitors are also used for filtering and smoothing, and compared to film capacitors, they have stronger overcurrent capacity, higher temperature resistance, and higher power density. However, due to the small size and large number of Ceralink capacitors, directly connecting them to traditional copper busbars using conventional soldering would cause soldering difficulties and poor solder joint reliability, seriously affecting packaging efficiency and reducing safety in use.
[0004] Therefore, it is necessary to invent a capacitor bank and bus package structure to solve the above problems. Utility Model Content
[0005] (a) Technical problems to be solved
[0006] The purpose of this invention is to provide a packaging structure for capacitor banks and busbars, which solves the problems of difficult soldering and poor solder joint reliability mentioned in the background art, which seriously affect packaging efficiency and reduce safety in use.
[0007] (II) Technical Solution
[0008] To achieve the above objectives, this utility model provides the following technical solution: a capacitor bank and busbar encapsulation structure, including a Ceralink component, a busbar component welded to the bottom surface of the Ceralink component, slots formed on both sides of the surface of the busbar component, and a magnetic ring fixed inside the slots by silicone encapsulation. The busbar component includes a positive copper busbar, a negative copper busbar, a double-sided PCB board, and insulating material. The double-sided PCB board is welded to the surface of the Ceralink component, an insulating material is installed on one side of the double-sided PCB board, a negative copper busbar is installed on the bottom surface of the insulating material, and a positive copper busbar is installed on the top surface of the insulating material.
[0009] As a further embodiment of this utility model, the bottom surface of the magnetic ring is welded to the upper half of the magnetic core, and the bottom surface of the upper half of the magnetic core is fixedly connected to two sets of silicone plates. The silicone plates serve to connect the upper half and the lower half of the magnetic core.
[0010] As a further embodiment of this utility model, the bottom surfaces of the two sets of silicone plates are fixedly connected to the lower half of the magnetic core, which is fixedly connected to the inside of the slot. The slot serves to install the lower half of the magnetic core.
[0011] As a further embodiment of this utility model, a busbar is welded to the bottom surface of the Ceralink component. The surface of the busbar has two sets of grounding holes, and the busbar serves as a mounting device.
[0012] As a further embodiment of this utility model, polarized holes are provided on both sides of the grounding hole, one set of which is a negative polarized hole and the other set of which is a positive polarized hole. The grounding hole serves to install a Y capacitor.
[0013] As a further embodiment of this utility model, the surface of the busbar is electroplated to form a welding station, and a Y capacitor is welded to the surface of the busbar. The Y capacitor enables the surface-mount capacitor group to integrate EMC filtering performance.
[0014] As a further embodiment of this utility model, the busbar plate has two sets of magnetic core mounting and positioning holes on its surface, and two sets of production positioning holes on both sides of its surface. The production positioning holes serve to fix the device in place.
[0015] (III) Beneficial Effects
[0016] This utility model provides a packaging structure for a capacitor bank and a bus, which has the following advantages:
[0017] The packaging structure of this capacitor bank and bus involves a stamping process to bond multiple layers of PCB material, insulating material, and positive and negative copper busbars together. Electroplating then forms electrode solder joints on the PCB assembly. Finally, the Ceralink capacitors are soldered onto the bus assembly. Additionally, an EMC filter is added to the DC input terminal of the embedded copper busbar on the PCB. This method not only solves the packaging problem of the Ceralink capacitors but also eliminates the space required for traditional external EMC filters, improving filtering performance. This packaging solution allows multiple small components to be assembled into a single large device for use in power circuits, representing a revolutionary design that disrupts industry norms in the automotive field. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the busbar assembly structure of this utility model;
[0020] Figure 3 This is a schematic diagram of the recirculation plate structure of this utility model;
[0021] Figure 4 This is a schematic diagram of the magnetic core structure of this utility model;
[0022] Figure 5 This is a schematic diagram of the Y-capacitor structure of this utility model.
[0023] In the diagram: 100, Ceralink component; 200, busbar assembly; 21, positive copper busbar; 22, negative copper busbar; 23, double-sided PCB board; 24, insulating material; 300, magnetic ring; 3001, upper half of magnetic core; 3002, silicone plate; 3003, lower half of magnetic core; 400, Y capacitor; 500, busbar board; 600, grounding hole; 700, polarity hole; 800, soldering station; 900, magnetic core mounting positioning hole; 901, production positioning hole. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.
[0025] Please see Figures 1 to 5 This utility model provides a technical solution: a capacitor bank and bus package structure, including a Ceralink component 100, a bus component 200 welded to the bottom surface of the Ceralink component 100, slots on both sides of the surface of the bus component 200, and a magnetic ring 300 fixed inside the slots by silicone encapsulation. The bus component 200 includes a positive copper busbar 21, a negative copper busbar 22, a double-sided PCB board 23, and an insulating material 24. The double-sided PCB board 23 is welded to the surface of the Ceralink component 100, an insulating material 24 is installed on one side of the double-sided PCB board 23, a negative copper busbar 22 is installed on the bottom surface of the insulating material 24, and a positive copper busbar 21 is installed on the top surface of the insulating material 24.
[0026] The bottom surface of the magnetic ring 300 is welded to the upper half of the magnetic core 3001. Two sets of silicone plates 3002 are fixedly connected to the bottom surface of the upper half of the magnetic core 3001. The silicone plates 3002 serve to connect the upper half of the magnetic core 3001 and the lower half of the magnetic core 3003.
[0027] The bottom surfaces of the two sets of silicone plates 3002 are fixedly connected to the lower half of the magnetic core 3003. The lower half of the magnetic core 3003 is fixedly connected to the inside of the slot. The slot serves to install the lower half of the magnetic core 3003.
[0028] A busbar 500 is welded to the bottom surface of the Ceralink component 100. Two sets of grounding holes 600 are opened on the surface of the busbar 500. The busbar 500 serves as a place for the device.
[0029] The grounding hole 600 has polarized holes 700 on both sides. One set of polarized holes 700 is negative and the other set is positive. The grounding hole 600 serves to install the Y capacitor 400.
[0030] The surface of the busbar 500 is electroplated to form a welding station 800. Y capacitors 400 are welded to the surface of the busbar 500. The Y capacitors 400 are used to integrate the EMC filtering performance of the chip capacitor group.
[0031] The busbar 500 has two sets of magnetic core mounting and positioning holes 900 on its surface, and two sets of production positioning holes 901 on both sides of its surface. The production positioning holes 901 are used to fix the device.
[0032] In this invention, the working steps of the device are as follows:
[0033] The first step: The internal arrangement of the busbar assembly 200 is achieved by pressing together three layers of insulating material 24, negative copper busbar 22 and positive copper busbar 21. The thickness of the internal insulating material 24 is selected to be 0.3mm or more to meet the voltage withstand capability.
[0034] The second step: The busbar 500 is internally perforated and then electroplated with copper foil to form an electrical connection with the positive and negative copper busbar components;
[0035] Third step: The surface of the busbar 500 is electroplated to form a welding platform 800, which is connected to the electroplated hole below to realize the electrical connection of the positive and negative copper busbars.
[0036] Step 4: The soldering stations 800 on the busbar 500 are arranged in a positive-negative-negative-positive pattern to increase soldering insulation and improve the space utilization of Ceralink capacitor layout;
[0037] Step 5: The bus assembly 200 uses a two-layer PCB. The upper copper foil is designed as a soldering station to connect with the capacitor body. The lower copper foil is designed as ground. The simultaneous presence of copper foil on both sides reduces the occurrence of PCB warpage.
[0038] Step 6: The lower surface copper foil is designed as ground for grounding. This forms a parasitic Y capacitance of 400Ω with the positive and negative terminals, achieving a pF level and enhancing the product's filtering function.
[0039] Step 7: The back of the busbar 500 is drilled with a magnetic core mounting and positioning hole 900 to integrate the magnetic core into the component, increasing product integration and filtering performance, while also facilitating production and installation;
[0040] Step 8: The Y capacitor 400 is placed in front of the busbar 500 to effectively absorb the stray current caused by the switch.
[0041] Step 9: Highly integrated layout design scheme for surface mount capacitors and EMC components;
[0042] Step 10: Make positioning process holes on the PCB board / copper busbar to locate the relative positions.
[0043] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.
[0044] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.
[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A capacitor bank and bus package structure, including a Ceralink component (100), characterized in that: The bottom surface of the Ceralink component (100) is welded to a bus assembly (200). The bus assembly (200) has slots on both sides of its surface, and a magnetic ring (300) is fixed inside the slots by silicone encapsulation. The bus assembly (200) includes a positive copper busbar (21), a negative copper busbar (22), a double-sided PCB board (23), and an insulating material (24). The double-sided PCB board (23) is soldered to the surface of the Ceralink assembly (100). An insulating material (24) is installed on one side of the double-sided PCB board (23). A negative copper busbar (22) is installed on the bottom surface of the insulating material (24), and a positive copper busbar (21) is installed on the top surface of the insulating material (24).
2. The capacitor bank and bus packaging structure according to claim 1, characterized in that: The bottom surface of the magnetic ring (300) is welded to the upper half of the magnetic core (3001), and the bottom surface of the upper half of the magnetic core (3001) is fixedly connected to two sets of silicone plates (3002).
3. The capacitor bank and bus packaging structure according to claim 2, characterized in that: The bottom surfaces of the two sets of silicone plates (3002) are fixedly connected to the lower half of the magnetic core (3003), which is fixedly connected to the inside of the slot.
4. The capacitor bank and bus packaging structure according to claim 1, characterized in that: The bottom surface of the Ceralink component (100) is welded to a busbar (500), and the surface of the busbar (500) has two sets of grounding holes (600).
5. The capacitor bank and bus packaging structure according to claim 4, characterized in that: The grounding hole (600) has polar holes (700) on both sides, one set of polar holes (700) being negative polar holes and the other set of polar holes (700) being positive polar holes.
6. The capacitor bank and bus packaging structure according to claim 4, characterized in that: The surface of the busbar (500) is formed by electroplating to form a welding station (800), and a Y capacitor (400) is welded to the surface of the busbar (500).
7. The capacitor bank and bus packaging structure according to claim 4, characterized in that: The busbar (500) has two sets of magnetic core mounting and positioning holes (900) on its surface, and two sets of production positioning holes (901) are provided on both sides of the surface of the busbar (500).