Light-emitting device, lamp panel and display device

Abstract

The embodiment of the utility model discloses a light-emitting device, a lamp panel and a display device. In one embodiment, a light emitting device includes a package carrier; the driving chip is arranged on the packaging carrier plate, and the packaging carrier plate is electrically connected with the driving chip; the middle carrier plate is arranged on one side, far away from the packaging carrier plate, of the driving chip; the light source chip is arranged on one side, far away from the packaging carrier plate, of the middle carrier plate, and the light source chip is electrically connected with the driving chip through the middle carrier plate; the light emitting structure layer surrounds the driving chip, the middle carrier plate and the light source chip; the light emitting structure layer comprises a first light emitting structure layer, the first light emitting structure layer comprises a plurality of sub-film layers which are arranged in a stacked mode, and the refractive index of the sub-film layer close to the light source chip is larger than that of the sub-film layer away from the light source chip. According to the embodiment, the total reflection and internal reflection loss of the light source chip can be greatly reduced, the emergent angle of emergent light of the light source chip is increased, and the light emitting efficiency of the light source chip is improved.

Description

Technical Field

[0001] This utility model relates to the field of display technology. More specifically, it relates to a light-emitting device, a lamp panel, and a display apparatus. Background Technology

[0002] Currently, in liquid crystal display technologies, especially in Mini LED technologies, there are problems such as large total internal reflection and internal reflection losses of the light source chip, small emission angle of the emitted light from the light source chip, and low light extraction efficiency of the light source chip. Utility Model Content

[0003] The purpose of this invention is to provide a light-emitting device, a lamp board, and a display device to solve at least one of the problems existing in the prior art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] The first aspect of this utility model provides a light-emitting device, including a packaging substrate;

[0006] The driver chip is disposed on the packaging substrate, and the packaging substrate is electrically connected to the driver chip;

[0007] An intermediate carrier board disposed on the side of the driver chip away from the packaging carrier board;

[0008] A light source chip is disposed on the side of the intermediate carrier plate away from the packaging carrier plate, and the light source chip is electrically connected to the driving chip through the intermediate carrier plate;

[0009] A light-emitting structure layer surrounding the driver chip, the intermediate carrier board, and the light source chip;

[0010] The light-emitting structure layer includes a first light-emitting structure layer, which includes a plurality of sub-film layers stacked together, wherein the refractive index of the sub-film layers closer to the light source chip is greater than the refractive index of the sub-film layers farther away from the light source chip.

[0011] Optionally, the light-emitting structure layer further includes an optical structure layer for reflecting the light emitted from the light source chip;

[0012] The optical structure layer surrounds the driving chip, and the optical structure layer has an opening that exposes the light source chip;

[0013] The first light-emitting structure layer surrounds the intermediate carrier and the light source chip.

[0014] Optionally, the cross-sectional width of the opening gradually increases along a first direction, where the first direction is the direction from the encapsulation carrier to the intermediate carrier.

[0015] Optionally, the light-emitting device further includes a coating layer surrounding the light-emitting structural layer.

[0016] Optionally, the refractive index of the coating layer is less than the refractive index of the sub-film layer.

[0017] Optionally, the light-emitting device further includes a protective layer surrounding the coating layer.

[0018] Optionally, the hardness of the protective layer is greater than the hardness of the covering layer.

[0019] Optionally, the packaging substrate has pads on the side away from the driver chip.

[0020] The second aspect of this utility model provides a lamp board, including a plurality of light-emitting devices arranged in an array.

[0021] The third aspect of this utility model provides a display device, including the aforementioned lamp panel.

[0022] The beneficial effects of this utility model are as follows:

[0023] The technical solution described in this utility model, by setting the first light-emitting structure layer to include multiple sub-film layers stacked together, wherein the refractive index of the sub-film layer closer to the light source chip is greater than the refractive index of the sub-film layer farther away from the light source chip, can greatly reduce the total internal reflection and internal reflection losses of the light source chip, increase the emission angle of the light emitted from the light source chip, and improve the light-emitting efficiency of the light source chip. Attached Figure Description

[0024] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0025] Figure 1 This diagram illustrates the structure of a light-emitting device provided in one embodiment of the present invention.

[0026] Figures 2 to 9 This diagram illustrates the fabrication process of a light-emitting device according to an embodiment of the present invention.

[0027] Figure 10 A schematic diagram of the structure of a light-emitting device provided in another embodiment of the present invention is shown.

[0028] Figures 11 to 19 This diagram illustrates the fabrication process of a light-emitting device according to another embodiment of the present invention.

[0029] Figure 20 A schematic diagram of the structure of a lamp panel provided in one embodiment of the present invention is shown.

[0030] Figure 21A schematic diagram of the structure of a lamp panel provided in another embodiment of the present invention is shown. Detailed Implementation

[0031] The terms “on…”, “formed on…”, and “set on…” used in this invention can indicate that one layer is directly formed or set on another layer, or that one layer is indirectly formed or set on another layer, meaning that there are other layers between the two layers.

[0032] It should be noted that although the terms "first," "second," etc., may be used herein to describe various components, members, elements, regions, layers, and / or parts, these components, members, elements, regions, layers, and / or parts should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer, and / or part from another. Thus, for example, the first component, first member, first element, first region, first layer, and / or first part discussed below may be referred to as the second component, second member, second element, second region, second layer, and / or second part without departing from the teachings of this utility model.

[0033] In this invention, unless otherwise stated, the term "co-layer arrangement" refers to two layers, components, members, elements, or portions that can be formed by the same fabrication process (e.g., patterning process), and that these two layers, components, members, elements, or portions are generally formed of the same material. For example, co-layer arrangement of two or more functional layers means that these co-layer functional layers can be formed using the same material layer and the same fabrication process, thereby simplifying the fabrication process of the display substrate.

[0034] In this invention, unless otherwise stated, the term "patterning process" generally includes steps such as photoresist coating, exposure, development, etching, and photoresist stripping. The term "one-step patterning process" refers to a process of forming patterned layers, components, or parts using a single photomask.

[0035] With the increasing maturity of flat panel display technology, the display device industry is developing towards higher resolution, curved surfaces, ultra-thin designs, high dynamic range imaging, high contrast, and wide color gamut. Taking LCD technology in flat panel displays as an example, direct-lit backlight modules are widely used in large-size LCD devices, and the core component of a direct-lit backlight module is the Mini-LED lamp board. Currently, Mini-LED lamp boards, combined with local dimming technology, enable each area to be independently switched on or have its brightness adjusted, allowing for more precise control of the brightness and darkness of each light-emitting area of ​​the backlight module. This results in more distinct brightness and darkness levels in the image, enhancing the user's visual experience, and leading to its widespread application in the display technology field.

[0036] However, the following problems often exist in the related technologies of Mini-LED light panels:

[0037] 1. In Mini-LED light boards, the light source chip and driver chip are arranged on the same plane on the circuit board, which results in a larger Mini-LED light board size, a lower density of light source chips per unit area, and lower light output brightness.

[0038] 2. In a Mini-LED light board, each driver chip is connected to a large number of light source chips through the circuit on the circuit board. The distance between multiple light source chips varies greatly, which can easily cause RC delay problems and affect the light output effect.

[0039] 3. In Mini-LED light panels, as the number of local dimming zones increases, complex planar circuits need to be set up in the circuit board to allow each driver chip to connect to a large number of light source chips at the same time. This makes the circuit board manufacturing difficult and greatly increases the cost of Mini-LED light panels.

[0040] Although stacking the light source chip and the driver chip to set up the light-emitting device can solve the above problems to some extent, there are still problems in the related technology, such as large total internal reflection and internal reflection losses of the light source chip, small emission angle of the light emitted by the light source chip, and low light extraction efficiency of the light source chip.

[0041] In view of this, one embodiment of the present invention provides a light-emitting device, including a packaging substrate; a driving chip disposed on the packaging substrate, the packaging substrate being electrically connected to the driving chip; an intermediate substrate disposed on the driving chip on a side away from the packaging substrate; a light source chip disposed on the intermediate substrate on a side away from the packaging substrate, the light source chip being electrically connected to the driving chip through the intermediate substrate; and a light-emitting structure layer surrounding the driving chip, the intermediate substrate, and the light source chip; the light-emitting structure layer includes a first light-emitting structure layer, the first light-emitting structure layer including a plurality of sub-film layers stacked together, the refractive index of the sub-film layers closer to the light source chip being greater than the refractive index of the sub-film layers farther from the light source chip.

[0042] In a specific example, such as Figure 1As shown, the light-emitting device includes a packaging substrate 10; a driving chip 11 disposed on the packaging substrate 10, and the packaging substrate 10 and the driving chip 11 are electrically connected; an intermediate substrate 12 disposed on the driving chip 11 on the side away from the packaging substrate 10; a light source chip 13 disposed on the intermediate substrate 12 on the side away from the packaging substrate 10, and the light source chip 13 is electrically connected to the driving chip 11 through the intermediate substrate 12; a light-emitting structure layer surrounding the driving chip 11, the intermediate substrate 12 and the light source chip 13; the light-emitting structure layer includes a first light-emitting structure layer 14, the first light-emitting structure layer 14 including a plurality of sub-film layers stacked together, the refractive index of the sub-film layers closer to the light source chip 13 is greater than the refractive index of the sub-film layers farther from the light source chip 13.

[0043] Furthermore, such as Figure 1 As shown, the multiple sub-film layers include a first sub-film layer 141, a second sub-film layer 142, and a third sub-film layer 143; the refractive index of the multiple sub-film layers gradually decreases in the light emission direction of the light source chip 13, for example, the refractive index of the third sub-film layer 143 is less than the refractive index of the second sub-film layer 142; the refractive index of the second sub-film layer 142 is less than the refractive index of the first sub-film layer 141.

[0044] This embodiment sets the first light-emitting structure layer to include multiple sub-film layers stacked together. The refractive index of the sub-film layer closer to the light source chip is greater than that of the sub-film layer farther away from the light source chip, thereby greatly reducing the total internal reflection and internal reflection losses of the light source chip, increasing the emission angle of the light emitted from the light source chip, and improving the light-emitting efficiency of the light source chip.

[0045] In a specific example, such as Figures 2 to 9 As shown, a method for fabricating a light-emitting device is explained in detail, including:

[0046] Step S01-1: As Figure 2 As shown, a packaging carrier board 10 is provided;

[0047] Step S01-2: As Figure 3 As shown, a plurality of driver chips 11 are arranged in an array on the packaging substrate 10, and each driver chip 11 is electrically connected to the packaging substrate 10.

[0048] Step S01-3: As Figure 4 As shown, an intermediate carrier board 12 is formed on each driver chip 11, and the intermediate carrier board 12 is electrically connected to the driver chip 11.

[0049] Step S01-4: As Figure 5 As shown, a light source chip 13 is formed on each intermediate carrier board 12, and the light source chip 13 is electrically connected to the intermediate carrier board 12, and then the light source chip 13 is electrically connected to the driver chip 11.

[0050] Step S01-5: As Figure 6 As shown, a light-emitting structure layer 140 is formed on the packaging substrate 10, and the light-emitting structure layer 140 covers each driver chip 11 and each light source chip 12.

[0051] Step S01-6: As Figure 7 As shown, the light-emitting structure layer 140 is patterned to form a plurality of spaced first light-emitting structure layers 14; wherein each first light-emitting structure layer 14 covers a light source chip 13 and a driver chip 11.

[0052] For example, such as Figure 7 As shown, a patterned first light-emitting structure layer 14 can be formed by etching or cutting away part of the light-emitting structure layer 140.

[0053] For example, such as Figure 7 As shown, the material of the first light-emitting structure layer 14 can be silicone.

[0054] For example, such as Figure 7 As shown, the first light-emitting structure layer 14 includes multiple sub-film layers, which may include a first sub-film layer 141, a second sub-film layer 142, and a third sub-film layer 143; the first sub-film layer 141 is a high-refractive-index silicone resin layer with a phenyl content greater than 50%; the second sub-film layer 142 is a medium-refractive-index silicone resin layer with a phenyl content less than 40%; and the third sub-film layer 143 is a low-refractive-index silicone resin layer based on methacrylate.

[0055] Step S01-7: As Figure 8 As shown, a cladding layer 15 is formed around each first light-emitting structure layer 14; for example, an etching process is used to form a one-to-one cladding layer 15 around each first light-emitting structure layer 14.

[0056] For example, such as Figure 8 As shown, the material of the coating layer 15 can be transparent resin;

[0057] Steps S01-8: As Figure 9 As shown, a protective layer 16 is formed around the outer periphery of the coating layer 15; for example, an etching process is used to form a one-to-one corresponding protective layer 16 around the outer periphery of the coating layer 15; wherein, the hardness of the protective layer 16 is greater than the hardness of the coating layer 15.

[0058] Steps S01-9: As Figure 1 As shown, the packaging substrate 10 is cut to form multiple light-emitting devices, which are integrated optical drive LED beads.

[0059] The light-emitting structure layer in this embodiment may include multiple sub-film layers, and the refractive index of each sub-film layer gradually decreases in the light-emitting direction of the light source chip to form a "gradient" internal structure with decreasing refractive index. This greatly reduces the total internal reflection and internal reflection losses of the light source chip, increases the emission angle of the emitted light from the light source chip, and improves the light-emitting efficiency of the light source chip.

[0060] In one possible implementation, the light-emitting structure layer further includes an optical structure layer for reflecting light emitted from the light source chip; the optical structure layer surrounds the driving chip and has an opening that exposes the light source chip; the first light-emitting structure layer surrounds the intermediate carrier and the light source chip.

[0061] In a specific example, such as Figure 10 As shown, the light-emitting device includes a packaging substrate 100; a driving chip 101 disposed on the packaging substrate 100, the packaging substrate 100 being electrically connected to the driving chip 101; an intermediate substrate 102 disposed on the driving chip 101 on the side away from the packaging substrate 100; a light source chip 104 disposed on the intermediate substrate 102 on the side away from the packaging substrate 100, the light source chip 104 being electrically connected to the driving chip 101 through the intermediate substrate 102; and a light-emitting structure layer surrounding the driving chip 101, the intermediate substrate 102, and the light source chip 104; the light-emitting structure layer includes a first light-emitting structure layer 105, the first light-emitting structure layer 105 including a plurality of sub-film layers stacked together, the refractive index of the sub-film layers closer to the light source chip 104 being greater than the refractive index of the sub-film layers farther from the light source chip 104.

[0062] Furthermore, such as Figure 10 As shown, the multiple sub-film layers include a first sub-film layer 1051, a second sub-film layer 1052, and a third sub-film layer 1053; the refractive index of the multiple sub-film layers gradually decreases in the light emission direction of the light source chip 104, for example, the refractive index of the third sub-film layer 1053 is less than the refractive index of the second sub-film layer 1052; the refractive index of the second sub-film layer 1052 is less than the refractive index of the first sub-film layer 1051.

[0063] Furthermore, such as Figure 10 As shown, the light-emitting structure layer also includes an optical structure layer 103 for reflecting light emitted from the light source chip 104; the optical structure layer 103 surrounds the driving chip 101, and the optical structure layer 103 has an opening 1031 that exposes the light source chip 104; the first light-emitting structure layer 105 surrounds the intermediate carrier plate 102 and the light source chip 104.

[0064] In this embodiment, the light-emitting structure layer also includes an optical structure layer for reflecting the light emitted by the light source chip. This allows the light emitted by the light source chip to be emitted in the light-emitting structure layer and then projected toward the light-emitting surface, thereby improving the light-emitting efficiency of the light source chip to a certain extent.

[0065] In another specific example, such as Figures 11 to 19 As shown, another method for fabricating light-emitting devices is explained in detail, which includes:

[0066] Step S11-1: As Figure 11 As shown, a packaging carrier board 100 is provided;

[0067] Step S11-2: As Figure 12 As shown, a plurality of driver chips 101 are arranged in an array on the packaging substrate 100, and each driver chip 101 is electrically connected to the packaging substrate 100.

[0068] Step S11-3: As Figure 13 As shown, an intermediate carrier board 102 is formed on each driver chip 101, so that the intermediate carrier board 102 is electrically connected to the driver chip 101.

[0069] Step S11-4: As Figure 14 As shown, a first optical layer is formed on the packaging substrate 100, and the first optical layer is patterned to form a plurality of spaced optical structure layers 103.

[0070] For example, such as Figure 14 As shown, the optical structure layer 103 has reflective properties; the material of the optical structure layer 103 can be mirror aluminum or saturated polymer material commonly known as chlorinated polyethylene (PEC).

[0071] For example, such as Figure 14 As shown, the optical structure layer 103 is formed by injection molding.

[0072] For example, such as Figure 14 As shown, each optical structure layer 103 in the plurality of spaced optical structures can be formed in the following manner:

[0073] Step S11-41: First, form a bottom-layer optical structure around the driver chip 101;

[0074] Step S11-42: Place a mold on the driver chip 101. The cross-sectional shape of the mold is an inverted trapezoid.

[0075] Step S11-43: A top-layer optical structure is formed on the periphery of the mold, and the bottom-layer optical structure and the top-layer optical structure together form the optical structure layer 103;

[0076] Step S11-5: As Figure 15 As shown, a light source chip 104 is formed on each driver chip 101;

[0077] Step S11-6: As Figure 16 As shown, a light-emitting structure layer 150 is formed on the packaging substrate 100, and the light-emitting structure layer 150 covers each light source chip 104.

[0078] For example, such as Figure 16 As shown, the material of the light-emitting structure layer 150 can be silicone.

[0079] Step S11-7: As Figure 17 As shown, the light-emitting structure layer 150 is patterned to form a plurality of spaced first light-emitting structure layers 105; wherein each first light-emitting structure layer 105 covers a light source chip 104.

[0080] For example, such as Figure 17 As shown, the first light-emitting structure layer 105 includes multiple sub-film layers, which may include a first sub-film layer 1051, a second sub-film layer 1052, and a third sub-film layer 1053; the first sub-film layer 1051 is a high-refractive-index silicone layer made of silicone resin with a phenyl content greater than 50%; the second sub-film layer 1052 is a medium-refractive-index silicone layer with a phenyl content less than 40%; and the third sub-film layer 1053 is a low-refractive-index silicone layer made of methacrylate.

[0081] Step S11-8: As Figure 18 As shown, a cladding layer 106 is formed around each first light-emitting structure layer 105; wherein the refractive index of the cladding layer 106 is different from the refractive index of the first light-emitting structure layer 105.

[0082] For example, such as Figure 18 As shown, the material of the coating layer 106 can be a transparent resin;

[0083] Step S11-9: As Figure 19 As shown, a protective layer 107 is formed around the outer periphery of the covering layer 106; wherein the hardness of the protective layer 107 is greater than the hardness of the covering layer 106.

[0084] Steps S11-10: As Figure 10 As shown, the packaging substrate 100 is cut to form multiple light-emitting devices; the light-emitting devices are integrated optical drive lamp beads.

[0085] In one possible implementation, the cross-sectional width of the opening gradually increases along a first direction, which is the direction from the packaging carrier to the intermediate carrier.

[0086] In a specific example, such as Figure 10 As shown, the cross-sectional width of the opening 1031 gradually increases along the first direction X, where the first direction X is the direction from the encapsulation carrier 100 to the intermediate carrier 102.

[0087] In this embodiment, the optical structure layer covers the sidewall of the driver chip, and the optical structure layer has an opening that exposes the top surface of the driver chip. The cross-sectional width of the opening gradually increases in the light emission direction, so as to utilize the sidewall of the optical structure layer to form a total reflection angle, thereby improving the light extraction efficiency and the light emission efficiency of the light source chip.

[0088] In one possible implementation, the light-emitting device further includes a cladding layer surrounding the light-emitting structural layer.

[0089] In a specific example, such as Figure 1 As shown, the light-emitting device also includes a covering layer 15 surrounding the light-emitting structure layer.

[0090] In another specific example, such as Figure 10 As shown, the light-emitting device also includes a covering layer 106 surrounding the light-emitting structure layer.

[0091] In this embodiment, by setting a coating layer to surround the light-emitting structure layer, and taking advantage of the difference between the refractive index of the coating layer and the refractive index of the light-emitting structure layer (for example, the refractive index of the coating layer is less than that of the light-emitting structure layer), the light extraction efficiency of the light source chip can be further improved.

[0092] In one possible implementation, the refractive index of the coating layer is less than the refractive index of the sub-film layer.

[0093] In a specific example, such as Figure 1 As shown, the refractive index of the coating layer 15 is less than that of the sub-film layer.

[0094] In another specific example, such as Figure 10 As shown, the refractive index of the coating layer 106 is less than that of the sub-film layer.

[0095] This embodiment uses a coating layer with a refractive index lower than that of the sub-film layer to form a "gradient" internal structure with decreasing refractive index, thereby further reducing the total internal reflection and internal reflection losses of the light source chip, further increasing the emission angle of the emitted light from the light source chip, and further improving the light extraction efficiency of the light source chip.

[0096] In one possible implementation, the light-emitting device further includes a protective layer surrounding the coating layer.

[0097] In a specific example, such as Figure 1 As shown, the light-emitting device also includes a protective layer 16 surrounding the covering layer 15.

[0098] Furthermore, such as Figure 1 As shown, the protective layer 16 is partially transparent, and the material of the protective layer 16 is a combination of reflective ink and diffuse particles.

[0099] In another specific example, such as Figure 10 As shown, the light-emitting device also includes a protective layer 107 surrounding the covering layer 106.

[0100] Furthermore, such as Figure 10 As shown, the protective layer 107 is partially transparent, and the material of the protective layer 107 is a combination of reflective ink and diffuse particles.

[0101] This embodiment sets up a protective layer to surround the coating layer, thereby increasing the light emission angle through diffuse reflection of the protective layer, which in turn increases the emission angle of the light emitted from the light source chip, and further improves the light emission efficiency of the light source chip.

[0102] In one possible implementation, the hardness of the protective layer is greater than the hardness of the covering layer.

[0103] In a specific example, such as Figure 1 As shown, the hardness of the protective layer 16 is greater than that of the covering layer 15.

[0104] In another specific example, such as Figure 10 As shown, the hardness of the protective layer 107 is greater than that of the covering layer 106.

[0105] This embodiment improves the mechanical strength of the light-emitting device by setting the hardness of the protective layer to be greater than that of the coating layer, thus effectively protecting the internal structure of the light-emitting device from easy damage.

[0106] In one possible implementation, the side of the packaging substrate away from the driver chip is provided with pads.

[0107] In a specific example, such as Figure 1 As shown, a pad 110 is provided on the side of the packaging substrate 10 away from the driver chip 11.

[0108] Furthermore, such as Figure 1 As shown, a first pad 111 is also provided on the side of the packaging substrate 10 near the driver chip 11. The driver chip 11 is electrically connected to the first pad 111, for example, the driver chip 11 and the first pad 111 are soldered with solder paste.

[0109] In another specific example, such as Figure 10 As shown, a pad 1100 is provided on the side of the packaging substrate 100 away from the driver chip 101.

[0110] Furthermore, such as Figure 10 As shown, a first pad 1111 is also provided on the side of the packaging substrate 100 near the driver chip 101. The driver chip 101 is electrically connected to the first pad 1111. For example, the driver chip 101 and the first pad 1111 are soldered with solder paste.

[0111] In this embodiment, a solder pad is provided on the side of the packaging substrate away from the driver chip. Solder paste is applied to the solder pad to achieve an electrical connection between the light-emitting device and the circuit board, which simplifies the production process, improves production efficiency, and saves production costs.

[0112] In a specific example, such as Figure 1 As shown, the encapsulation carrier 10 adopts a flexible substrate, and the substrate material can be an organic polymer or a thin and tough glass substrate.

[0113] In another specific example, such as Figure 10 As shown, the encapsulation carrier 100 adopts a flexible substrate, and the substrate material can be an organic polymer or a thin and tough glass substrate.

[0114] It should be noted that this embodiment can also be applied to innovative designs of MicroLED + flexible substrate.

[0115] Another embodiment of this utility model provides a lamp board, including a plurality of light-emitting devices arranged in an array.

[0116] In a specific example, such as Figure 20 As shown, the lamp panel includes multiple light-emitting devices arranged in an array and a circuit board 17.

[0117] In a specific example, a method for preparing a lamp panel is explained in detail, including:

[0118] Step S01: As Figures 1 to 9 As shown, multiple light-emitting devices are prepared; wherein, the specific steps of step S01 include steps S01-1 to S01-9, the light-emitting device is an integrated optical drive lamp bead, and the integrated optical drive lamp bead includes a stacked packaging substrate 10, a driver chip 11 and a light source chip 13.

[0119] Step S02: As Figure 20 As shown, a circuit board 17 is provided, on which a plurality of light-emitting devices are arranged in an array; wherein, the light source chip 13 is disposed on the side of the driver chip 11 away from the circuit board 17.

[0120] In another specific example, such as Figure 21 As shown, the lamp board includes multiple light-emitting devices arranged in an array and a circuit board 108.

[0121] In another specific example, a detailed explanation of a different method for preparing a lamp panel is provided, which includes:

[0122] Step S11: As Figures 11 to 19As shown, multiple light-emitting devices are prepared; wherein, the specific steps of step S11 include steps S11-1 to S01-10, the light-emitting device is an integrated optical drive lamp bead, and the integrated optical drive lamp bead includes a stacked packaging substrate 100, a driver chip 101 and a light source chip 104.

[0123] Step S12: As Figure 21 As shown, a circuit board 108 is provided, on which a plurality of light-emitting devices are arranged in an array; wherein, the light source chip 104 is disposed on the side of the driver chip 101 away from the circuit board 108.

[0124] In a specific example, the light panel uses high-efficiency power control to achieve one light per zone, with each light being independently controlled without affecting the brightness of other lights.

[0125] In a specific example, multiple light-emitting devices are arranged in an array on a circuit board to form multiple partitions, and the circuit board drives multiple light-emitting devices in at least one partition.

[0126] Furthermore, the circuit board has a circuit structure. Multiple light-emitting devices are arranged in an array on the circuit board. For example, the light-emitting devices are connected to the circuit structure of the driving carrier circuit board through a packaging substrate.

[0127] Furthermore, Mini LED local dimming zoning is a local dimming technology used in direct-lit backlighting of televisions. In related technologies, a controller, multiple driver chips, and multiple light source chips are horizontally arranged on a circuit board. The controller needs to electrically connect to multiple driver chips through planar circuit wiring on the circuit board, and the controller also needs to electrically connect to multiple light source chips through planar circuit wiring on the circuit board. Each driver chip also needs to electrically connect to multiple light source chips through planar circuit wiring on the circuit board. As the number of local dimming zones increases, the complexity of manufacturing the planar circuit wiring on the circuit board increases exponentially, resulting in difficulties in circuit board manufacturing and excessively high costs.

[0128] In this embodiment, only planar circuit wiring connecting the controller and each light-emitting device needs to be set on the circuit board. Specifically, only planar circuit wiring connecting the controller and each packaging carrier board needs to be set on the circuit board, which can greatly reduce the wiring difficulty and manufacturing cost of the circuit board.

[0129] This embodiment can reduce the size of the Mini-LED light board or increase the density of light source chips per unit area, thereby improving the light output brightness; effectively improve the resistor-capacitor delay problem and enhance the light output effect of the light board; reduce the difficulty of circuit board manufacturing; and improve the light output efficiency.

[0130] Another embodiment of this utility model provides a display device, including the aforementioned lamp panel.

[0131] In a specific example, the display device is a liquid crystal display (LCD), and the lamp panel can be used as a backlight module in the liquid crystal display.

[0132] Furthermore, the display device also includes a cover plate, which can be located on the side of the lamp board away from the circuit board, that is, on the light-emitting side of the lamp board. Furthermore, the cover plate is a light-transmitting cover plate, and the material of the cover plate includes glass, polyethylene terephthalate, polyimide, etc.

[0133] Furthermore, the display device also includes a display panel disposed between the lamp panel and the cover plate. Of course, in other embodiments of this application, the display device can also be a direct-view display device. In this case, the lamp panel can directly serve as a display panel capable of displaying multiple colors, and the lamp panel includes light source chips with multiple luminous colors.

[0134] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.

Claims

1. A light-emitting device, characterized in that, Including the packaging substrate; The driver chip is disposed on the packaging substrate, and the packaging substrate is electrically connected to the driver chip; An intermediate carrier board disposed on the side of the driver chip away from the packaging carrier board; A light source chip is disposed on the side of the intermediate carrier plate away from the packaging carrier plate, and the light source chip is electrically connected to the driving chip through the intermediate carrier plate; A light-emitting structure layer surrounding the driver chip, the intermediate carrier board, and the light source chip; The light-emitting structure layer includes a first light-emitting structure layer, which includes a plurality of sub-film layers stacked together, wherein the refractive index of the sub-film layers closer to the light source chip is greater than the refractive index of the sub-film layers farther away from the light source chip.

2. The light-emitting device according to claim 1, characterized in that, The light-emitting structure layer also includes an optical structure layer for reflecting the light emitted by the light source chip; The optical structure layer surrounds the driving chip, and the optical structure layer has an opening that exposes the light source chip; The first light-emitting structure layer surrounds the intermediate carrier and the light source chip.

3. The light-emitting device according to claim 2, characterized in that, The cross-sectional width of the opening gradually increases along a first direction, which is the direction from the packaging carrier plate to the intermediate carrier plate.

4. The light-emitting device according to claim 1 or 2, characterized in that, The light-emitting device also includes a coating layer surrounding the light-emitting structural layer.

5. The light-emitting device according to claim 4, characterized in that, The refractive index of the coating layer is less than that of the sub-film layer.

6. The light-emitting device according to claim 4, characterized in that, The light-emitting device also includes a protective layer surrounding the coating layer.

7. The light-emitting device according to claim 6, characterized in that, The hardness of the protective layer is greater than that of the covering layer.

8. The light-emitting device according to claim 1, characterized in that, The packaging substrate has pads on the side away from the driver chip.

9. A light panel, characterized in that, It includes a plurality of light-emitting devices arranged in an array as described in any one of claims 1 to 8.

10. A display device, characterized in that, Includes the lamp panel as described in claim 9.

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