Structure compatible with blue film feeding and carrier tape feeding simultaneously

Abstract

The utility model discloses a structure compatible with feeding of a blue film and a carrier tape simultaneously, which comprises a matching guide rail installed on a die bonder, and the matching guide rail, a first XY mobile platform and a second XY mobile platform are located at the same horizontal position; a carrier tape feeding feeder is arranged on the top of the second XY moving platform in a sliding mode, and a plurality of carrier tape waste discharging pipelines are arranged on the side, close to the ejector pin mechanism, of the top of the carrier tape feeding feeder. According to the structure compatible with blue film feeding and carrier tape feeding simultaneously, the feeding structure is installed on the die bonders, a client can freely switch feeding modes according to actual production requirements, the number of the die bonders for blue film feeding and the number of the die bonders for carrier tape feeding are different for existing diversified products, the number of the die bonders for blue film feeding and the number of the die bonders for carrier tape feeding are different, and the production efficiency is improved. In the prior art, equipment configurations required for connection of different products are often different, the feeding structure can meet any use requirements of customers, and die bonders with different feeding structures are required in the past, so that the use production area and the equipment investment cost are increased.

Description

Technical Field

[0001] This utility model relates to the technical field of chip die bonding processing, specifically a structure that is compatible with both blue film and carrier tape feeding. Background Technology

[0002] With the acceleration of domestic substitution of semiconductor chips, the requirements for chip bonding equipment are becoming increasingly higher, and the functional requirements are also becoming more demanding. When processing chips, a feeding mechanism is needed for auxiliary processing.

[0003] Existing loading mechanisms sometimes pick up pads or chips from the blue film with orientations significantly different from those required for subsequent soldering, increasing the complexity of the soldering station or alignment station. To address this deficiency, a COC blue film loading mechanism disclosed in existing technology (application number CN202222358982.4, publication date 2023-01-03) can be referenced. This loading mechanism uses X-axis and Y-axis modules to enable the blue film carrier plate to move the blue film rapidly along the X-axis or Y-axis; the reciprocating rotation of the motor shaft drives the synchronous pulley to reciprocate, and the reciprocating rotation of the synchronous pulley drives the associated synchronous belt and carrier clamping frame to reciprocate as well, thereby ensuring that the chips or pads on the blue film are aligned at a fixed point. This mechanism has a simple structure, ensures the basic accuracy of the orientation of the chips or pads on the blue film, and simplifies the subsequent orientation correction process.

[0004] Although the aforementioned feeding mechanism can achieve the corrective effect, it still has certain shortcomings in use. The existing feeding structure only has one feeding mode and is installed on different equipment, which requires greater investment from the customer end to meet production needs.

[0005] Therefore, we proposed a structure that is compatible with both blue film and carrier tape feeding, which can effectively solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a structure that is compatible with both blue film and carrier tape feeding, in order to solve the problem that the feeding structures currently available on the market, as mentioned in the background art, only have one feeding mode and are installed on different devices, which requires greater investment from the customer end to meet production needs.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a structure that simultaneously supports blue film and carrier tape feeding, comprising a guide rail mounted on a die bonder, wherein the guide rail, a first XY moving platform, and a second XY moving platform are at the same horizontal position; a set of ejector pin mechanisms are slidably arranged on the outer side of the guide rail, a blue film feeding assembly is slidably arranged on the top position of the first XY moving platform, a carrier tape feeding feeder is slidably arranged on the top position of the second XY moving platform, and a plurality of carrier tape waste discharge pipes are arranged on the side of the top of the carrier tape feeding feeder near the ejector pin mechanisms.

[0008] As a preferred technical solution of this application, the ejector mechanism includes a manual slide table slidably disposed on the top of the mating guide rail. A vacuum adsorption solenoid valve with its output end facing upward is provided on one side of the top of the manual slide table. A drive motor is installed at the rear top of the manual slide table. The output end of the drive motor extends into the interior of the manual slide table and is connected to the center of the eccentric wheel. The outer edge of the eccentric wheel is attached to the bottom of the ejector assembly.

[0009] As a preferred technical solution of this application, the outer side of the ejector pin assembly extends outward from the top outer side of the manual slide. The ejector pin assembly forms an elastic back-and-forth movement structure with the inside of the manual slide through an eccentric wheel. When the ejector pin assembly pierces the blue film upward and ejects the chip, the chip and the blue film are separated.

[0010] As a preferred technical solution of this application, both the first XY moving platform and the blue film feeding component are driven by form, and the moving range of both the first XY moving platform and the second XY moving platform is greater than the size of the ejector pin mechanism, thereby facilitating the positional movement of the first XY moving platform and the second XY moving platform.

[0011] As a preferred technical solution of this application, the interior of the blue film feeding assembly includes a blue film clamping fixture that is slidably disposed on the top of the first XY moving platform, and a 6-inch blue film ring is also engaged at the upper end of the blue film feeding assembly, which facilitates the feeding of the blue film.

[0012] As a preferred technical solution of this application, the blue film clamping fixture contains a blue film inside, and an elastic bonding block is provided on one side of the blue film clamping fixture. The outer side of the elastic bonding block is bonded to the side of the 6-inch ring of the blue film to achieve the limiting treatment of the blue film. The elastic block can be bonded to one side of the 6-inch ring of the blue film.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This structure is compatible with both blue film and carrier tape feeding. The feeding structure is installed on the die bonder, and customers can switch the feeding mode at will according to actual production needs. With the current diversity of products, the number of die bonders for blue film feeding and the number of die bonders for carrier tape feeding are also different. Often, the equipment configuration required for different product lines is different. This feeding structure can meet any needs of customers. In the past, die bonders with different feeding structures needed to be purchased according to the actual number of machines, thereby increasing the production area and equipment investment costs.

[0014] 1. A ejector pin mechanism is provided. By adjusting the position of the ejector pin mechanism, the positions of the drive motor, eccentric wheel and ejector pin assembly can be adjusted. In conjunction with the position of the first XY moving platform, the ejector pin assembly can be moved to pierce the blue film and eject the chip, thus separating the chip from the blue film.

[0015] 2. A blue film clamping fixture is set up. The elastic bonding block set on the top of the blue film clamping fixture limits the side of the 6-inch blue film ring, which can achieve the purpose of stabilizing and limiting the 6-inch blue film ring.

[0016] 3. A carrier tape waste discharge pipe is set up. The carrier tape feeder feeds the material through a set step distance. After the current chip is taken away, the carrier tape feeder moves forward. When the material on the carrier tape is used up or a chip of a different specification needs to be replaced, it is moved by the second XY moving platform. In addition, a carrier tape waste discharge pipe is set up to process the excess waste material. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the working state of the ejector pin assembly and the carrier belt feeder of this utility model;

[0019] Figure 3 This is a schematic diagram showing the working state of the ejector pin assembly and the blue film feeding assembly of this utility model;

[0020] Figure 4 This is a schematic diagram of the main structure of the ejector pin assembly of this utility model;

[0021] Figure 5 This is a schematic diagram of the main structure of the blue film feeding assembly of this utility model;

[0022] Figure 6 This is a schematic diagram of the main structure of the carrier belt feeding feeder of this utility model.

[0023] In the diagram: 1. Guide rail; 2. Ejector pin mechanism; 201. Manual slide table; 202. Vacuum adsorption solenoid valve; 203. Drive motor; 204. Eccentric wheel; 205. Ejector pin assembly; 3. First XY moving platform; 4. Blue film feeding assembly; 401. Blue film clamping fixture; 402. 6-inch blue film ring; 5. Second XY moving platform; 6. Carrier belt feeding feeder; 7. Carrier belt waste discharge pipe. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1-6 The present invention provides the following technical solution:

[0026] Example 1

[0027] For easier carrier belt loading, please refer to the attached document. Figure 1 Appendix Figure 2 and attached Figure 6 The assembly includes a guide rail 1 mounted on a die bonder, with the guide rail 1, the first XY moving platform 3, and the second XY moving platform 5 all at the same horizontal level. A set of ejector pin mechanisms 2 are slidably arranged on the outer side of the guide rail 1. A blue film feeding assembly 4 is slidably arranged on the top position of the first XY moving platform 3. A carrier tape feeding feeder 6 is slidably arranged on the top position of the second XY moving platform 5. Several sets of carrier tape waste discharge pipes 7 are arranged on the top side of the carrier tape feeding feeder 6 near the ejector pin mechanism 2. The first XY moving platform 3 and the blue film feeding assembly 4 are both driven by a mechanism, and the movement range of the first XY moving platform 3 and the second XY moving platform 5 is greater than the size of the ejector pin mechanism 2.

[0028] When the ejector pin mechanism 2 is in the avoidance position, the carrier belt is installed on top of the carrier belt feeding feeder 6. The feeder 6 feeds the material according to the set step distance. After the previous chip is taken away, the feeder will send the carrier belt forward. When the material on the carrier belt is used up or a chip of a different specification needs to be replaced, the XY platform moves, thereby achieving the purpose of feeding. The purpose of carrier belt feeding can be achieved through the above settings.

[0029] Example 2

[0030] For easier handling of blue screen compatibility issues, please refer to the attached document. Figure 1 and attached Figure 3 -Appendix Figure 5The ejector mechanism 2 includes a manual slide 201 slidably mounted on the top of the mating guide rail 1. A vacuum adsorption solenoid valve 202 with its output end facing upwards is located on one side of the top of the manual slide 201. A drive motor 203 is mounted on the rear side of the top of the manual slide 201, with its output end extending into the interior of the manual slide 201 and connected to the center of an eccentric wheel 204. The outer edge of the eccentric wheel 204 is attached to the bottom of the ejector assembly 205. The outer side of the ejector assembly 205 extends out of the manual slide 201. At the top outer position, the ejector pin assembly 205 forms an elastic back-and-forth movement structure with the inside of the manual slide table 201 via the eccentric wheel 204; the interior of the blue film feeding assembly 4 includes a blue film clamping fixture 401 slidably disposed on the top of the first XY moving platform 3, and a blue film 6-inch ring 402 is also engaged at the upper end of the blue film feeding assembly 4; the blue film is placed inside the blue film clamping fixture 401, and an elastic bonding block is provided on one side of the blue film clamping fixture 401, with the outer side of the elastic bonding block abutting the side of the blue film 6-inch ring 402 to achieve the limiting treatment of the blue film.

[0031] First, the 6-inch blue film ring 402 needs to be fixed. The elastic fitting block set on the top of the blue film clamping fixture 401 limits the blue film ring 402, so that the blue film ring 402 is fixed on the blue film clamping fixture 401. The first XY moving platform 3 moves to position each chip. The vacuum adsorption solenoid valve 202 set above the manual slide 201 can adsorb the blue film inside the blue film ring 402 through vacuum. By activating the drive motor 203 on one side of the manual slide 201, the output end of the drive motor 203 can drive the eccentric wheel 204. The ejector pin assembly 205 can slide inside the manual slide 201 through the outer edge of the eccentric wheel 204, so that the ejector pin assembly 205 pierces the blue film upward and ejects the chip, separating the chip from the blue film. After the current chip is removed, the next chip is automatically positioned.

Claims

1. A structure that is compatible with both blue film and carrier tape feeding, comprising a guide rail (1) mounted on a die bonder, wherein the guide rail (1), the first XY moving platform (3) and the second XY moving platform (5) are at the same horizontal position; Its characteristics are: A set of ejector pin mechanisms (2) is slidably arranged on the outer side of the guide rail (1), a blue film feeding assembly (4) is slidably arranged on the top position of the first XY moving platform (3), a carrier belt feeding feeder (6) is slidably arranged on the top position of the second XY moving platform (5), and several sets of carrier belt waste discharge pipes (7) are arranged on the side of the top of the carrier belt feeding feeder (6) near the ejector pin mechanism (2).

2. The structure according to claim 1, which is compatible with both blue film and carrier tape feeding, is characterized in that: The ejector mechanism (2) includes a manual slide (201) slidably mounted on the top of the mating guide rail (1). A vacuum adsorption solenoid valve (202) with its output end facing upward is provided on one side of the top of the manual slide (201). A drive motor (203) is installed on the rear side of the top of the manual slide (201). The output end of the drive motor (203) extends into the interior of the manual slide (201), and the output end of the drive motor (203) is connected to the center of the eccentric wheel (204). The outer edge of the eccentric wheel (204) is attached to the bottom of the ejector assembly (205).

3. The structure according to claim 2 that simultaneously supports blue film and carrier tape feeding, characterized in that: The outer side of the ejector pin assembly (205) extends outward from the top outer side of the manual slide (201), and the ejector pin assembly (205) forms an elastic back-and-forth movement structure with the interior of the manual slide (201) through the eccentric wheel (204).

4. The structure according to claim 1 that simultaneously supports blue film and carrier tape feeding, characterized in that: The first XY moving platform (3) and the blue film feeding component (4) are both driven by form, and the moving range of the first XY moving platform (3) and the second XY moving platform (5) is greater than the size of the ejector pin mechanism (2).

5. The structure according to claim 1 that simultaneously supports blue film and carrier tape feeding, characterized in that: The interior of the blue film feeding assembly (4) includes a blue film clamping fixture (401) that is slidably disposed on the top of the first XY moving platform (3), and a blue film 6-inch ring (402) is also engaged at the upper end of the blue film feeding assembly (4).

6. The structure according to claim 5 that simultaneously supports blue film and carrier tape feeding, characterized in that: The blue film clamping fixture (401) contains a blue film inside, and an elastic bonding block is provided on one side of the blue film clamping fixture (401). The outer side of the elastic bonding block is attached to the side of the 6-inch ring (402) of the blue film to achieve the limiting treatment of the blue film.

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