Packaging substrate processing system

Abstract

The utility model discloses a packaging substrate processing system, which is used for processing a packaging substrate and comprises a dust-free room, the conveying device is used for guiding the packaging substrate into the dust-free chamber from the inlet of the dust-free chamber; each air plate is mounted at an inlet of the dust-free room, and the air plates are arranged right above the conveying device at intervals in the transmission direction of the conveying device; the air blower is communicated with the air plates, so that air in the dust-free chamber is blown to the packaging substrate just entering the inlet of the dust-free chamber through the air plates; and the filtering device is connected between the air blower and each air plate. According to the packaging substrate processing system provided by the utility model, the packaging substrate is pressed by utilizing airflow, extra mechanical stress cannot be applied to the packaging substrate, and the packaging substrate is prevented from being bent or damaged.

Description

Technical Field

[0001] This utility model relates to the field of packaging substrate processing technology, and specifically to a packaging substrate processing system. Background Technology

[0002] With the further development of packaging substrate technology, when the total thickness of the packaging substrate is less than 1mm or even lower, the rigidity of the packaging substrate will also decrease.

[0003] In the prior art, those skilled in the art have found that packaging substrates with thinner thickness or lower rigidity may malfunction when entering the cleanroom entrance. Utility Model Content

[0004] Based on the inventive discovery of this utility model, the reasons for the failure of thinner packaging substrates passing through the cleanroom entrance are roughly as follows:

[0005] 1. The environmental pressure in the cleanroom differs from that outside the cleanroom, which may cause deformation forces on the packaging substrate, causing the packaging substrate to warp and further preventing the packaging substrate from entering the cleanroom.

[0006] 2. Commonly used structures or components for fixed packaging substrate transfer, such as vacuum chucks, grippers, or rollers used for pressing and guiding, are generally limited by the size of the mechanism and are not convenient to be installed in the wall section where the packaging substrate enters the cleanroom.

[0007] To overcome the above shortcomings, this utility model provides a packaging substrate processing system.

[0008] This utility model discloses a packaging substrate processing system for processing packaging substrates, including:

[0009] A cleanroom having an entrance;

[0010] A conveying device for introducing the packaging substrate from the entrance of the cleanroom into the cleanroom;

[0011] Several air deflectors are provided, each of which is installed at the entrance outside the wall section of the cleanroom. The air deflectors are arranged at intervals above the conveying device along the transmission direction of the conveying device. The air outlets of all the air deflectors are arranged in parallel. The air deflectors can cover the area where the encapsulation substrate passes through the conveying device.

[0012] A blower, which is connected to the air vanes, is used to blow the gas in the cleanroom through each of the air vanes toward the encapsulation substrate that just enters the cleanroom entrance.

[0013] A filter device is connected between the blower and each of the air vanes.

[0014] Furthermore, the conveying device is a roller or a conveyor belt.

[0015] Furthermore, the wind vane is provided with rotating shafts at both ends, and the wind vane can adjust its angle with the rotating shaft as the rotation center. The range of the rotation angle of the wind vane is 0-30°.

[0016] Furthermore, the blower is installed outside the cleanroom, and the inlet pipe of the blower is connected to the cleanroom.

[0017] Furthermore, the inner diameter of the air outlet of the air vane is 3mm.

[0018] Furthermore, the frequency adjustment range of the blower is 0-50Hz, and the air pressure range is 0.1-0.5Mpa.

[0019] Furthermore, the filtration accuracy of the filtration device is 0.3 μm.

[0020] The beneficial effects of this utility model are as follows:

[0021] (1) The packaging substrate is pressed by airflow to prevent it from bending and warping. No additional mechanical stress is applied to the packaging substrate, thus avoiding damage and material deformation.

[0022] (2) Compared with other systems used for packaging substrate processing, such as vacuum suction cups, the air plate has greater versatility and can be applied to packaging substrates of different thicknesses and materials without causing negative impacts.

[0023] (3) The packaging substrate processing system effectively improves the on-site working conditions and solves the problem of reduced passability on the production line caused by the bending of the packaging substrate, thereby improving the stability and operating efficiency of the production line. Attached Figure Description

[0024] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of this invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely schematic to aid in understanding the invention and do not specifically limit the shapes and proportions of the components. Those skilled in the art, under the guidance of this invention, can select various possible shapes and proportions to implement this invention according to specific circumstances. In the drawings:

[0025] Figure 1 This is a schematic diagram of the packaging substrate processing system described in this utility model;

[0026] Figure 2This is a schematic diagram of the wind vane structure described in this utility model;

[0027] Figure 3 This is a schematic diagram of the packaging substrate transfer according to the present invention.

[0028] In the diagram: 1. Cleanroom; 2. Packaging substrate; 3. Conveying device; 4. Air vane; 41. Rotating shaft; 5. Blower; 6. Filtering device. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-3 The present invention will be further illustrated by the following specific embodiments.

[0030] In the description of this utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The implementation methods of this utility model will now be described based on its overall structure.

[0031] Currently, when conveying the packaging substrate 2 into the cleanroom 1, on the one hand, the reduced overall thickness of the packaging substrate 2 results in poor rigidity; on the other hand, the pressure difference between the inside and outside of the cleanroom 1 (generally, the cleanroom 1 has a positive pressure, with the indoor pressure greater than the outdoor pressure) causes the packaging substrate 2 to experience a significant outward pushing force on the side about to enter the cleanroom 1, easily leading to bending at the entrance of the cleanroom 1. Existing devices used to prevent bending of the packaging substrate 2, such as air-floating platforms or vacuum suction cups, are difficult to install in the wall penetration section of the cleanroom 1. Therefore, this utility model discloses a packaging substrate processing system and operating method to solve one or more of the above-mentioned problems.

[0032] like Figure 1 and Figure 3 As shown, this utility model discloses a packaging substrate processing system. The device is installed at the entrance of a cleanroom 1 for conveying packaging substrates 2, and includes:

[0033] Conveying device 3, the conveying device 3 being used to convey the packaging substrate 2;

[0034] Several air baffles 4 are installed at the entrance of the cleanroom 1, and the several air baffles 4 are arranged parallel to each other above the conveying device 3 along the transmission direction of the conveying device 3.

[0035] Blower 5, which is connected to the air deflector 4;

[0036] A filter device 6 is connected between the blower 5 and the air deflector 4.

[0037] Using the above structure, the packaging substrate 2 is placed on the conveying device 3 and transported to the cleanroom 1 via the conveying device 3. An air deflector 4 is installed at the entrance of the cleanroom 1, with the air outlet of the air deflector 4 facing the conveying device 3. Several air deflectors 4 can be installed and arranged at intervals directly above the conveying device 3 to ensure that the air outlet of the air deflector 4 faces the packaging substrate 2. The blower 5 is connected to the air deflector 4 and transmits the air in the cleanroom 1 to the air deflector 4 after being processed by the filter device 6. The airflow blows from top to bottom through the air deflector 4, acting on the surface of the packaging substrate 2 and pressing down the warped packaging substrate 2, so that the packaging substrate 2 remains flat on the conveying device 3 and can be smoothly conveyed into the cleanroom 1, improving the passability of the packaging substrate 2, thereby improving production efficiency and product quality.

[0038] like Figure 2 As shown, in this embodiment, the air deflector 4 is installed at the entrance of the wall-penetrating section of the cleanroom 1. The encapsulation substrate 2 enters the cleanroom 1 from this point. The air deflector 4 can cover the area where the encapsulation substrate 2 passes through the conveying device 3. In addition, the air deflector 4 is equipped with rotating shafts 41 at both ends, which are rotatably connected to the top of the conveying device 3 through brackets. The air deflector 4 can adjust its angle with the rotating shafts 41 as the rotation center, so that the air outlet of the air deflector 4 is aligned with the bent encapsulation substrate 2. The adjustment range of the air deflector 4 is between 0-30°, ensuring that the airflow of the air deflector 4 can cover the area where the encapsulation substrate 2 passes.

[0039] In this embodiment, the conveying device 3 can be a roller or a conveyor belt. When the air plate 4 is working, the airflow allows the packaging substrate 2 to be flatly attached to the surface of the conveying device 3, such as... Figure 3 As shown, taking the roller as an example, the packaging substrate is placed on the conveying device 3, the angle of the air plate 4 is adjusted, and the packaging substrate 2 is pressed by the airflow, so that the packaging substrate 2 enters the clean room.

[0040] In this embodiment, the blower 5 is installed outside the cleanroom 1, using the ambient air inside the cleanroom 1 as the air source for the air deflector 4. Clean air reduces contamination of the packaging substrate 2. The air pressure of the air deflector 4 can be controlled by adjusting the frequency of the blower 5. The frequency of the blower 5 is adjusted according to the thickness of the packaging substrate 2 to ensure that the packaging substrate 2 is pressed evenly. The adjustable frequency range of the blower 5 is 0-50Hz, and the air pressure range is 0.1-0.5MPa.

[0041] In this embodiment, the air plate 4 uses the air in the cleanroom 1 as the air source. The air in the cleanroom 1 is delivered to the air plate 4 by the blower 5. Small-diameter air outlets are arranged at intervals on the surface of the air plate 4. The inner diameter of each air outlet is 3mm. The small-diameter air outlets ensure smooth airflow and prevent excessive local air pressure when pressing the packaging substrate 2, which could damage the packaging substrate 2.

[0042] In this embodiment, the filter device 6 is connected between the blower 5 and the air plate 4. The filter device 6 has a filtration accuracy of 0.3μm, which prevents solid particles in the air from being conveyed from the blower 5 to the air plate 4 and adhering to the packaging substrate 2, thus preventing contamination of the packaging substrate 2.

[0043] The method of using the packaging substrate processing system described in this utility model is as follows: Utility Model

[0044] Step 1: Install the air plate 4. Install the air plate 4 at the entrance of the wall section of the clean room 1. Set the air plate 4 parallel to the conveying device 3 to ensure that the air plate 4 can press the packaging substrate 2 so that the packaging substrate 2 is flat and attached to the conveying device 3.

[0045] Step 2: Clean the air outlet of the air outlet of the air outlet and check whether the air outlet of the air outlet of the air outlet is normal to ensure that the air outlet of the air outlet can output air normally.

[0046] Step 3: Connect the air source, turn on the blower 5, and send the air in the cleanroom 1 through the filter device 6 and then to the air plate 4;

[0047] Step 4: Adjust the air pressure. Control the air pressure of the air plate 4 by adjusting the frequency of the blower 5. Determine the appropriate air pressure according to the thickness of the packaging substrate 2 that needs to be conveyed, so that the packaging substrate 2 can fit perfectly on the conveying device 3, and prevent the packaging substrate 2 from being too small to be pressed or too large to deform.

[0048] Step 5: Adjust the air deflector 4. The adjustable angle of the air deflector 4 is 0-30°. Adjust the appropriate angle to press the encapsulation substrate 2 so that the encapsulation substrate 2 can pass through smoothly.

[0049] Step 6: Place the first piece in the test. If the test passes, repeat steps 4 and 5 until the first piece passes the test. Then, normal operation can begin.

[0050] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A packaging substrate processing system, characterized in that, Used for processing packaging substrates, including: A cleanroom having an entrance; A conveying device for introducing the packaging substrate from the entrance of the cleanroom into the cleanroom; Several air deflectors are provided, each of which is installed at the entrance outside the wall section of the cleanroom. The air deflectors are arranged at intervals above the conveying device along the transmission direction of the conveying device. The air outlets of all the air deflectors are arranged in parallel. The air deflectors can cover the area where the encapsulation substrate passes through the conveying device. A blower, which is connected to the air vanes, is used to blow the gas in the cleanroom through each of the air vanes toward the encapsulation substrate that just enters the cleanroom entrance. A filter device is connected between the blower and each of the air vanes.

2. The packaging substrate processing system according to claim 1, characterized in that, The conveying device is a roller or a conveyor belt.

3. The packaging substrate processing system according to claim 1, characterized in that, The wind vane has rotating shafts at both ends, and the wind vane can adjust its angle with the rotating shafts as the rotation center. The range of the rotation angle of the wind vane is 0-30°.

4. The packaging substrate processing system according to claim 1, characterized in that, The blower is installed outside the cleanroom, and the inlet pipe of the blower is connected to the cleanroom.

5. The packaging substrate processing system according to claim 1, characterized in that, The inner diameter of the air outlet of the air deflector is 3mm.

6. The packaging substrate processing system according to claim 1, characterized in that, The frequency adjustment range of the blower is 0-50Hz, and the air pressure range is 0.1-0.5Mpa.

7. The packaging substrate processing system according to claim 1, characterized in that, The filtration accuracy of the filtration device is 0.3 μm.

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