Micro-channel heat exchange device
By designing a microchannel heat exchange device, the problem of heat dissipation for chips with high heat flux density, which cannot be met by traditional heat dissipation technology, is solved, resulting in more efficient heat dissipation and more stable chip operation.
Patent Information
- Application Number
- CN202520336324.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-02-28
AI Technical Summary
Traditional air-cooling technology cannot meet the heat dissipation requirements of high heat flux density in electronic chips, making chip temperature control difficult and affecting electrical performance, operating frequency and reliability.
The microchannel heat exchange device includes a cooling substrate, a flow divider, a double-layer microchannel cooling structure, column ribs, and microchannels. Through the design of the liquid storage structure and the cooling medium flow section, the cooling medium can effectively flow and circulate between the medium cooling layer and the heat exchange layer, thereby enhancing the heat dissipation effect.
It improves the chip's heat dissipation efficiency, evens out the heat flux density distribution, extends the heat exchange time, increases the heat exchange frequency and heat transfer intensity, and ensures stable chip operation.
Smart Images
Figure CN223844280U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of enhanced heat exchange and relates to a microchannel heat exchange device. Background Technology
[0002] With the improvement of electronic chip performance and miniaturization, chips have been developing towards higher integration and smaller size. Chips exhibit increasingly higher heat flux densities, and traditional air-cooling technology can no longer meet the heat dissipation requirements. Therefore, chip temperature control is crucial. For chips to operate stably and continuously, excessively high temperatures will reduce their operational stability, directly affecting their electrical performance, operating frequency, mechanical strength, and reliability, and may even lead to chip damage, thus becoming one of the bottlenecks restricting further development of chip technology. Therefore, to ensure reliable and stable chip operation, new and efficient heat dissipation technologies have become an urgent need.
[0003] Against this backdrop, researchers have proposed a microchannel heat dissipation method, which aims to make the heat flux density distribution on the chip surface more uniform, thereby extending the heat exchange time, increasing the heat exchange frequency, enhancing heat transfer, and achieving more efficient heat exchange. Utility Model Content
[0004] To address the shortcomings of existing technologies, this invention provides a microchannel heat exchange device that solves the aforementioned problems.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a microchannel heat exchange device, comprising a cooling substrate and a flow divider. The cooling substrate is provided with a double-layer microchannel cooling structure, column ribs, and microchannels. The double-layer microchannel cooling structure includes a heat exchange layer and a medium cooling layer for extending the heat exchange time. The medium cooling layer is divided into a liquid storage structure and a cooling medium flow section. The channels of the liquid storage structure are hexagonal in shape and distributed around the cooling medium flow section. The liquid channels within the liquid storage structure are independent of each other, preventing the liquid in the liquid storage structure from flowing between each other in the medium cooling layer. Arrow-shaped holes are intersecting at the corners of the cooling medium flow section to allow the cooling medium to flow between the heat exchange layer and the medium cooling layer.
[0006] Based on the above technical solutions, this utility model also provides the following optional technical solutions:
[0007] A further technical solution: A partition is provided between the medium cooling layer and the top cover plate, and a hexagonal channel is provided in the partition. The hexagonal channels are interconnected and connected to the liquid storage structure. The cooling medium flow section is connected to the regular hexagonal heat exchange section channel of the heat exchange layer.
[0008] Further technical solution: The hexagonal channel is connected to the second liquid inlet and the first liquid outlet through a pipeline. The cooling medium flows through the second liquid inlet to the liquid storage structure in the medium cooling layer.
[0009] Further technical solution: Multiple ribs are provided in the cooling medium flow section of the medium cooling layer to divert the cooling medium. The cross-sectional shape of the ribs is trapezoidal, and they are added sequentially from the inner layer to the outer layer, with two ribs on each side of the innermost layer.
[0010] A further technical solution: The cooling medium layer has a hole in the center, which is connected to a pipe in the top cover plate, so that the liquid can directly reach the central area of the heat exchange layer.
[0011] Further technical solution: The cooling substrate is provided with a cooling tank, the bottom of the cooling tank is provided with a background heat source and multiple hot spots arranged in a matrix, the cooling tank is provided with multiple sets of microchannels, and between two adjacent sets of microchannels are multiple sets of column ribs and multiple double-layer microchannel cooling structures. The double-layer microchannel cooling structures are located above the hot spots, and the microchannels and column ribs are located above the background heat source.
[0012] Further technical solution: The hexagonal heat exchange section channel on the heat exchange layer is surrounded by a fan-shaped conical groove to increase the residence time of the cooling medium. Each side of each ring of the hexagonal heat exchange section channel is successively increased by a fan-shaped conical groove, and each side of the innermost ring is a fan-shaped conical groove.
[0013] A further technical solution: The top cover plate is provided with a liquid inlet at its axial center for the flow of cooling medium.
[0014] A further technical solution: The flow divider is disposed between the cooling substrate and the upper cover plate. The flow divider includes a flow divider baffle and an inlet channel. The inlet channel and the outlet channel are located on both sides of the flow divider and are respectively connected to the working fluid inlet and the working fluid outlet.
[0015] Beneficial effects
[0016] This invention provides a microchannel heat exchange device, which has the following advantages compared with the prior art:
[0017] 1. Part of the cooling medium flows into the hexagonal channel through the liquid inlet 2 located on the side of the partition and converges in multiple liquid storage structures. After filling the liquid storage structures, it flows out through the liquid outlet 1 to maintain the cooling effect of the cooling medium in the medium cooling layer. Thus, the cooling medium flowing up from the heat exchange layer is cooled by the cooling medium in the liquid storage structure. Since the cooling medium flow section is not connected to the liquid storage structure, the cooling medium is cooled in the medium cooling layer after completing the heat exchange in the heat exchange layer, and then re-enters the heat exchange layer to complete the heat exchange in the remaining part of the heat exchange layer.
[0018] 2. The cooling medium enters directly into the hexagonal heat exchange section channel on the heat exchange layer through the inlet 1. Then, it flows outwards sequentially through the four small holes around the hexagonal heat exchange section channel. After completing the first round of heat exchange and cooling of the background heat source and hot spot heat source, some of the cooled medium, due to the pressure of the side wall, enters the medium cooling layer through the arrow-shaped hole for cooling. After the cooling medium is cooled, it enters the second round of the hexagonal heat exchange section channel on the heat exchange layer again, mixing with the cooling medium that has not flowed into the medium cooling layer. This cycle repeats, flowing outwards round by round, until it reaches the edge of the heat exchange layer, completing the heat exchange of part of the heat exchange layer. Finally, the cooling medium flows out from the outlet 2.
[0019] 3. The microchannels, the inlet and outlet channels above the microchannels, the multiple sets of column ribs at one end of the microchannels, and the double-layer microchannel cooling structure work together to dissipate heat simultaneously and concentrate heat dissipation for units with high heat output, thereby improving heat dissipation efficiency and thus enhancing the heat dissipation effect. The cooling medium is forced to flow forward and downward within the diversion baffle. The forward-flowing cooling medium is obstructed by the diversion baffle and flows into the double-layer microchannel cooling structure through inlet one and inlet two, respectively. The cooling medium that directly enters the double-layer microchannel cooling structure through inlet one directly enters the central area of the regular hexagonal heat exchange section channel on the heat exchange layer, and then flows outward along the four small holes around the regular hexagonal heat exchange section channel. After the first round of heat exchange and cooling of the background heat source and hot spot heat source, part of the cooled medium after heat exchange enters the medium cooling layer through the arrow-shaped hole due to the pressure of the side wall. At the same time, part of the cooled medium flowing into the double-layer microchannel cooling structure flows into multiple liquid storage structures, so that the cooled medium after heat exchange is cooled when it flows through the cooling medium flow section on the medium cooling layer. Meanwhile, part of the cooled medium after heat exchange flows out from the liquid outlet on the heat exchange layer and mixes with the cooling medium at the column rib and microchannel. After converging with the downward flowing cooling medium in the cooling tank, it flows up and down along the microchannel for flow heat exchange. Finally, the cooled medium flows upward and flows out from the outlet channel of the diversion baffle on the other side. Attached Figure Description
[0020] Figure 1 : A three-dimensional exploded view of the implementation of this utility model.
[0021] Figure 2 : Schematic diagram of the appearance of this utility model.
[0022] Figure 3 : Structural diagram of this utility model without the upper cover plate.
[0023] Figure 4 : This is a schematic diagram of the structure of the cooling substrate of this utility model.
[0024] Figure 5 : A schematic diagram of the structure of the double-layer microchannel cooling structure of this utility model.
[0025] Figure 6 : Enlarged schematic diagram of the structure of this utility model.
[0026] Figure 7 : Internal structure diagram of the heat exchange layer of the double-layer microchannel cooling structure of this utility model.
[0027] Figure 8 : Internal structure diagram of the medium cooling layer of the double-layer microchannel cooling structure of this utility model.
[0028] Figure 9 : Internal structure diagram of the partition plate of the double-layer microchannel cooling structure of this utility model.
[0029] Figure 10 : Schematic diagram of the internal liquid flow of the double-layer microchannel of this utility model.
[0030] In the diagram: 1. Cooling substrate; 2. Diversion baffle; 3. Upper cover plate; 4. Double-layer microchannel cooling structure; 5. Column rib; 6. Microchannel; 7. Diversion baffle; 8. Inlet channel; 9. Outlet channel; 11. Working fluid inlet; 12. Working fluid outlet; 13. Heat exchange layer; 14. Medium cooling layer; 15. Liquid inlet 1; 16. Liquid inlet 2; 17. Liquid outlet 1; 18. Baffle; 19. Top cover plate; 20. Hexagonal channel; 21. Fan-shaped conical groove; 22. Rib column; 23. Liquid storage structure; 24. Arrow-shaped hole; 25. Detailed Implementation
[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0032] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.
[0033] Please see Figure 1 , Figure 4 , Figure 5 as well as Figure 8This invention provides a microchannel heat exchange device according to one embodiment of the present invention, comprising a cooling substrate 1 and a flow divider 2. The cooling substrate 1 is provided with a double-layer microchannel cooling structure 4, column ribs 5 and microchannels 6. The microchannels 6 can change the forward-flowing liquid to flow downward and into the column ribs 5 in front for turbulence. The double-layer microchannel cooling structure 4 includes a heat exchange layer 13 and a medium cooling layer 14 for extending the heat exchange time. The medium cooling layer 14 is divided into a liquid storage structure 24 and a cooling medium flow section. The liquid storage structure 24 has a hexagonal channel shape, a depth of 0.11 mm and a width of 0.04 mm. The liquid storage structure 24 is distributed around the cooling medium flow section. The liquid channels in the liquid storage structure 24 are independent of each other, so that the liquid in the liquid storage structure 24 cannot flow between each other in the medium cooling layer 14. Arrow-shaped holes 25 are opened at intervals at the corners of the cooling medium flow section to allow the cooling medium to flow between the heat exchange layer 13 and the medium cooling layer 14.
[0034] Please see Figure 5 as well as Figure 8 Specifically, a partition 19 is provided between the medium cooling layer 14 and the top cover plate 20. A hexagonal channel 21 is provided in the partition 19. The hexagonal channels 21 are interconnected and connected to the liquid storage structure 24. The cooling medium flow section is connected to the regular hexagonal heat exchange section channel of the heat exchange layer 13.
[0035] Please see Figure 5 as well as Figure 7 Specifically, each end of the liquid inlet 16 and the liquid outlet 17 is provided with a pipe connected to the hexagonal channel 21 in the partition 19, so that part of the cooling medium flows into the hexagonal channel 21 through the liquid inlet 16 on the side of the partition 19 and converges in multiple liquid storage structures 24. After filling the liquid storage structure 24, it flows out through the liquid outlet 17 to maintain the cooling effect of the cooling medium in the medium cooling layer 14. Thus, the cooling medium flowing up the heat exchange layer 13 is cooled by the cooling medium in the liquid storage structure 24. Since the flow section of the cooling medium is not connected to the liquid storage structure 24, the cooling medium is cooled in the medium cooling layer 14 after completing the heat exchange in the heat exchange layer 13, and then enters the heat exchange layer 13 again to complete the heat exchange of the rest of the heat exchange layer 13.
[0036] Please see Figure 7 Specifically, the cooling medium flow section of the medium cooling layer 14 is provided with multiple ribs 23 for diverting the cooling medium. The cross-sectional shape of the ribs 23 is trapezoidal, the height of the ribs 23 is 0.1 mm, the length of the upper base of the trapezoid is 0.05 mm, the length of the lower base is 0.1 mm, and the height is 0.043 mm. The ribs 23 are arranged in order from the inner layer to the outer layer, with two ribs on each side of the innermost layer.
[0037] Please see Figure 5 Specifically, the cooling medium layer 14 has a hole with a diameter of 0.32 mm in the center, which is connected to the pipe in the top cover plate 20, so that the liquid can directly reach the central area of the heat exchange layer 13.
[0038] Please see Figure 1 as well as Figure 4 Specifically, the cooling substrate 1 is provided with a cooling tank, the bottom of the cooling tank is provided with a background heat source and multiple hot spots arranged in a matrix, the cooling tank is provided with multiple sets of microchannels 6, and between two adjacent sets of microchannels 6 are multiple sets of column ribs 5 and multiple double-layer microchannel cooling structures 4. The double-layer microchannel cooling structures 4 are located above the hot spots, and the microchannels 6 and the column ribs 5 are both located above the background heat source.
[0039] Please see Figure 7 Specifically, the fan-shaped conical groove 22 is disposed around the regular hexagonal heat exchange section channel on the heat exchange layer 13. The groove depth is 0.1mm, the radius of the fan-shaped part is 0.02mm, and the height of the conical part is 1mm. They are tangent at the connection point. Each side of each ring of the regular hexagonal heat exchange section channel adds a fan-shaped conical groove 22 outward in sequence, and each side of the innermost ring is a fan-shaped conical groove 22.
[0040] Please see Figure 7 Specifically, the fan-shaped conical groove 22 can effectively increase the residence time of the cooling medium and provide concentrated cooling for the overheated areas of the chip.
[0041] Please see Figure 5 Specifically, the top cover plate 20 has an inlet 15 at its axial center for the flow of cooling medium. The cooling medium enters directly into the central area of the hexagonal heat exchange section channel on the heat exchange layer 13 through the inlet 15, and then flows outwards sequentially through the four small holes around the hexagonal heat exchange section channel. After completing the first round of heat exchange and cooling of the background heat source and hot spot heat source, part of the cooled medium after heat exchange enters the medium cooling layer 14 through the arrow-shaped hole 25 due to the pressure of the side wall. After the cooling medium is cooled, it enters the second round of the hexagonal heat exchange section channel on the heat exchange layer 13 again and mixes with the cooling medium that has not flowed into the medium cooling layer 14. This cycle repeats, flowing outwards round by round, and finally reaches the edge of the heat exchange layer 13, completing part of the heat exchange in the heat exchange layer 13. Finally, the cooling medium flows out from the outlet 18.
[0042] Please see Figure 1 , Figure 2 as well as Figure 3Specifically, the flow divider 2 is disposed between the cooling substrate 1 and the upper cover plate 3. The flow divider 2 includes a flow divider baffle 7, an inlet channel 8, and an outlet channel 9. The inlet channel 8 and the outlet channel 9 are located on both sides of the flow divider 2 and are respectively connected to the working fluid inlet 11 and the working fluid outlet 12.
[0043] Please see Figure 3 Specifically, the flow divider 7 is placed in the channel of the flow divider 2 to adjust the fluid flow distribution.
[0044] In this embodiment of the invention, the microchannel 6, the inlet and outlet channels above the microchannel 6, the multiple sets of column ribs 5 at one end of the microchannel 6, and the double-layer microchannel cooling structure 4 work together to dissipate heat simultaneously and concentrate heat dissipation on units with high heat output, thereby improving heat dissipation efficiency and thus enhancing the heat dissipation effect. The cooling medium is forced to flow forward and downward within the diversion baffle 2. The forward-flowing cooling medium is obstructed by the diversion baffle 7 and flows into the double-layer microchannel cooling structure 4 through inlet 15 and inlet 16, respectively. The cooling medium entering the double-layer microchannel cooling structure 4 through inlet 15... The medium directly enters the central area of the hexagonal heat exchange section channel on the heat exchange layer 13, and then flows outwards sequentially through the four small holes around the hexagonal heat exchange section channel. After completing the first round of heat exchange and cooling of the background heat source and hot spot heat source, part of the cooled medium after heat exchange enters the medium cooling layer 14 through the arrow-shaped hole 25 due to the pressure of the side wall. At the same time, part of the cooled medium that flows into the double-layer microchannel cooling structure 4 through the liquid inlet 16 flows into multiple liquid storage structures 24, so that the cooled medium after heat exchange is cooled when it flows through the cooling medium flow section on the medium cooling layer 14.
[0045] Meanwhile, part of the cooling medium after heat exchange flows out from the outlet 18 on the heat exchange layer 13 and mixes with the cooling medium at the column rib 5 and microchannel 6. After converging with the downward flowing cooling medium in the cooling tank, it flows up and down along the microchannel for flow heat exchange. Finally, the cooling medium flows upward and out from the outlet channel 9 of the diversion baffle on the other side.
[0046] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0047] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A microchannel heat exchange device, characterized in that, It includes a cooling substrate (1) and a flow divider (2), wherein the cooling substrate (1) is provided with microchannels (6), a double-layer microchannel cooling structure (4) and column ribs (5); The dual-layer microchannel cooling structure (4) includes a heat exchange layer (13) and a medium cooling layer (14) for extending the heat exchange time. The medium cooling layer (14) is divided into a liquid storage structure (24) and a cooling medium flow section. The channel shape of the liquid storage structure (24) is hexagonal. The liquid storage structure (24) is distributed around the cooling medium flow section. The liquid channels in the liquid storage structure (24) are independent of each other, so that the liquid in the liquid storage structure (24) cannot flow between each other in the medium cooling layer (14). Arrow-shaped holes (25) are opened at intervals at the corners of the cooling medium flow section to allow the cooling medium to flow between the heat exchange layer (13) and the medium cooling layer (14).
2. The microchannel heat exchanger according to claim 1, characterized in that, A partition (19) is provided between the medium cooling layer (14) and the top cover plate (20). A hexagonal channel (21) is provided in the partition (19). The hexagonal channels (21) are interconnected and connected to the liquid storage structure (24). The cooling medium flow section is connected to the regular hexagonal heat exchange section channel of the heat exchange layer (13).
3. The microchannel heat exchanger according to claim 2, characterized in that, The hexagonal channel (21) is connected to the liquid inlet 2 (16) and the liquid outlet 1 (17) through a pipeline. The cooling medium flows through the liquid inlet 2 (16) to the liquid storage structure (24) in the medium cooling layer (14).
4. The microchannel heat exchanger according to claim 2, characterized in that, The cooling medium flow section of the medium cooling layer (14) is provided with multiple ribs (23) for diverting the cooling medium. The cross-sectional shape of the ribs (23) is trapezoidal.
5. The microchannel heat exchanger according to claim 2, characterized in that, The cooling medium layer (14) has a hole in the center, which is connected to the pipe in the top cover plate (20) so that the cooling medium can directly reach the area in the center of the heat exchange layer (13).
6. The microchannel heat exchanger according to claim 1, characterized in that, The cooling substrate (1) is provided with a cooling tank. The bottom of the cooling tank is provided with a background heat source and multiple hot spots arranged in a matrix. Multiple sets of microchannels (6) are arranged in the cooling tank. Multiple sets of column ribs (5) and multiple double-layer microchannel cooling structures (4) are arranged between two adjacent sets of microchannels (6). The double-layer microchannel cooling structures (4) are located above the hot spots. The microchannels (6) and the column ribs (5) are both located above the background heat source.
7. The microchannel heat exchanger according to claim 1, characterized in that, The heat exchange layer (13) is surrounded by a fan-shaped conical groove (22) to increase the residence time of the cooling medium.
8. The microchannel heat exchanger according to claim 2, characterized in that, The top cover plate (20) has a liquid inlet (15) at its axial center for the flow of cooling medium.
9. The microchannel heat exchanger according to claim 1, characterized in that, The flow divider (2) is disposed between the cooling substrate (1) and the upper cover plate (3). The flow divider (2) includes a flow divider baffle (7), an inlet channel (8) and an outlet channel (9). The inlet channel (8) and the outlet channel (9) are located on both sides of the flow divider (2) and are respectively connected to the working fluid inlet (11) and the working fluid outlet (12).
10. The microchannel heat exchanger according to claim 9, characterized in that, The flow divider (7) is placed in the channel of the flow divider (2) to adjust the fluid flow distribution.