Novel power module radiator

Abstract

The utility model relates to the technical field of vehicle power module accessories, and discloses a novel power module radiator which comprises a power module, an upper heat conduction substrate and a lower heat conduction substrate, the power module is fixedly connected to the top of the upper heat conduction substrate, the lower heat conduction substrate is fixedly connected to the bottom end of the upper heat conduction substrate, and the upper heat conduction substrate is fixedly connected with the lower heat conduction substrate. An inner cavity is formed between the upper heat conduction substrate and the lower heat conduction substrate, a refrigerant working medium is arranged on the top face of the interior of the upper heat conduction substrate, upper liquid absorption cores are fixedly installed on the two sides of the interior of the upper heat conduction substrate, and lower liquid absorption cores are fixedly installed on the two sides of the interior of the lower heat conduction substrate. The power module does not need to be used in cooperation with thermal management of the whole vehicle, independence is improved, heat generated by the power module can be stably and efficiently dissipated, and hidden dangers of local hot spot conditions are reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of automotive power module accessories, and more specifically, to a novel power module heat sink. Background Technology

[0002] A power module is a powerful integrated circuit module used to control and drive high-power electronic devices, such as AC motor drivers, frequency converters, and inverters. It is a highly integrated semiconductor device, typically including multiple functional modules such as power switches, drive circuits, protection circuits, and control circuits. Power modules are high-voltage, high-current, and heat-generating devices, and usually require heat dissipation components. Currently, the heat sinks for automotive power modules are usually pin-fin structures or spiral water channel structures, which have relatively large voltage drops and need to be used in conjunction with the vehicle's thermal management system. They have poor independence, limited heat dissipation efficiency, and pose a certain risk of localized hot spots, affecting the heat dissipation effect on the power module. Based on this, this utility model designs a novel power module heat sink to solve the above problems. Utility Model Content

[0003] The purpose of this invention is to provide a novel power module heat sink to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A novel power module heat sink includes a power module, an upper thermally conductive substrate, and a lower thermally conductive substrate. The power module is fixedly connected to the top of the upper thermally conductive substrate, and the lower thermally conductive substrate is fixedly connected to the bottom of the upper thermally conductive substrate. An internal cavity is formed between the upper and lower thermally conductive substrates. A refrigerant is disposed on the inner top surface of the upper thermally conductive substrate. Upper liquid-absorbing cores are fixedly installed on both inner sides of the upper thermally conductive substrate, and lower liquid-absorbing cores are fixedly installed on both inner sides of the lower thermally conductive substrate. The opposite end faces of the upper and lower liquid-absorbing cores are in contact.

[0006] As a preferred embodiment of this utility model, both the upper and lower thermally conductive substrates are made of copper.

[0007] As a preferred embodiment of this utility model, the bottom front side of the lower heat-conducting substrate is fixedly connected to a working fluid outlet end, and an outlet cap is threaded onto the external side of the working fluid outlet end.

[0008] As a preferred embodiment of this utility model, both the upper and lower liquid-absorbing cores are components made of capillary porous material.

[0009] As a preferred technical solution of this utility model, the bottom rear side of the lower heat-conducting substrate is fixedly connected to a working fluid inlet end, and an inlet cap is threaded onto the external thread of the working fluid inlet end.

[0010] As a preferred embodiment of this invention, the refrigerant is a solidified wax refrigerant.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] This invention places the power module on top of the upper heat-conducting substrate. The heat generated by the power module during operation is transferred to the upper heat-conducting substrate. The lower heat-conducting substrate is placed at the bottom of the upper heat-conducting substrate, forming an internal cavity between them. A refrigerant is placed on the top surface of the upper heat-conducting substrate. When the upper heat-conducting substrate is heated, the refrigerant evaporates to produce steam. Due to the low flow resistance, the steam quickly diffuses in the internal cavity to the cold end face of the lower heat-conducting substrate and condenses to form a liquid refrigerant. The liquid refrigerant is adsorbed and transferred by the lower and upper liquid-absorbing cores to the area below the power module for further evaporation, completing the refrigerant circulation and heat transfer. This design eliminates the need for vehicle thermal management, enhancing independence and enabling stable and efficient heat dissipation of the heat generated by the power module. It also reduces the risk of localized hot spots and improves the heat dissipation effect on the power module. Attached Figure Description

[0013] Figure 1 This is a first-view perspective three-dimensional structural diagram of a novel power module heat sink according to the present invention;

[0014] Figure 2 This is a cross-sectional view of a novel power module heat sink according to the present invention.

[0015] Figure 3 This is a second-view perspective three-dimensional structural diagram of a novel power module heat sink according to the present invention;

[0016] Figure 4 This is a three-dimensional structural diagram of the lower heat-conducting substrate in a novel power module heat sink according to this utility model.

[0017] In the diagram: 1. Power module; 2. Upper thermally conductive substrate; 201. Upper liquid suction core; 3. Lower thermally conductive substrate; 301. Lower liquid suction core; 4. Refrigerant; 5. Internal cavity; 6. Refrigerant outlet; 601. Outlet cap; 7. Refrigerant inlet; 701. Inlet cap. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] like Figures 1 to 4 As shown, this utility model provides a novel power module heat sink, including a power module 1, an upper heat-conducting substrate 2, and a lower heat-conducting substrate 3. The power module 1 is fixedly connected to the top of the upper heat-conducting substrate 2. The heat generated by the power module 1 during operation is transferred to the upper heat-conducting substrate 2. The lower heat-conducting substrate 3 is fixedly connected to the bottom of the upper heat-conducting substrate 2. An internal cavity 5 is formed between the upper heat-conducting substrate 2 and the lower heat-conducting substrate 3. A refrigerant 4 is disposed on the inner top surface of the upper heat-conducting substrate 2. When the upper heat-conducting substrate 2 is heated, the refrigerant 4 evaporates to generate steam. Due to the low flow resistance, the steam is trapped inside. The cavity 5 rapidly diffuses to the cold end face of the lower heat-conducting substrate 3, where it condenses to form a liquid refrigerant working fluid 4. Upper liquid-absorbing cores 201 are fixedly installed on both sides of the interior of the upper heat-conducting substrate 2, and lower liquid-absorbing cores 301 are fixedly installed on both sides of the interior of the lower heat-conducting substrate 3. The opposite end faces of the upper liquid-absorbing core 201 and the lower liquid-absorbing core 301 are in contact. The liquid refrigerant working fluid 4 formed after condensation is adsorbed and transferred to the bottom of the power module 1 by the lower liquid-absorbing core 301 and the upper liquid-absorbing core 201, and then evaporates again, completing the working fluid cycle and heat transfer, thereby enabling stable and efficient heat dissipation of the heat generated by the power module 1.

[0020] Among them, such as Figure 1 As shown, both the upper thermally conductive substrate 2 and the lower thermally conductive substrate 3 are made of copper, which achieves the purpose of giving the upper thermally conductive substrate 2 and the lower thermally conductive substrate 3 good thermal conductivity.

[0021] Among them, such as Figure 2 As shown, the bottom front side of the lower heat-conducting substrate 3 is fixedly connected to the working fluid outlet end 6. Waste liquid refrigerant 4 is discharged through the working fluid outlet end 6. The working fluid outlet end 6 is threaded with an outlet cap 601.

[0022] Among them, such as Figure 2 As shown, both the upper liquid-absorbing core 201 and the lower liquid-absorbing core 301 are components made of capillary porous material, which achieves the purpose of enabling the upper liquid-absorbing core 201 and the lower liquid-absorbing core 301 to produce a good adsorption and transport effect on the liquid refrigerant 4 formed after condensation.

[0023] Among them, such as Figure 2As shown, the bottom rear side of the lower heat-conducting substrate 3 is fixedly connected to the working fluid inlet 7, which can inject new liquid refrigerant 4 into the internal cavity 5 through the working fluid inlet 7. The working fluid inlet 7 is threaded with an inlet cap 701.

[0024] Among them, such as Figure 2 As shown, refrigerant 4 is a solidified wax refrigerant, which enables refrigerant 4 to absorb heat quickly.

[0025] The working principle of this utility model:

[0026] By placing the power module 1 on top of the upper heat-conducting substrate 2, the heat generated by the power module 1 during operation is transferred to the upper heat-conducting substrate 2. The lower heat-conducting substrate 3 is placed at the bottom of the upper heat-conducting substrate 2, forming an internal cavity 5 between the upper heat-conducting substrate 2 and the lower heat-conducting substrate 3. The refrigerant 4 is placed on the inner top surface of the upper heat-conducting substrate 2. When the upper heat-conducting substrate 2 is heated, the refrigerant 4 evaporates to generate steam. Due to the low flow resistance, the steam quickly diffuses in the internal cavity 5 to the cold end face of the lower heat-conducting substrate 3 and condenses to form liquid refrigerant 4. The liquid refrigerant 4 is adsorbed and transferred to the area below the power module 1 by the lower liquid suction core 301 and the upper liquid suction core 201 and evaporates again, completing the refrigerant cycle and heat transfer. It does not need to be used in conjunction with the vehicle thermal management system, which is beneficial to improve independence. It can stably and efficiently dissipate the heat generated by the power module 1 and reduce the risk of local hot spots.

[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel power module heat sink, characterized in that: It includes a power module (1), an upper thermally conductive substrate (2), and a lower thermally conductive substrate (3); The power module (1) is fixedly connected to the top of the upper heat-conducting substrate (2), and the lower heat-conducting substrate (3) is fixedly connected to the bottom of the upper heat-conducting substrate (2). An internal cavity (5) is formed between the upper heat-conducting substrate (2) and the lower heat-conducting substrate (3). A refrigerant (4) is provided on the inner top surface of the upper heat-conducting substrate (2). The upper heat-conducting substrate (2) has an upper liquid-absorbing core (201) fixedly installed on both sides of its interior, and the lower heat-conducting substrate (3) has a lower liquid-absorbing core (301) fixedly installed on both sides of its interior. The upper liquid-absorbing core (201) and the lower liquid-absorbing core (301) are in contact with each other.

2. The novel power module heat sink according to claim 1, characterized in that: Both the upper heat-conducting substrate (2) and the lower heat-conducting substrate (3) are made of copper.

3. The novel power module heat sink according to claim 1, characterized in that: The bottom front side of the lower heat-conducting substrate (3) is fixedly connected to the working fluid outlet end (6), and the external thread of the working fluid outlet end (6) is fitted with an outlet cap (601).

4. The novel power module heat sink according to claim 1, characterized in that: Both the upper liquid-absorbing core (201) and the lower liquid-absorbing core (301) are components made of capillary porous material.

5. A novel power module heat sink according to claim 1, characterized in that: The bottom rear side of the lower heat-conducting substrate (3) is fixedly connected to the working fluid inlet end (7), and the working fluid inlet end (7) is threaded with an inlet cap (701).

6. A novel power module heat sink according to claim 1, characterized in that: The refrigerant (4) is a solidified wax refrigerant.

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