Semiconductor packaging mold

Abstract

The utility model discloses a semiconductor packaging mold which comprises an upper mold and a lower mold which are connected through a hydraulic cylinder, and a material injection hole is formed in the upper mold. A feeding mechanism is arranged at the top of the upper die and comprises a discharging box body, a discharging cavity is longitudinally formed in the discharging box body, the bottom of the discharging cavity communicates with a material injection hole, mounting cavities of semicircular structures are formed in the left end and the right end of the discharging cavity correspondingly, and rotating shafts are arranged at the circle centers of the mounting cavities; a plurality of stirring plates are arranged on the rotating shafts, the stirring plates on the two rotating shafts are staggered when rotating, heating coils are arranged outside the discharging cavity and the mounting cavity, and the heating coils are externally connected with a heater. By means of the stirring plate capable of rotating, glue is pushed to the injection hole, the heating coil is matched to evenly heat the outer side of the discharging cavity and the outer side of the mounting cavity, the situation that the plastic is condensed in the cavity during glue feeding is avoided, and meanwhile the situation that the normal glue injection efficiency is affected by solidification of the glue is prevented.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to a semiconductor packaging mold. Background Technology

[0002] Semiconductor packaging technology involves placing a semiconductor chip into a lower mold cavity, then closing the upper mold, heating and melting the mold and packaging plastic, injecting the molten plastic into the cavity to encapsulate the semiconductor chip, and finally allowing the plastic to cool and solidify, thus bonding with the semiconductor chip to protect it.

[0003] When dispensing adhesive into semiconductor packaging molds, the adhesive material is not immediately injected into the mold cavity but is temporarily stored in a container. However, if the adhesive material stored in the container is left to stand for a period of time, it can easily affect the normal dispensing efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor packaging mold that addresses the shortcomings and deficiencies of existing technologies.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a semiconductor packaging mold, including an upper mold and a lower mold, which are connected by a hydraulic cylinder. Its innovation lies in: an injection hole is opened inside the upper mold; a feeding mechanism is provided at the top of the upper mold, the feeding mechanism including a feeding box, a feeding cavity is longitudinally arranged inside the feeding box, the bottom of the feeding cavity is connected to the injection hole, semi-circular mounting cavities are respectively opened at the left and right ends of the feeding cavity, a rotating shaft is provided at the center of the mounting cavity, multiple stirring plates are arranged on the rotating shaft, and the stirring plates on two rotating shafts are misaligned when rotating; one end of the rotating shaft extends to the outside of the feeding box and is provided with a driven wheel; a drive shaft is also provided outside the feeding box, a driving wheel is provided on the drive shaft, the driving wheel is driven by a motor; a heating coil is provided outside the feeding cavity and the mounting cavity, and a heater is connected to the heating coil.

[0006] Furthermore, the stirring plate is fitted to the inner wall of the mounting cavity.

[0007] Furthermore, a drive wheel is provided on the output shaft of the motor, and the drive wheel and the driving wheel are connected by a belt for transmission. The driving wheel is a double-groove driving wheel.

[0008] The beneficial effects of this utility model after adopting the above structure are as follows:

[0009] This invention uses a rotating stirring plate to push the rubber material into the injection hole. Combined with a heating coil, it can evenly heat the outside of the feeding chamber and the mounting chamber, avoiding the condensation of the plastic inside the chamber during the injection process and preventing the rubber material from solidifying and affecting the normal injection efficiency. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the internal structure of the present invention;

[0011] Figure 2 This is a schematic diagram of the external structure of this utility model.

[0012] Explanation of reference numerals in the attached figures:

[0013] 1 Upper mold, 2 Lower mold, 3 Hydraulic cylinder, 4 Injection hole, 5 Feeding mechanism, 51 Discharge box, 52 Discharge cavity, 53 Mounting cavity, 54 Rotating shaft, 55 Mixing plate, 56 Driven wheel, 57 Drive shaft, 58 Drive wheel, 59 Motor, 510 Heating coil, 511 Heater. Detailed Implementation

[0014] The present invention will be further described below with reference to the accompanying drawings.

[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model.

[0016] See Figure 1-2 A semiconductor packaging mold includes an upper mold 1 and a lower mold 2, which are connected by a hydraulic cylinder 3. The upper mold 1 has an injection hole 4 inside. The top of the upper mold 1 is provided with a feeding mechanism 5, which includes a feeding box 51. The feeding box 51 has a longitudinally arranged feeding cavity 52 inside. The bottom of the feeding cavity 52 is connected to the injection hole 4. The left and right ends of the feeding cavity 52 are respectively provided with semi-circular mounting cavities 53. A rotating shaft 54 ​​is provided at the center of the mounting cavity 53. Multiple stirring plates 55 are provided on the rotating shaft 54. The stirring plates on the two rotating shafts 54 are misaligned when rotating. One end of the rotating shaft 54 ​​extends to the outside of the feeding box and is provided with a driven wheel 56. A drive shaft 57 is also provided outside the feeding box 51. A drive wheel 58 is provided on the drive shaft 57. The drive wheel 58 is driven by a motor 59. A heating coil 510 is provided outside the feeding cavity 52 and the mounting cavity 53. The heating coil 510 is connected to a heater 511. Specifically, the rubber material enters from the feeding chamber 52. The starting motor 59 drives the drive wheel 58 to rotate, which in turn drives the driven wheel 56 to rotate. The driven wheel drives the rotating shaft 54 ​​to rotate, which in turn drives the stirring plate 55 to rotate, pushing the rubber material into the injection hole. At the same time, the heater 511 is turned on to heat the heating coil 510. The heating coil 510 can evenly heat the outside of the feeding chamber 52 and the mounting chamber 53, avoiding the condensation of the plastic inside the chamber during the feeding process, and preventing the rubber material from solidifying and affecting the normal injection efficiency.

[0017] In this embodiment, the stirring plate 55 is fitted to the inner wall of the mounting cavity 53, thereby scraping off the inner wall of the mounting cavity 53 and preventing the adhesive from adhering to the inner wall of the mounting cavity 53.

[0018] In this embodiment, a drive wheel is mounted on the output shaft of the motor 59, and the drive wheel and the driving wheel are connected by a belt for transmission. The driving wheel is a double-groove driving wheel. After the motor 59 starts, it drives the driving wheel to rotate through the drive wheel and the belt. The driving wheel drives the driven wheel 56 to rotate, which in turn drives the rotating shaft to rotate, thereby rotating the mixing plate 55 and pushing the adhesive material into the injection hole 4.

[0019] The above description is only used to illustrate the technical solution of this utility model and is not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. A semiconductor packaging mold, comprising an upper mold and a lower mold, connected by a hydraulic cylinder, characterized in that: The upper mold has an injection hole inside; the top of the upper mold is provided with a feeding mechanism, the feeding mechanism includes a feeding box, the feeding box has a longitudinally arranged feeding cavity inside, the bottom of the feeding cavity is connected to the injection hole, the left and right ends of the feeding cavity are respectively provided with semi-circular mounting cavities, the center of the mounting cavity is provided with a rotating shaft, the rotating shaft is provided with multiple stirring plates, and the stirring plates on the two rotating shafts are misaligned when rotating, one end of the rotating shaft extends to the outside of the feeding box and is provided with a driven wheel, the outside of the feeding box is also provided with a drive shaft, the drive shaft is provided with a driving wheel, the driving wheel is driven by a motor, the outside of the feeding cavity and the mounting cavity is provided with a heating coil, and the heating coil is connected to an external heater.

2. A semiconductor packaging mold according to claim 1, characterized in that: The stirring plate is fitted to the inner wall of the mounting cavity.

3. A semiconductor packaging mold according to claim 1, characterized in that: A drive wheel is mounted on the output shaft of the motor, and the drive wheel and the driving wheel are connected by a belt for transmission. The driving wheel is a double-groove driving wheel.

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