Welding device for electronic chip processing

Abstract

The utility model discloses a welding device for electronic chip processing, which comprises a bottom plate, an inverted L-shaped mounting seat is arranged on the bottom plate, the front side surface of the inverted L-shaped mounting seat is connected with a welding gun through a lifting cylinder, an adsorption component is arranged on the bottom plate and right below the welding gun, the inverted L-shaped mounting seat is provided with a T-shaped support plate, the T-shaped support plate is provided with an automatic feeding component, and the automatic feeding component is provided with a feeding component. A pull-back assembly is arranged between the inverted-L-shaped mounting base and the feeding runner, and an ejection assembly is arranged at the bottom of the inverted-L-shaped mounting base. According to the utility model, the vibration feeding disc is vibrated through the vibration motor, electronic chips in the vibration feeding disc enter the feeding flow channel and fall into the electronic chip placing groove, and then the electronic chips are ejected through the combination of the lifting air cylinder for driving the welding gun to lift and the ejection component; and the feeding runner swings left and right, so that the electronic chip is separated from the electronic chip placing groove and then is welded on the circuit board by the welding gun, the electronic chip is automatically welded on the circuit board, the chip to be processed does not need to be manually placed on a processing assembly line, and the working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to welding device technical field, concretely relates to a welding device for electronic chip processing. BACKGROUND

[0002] Chip refers to the silicon chip containing integrated circuit, and the volume is very small, often is a part of computer or other electronic equipment, usually a very thin silicon chip, etching has the transistor of microprocessor on, and it is a kind of circuit miniaturization in electronics, and is usually manufactured on semiconductor wafer surface.

[0003] The existing electronic chip welding needs to be manually placed in the processing pipeline continuously, and the position needs to be manually adjusted, so that the production efficiency is reduced, and the convenience of device use is reduced. UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of welding devices for electronic chip processing, to solve the problems of existing welding device for electronic chip processing in the above background technology.

[0005] To achieve the above object, the utility model provides a kind of welding devices for electronic chip processing, including bottom plate, the bottom plate is provided with inverted L type mounting seat, the inverted L type mounting seat front side is provided with lifting cylinder, the piston rod end of the lifting cylinder is connected with welding torch, the bottom plate is provided with suction assembly below welding torch, the top surface and side surface of the inverted L type mounting seat are jointly installed with T type support plate, the T type support plate is provided with automatic feeding assembly, the automatic feeding assembly is displaced on the surface of T type support plate by displacement component, the automatic feeding assembly includes vibration feeder tray and the vibration motor of driving vibration feeder tray eccentric vibration, the vibration motor is installed at T type support plate rear side top, feeding hopper is provided above the vibration feeder tray, outlet is provided below the vibration feeder tray, and the outlet end of vibration feeder tray is connected with feeding flow channel, the outlet of feeding flow channel extends between welding torch and suction assembly, and the outlet end of feeding flow channel is provided with electronic chip placement slot, the inverted L type mounting seat and feeding flow channel are provided with pullback component, the side of the inverted L type mounting seat bottom plate away from T type support plate is provided with limit plate, and top opening component is arranged between the limit plate and feeding flow channel.

[0006] Preferably, the inlet pipe of the lifting cylinder is provided with a filter and a solenoid valve, and the filter is provided with a pressure regulating valve.

[0007] Preferably, the suction assembly includes a vacuum pump mounted on the bottom plate, and the slot surface of the electronic chip placement slot is provided with a through hole, and the air inlet hole of the vacuum pump is arranged directly below the through hole.

[0008] Preferably, the displacement assembly comprises a bowl provided on one side of a vibrating feeder disc, a four-corner ring is arranged between the vibrating feeder disc and the bowl, a quincunx handle is arranged on the side surface of the bowl, the quincunx handle is vertically connected with the four-corner ring, and the quincunx handle is threadedly connected with the bowl.

[0009] Preferably, the back-pulling assembly comprises a first mounting hole arranged on the feeding flow channel, a second mounting hole arranged on the same side surface of the inverted L-shaped mounting base and the T-shaped support plate, and a back-pulling spring arranged between the first mounting hole and the second mounting hole.

[0010] Preferably, the top opening assembly comprises a top rod arranged on the side surface of the feeding flow channel, two first fixing plates arranged at the bottom of the inverted L-shaped mounting base, and a first connecting plate rotationally connected with one end of the two first fixing plates, a buffer spring vertically arranged on the surface of the limiting plate, the buffer spring connected with the side surface of the first connecting plate away from the first fixing plate, a through hole arranged on the first connecting plate, a U-shaped groove arranged on the side of the first connecting plate away from the limiting plate, a support plate connected with the bottom of the U-shaped groove, and a baffle corresponding to the top rod arranged on the support plate.

[0011] Preferably, a hollow column is arranged on the side surface of the U-shaped groove, the hollow column is sleeved on a connecting rod, a limiting ring limiting the position of the hollow column is arranged on one end of the connecting rod, the other end of the connecting rod is connected with the through hole through the U-shaped groove, the first connecting plate is rotationally connected around the connecting rod, a lower limiting spring is arranged between the end of the first connecting plate away from the first fixing plate and the end of the limiting plate, and a circular ring is sleeved on the surface of the hollow column.

[0012] Preferably, a second fixing plate is connected with the piston rod of the lifting cylinder, an inclined surface tangent to the circular ring is arranged on the lower side of the second fixing plate, the rear side of the second fixing plate is connected with one side surface of a second connecting plate through a second connecting rod, and the other side surface of the second connecting plate is connected with the first connecting plate through a first connecting rod.

[0013] Preferably, a controller is arranged on the bottom plate, and the output end of the controller is electrically connected with the lifting cylinder, the electromagnetic valve, the vibration motor, the vacuum pump and the pressure regulating valve.

[0014] Compared with the prior art, the utility model has the advantages that:

[0015] (1)The utility model discloses a vibration motor vibrates the vibration feeding tray, and the electronic chip in vibration feeding tray enters the feeding flow channel and falls to the electronic chip placing groove, and then through the lifting cylinder that drives the welding torch lifting combines the top -opening subassembly, makes the feeding flow channel swing left and right and makes the electronic chip be separated from the electronic chip placing groove after being welded on the circuit board by the welding torch, thereby realizes that the electronic chip is welded on the circuit board automatically, need not manually place the chip to be processed to the processing assembly line, improves work efficiency, through the height of welding torch that lifting cylinder controls, further improves work efficiency, improves the convenience of device use.

[0016] (2)The utility model discloses a mobile subassembly is set up, wherein the rotation of plum blossom handle makes the bowl public drive four corner rings to move left and right, and the movement of four corner rings drives vibration feeding tray to move in the same direction, thereby realizing the position adjustment of vibration feeding tray, and the position of feeding flow channel is also adjusted, through setting back pull subassembly, when the outlet of feeding flow channel removes between welding torch and adsorption component, under the action of back pull spring, feeding flow channel resets automatically, makes the accurate welding position of electronic chip. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the embodiment of the utility model, the following will be to the embodiment or the description of prior art needed to use the drawing briefly introduced, obviously, the following description in the drawing is only some embodiments of the utility model, for the ordinary skilled person in the art, under the premise of not paying the creative labor, can also obtain other drawings according to these drawings.

[0018] Figure 1 It is the front view structural schematic diagram of the embodiment of the utility model.

[0019] Figure 2 It is Figure 1 The enlarged view in A of the embodiment of the utility model.

[0020] Figure 3 It is the side view structural schematic diagram of the embodiment of the utility model.

[0021] Figure 4 It is Figure 3 The enlarged view in B of the embodiment of the utility model.

[0022] In the figure: base plate 1, inverted L-shaped mounting seat 2, lifting cylinder 3, welding gun 4, vibrating feeder 5, displacement assembly 6, bowl public 601, four-corner ring 602, plum blossom handle 603, spring 604, feeding flow channel 7, pullback assembly 8, first mounting hole 801, second mounting hole 802, pullback spring 803, top opening assembly 9, top rod 901, first fixed plate 902, first connecting plate 903, buffer spring 904, U-shaped groove 905, baffle 906, hollow column 907, connecting rod 908, lower limit spring 909, circular ring 910, second connecting plate 911, second fixed plate 912, first connecting rod 913, second connecting rod 914, sliding cavity 916, T-shaped support plate 10, feeding hopper 11, electronic chip placement groove 12, electromagnetic valve 13, limit plate 14, vibration motor 15, controller 16, vacuum pump 17, filter 18, pressure regulating valve 19. DETAILED DESCRIPTION

[0023] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the embodiments of the present application, and cannot be understood as a limitation of the present application.

[0024] In the description of the embodiments of the present application, it should be understood that, if the present application embodiments involve directional indications, such as up, down, left, right, front, back, inner, outer, and the like, the orientation or position relationship is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as a limitation of the present application.

[0025] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0026] In the embodiments of the utility model, unless there are explicit provisions and limitations, if there are terms such as ''installation'', ''connection'', ''connection'', ''fixing'', etc., they should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated. It can be mechanically connected, or it can be electrically connected. It can be directly connected, or it can be indirectly connected through an intermediate medium. It can be the communication between two elements or the interaction relationship between two elements. For ordinary skilled persons in the art, the specific meanings of the above-mentioned terms in the embodiments of the utility model can be understood according to the specific circumstances.

[0027] As shown in Figures 1 to 4 The utility model discloses a welding device for electronic chip processing, including the bottom plate 1, be provided with inverted L type mounting seat 2 on the bottom plate 1, inverted L type mounting seat 2 front side is provided with lifting cylinder 3, and the piston rod end of lifting cylinder 3 is connected with welding torch 4, and the bottom plate 1 is located the suction assembly below welding torch 4, inverted L type mounting seat 2 top surface and side are jointly installed with T type support plate 10, be provided with automatic feeding assembly on T type support plate 10, and automatic feeding assembly makes horizontal displacement on the surface of T type support plate 10 through displacement component 6, and automatic feeding assembly includes vibration feeder 5 and drive vibration feeder 5 eccentric vibration's vibration motor 15, and vibration motor 15 is installed at T type support plate 10 rear side top, be provided with feeding hopper 11 above vibration feeder 5, be provided with the outlet below vibration feeder 5, and the outlet end of vibration feeder 5 is connected with feeding flow channel 7, and the outlet of feeding flow channel 7 extends to between welding torch 4 and suction assembly, and the outlet end of feeding flow channel 7 is provided with electronic chip placement groove 12, and be provided with back pull assembly 8 between inverted L type mounting seat 2 and feeding flow channel 7, and the side of inverted L type mounting seat 2 bottom away from T type support plate 10 is provided with limit stop 14, and top opening component 9 is arranged between limit stop 14 and feeding flow channel 7.

[0028] In the embodiments, as shown in Figure 3 The filter 18 is provided on the inlet pipe of the lifting cylinder 3, and the electromagnetic valve 13 and the pressure regulating valve 19 are provided on the filter 18.

[0029] Specifically, the filter 18 is provided to filter the compressed gas entering the lifting cylinder 3, the pressure regulating valve 19 is provided to regulate the pressure in the filter 18, and the electromagnetic valve 13 is provided to regulate the amount of compressed air entering the lifting cylinder 3.

[0030] In the embodiments, as shown in Figure 1 The suction assembly includes a vacuum pump 17 installed on the bottom plate 1, and the slot surface of the electronic chip placement groove 12 is provided with a through hole, and the air inlet hole of the vacuum pump 17 is arranged below the through hole.

[0031] Specifically, the suction hole is arranged directly below the through hole, so that the negative pressure of the vacuum pump 17 passes through the suction hole and then passes through the through hole to adsorb the electronic chip in the electronic chip placing groove 12.

[0032] In this embodiment, as shown in Figure 1 and Figure 3 , the displacement assembly 6 includes a bowl 601 arranged on one side of the vibrating feeder 5, a four-corner ring 602 arranged between the vibrating feeder 5 and the bowl 601, a quincunx handle 603 arranged on one side of the center of the side surface of the bowl 601, the quincunx handle 603 vertically penetrating the bowl 601 and being connected with the four-corner ring 602, the quincunx handle 603 being threadedly connected with the bowl 601, and a spring 604 arranged between the quincunx handle 603 and the bowl 601.

[0033] Specifically, the bowl 601 is moved left and right by rotating the quincunx handle 603, so that the vibrating feeder 5 is also moved left and right, and the vibrating feeder 5 is returned to the original position by the spring 604.

[0034] In this embodiment, as shown in Figure 1 , the pull-back assembly 8 includes a first mounting hole 801 arranged on the feeding flow channel 7, a second mounting hole 802 arranged on the same side surface of the inverted L-shaped mounting seat 2 and the T-shaped support plate 10, and a pull-back spring 803 arranged between the first mounting hole 801 and the second mounting hole 802.

[0035] Specifically, when the feeding flow channel 7 is deviated, the feeding flow channel 7 is automatically reset under the action of the pull-back spring.

[0036] In this embodiment, as shown in Figures 1 to 4As shown, the top opening assembly 9 includes a top rod 901 arranged on the side of the feeding flow channel 7, the bottom of the inverted L-shaped mounting seat 2 is provided with two first fixed plates 902, the ends of the two first fixed plates 902 are rotatably connected with one end of a first connecting plate 903, a buffer spring 904 is vertically arranged on the surface of the limiting plate 14, one end of the buffer spring 904 away from the limiting plate 14 is connected with the side of the end of the first connecting plate 903 away from the fixed plate, a through hole is arranged on the first connecting plate 903, a U-shaped groove 905 is arranged on the side of the first connecting plate 903 away from the limiting plate 14, a supporting plate is connected to the bottom of the U-shaped groove 905, a baffle 906 corresponding to the top rod 901 is arranged on the supporting plate, a hollow column 907 is arranged on the side of the U-shaped groove 905, the hollow column 907 is sleeved with a connecting rod 908, a limiting ring limiting the position of the hollow column 907 is arranged on one end of the connecting rod 908, the other end of the connecting rod 908 penetrates through the U-shaped groove 905 and is connected with the through hole, and the first connecting plate 903 is rotatably connected around the connecting rod 908, a lower limiting spring 909 is arranged between the end of the first connecting plate 903 away from the first fixed plate 902 and the end of the limiting plate 14, a circular ring 910 is sleeved on the surface of the hollow column 907, a second fixed plate 912 is connected with the side of the piston rod of the lifting cylinder 3, an inclined surface tangent to the circular ring 910 is arranged on the lower side of the second fixed plate 912, the rear side of the second fixed plate 912 is connected with one side of a second connecting plate 911 through a second connecting rod 914, and the other side of the second connecting plate 911 is connected with the first connecting plate 903 through a first connecting rod 913.

[0037] Specifically, the first connecting plate 903 is rotatably connected between the two first fixed plates 902 at its upper end and swings left and right around the upper end at a certain angle under the action of the lower limit spring 909. When the lifting cylinder 3 drives the piston rod to descend, the piston rod descends and drives the second fixed plate 912 to descend. Since the lower side of the second fixed plate 912 has an inclined surface tangent to the ring 910, the descent of the second fixed plate 912 pushes the ring 910 to move to the right, causing the hollow column 907 to move to the right. The rightward movement of the hollow column 907 drives the U-shaped groove 905 to move to the right. The rightward movement of the U-shaped groove 905 drives the first connecting plate 903 to swing to the right, and at the same time drives the baffle 906 to move to the right, thereby causing the top rod 901 to move to the right. The feeding channel 7 also swings to the right; when the lifting cylinder 3 drives the piston rod to rise, the piston rod drives the second fixed plate 912 to rise, and the ring 910 moves to the left and returns to its original position without the restriction of the second fixed plate 912. The first connecting plate 903 swings back to the left and returns to its original position under the limiting action of the lower limit spring 909, so that the hollow column 907 and the U-shaped groove 905 quickly move to the left and return to their original positions. The U-shaped groove 905 quickly moves to the left and drives the baffle 906 to move to the left and quickly return to its original position, so that the top rod 901 quickly moves to the left and returns to its original position. The feeding channel 7 also swings to the left and returns to its original position. In this way, when the lifting cylinder 3 drives the piston rod to rise and fall, the feeding channel 7 swings left and right through the opening assembly 9.

[0038] In this embodiment, as Figure 1 As shown, a controller 16 is installed on the base plate 1. The output terminal of the controller 16 is electrically connected to the lifting cylinder 3, the solenoid valve 13, the vibration motor 15, the vacuum pump 17, and the pressure regulating valve 19, respectively.

[0039] The working principle of the embodiment is as follows: first, the operator rotates the wrench 603 to adjust the outlet of the feeding flow channel 7 to be between the welding gun 4 and the vacuum pump 17, places the circuit board between the welding gun 4 and the vacuum pump 17, starts the vacuum pump 17 to suck the circuit board, and then puts the electronic chip into the vibrating feeding tray 5 along the feeding hopper 11, starts the vibrating motor 15, and the vibrating motor 15 drives the vibrating feeding tray 5 to vibrate, the vibration of the vibrating feeding tray 5 drives the electronic chip to enter the feeding flow channel 7, the electronic chip is conveyed along the feeding flow channel 7 and falls into the electronic chip placing groove 12, at this time, compressed air is supplied to the lifting cylinder 3, the filter 18 filters the compressed air, the electromagnetic valve 13 adjusts the volume of the compressed air, so that the welding gun 4 is driven by the lifting cylinder 3 to move downward to the direction of the electronic chip placing groove 12, the second fixed plate 912 is driven to move downward, the circular ring 910 is driven to move rightwards, the U-shaped groove 905 is driven to move rightwards, the first connecting plate 903 is driven to swing rightwards, and the baffle 906 is driven to move rightwards, so that the top rod 901 moves rightwards, the feeding flow channel 7 swings rightwards, and the electronic chip placing groove 12 moves rightwards, the electronic chip is separated from the electronic chip placing groove 12, the welding gun 4 welds the electronic chip on the circuit board, then the lifting cylinder 3 is not supplied with compressed air, the second fixed plate 912 is driven to move upwards, the circular ring 910 is not limited to move leftwards to the original position by the second fixed plate 912, the first connecting plate 903 is driven to swing leftwards to the original position by the lower limit spring 909, the hollow column 907 and the U-shaped groove 905 are driven to move leftwards to the original position, the baffle 906 is driven to move leftwards to the original position, so that the top rod 901 moves leftwards to the original position, and the feeding flow channel 7 swings leftwards to the original position, so that the welding of the electronic chip is completed; the feeding flow channel 7 swings leftwards and rightwards while the welding gun is driven by the lifting cylinder 3 to move up and down, so that the electronic chip is automatically welded on the circuit board.

[0040] The above is only a preferred embodiment of the utility model, and is not used to limit the utility model, and any modification, equivalent replacement and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A soldering apparatus for electronic chip processing comprising a base plate (1), characterized in that, The bottom plate (1) is provided with an inverted L-shaped mounting seat (2), the front side of the inverted L-shaped mounting seat (2) is provided with a lifting cylinder (3), the piston rod end of the lifting cylinder (3) is connected with a welding gun (4), the bottom plate (1) is provided with a suction assembly directly below the welding gun (4), the top surface and the side surface of the inverted L-shaped mounting seat (2) are jointly provided with a T-shaped support plate (10), the T-shaped support plate (10) is provided with an automatic feeding assembly, the automatic feeding assembly is horizontally displaced on the surface of the T-shaped support plate (10) through a displacement assembly (6), the automatic feeding assembly comprises a vibrating feeding tray (5) and a vibrating motor (15) for driving eccentric vibration of the vibrating feeding tray (5), the vibrating motor (15) is installed at the top of the rear side of the T-shaped support plate (10), a feeding hopper (11) is arranged above the vibrating feeding tray (5), an outlet is arranged below the vibrating feeding tray (5), and the outlet end of the vibrating feeding tray (5) is connected with a feeding flow channel (7), the outlet of the feeding flow channel (7) extends to between the welding gun (4) and the suction assembly, and the outlet end of the feeding flow channel (7) is provided with an electronic chip placing groove (12), a pull-back assembly (8) is arranged between the same side surface of the inverted L-shaped mounting seat (2) and the T-shaped support plate (10) and the feeding flow channel (7), a limiting plate (14) is arranged on the side of the bottom of the inverted L-shaped mounting seat (2) away from the T-shaped support plate (10), and a top opening assembly (9) is arranged between the limiting plate (14) and the feeding flow channel (7).

2. The soldering apparatus for electronic chip processing according to claim 1, wherein A filter (18) and a solenoid valve (13) are arranged on the air inlet pipe of the lifting cylinder (3), and a pressure regulating valve (19) is arranged on the filter.

3. The soldering apparatus for electronic chip processing according to claim 1, wherein The suction assembly comprises a vacuum pump (17) installed on the bottom plate (1), and a through hole is formed in the groove surface of the electronic chip placing groove (12), and the air suction hole of the vacuum pump (17) is arranged directly below the through hole.

4. The soldering apparatus for electronic chip processing according to claim 1, wherein The displacement assembly (6) comprises a bowl (601) arranged on one side of the vibrating feeding tray (5), a four-corner ring (602) is arranged between the vibrating feeding tray (5) and the bowl (601), a quincunx handle (603) is arranged on one side of the center of the side surface of the bowl (601), the quincunx handle (603) penetrates the bowl (601) vertically and is connected with the four-corner ring (602), and the quincunx handle (603) is threadedly connected with the bowl (601), and a spring (604) is arranged between the quincunx handle (603) and the bowl (601).

5. The soldering apparatus for electronic chip processing according to claim 1, wherein The pull-back assembly (8) comprises a first mounting hole (801) arranged on the feeding flow channel (7), a second mounting hole (802) arranged on the same side surface of the inverted L-shaped mounting seat (2) and the T-shaped support plate (10), and a pull-back spring (803) arranged between the first mounting hole (801) and the second mounting hole (802).

6. The soldering apparatus for electronic chip processing according to claim 1, wherein The top opening assembly (9) includes a top rod (901) arranged on the side of the feeding flow channel (7), the bottom of the inverted L-shaped mounting seat (2) is provided with two first fixing plates (902), the ends of the two first fixing plates (902) are rotatably connected with one end of the first connecting plate (903), the surface of the limiting plate (14) is vertically provided with a buffer spring (904), one end of the buffer spring (904) away from the limiting plate (14) is connected with the side of the end of the first connecting plate (903) away from the fixing plate, a through hole is formed in the first connecting plate (903), a U-shaped groove (905) is arranged on the side of the first connecting plate (903) away from the limiting plate (14), the U-shaped groove (905) is provided with a supporting plate at the bottom, and a baffle (906) corresponding to the top rod (901) is arranged on the supporting plate.

7. The soldering apparatus for electronic chip processing according to claim 6, wherein The U-shaped groove (905) is provided with a hollow column (907) on the side, the hollow column (907) is sleeved on the connecting rod (908), a limiting ring limiting the position of the hollow column (907) is arranged on one end of the connecting rod (908), the other end of the connecting rod (908) penetrates the U-shaped groove (905) and is connected with the through hole, and the first connecting plate (903) is rotatably connected around the connecting rod (908), a lower limiting spring (909) is arranged between the end of the first connecting plate (903) away from the first fixing plate (902) and the end of the limiting plate (14), and the surface of the hollow column (907) is sleeved with a circular ring (910).

8. The soldering apparatus for electronic chip processing according to claim 6, wherein The piston rod of the lifting cylinder (3) is connected with a second fixing plate (912) on the side, the lower side of the second fixing plate (912) is provided with a slope tangent to the circular ring (910), the rear side of the second fixing plate (912) is connected with one side of a second connecting plate (911) through a second connecting rod (914), and the other side of the second connecting plate (911) is connected with the first connecting plate (903) through a first connecting rod (913).

9. The soldering apparatus for electronic chip processing according to any one of claims 1 to 3, wherein The bottom plate (1) is provided with a controller (16), and the output end of the controller (16) is electrically connected with the lifting cylinder (3), the electromagnetic valve (13), the vibration motor (15), the vacuum pump (17) and the pressure regulating valve (19).

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