Anti-vibration high-reliability optical module clamp
By designing a optical module fixture structure with card slots, spring clips, and heat dissipation micropillars, the vibration resistance and heat dissipation problems of the optical module fixture were solved, achieving highly reliable electrical connection and heat dissipation, and improving the vibration resistance and heat dissipation efficiency of the optical module.
Patent Information
- Application Number
- CN202520183910.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-06
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-02-06
AI Technical Summary
Existing optical module fixtures suffer from poor vibration resistance, complex structure, high cost, and insufficient heat dissipation performance, making it difficult to meet the heat dissipation requirements of high-density optical modules.
A light module fixture structure including a slot, a spring, a heat dissipation micropillar, and a cover plate was designed. The spring adopts an S-shaped arc structure and a high elastic modulus material. The silicone pad is used to fix the pins of the light module. The heat dissipation micropillar is made of a high thermal conductivity material. The cover plate contacts the light module to dissipate heat.
It achieves excellent vibration resistance and heat dissipation performance, ensuring stable electrical connection of optical modules in high vibration environments, extending service life, and reducing the complexity and cost of fixtures.
Smart Images
Figure CN223849100U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to optical module clamp technical field, concretely relates to a high reliable optical module clamp of anti -vibration. BACKGROUND
[0002] The optical module is a kind of integrated module for converting optical signal into electrical signal and / or converting electrical signal into optical signal, and plays an important role in optical fiber communication process.Optical module generates a large amount of heat when working, and the laser for generating or receiving optical signal in optical module has relatively strict temperature requirement, to ensure the normal operation of optical communication, the heat generated by optical module needs to be dissipated in time.However, with the increase of network product single board traffic, the high-density layout of optical module on single board is caused, thereby the optical module cascade heat dissipation problem is brought.In addition, some optical modules need to have high reliable anti-vibration performance and heat dissipation performance when testing and applying, and the optical module clamp in the prior art often has problems of poor anti-vibration performance, complex structure, high cost and the like. SUMMARY
[0003] The utility model aims at solving above-mentioned technical problem, proposes a kind of high reliable optical module clamp of anti -vibration, and structure is simple, ingenious, and anti-vibration performance, heat dissipation performance are all excellent.
[0004] To achieve the above-mentioned purposes of the present application, the technical scheme of the utility model is as follows:
[0005] A kind of high reliable optical module clamp of anti -vibration, including the base with clamping groove, and the cover plate with several heat dissipation micro columns, several elastic sheets are installed in the bottom of clamping groove, the clamping groove above elastic sheet is used to place optical module, optical module is installed and fixed in clamping groove by screw and respectively set screw hole on cover plate and base, the top of elastic sheet is equipped with the silica gel pad with conductivity and adhesion, and the pin of optical module is in contact with the silica gel pad on elastic sheet.
[0006] Further, the elastic sheet is S-shaped arc structure.
[0007] Further, the elastic sheet is arc structure with narrow top and wide bottom, and the elastic sheet is made of material with elastic modulus not less than 200GPa.
[0008] Further, the elastic sheet is welded to the bottom of clamping groove.
[0009] Further, the back of the base is connected with BGA ball.
[0010] Further, the base is multilayer substrate base.
[0011] Further, the base is welded on the mother board by BGA ball.
[0012] Further, the heat dissipation micro column is made of high thermal conductivity material.
[0013] Further, the heat dissipation micro column is made of high thermal conductivity material.
[0014] Further, the base is provided with an interface for passing the optical fiber tail fiber.
[0015] The utility model discloses beneficial effect has:
[0016] One, the utility model discloses a simple structure, ingenious, the anti-vibration high reliable optical module clamp of excellent anti-vibration performance, heat dissipation performance, the bottom of clamping groove is equipped with a plurality of elastic sheet, and the optical module is installed and fixed in the clamping groove through the screw and the screw hole of the cover plate and the base respectively, and the top of elastic sheet is equipped with the silica gel pad with conductivity and viscosity, and the pin of optical module contacts the silica gel pad on the elastic sheet, and the silica gel pad on the top of elastic sheet is bonded together with the pin of optical module, guarantees the pin of optical module to have viscosity with elastic sheet in high vibration, and does not fall off, and maintains electrical connection, and the cover plate contacts the top of optical module, can export the heat of optical module to the heat dissipation micro column, and then dissipates the heat.
[0017] Two, the utility model discloses a kind of elastic sheet of S-shaped arc structure of relatively optimal structure, excellent anti-vibration capacity, not easy to damage, long service life.
[0018] Three, the utility model discloses the arc structure of elastic sheet top narrow, bottom wide, so the elastic sheet of this structure is fixed in the bottom of clamping groove, and the elastic sheet is preferably made of material with elastic modulus not less than 200GPa.
[0019] Four, the utility model discloses heat dissipation micro column is made of high thermal conductivity material, guarantees that it has excellent heat dissipation performance, and heat dissipation micro column and cover plate integrated structure, convenient for installing and fixing optical module and clamp. DRAWINGS
[0020] Figure 1 It is the plan view of clamp base.
[0021] Figure 2 It is the structure diagram of elastic sheet part.
[0022] Figure 3 It is the side view of clamp.
[0023] Figure 4 It is the bottom view of clamp.
[0024] Figure 5 It is the structure diagram of the cover plate of clamp.
[0025] Figure 6 It is the structure diagram of clamp assembled with optical module.
[0026] The components are: 1. Base; 2. Card slot; 3. Heat dissipation micro-pillar; 4. Cover plate; 5. Spring; 6. Optical module; 7. Screw; 8. Screw hole; 9. Silicone pad; 10. BGA ball; 11. Motherboard; 12. Fiber optic pigtail; 13. Interface; 14. Gasket. Detailed Implementation
[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0028] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual pictures. They should not be construed as limiting the invention. To better illustrate the embodiments of the invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.
[0029] Example 1
[0030] A vibration-resistant, highly reliable optical module fixture, belonging to the field of optical module fixture technology, referenced... Figures 1-6 The device includes a base 1 with a slot 2 and a cover plate 4 with several heat dissipation micropillars 3. Several springs 5 are installed at the bottom of the slot 2. The slot 2 above the springs 5 is used to place the optical module 6. The optical module 6 is installed and fixed in the slot 2 by screws 7 and screw holes 8 opened on the cover plate 4 and the base 1 respectively. The top of the spring is provided with a conductive and adhesive silicone pad 9. The pins of the optical module 6 contact the silicone pad 9 on the spring 5.
[0031] This embodiment is the most basic implementation. The optical module 6 is installed in the base 1. The pins of the optical module 6 are in contact with the spring contact 5. The optical module 6 is fixed in the slot 2 by screws 7 and screw holes 8 opened on the cover plate 4 and the base 1 respectively. The cover plate 4 presses down on the optical module 6, restricting the range of motion of the optical module 6 in the base 1. The top of the spring contact 5 has a silicone pad 9 with adhesive and conductive functions, which can ensure that the pins of the optical module 6 are sticky to the spring contact 5 under high vibration, and do not fall off, thus maintaining electrical connection. This structural design effectively solves the application requirements of the optical module 6 in testing, application vibration resistance, heat dissipation and other applications. The cover plate 4 is in contact with the top of the optical module 6, and conducts the heat of the optical module 6 to the heat dissipation micro-pillar 3 to dissipate the heat.
[0032] Example 2
[0033] This embodiment is a further optimization on embodiment 1, the difference is that the elastic sheet 5 is in an S-shaped arc structure, which has better anti-vibration ability.
[0034] Embodiment 3
[0035] This embodiment is compared with embodiment 2, the difference is that the elastic sheet 5 is in an arc structure with narrow top and wide bottom, and the elastic sheet 5 is made of a material with an elastic modulus not less than 200GPa. Figure 3
[0036] Embodiment 4
[0037] This embodiment is compared with embodiments 1-3, the difference is that the elastic sheet 5 is welded to the bottom of the clamping groove 2.
[0038] Embodiment 5
[0039] This embodiment is compared with embodiments 1-4, the difference is that the back of the base 1 is connected with BGA balls 10, and the back of the base 1 is connected with BGA balls 10 to dissipate the electrical connection of the elastic sheet 5. Figure 2
[0040] Embodiment 6
[0041] This embodiment is compared with embodiments 1-5, the difference is that the base 1 is a multi-layer substrate base 1.
[0042] Embodiment 7
[0043] This embodiment is compared with embodiments 1-6, the difference is that the base 1 is welded to the motherboard 11 through BGA balls 10. Referring to Figure 6 , the base 1 of the clamp is fixedly installed on the motherboard 11 through screws 7, and a gasket 14 is placed at the fastening connection between the base 1 and the motherboard 11. In specific implementation, the base 1 can be welded to the motherboard 11 through reflow soldering, and the cover plate 4, the base 1 and the motherboard 11 are fixed together through the screw 7 and other structural members.
[0044] Embodiment 8
[0045] This embodiment is compared with embodiments 1-7, the difference is that the heat dissipation micro column 3 is made of a high thermal conductivity material.
[0046] Embodiment 9
[0047] This embodiment is compared with embodiments 1-8, the difference is that the heat dissipation micro column 3 is integrated with the cover plate 4 in an integrated structure.
[0048] Embodiment 10
[0049] This embodiment is compared with embodiments 1-9, the difference is that referring to Figure 6 An interface 13 is formed on the base 1 for passing the fiber tail 12.
[0050] Embodiment 11
[0051] In order to make the public understand the scheme, the embodiment takes a high-reliability optical module clamp with a better structure as an example to further illustrate the scheme.
[0052] Reference Figures 1-6 The clamp comprises a base 1 with a clamping groove 2 and a cover plate 4 with a plurality of heat dissipation micro columns 3. A plurality of elastic sheets 5 are installed at the bottom of the clamping groove 2. The clamping groove 2 above the elastic sheets 5 is used to place an optical module 6. The optical module 6 is installed and fixed in the clamping groove 2 through screws 7 and the cover plate 4 and the base 1 with screw holes 8 formed respectively. The top end of the elastic sheet 5 is provided with a conductive and adhesive silica gel pad 9. The pin of the optical module 6 is in contact with the silica gel pad 9 on the elastic sheet 5.
[0053] In the embodiment, the elastic sheet 5 is in an S-shaped arc structure. The elastic sheet 5 is in an arc structure with a narrow top end and a wide bottom end. The elastic sheet 5 is made of a material with an elastic modulus not less than 200 GPa. The elastic sheet 5 is welded to the bottom of the clamping groove 2.
[0054] In the embodiment, the back of the base 1 is connected with BGA balls 10. The base 1 is a multi-layer substrate base 1. The base 1 is welded to the mother board 11 through the BGA balls 10.
[0055] In the embodiment, the heat dissipation micro column 3 is made of a high-thermal-conductivity material. The heat dissipation micro column 3 is in an integrated structure with the cover plate 4.
[0056] In the embodiment, an interface 13 is formed on the base 1 for passing the fiber tail 12. The optical module 6 is connected with an optical fiber through the fiber tail 12.
[0057] In the embodiment, the elastic sheet 5 in an S-shaped arc structure is used as the main anti-vibration structure of the clamp. The high-return elastic sheet 5 is made of a material with an elastic modulus not less than 200 GPa. During installation, the elastic sheet 5 is first installed in the clamping groove 2 of the substrate. The elastic sheet 5 is welded to the clamping groove 2. The back of the substrate is connected with BGA balls 10. The cover plate 4 dissipates heat through the micro column structure. The cover plate 4 and the base 1 are connected and installed through the cooperation of the screws 7 and the screw holes 8 formed respectively on the cover plate 4 and the base 1.
[0058] The optical module 6 is installed in the base 1 and in contact with the elastic sheet 5. The cover plate 4 presses the optical module 6 to constrain the optical module 6 in the base 1. The top end of the elastic sheet 5 has a silica gel pad 9 with adhesive and conductive functions, which can ensure that the pin of the optical module 6 has adhesion with the elastic sheet 5 in high vibration and does not fall off, maintaining electrical connection. Such a structure design better solves the application requirements of the optical module 6 in testing, application anti-vibration, heat dissipation and other high-reliability applications.
Claims
1. A vibration-resistant, highly reliable optical module clamp, characterized in that: It includes base (1) with clamping slot (2), and cover plate (4) with several heat dissipation micro pillars (3), clamping slot (2) bottom is equipped with several elastic sheets (5), clamping slot (2) above elastic sheet (5) is used to place optical module (6), optical module (6) is fixed in clamping slot (2) through screw (7) and cover plate (4), base (1) respectively equipped with screw hole (8), elastic sheet (5) top end is equipped with conductive and adhesive silica gel pad (9), optical module (6) pin is contacted with elastic sheet (5) silica gel pad (9).
2. The high-reliability optical module clamp capable of resisting vibration according to claim 1, wherein: The elastic sheet (5) is S-shaped arc structure.
3. The anti-vibration high-reliability optical module holder of claim 2, wherein: The elastic sheet (5) is arc structure with narrow top and wide bottom, and the elastic sheet (5) is made of material with elastic modulus not less than 200GPa.
4. The high reliable optical module clamp capable of resisting vibration according to claim 2, wherein: The elastic sheet (5) is welded with the bottom of the clamping slot (2).
5. The high reliable optical module clamp capable of resisting vibration according to claim 1, wherein: The back of the base (1) is connected with BGA ball (10).
6. The anti-vibration high-reliability optical module holder of claim 5, wherein: The base (1) is multilayer substrate base (1).
7. The anti-vibration high-reliability optical module holder of claim 1, wherein: The base (1) is welded on the mother board (11) through BGA ball (10).
8. The high reliable optical module clamp with anti-vibration according to claim 1, wherein: The heat dissipation micro pillar (3) is made of high thermal conductivity material.
9. The anti-vibration high-reliability optical module holder of claim 8, wherein: The heat dissipation micro pillar (3) is integrated with the cover plate (4).
10. The high reliable optical module clamp of claim 1, wherein: The base (1) is equipped with interface (13) for passing through optical fiber tail fiber (12).