Wafer scheduling and transferring manipulator device

Abstract

The utility model discloses a wafer scheduling and transferring manipulator device, and belongs to the technical field of semiconductor manufacturing. The wafer dispatching and transferring mechanical arm device comprises a wafer clamping mechanism, the wafer clamping mechanism comprises a bottom plate, a driving part and at least two first rotating trays arranged at intervals, each first rotating tray comprises a first rotating rod and a first supporting bottom connected to the first rotating rod, and the first rotating rods are rotationally connected to the bottom plate; the driving part can drive the at least two first rotating rods to rotate at the same time, so that the first wafer can penetrate through the space between the at least two first rotating rods, or the at least two first supporting bases support the first wafer at the same time. The wafer dispatching and transferring manipulator device can adapt to the size change of wafers, has the advantages of low requirement on control precision and low failure rate, and is not easy to cause wafer pollution.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially relates to a wafer scheduling transfer manipulator device. BACKGROUND

[0002] Silicon carbide (SiC) technology has made significant progress in the past few years, and silicon carbide, as a high-efficiency, high-temperature-resistant and high-conductivity material, has brought new possibilities to the semiconductor field. Compared with traditional silicon-based semiconductors, SiC semiconductors exhibit better performance in high-temperature and high-voltage environments, which makes its application in power electronic devices extremely important.

[0003] The main contaminants on the surface of a silicon carbide polishing wafer are particles, metals, organic matter, moisture molecules and oxide films. For example, the Si surface of a single crystal polishing wafer can be covered with organic matter, making it difficult to remove the oxide film and related contaminants. High-level commercial devices require silicon carbide substrates to have a defect-free and ultra-clean surface. At the same time, clean, smooth and defect-free substrate wafers are also crucial for obtaining high-quality epitaxial layers subsequently.

[0004] The silicon carbide wafer cleaning equipment includes a wafer scheduling transfer manipulator device. When cleaning the wafer, the wafer scheduling transfer manipulator device is used to schedule and transfer the wafer in different process tanks. During the process of rough machining to finish machining of the silicon carbide wafer, there are often different sizes, such as 8-inch wafers with a diameter range of 205mm-230mm and 6-inch wafers with a diameter range of 155mm-162mm. In the prior art, the wafer scheduling transfer manipulator device uses edge clamping or bottom supporting to schedule and transfer the wafer. However, the edge clamping method cannot simultaneously accommodate multiple wafer sizes and may not be able to clamp the wafer, which requires high control precision and is prone to failure. The bottom supporting method has a large contact area with the bottom surface of the wafer, which can easily contaminate the wafer. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a wafer scheduling transfer manipulator device that can adapt to changes in wafer size, has low control precision requirements, low failure rate, and is less likely to contaminate the wafer.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] The wafer scheduling and transferring manipulator device comprises a clamping mechanism, the clamping mechanism comprises a base plate, a driving member and at least two spaced first rotary trays, the first rotary tray comprises a first rotating rod and a first tray bottom connected to the first rotating rod, the first rotating rod is rotationally connected to the base plate, the driving member can simultaneously drive at least two first rotating rods to rotate, so that a first wafer can pass through between at least two first rotating rods, or at least two first tray bottoms simultaneously support the first wafer.

[0008] In some possible embodiments, the clamping mechanism further comprises a first transmission module, the driving member simultaneously drives at least two first rotating rods to rotate through the first transmission module.

[0009] In some possible embodiments, the first transmission module comprises a first driving plate and at least two first transmission assemblies, the first transmission assembly is correspondingly arranged with the first rotary tray, the first transmission assembly is connected between the first driving plate and the base plate, the driving member drives the first driving plate, and the first driving plate drives the first rotary tray to rotate through the first transmission assembly.

[0010] In some possible embodiments, the first transmission assembly comprises a first rack and a first gear that are engaged with each other, the first gear is rotationally connected to the base plate, the first rotating rod is connected to the first gear, the first rack is connected to the first driving plate, and the driving member can drive the first driving plate to move.

[0011] In some possible embodiments, the clamping mechanism further comprises at least two second rotary trays, the second rotary tray comprises a second rotating rod and a second tray bottom connected to the second rotating rod, the second rotating rod is rotationally connected to the base plate; the distance between the first tray bottom and the base plate is greater than the distance between the second tray bottom and the base plate, and the first rotating rod is located outside the second rotating rod; the driving member can simultaneously drive at least two second rotating rods and at least two first rotating rods to rotate, so that a second wafer can pass through between at least two second rotating rods, or at least two second tray bottoms simultaneously support the second wafer.

[0012] In some possible embodiments, a base, a driving assembly and a mechanical arm are further included, the clamping mechanism is arranged on the mechanical arm, and the driving assembly is used to drive the mechanical arm to move in a vertical direction.

[0013] In some possible implementation manners, the clamping piece mechanism further comprises a first transmission module, a second transmission module and an adapter, the driving member is drivingly connected to the first transmission module and the second transmission module through the adapter, the driving member simultaneously drives at least two first rotating rods to rotate through the first transmission module, and the driving member simultaneously drives at least two second rotating rods to rotate through the second transmission module.

[0014] In some possible implementation manners, the second transmission module comprises a second driving plate and at least two second transmission assemblies, the second transmission assemblies are arranged in correspondence with the second rotating trays, the second transmission assemblies are connected between the second driving plate and the bottom plate, the driving member drives the second driving plate, and the second driving plate drives the second rotating trays to rotate through the second transmission assemblies.

[0015] In some possible implementation manners, the driving member is provided with a stroke detection member, and / or the bottom plate is provided with a wafer detection member on the side facing the first bottom.

[0016] In some possible implementation manners, the surface of the first bottom for contacting the first wafer is an inclined surface.

[0017] The wafer scheduling and transferring mechanical hand device has the advantages that:

[0018] The wafer scheduling and transferring mechanical hand device has the advantages that: BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a schematic diagram of the wafer scheduling and transferring mechanical hand device provided in the specific embodiment of the utility model;

[0020] Figure 2 is a partial schematic diagram of the wafer scheduling and transferring mechanical hand device provided in the specific embodiment of the utility model;

[0021] Figure 3 is a schematic diagram of the clamping piece mechanism provided in the specific embodiment of the utility model;

[0022] Figure 4is a schematic view of a first wafer supported by a clamping piece mechanism from a perspective provided by the embodiment of the utility model;

[0023] Figure 5 is a schematic view of a first wafer supported by a clamping piece mechanism from another perspective provided by the embodiment of the utility model.

[0024] In the figure,

[0025] 1, clamping piece mechanism;11, bottom plate;12, driving part;13, first rotary tray;131, first rotating rod;132, first bottom support;14, first transmission module;141, first driving plate;142, first transmission assembly;1421, first rack;1422, first gear;15, second rotary tray;151, second rotating rod;152, second bottom support;16, second transmission module;161, second driving plate;162, second transmission assembly;1621, second rack;1622, second gear;17, adapter;18, driving connection plate;19, guide rail;

[0026] 2, base;21, mounting seat;22, mounting plate;3, driving assembly;31, electric cylinder;32, hollow rotary platform;4, mechanical arm;41, support plate;42, reinforcing rib;5, motor;6, position sensor;61, mounting block;7, inductive sheet;8, cover;9, fixed plate;10, rotating shaft;20, wafer detection part;100, first wafer. Embodiment

[0027] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the embodiment of the utility model will be further described in detail below in conjunction with the drawings. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor belong to the protection scope of the utility model.

[0028] In the description of the utility model, unless another explicit provision and limitation, the terms "connected", "connected", "fixed" should be broad sense understanding, for example, can be fixed connection, can also be detachable connection, or integral;Can be mechanical connection, can also be electrical connection;Can be directly connected, can also be indirectly connected through the intermediate medium, can be the communication inside two elements or the interaction relationship of two elements. For the person skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] like Figures 1-5 As shown, this embodiment provides a wafer scheduling and transfer robot device, including a clamping mechanism 1. The clamping mechanism 1 includes a base plate 11, a driving member 12, and at least two spaced first rotating trays 13. The first rotating tray 13 includes a first rotating rod 131 and a first support 132 connected to the first rotating rod 131. The first rotating rod 131 is rotatably connected to the base plate 11. The driving member 12 can simultaneously drive at least two first rotating rods 131 to rotate, so that the first wafer 100 can pass between at least two first rotating rods 131, or at least two first supports 132 can simultaneously support the first wafer 100.

[0031] Optionally, the number of first rotating trays 13 can be two, three, four, or more. When two first rotating trays 13 are provided, they are arranged opposite each other along the diameter direction of the first wafer 100 to ensure the stability of the first wafer 100 on the two first supports 132. When more first rotating trays 13 are provided, the stability of the first wafer 100 during the scheduling and transfer process can be further guaranteed, but the structure is more complex and the cost is higher. Therefore, the number of trays can be set according to actual needs and is not limited. In this embodiment, four first rotating trays 13 are provided, and the driving member 12 can drive the first supports 132 of the four first rotating trays 13 to point simultaneously towards the center direction. The first rotating rod 131 is cylindrical, and the first supports 132 are long strips, which are connected in an L-shape.

[0032] For ease of description, the first support 132 pointing towards the center is inward, and pointing away from the center is outward.

[0033] First, the clamping mechanism 1 is located directly above the first wafer 100. The driving member 12 drives at least two first rotating trays 13 to rotate, so that the first support 132 faces outward. Then, the first wafer 100 passes between the first rotating rods 131. Finally, the driving member 12 drives at least two first rotating trays 13 to rotate, so that the first support 132 faces inward, and the first wafer 100 is supported on the first support 132.

[0034] By setting at least two spaced first rotating trays 13, the contact area with the first wafer 100 is reduced, and wafer pollution is not easy to cause. According to actual use requirements, for example, the first wafer 100 is an 8-inch wafer, and its diameter range is 205mm-230mm during processing, the length of the first bottom 132 and the spacing between the at least two first rotating trays 13 are extended, so that the size change of the 8-inch wafer during processing can be adapted, and the advantage of high compatibility of wafer size is achieved. Compared with the edge clamping method, the control precision requirement of the present scheme is low, and when the driving member 12 drives the first rotating tray 13 to rotate, even if there is deviation, the first wafer 100 can be normally supported and carried, and the advantages of low failure rate and high stability are achieved.

[0035] The first bottom 132 is used for the surface in contact with the first wafer 100, that is, the upper surface of the first bottom 132 is an inclined surface, and when the first wafer 100 is located on the first bottom 132, the inclined surface limits the edge of the first wafer 100, further ensuring the stability of the first wafer 100 during scheduling and transportation.

[0036] The clamping piece mechanism 1 further comprises a first transmission module 14, and the driving member 12 drives the at least two first rotating rods 131 to rotate through the first transmission module 14, thereby reducing the number of driving members 12, simplifying the structure, and reducing the cost. The first transmission module 14 comprises a first driving plate 141 and at least two first transmission assemblies 142, the first transmission assembly 142 is correspondingly arranged with the first rotating tray 13, the first transmission assembly 142 is connected between the first driving plate 141 and the bottom plate 11, the driving member 12 drives the first driving plate 141, and the first driving plate 141 drives the first rotating tray 13 to rotate through the first transmission assembly 142. The first transmission assembly 142 comprises a first rack 1421 and a first gear 1422 that are engaged with each other, the first gear 1422 is rotatably connected to the bottom plate 11, the first rotating rod 131 is connected to the first gear 1422, and the first rack 1421 is connected to the first driving plate 141. The driving member 12 can drive the first driving plate 141 to move.

[0037] In the embodiment, two first driving plates 141, four first transmission assemblies 142 are arranged, the four first transmission assemblies 142 correspond to the four first rotating trays 13, the four first transmission assemblies 142 are divided into two groups, two first transmission assemblies 142 correspond to one first driving plate 141, and the other two first transmission assemblies 142 correspond to the other first driving plate 141. By arranging the first driving plate 141, the number of the first transmission assemblies 142 is reduced. Specifically, two first racks 1421 are connected to both ends of the first driving plate 141, and the other two first racks 1421 are connected to both ends of the other first driving plate 141. The driving member 12 drives the movement of the two first driving plates 141, drives the simultaneous movement of the four first racks 1421, and drives the rotation of the four first gears 1422, that is, drives the rotation of the four first rotating trays 13. In other embodiments, the first transmission assembly 142 can be a combination structure of a worm gear and a worm, which is arranged and installed according to the structure of the first rack 1421 and the first gear 1422, and will not be described in detail.

[0038] In the prior art, the wafer scheduling and transfer manipulator device usually only supports the scheduling and transfer of a single size wafer. If different size wafers are needed to be produced, such as fixed 8-inch wafers (diameter 200mm) or fixed 6-inch wafers (diameter 150mm), corresponding wafer size cleaning equipment needs to be used, and the factory cost is extremely high. The jaw mechanism 1 further comprises at least two second rotating trays 15, the second rotating tray 15 comprising a second rotating rod 151 and a second bottom 152 connected to the second rotating rod 151, and the second rotating rod 151 being rotatably connected to the bottom plate 11. The distance between the first bottom 132 and the bottom plate 11 is greater than the distance between the second bottom 152 and the bottom plate 11, and the first rotating rod 131 is located outside the second rotating rod 151. The driving member 12 can simultaneously drive the rotation of the at least two second rotating rods 151 and the at least two first rotating rods 131, so that the second wafer can pass between the at least two second rotating rods 151, or the at least two second bottoms 152 simultaneously support the second wafer. The diameter of the first wafer 100 is greater than the diameter of the second wafer. For example, the first wafer 100 is an 8-inch wafer, and the diameter of the 8-inch wafer is in the range of 205mm-230mm. The second wafer is a 6-inch wafer, and the diameter of the 6-inch wafer is in the range of 155mm-162mm. By simultaneously driving the first rotating tray 13 and the second rotating tray 15 by the driving member 12, the number of the driving member 12 is further reduced, thereby simplifying the structure and reducing the cost.

[0039] Firstly, the size of the wafer is confirmed, that is, whether it is the first wafer 100 or the second wafer is confirmed; for example, when it is confirmed to be the second wafer, the clamping piece mechanism 1 is located directly above the second wafer, the driving member 12 drives the at least two first rotating trays 13 and the at least second rotating tray 15 to rotate, so that the first supporting bottom 132 and the second supporting bottom 152 are simultaneously directed to the outside; then, the first wafer 100 passes between the second rotating rods 151; finally, the driving member 12 drives the at least two first rotating trays 13 and the at least second rotating tray 15 to rotate, so that the first supporting bottom 132 and the second supporting bottom 152 are directed to the inside, and the second wafer is carried on the second supporting bottom 152. The first supporting bottom 132 and the second supporting bottom 152 realize the mode of double-layer rotating wafer supporting, which can simultaneously and infinitely compatibly schedule and transport two different sizes of wafers, for example, 8-inch wafers and 6-inch wafers, and the diameter range of the wafer that can be scheduled and transported reaches 155mm-230mm, with a large span. The above is an exemplary description, and the specific adjustment can be made according to the actual situation.

[0040] The clamping piece mechanism 1 first transmission module 14, second transmission module 16 and adapter 17, the driving member 12 drives the connection of the first transmission module 14 and the second transmission module 16 through the adapter 17, the driving member 12 drives the at least two first rotating rods 131 to rotate through the first transmission module 14 at the same time, the driving member 12 drives the at least two second rotating rods 151 to rotate through the second transmission module 16 at the same time. Through the adapter 17, the driving member 12 simultaneously drives the first transmission module 14 and the second transmission module 16 is realized, the driving member 12 drives the at least two second rotating rods 151 to rotate through the second transmission module 16 at the same time, reduces the use quantity of the driving member 12, thereby simplifying the structure and reducing the cost.

[0041] The second transmission module 16 comprises a second driving plate 161 and at least two second transmission assemblies 162, the second transmission assemblies 162 are arranged correspondingly with the second rotary tray 15, the second transmission assemblies 162 are connected between the second driving plate 161 and the bottom plate 11, the driving member 12 drives two second driving plates 161 simultaneously, the second driving plate 161 drives the second rotary tray 15 to rotate through the second transmission assembly 162. Exemplarily, referring to the structure of the first rotary tray 13 and the first transmission module 14, two second driving plates 161, four second rotary trays 15 and four second transmission assemblies 162 are arranged, the second transmission assembly 162 comprises a second rack 1621 and a second gear 1622 which are engaged with each other, two second racks 1621 are connected to two ends of one second driving plate 161, the other two second racks 1621 are connected to two ends of the other second driving plate 161, and the second rack 1621 moves with the second driving plate 161. Specifically, the adapter 17 is an adapter plate, the output end of the driving member 12, the two first driving plates 141 and the two second driving plates 161 are all connected to the adapter 17. Exemplarily, the driving member 12 is a micro-cylinder, the piston rod of the micro-cylinder is connected to the adapter 17. In other embodiments, the second transmission assembly 162 can also be a combination structure of a worm gear and a worm, which will not be described here.

[0042] The wafer scheduling and transferring manipulator device further comprises a base 2, a driving assembly 3, a motor 5 and a mechanical arm 4, the clamping piece mechanism 1 is arranged on the mechanical arm 4, the driving assembly 3 is used to drive the mechanical arm 4 to move in the vertical direction, and the motor 5 is used to drive the clamping piece mechanism 1 to rotate relative to the output end of the mechanical arm 4. Exemplarily, the driving assembly 3 comprises an electric cylinder 31 and a hollow rotating platform 32, the base 2 is slidably installed on a mounting seat 21 through a mounting plate 22, the hollow rotating platform 32 is installed on the base 2, the hollow rotating platform 32 drives the mechanical arm 4 to rotate in the horizontal plane through a rotating shaft 10, the electric cylinder 31 is installed on the mounting seat 21, and the electric cylinder 31 drives the hollow rotating platform 32 and the mechanical arm 4 to ascend and descend. The use steps comprise: after confirming the size of the wafer, it is confirmed whether it is the first wafer 100 or the second wafer, when it is confirmed that it is the first wafer 100, the driving assembly 3, i.e. the electric cylinder 31, drives the mechanical arm 4 and the clamping piece mechanism 1 to descend to a position above the first wafer 100 located on the first supporting plate 132 to pick up the wafer, when it is confirmed that it is the second wafer, the driving assembly 3, i.e. the electric cylinder 31, drives the mechanical arm 4 and the clamping piece mechanism 1 to descend to a position above the second wafer located on the second supporting plate 152 to pick up the wafer, the mechanical arm 4 and the clamping piece mechanism 1 are driven by the electric cylinder 31 to descend to the wafer picking position, so that the first wafer 100 and the second wafer can be respectively supported by the corresponding layer of the supporting plate. Then, the driving assembly 3 can realize the wafer scheduling and transferring of the mechanical arm 4.

[0043] Optionally, the wafer scheduling and transferring manipulator device further comprises a linear driving structure to drive the base 2 and the mechanical arm 4 on the base 2 to move in the horizontal direction, thereby increasing the degree of freedom.

[0044] Optionally, the mechanical arm 4 comprises a support plate 41 and a reinforcing rib 42 arranged on the support plate 41, the clamping piece mechanism 1 is installed on the support plate 41, and the reinforcing rib 42 is used to improve the structural strength of the support plate 41. One end of the support plate 41 is connected with a fixed plate 9, and the mechanical arm 4 is connected with the rotating shaft 10 through the fixed plate 9.

[0045] The motor 5 is fixed on the mechanical arm 4, the mounting block 61 is located on the outer periphery of the motor 5 and is fixed on the mechanical arm 4, the four position sensors 6 are uniformly spaced on the mounting block 61, the sensing sheet 7 is installed on the driving piece 12 and is located on the outer periphery formed by the four position sensors 6, when the motor 5 drives the clamping piece mechanism 1 to rotate relative to the output end of the mechanical arm 4, the corresponding position sensor 6 can detect the sensing sheet 7, so as to identify the angle position of the clamping piece mechanism 1 after being driven to rotate by the motor 5.

[0046] The outer periphery cover of the driving piece 12, i.e. the micro-cylinder, is provided with a cover 8, which plays a protection role.

[0047] Optionally, the mechanical arm 4 is connected with a driving connecting plate 18, the cylinder body of the driving piece 12, i.e. the micro-cylinder, and the guide rail 19 are installed on the output end of the motor 5 through the driving connecting plate 18, the piston rod of the micro-cylinder is connected with the adapter 17, and the adapter 17 is connected with a sliding block, which is slidingly connected with the guide rail 19, so as to ensure the movement accuracy of the adapter 17 and the meshing effect of the first transmission assembly 142 and the second transmission assembly 162.

[0048] The driving piece 12 is provided with a stroke detection piece, and / or the bottom plate 11 is provided with a wafer detection piece 20 on the side facing the first supporting bottom 132. The wafer detection piece 20, such as a visual recognition structure, can determine whether there is a wafer. When the driving piece 12 is a micro-cylinder, the stroke detection piece comprises two magnetic induction switches, which are one of the most common sensors on the cylinder. It works by relying on the magnetic ring on the cylinder piston ring. When the piston moves to the switch position, the magnetic ring makes the switch close, generating an electrical signal; when the magnetic ring leaves, the contact is disconnected, and the electrical signal disappears. This way can detect the position of the piston, so that the two magnetic induction switches are respectively used to detect the extension or retraction state of the micro-cylinder, so as to determine the direction of the first supporting bottom 132 and the second supporting bottom 152. For example, in the extended state, the first supporting bottom 132 and the second supporting bottom 152 face the inner side, and in the retracted state, the first supporting bottom 132 and the second supporting bottom 152 face the outer side.

[0049] The using steps include: driving the assembly 3, i.e. the hollow rotating platform 32, to drive the mechanical arm 4 and the clamping piece mechanism 1 to rotate, and driving the motor 5 to drive the clamping piece mechanism 1 to rotate, so that the clamping piece mechanism 1 is located above the wafer taking position; the stroke detection member detects the stroke state of the driving member 12; for example, when the stroke assembly detects that the driving member 12 is in the extended state, the driving member 12 is controlled to be retracted; at this time, the stroke detection member detects that the driving member 12 is in the retracted state, and the wafer grabbing action can be performed. Then, the wafer detection member 20 on the bottom plate 11 detects whether there is a wafer; when no wafer is detected, an alarm is sent; when the wafer is detected, the assembly 3 drives the mechanical arm 4 to descend to a suitable position. Finally, the driving member 12 is driven to be in the retracted state; at this time, the wafer is supported on the first supporting bottom 132 or the second supporting bottom 152, and the wafer grabbing reliability is improved.

[0050] Obviously, the above embodiments of the utility model are only examples for clearly explaining the utility model, and are not the limitation of the embodiments of the utility model. For ordinary skilled in the art, on the basis of the above description, other different forms of changes or variations can be made. Here, all the embodiments need not and cannot be exhausted. Any modification, equivalent replacement and improvement, etc. within the spirit and principle of the utility model should be included in the protection scope of the utility model claims.

Claims

1. A wafer dispatching transfer robot device, characterized by comprising: The clamp mechanism (1) comprises a base plate (11), a driving member (12) and at least two spaced first rotary trays (13), the first rotary tray (13) comprises a first rotating rod (131) and a first supporting bottom (132) connected to the first rotating rod (131), the first rotating rod (131) is rotationally connected to the base plate (11), and the driving member (12) can simultaneously drive at least two first rotating rods (131) to rotate, so that a first wafer (100) can pass between at least two first rotating rods (131), or at least two first supporting bottoms (132) simultaneously support the first wafer (100).

2. The wafer dispatching transfer robot apparatus according to claim 1, wherein The clamp mechanism (1) further comprises a first transmission module (14), and the driving member (12) simultaneously drives at least two first rotating rods (131) to rotate through the first transmission module (14).

3. The wafer dispatching transfer robot apparatus according to claim 2, wherein The first transmission module (14) comprises a first driving plate (141) and at least two first transmission assemblies (142), the first transmission assembly (142) is correspondingly arranged with the first rotary tray (13), the first transmission assembly (142) is connected between the first driving plate (141) and the base plate (11), the driving member (12) drives the first driving plate (141), and the first driving plate (141) drives the first rotary tray (13) to rotate through the first transmission assembly (142).

4. The wafer dispatching transfer robot apparatus according to claim 3, wherein The first transmission assembly (142) comprises a first rack (1421) and a first gear (1422) which are engaged with each other, the first gear (1422) is rotationally connected to the base plate (11), the first rotating rod (131) is connected to the first gear (1422), and the first rack (1421) is connected to the first driving plate (141). The driving member (12) can drive the first driving plate (141) to move.

5. The wafer dispatching transfer robot apparatus according to claim 1, wherein The clamp mechanism (1) further comprises at least two second rotary trays (15), the second rotary tray (15) comprises a second rotating rod (151) and a second supporting bottom (152) connected to the second rotating rod (151), and the second rotating rod (151) is rotationally connected to the base plate (11); the distance between the first supporting bottom (132) and the base plate (11) is greater than the distance between the second supporting bottom (152) and the base plate (11), and the first rotating rod (131) is located outside the second rotating rod (151); the driving member (12) can simultaneously drive at least two second rotating rods (151) and at least two first rotating rods (131) to rotate, so that a second wafer can pass between at least two second rotating rods (151), or at least two second supporting bottoms (152) simultaneously support the second wafer.

6. The wafer dispatching transfer robot apparatus according to claim 5, wherein The base (2), the driving assembly (3) and the mechanical arm (4) are further included, the clamp mechanism (1) is arranged on the mechanical arm (4), and the driving assembly (3) is used for driving the mechanical arm (4) to move in the vertical direction.

7. The wafer dispatching transfer robot apparatus according to claim 5, wherein The clamping piece mechanism (1) further comprises a first transmission module (14), a second transmission module (16) and an adapter (17), the driving member (12) is drivingly connected with the first transmission module (14) and the second transmission module (16) through the adapter (17), the driving member (12) simultaneously drives at least two first rotating rods (131) to rotate through the first transmission module (14), and the driving member (12) simultaneously drives at least two second rotating rods (151) to rotate through the second transmission module (16).

8. The wafer dispatching transfer robot apparatus according to claim 7, wherein The second transmission module (16) comprises a second driving plate (161) and at least two second transmission assemblies (162), the second transmission assemblies (162) are correspondingly arranged on the second rotating tray (15), the second transmission assemblies (162) are connected between the second driving plate (161) and the bottom plate (11), the driving member (12) drives the second driving plate (161), and the second driving plate (161) drives the second rotating tray (15) to rotate through the second transmission assemblies (162).

9. The wafer-handling robot apparatus of any of claims 1-8, wherein, The driving member (12) is provided with a stroke detection member, and / or the bottom plate (11) is provided with a wafer detection member (20) on a side facing the first supporting bottom (132).

10. The wafer-handling robot apparatus of any of claims 1-8, wherein, The surface of the first supporting bottom (132) for contacting the first wafer (100) is an inclined surface.

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