Optical cable detection equipment

Abstract

The utility model relates to the technical field of optical cable monitoring devices, in particular to optical cable detection equipment, which aims to solve the problem of poor heat dissipation, and comprises a shell, a main control board, a laser transmitter, a chip assembly, a heat absorption device, a first heat dissipation fan and a second heat dissipation fan, the shell is provided with an air inlet and an air outlet; the main control board is supported in the shell, the heat absorption device is connected with the main control board and the chip assembly in a heat conduction mode, and the chip assembly is arranged between the heat conduction face and the main control board. The heat absorption device is provided with a heat conduction face and a heat dissipation face which are arranged oppositely, an air guide device is arranged on the heat dissipation face corresponding to the chip assembly in position, the first heat dissipation fan is provided with a first air inlet and a first air outlet, the second heat dissipation fan is provided with a second air inlet and a second air outlet, and the first air outlet, the second air outlet and the air outlet are communicated with the air guide device. The first air outlet and the second air outlet face the heat dissipation face corresponding to the chip assembly.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of optical cable monitoring device, more particularly to an optical cable detection equipment. BACKGROUND

[0002] In the detection and maintenance of optical cable, it is usually necessary to measure the optical cable attenuation, joint loss, optical cable fault point positioning and understand the loss distribution along the length of the optical cable, etc. by means of optical cable detection equipment. The optical cable detection equipment can be applied in engineering acceptance, daily inspection, fault repair and inventory optical cable routing survey. Since the application range of the optical cable detection equipment is wide and the use scene is multiple, miniaturization is required to achieve the purpose of portability. However, the optical cable detection equipment usually includes circuit board, laser emitter, power supply and other heat generating devices. In order to maintain good working performance, it is particularly important to improve the heat dissipation level of the optical cable detection equipment. SUMMARY

[0003] The utility model aims at overcoming at least one defect of the prior art, and provides an optical cable detection equipment to solve the problem of poor heat dissipation.

[0004] The utility model takes the technical scheme that provides an optical cable detection equipment, including shell and main control board, laser emitter, chip assembly, heat absorption device, first heat dissipation fan and second heat dissipation fan arranged in the shell, the laser emitter, the chip assembly, the first heat dissipation fan, the second heat dissipation fan all are electrically connected with the main control board;

[0005] The shell is provided with an air inlet and an air outlet;

[0006] The main control board is supported in the shell, the heat absorption device has the heat conduction surface and the heat dissipation surface arranged oppositely, the heat conduction surface is in heat conduction connection with the main control board, the chip assembly is arranged between the heat conduction surface and the main control board, and the chip assembly is in heat conduction connection with the heat conduction surface;The first heat dissipation fan and the second heat dissipation fan are arranged on the heat dissipation surface corresponding to the position of the chip assembly, and the heat dissipation surface corresponding to the position of the chip assembly is provided with a wind guide device, the first heat dissipation fan is provided with a first air inlet and a first air outlet, the second heat dissipation fan is provided with a second air inlet and a second air outlet, the first air inlet and the second air inlet are guided into external air through the air inlet, and the first air outlet, the second air outlet and the air outlet are communicated with the wind guide device, wherein the first air outlet and the second air outlet are both towards the heat dissipation surface corresponding to the position of the chip assembly, and the wind guide device cooperates with the first heat dissipation fan and the second heat dissipation fan to guide air to pass through the heat dissipation surface corresponding to the position of the chip assembly, and make the air exhaust from the shell through the air outlet.

[0007] In the scheme, the first heat dissipation fan and the second heat dissipation fan can introduce external air through the air inlet, and the air guide device can guide and converge the two air flows, so that the two air flows pass through the heat dissipation surface corresponding to the position of the chip assembly together, thereby improving the air volume and cold quantity for heat dissipation of the chip assembly, and further accelerating the cooling rate of the chip assembly. In addition, the external air introduced by the first heat dissipation fan and the second heat dissipation fan can also accelerate the air flow in the space where the heat absorption device is located, thereby accelerating the heat dissipation of the heat absorbed by the heat absorption device from the main control board. The scheme can improve the cooling rate of the main control board and the chip assembly, two main heat generating devices, and effectively solve the problem of poor heat dissipation of the optical cable detection equipment.

[0008] In some embodiments, the air guide device includes an air guide cover that covers the heat dissipation surface corresponding to the position of the chip assembly, the air guide cover and the corresponding heat dissipation surface form an air guide chamber, and the air guide cover is provided with a first guide inlet, a second guide inlet and a guide outlet, which are all in communication with the air guide chamber. The first guide inlet is in communication with the first air outlet, the second guide inlet is in communication with the second air outlet, and the guide outlet is in communication with the air outlet.

[0009] In the scheme, the low-temperature air discharged through the first air outlet and the second air outlet is fully introduced into the air guide chamber through the first guide inlet and the second guide inlet. The low-temperature air can fully contact the heat dissipation surface corresponding to the chip assembly in the air guide chamber, and then the heat-exchanged air is sequentially discharged out of the shell through the guide outlet and the air outlet, achieving the purpose of rapidly cooling the chip assembly.

[0010] In some embodiments, the air guide cover includes a cover piece and a plurality of baffles. The plurality of baffles are protruded from the heat dissipation surface and arranged around the heat dissipation surface corresponding to the position of the chip assembly. The plurality of baffles form an opening on the side away from the heat dissipation surface, and the cover piece covers the opening. Wherein,

[0011] The baffles corresponding to the two sides of the first air outlet are arranged apart to form the first guide inlet;

[0012] The baffles corresponding to the two sides of the second air outlet are arranged apart to form the second guide inlet;

[0013] The baffles corresponding to the two sides of the air outlet are arranged apart to form the guide outlet.

[0014] In the scheme, the baffles form openings at positions corresponding to the first air outlet, the second air outlet and the air outlet, thereby forming the first guide inlet, the second guide inlet and the guide outlet. The baffles, the heat dissipation surface and the cover piece collectively form an air guide space, which is simple in structure and can meet the requirements of guiding and converging the two air flows.

[0015] In some embodiments, the cover is exposed to the outer surface of the shell through an exposing hole formed in the shell, and the connection between the cover and the shell is sealed.

[0016] In some embodiments, the chip assembly comprises a processing chip and a core board, both of which are arranged on the main control board and are in thermal connection with the heat-conducting surface.

[0017] The first and second inlets are arranged on both sides of the heat-conducting surface corresponding to the position of the processing chip, and the outlet is arranged on the heat-conducting surface corresponding to the position of the core board.

[0018] In some embodiments, the heat-conducting surface corresponding to the position of the chip assembly is provided with a plurality of first heat dissipation fins.

[0019] In some embodiments, at least part of the first heat dissipation fins are arranged on the heat-conducting surface close to the first inlet, and a first air guide gap is formed between adjacent first heat dissipation fins, and the openings at both ends of the first air guide gap are respectively directed towards the first inlet and the outlet.

[0020] In some embodiments, at least part of the first heat dissipation fins are arranged on the heat-conducting surface close to the second inlet, and a second air guide gap is formed between adjacent first heat dissipation fins, and the openings at both ends of the second air guide gap are respectively directed towards the second inlet and the outlet.

[0021] In some embodiments, at least part of the first heat dissipation fins are arranged on the heat-conducting surface close to the outlet, and a third air guide gap is formed between adjacent first heat dissipation fins, and the opening at the first end of the third air guide gap is directed towards the outlet, and the opening at the second end of the third air guide gap is directed towards the first inlet and / or the second inlet.

[0022] In some embodiments, the heat-conducting surface corresponding to the position of the first heat dissipation fan is provided with a plurality of second heat dissipation fins.

[0023] In some embodiments, the heat-conducting surface corresponding to the position of the second heat dissipation fan is provided with a plurality of third heat dissipation fins.

[0024] In some embodiments, a plurality of convection ports are arranged on each of two opposite sides of the shell, and the convection ports are used to guide the convection of air between the space inside the shell where the heat-conducting surface is located and the outside of the shell.

[0025] In some embodiments, an air guide member in communication with the air outlet is further provided.

[0026] In some embodiments, the heat-conducting surface corresponding to the position of the first heat-dissipating fan is in heat-conducting connection with the laser emitter.

[0027] In some embodiments, the heat-absorbing device comprises a first heat-dissipating plate, a second heat-dissipating plate and a third heat-dissipating plate, the first heat-dissipating plate has a first sub-heat-conducting surface and a first sub-heat-dissipating surface arranged oppositely, the second heat-dissipating plate has a second sub-heat-conducting surface and a second sub-heat-dissipating surface arranged oppositely, the third heat-dissipating plate has a third sub-heat-conducting surface and a third sub-heat-dissipating surface arranged oppositely, the heat-dissipating surface comprises the first sub-heat-dissipating surface, the second sub-heat-dissipating surface and the third sub-heat-dissipating surface, and the heat-conducting surface comprises the first sub-heat-conducting surface, the second sub-heat-conducting surface and the third sub-heat-conducting surface.

[0028] The first heat-dissipating plate and the second heat-dissipating plate are respectively arranged on two sides of the third heat-dissipating plate, the first sub-heat-conducting surface and the second sub-heat-conducting surface are respectively in heat-conducting connection with the main control board, the first sub-heat-dissipating surface is arranged with the first heat-dissipating fan, the second sub-heat-dissipating surface is arranged with the second heat-dissipating fan, the third sub-heat-conducting surface is in heat-conducting connection with the chip assembly, and the third sub-heat-dissipating surface is arranged with the air guiding device.

[0029] Compared with the prior art, the utility model discloses the beneficial effects are: through first heat-dissipating fan, second heat-dissipating fan and air guiding device cooperation, can drive two air current in the position corresponding to chip assembly's heat-dissipating surface to confluence, accelerate to chip assembly heat dissipation, and two air current can also accelerate the air current flow of heat-absorbing device's space, thereby promote main control board, chip assembly two main heat -generating device's heat dissipation level, to improve the performance of cable detection equipment. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is the structure diagram of the utility model.

[0031] Figure 2 It is Figure 1 the structure explosion map.

[0032] Figure 3 It is the local structure of the utility model Figure 1 .

[0033] Figure 4 It is Figure 3 the structure explosion map

[0034] Figure 5 It is the local structure of the utility model Figure 2 .

[0035] Reference numerals: Main housing 100, air inlet 110, air outlet 120, air guide 121, convection port 130, cover 200, exposure hole 210, main control board 300, first surface 310, second surface 320, through port 330, laser emitter 400, chip assembly 500, processing chip 510, core board 520, heat absorption device 600, heat conduction surface 610, heat dissipation surface 620, first heat sink 630, second heat sink 640, third heat sink 650, first Heat dissipation fins 651, first air guide gap 652, second air guide gap 653, third air guide gap 654, second heat dissipation fins 660, third heat dissipation fins 670, air flow channel 661, first cooling fan 700, first air inlet 710, first air outlet 720, second cooling fan 800, second air inlet 810, second air outlet 820, air guide cover 900, baffle 910, cover 920, first inlet 930, second inlet 940, outlet 950. Detailed Implementation

[0036] The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of this invention. To better illustrate the following embodiments, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0037] Example 1

[0038] like Figures 1-5 As shown, this embodiment provides an optical cable testing device, including a housing and a main control board 300, a laser emitter 400, a chip assembly 500, a heat absorption device 600, a first cooling fan 700 and a second cooling fan 800 disposed inside the housing. The laser emitter 400, the chip assembly 500, the first cooling fan 700 and the second cooling fan 800 are all electrically connected to the main control board 300.

[0039] The housing has an air inlet 110 and an air outlet 120;

[0040] The main control board 300 is supported inside the housing. Specifically, the main control board 300 has a first surface 310 and a second surface 320 arranged opposite to each other. In specific implementations, to improve the stability of the main control board 300, refer to... Figure 2 The four corners of the main control board 300 can be directly fixed to the housing using fasteners. At this time, the first surface 310 is attached to the inner surface of the housing. In addition, the heat absorption device 600 has a heat-conducting surface 610 and a heat dissipation surface 620 arranged opposite to each other. The second surface 320 of the main control board 300 is thermally connected to the heat-conducting surface 610. The chip assembly 500 is disposed between the heat-conducting surface 610 and the second surface 320, and the chip assembly 500 is thermally connected to the heat-conducting surface 610.

[0041] The first heat dissipation fan 700 and the second heat dissipation fan 800 are arranged on the heat dissipation surface 620 of the air guide device, and the heat dissipation surface 620 corresponding to the position of the chip assembly 500 is provided with the air guide device. The first heat dissipation fan 700 is provided with a first air inlet 710 and a first air outlet 720, and the second heat dissipation fan 800 is provided with a second air inlet 810 and a second air outlet 820. The first air inlet 710 and the second air inlet 810 are both guided into external air through the air inlet 110. The first air outlet 720, the second air outlet 820 and the air outlet 120 are all in communication with the air guide device, and the first air outlet 720 and the second air outlet 820 are both directed towards the heat dissipation surface 620 corresponding to the position of the chip assembly 500. The air guide device cooperates with the first heat dissipation fan 700 and the second heat dissipation fan 800 to guide air to pass through the heat dissipation surface 620 corresponding to the position of the chip assembly 500, and then make the air pass through the air outlet 120 to be discharged out of the shell.

[0042] In specific implementation, reference can be made to Figure 2 The chip assembly 500 is pressed on the heat conduction surface 610 by screws, spring buckles or other fixing members, and the chip assembly 500 is in surface contact with the heat conduction surface 610. In this way, the heat generated by the chip assembly 500 can be transmitted to the heat conduction surface 610. Preferably, in order to improve the heat transfer performance, heat-conducting silicone grease can also be applied to the contact surface between the chip assembly 500 and the heat conduction surface 610, or a heat-conducting gasket can be used to fill the gap between the chip assembly 500 and the heat conduction surface 610. In some other embodiments, an epoxy resin or a silica gel type heat-conducting adhesive can also be used to make the chip assembly 500 adhere to the heat conduction surface 610, which can also achieve the purpose of fixation and heat transfer. In some other embodiments, the chip assembly 500 and the heat conduction surface 610 can also be directly welded by metal solder to achieve fixation and heat conduction between them.

[0043] In specific implementation, in order to facilitate assembly, the shell includes a main shell part 100 provided with a mounting cavity and a cover 200 used for covering the opening of the main shell part 100. The main control board 300, the laser emitter 400, the chip assembly 500, the heat absorption device 600, the first heat dissipation fan 700 and the second heat dissipation fan 800 are all arranged in the mounting cavity of the main shell part 100.

[0044] In addition, in order to facilitate the loading and unloading, the heat absorption device 600 comprises a first heat dissipation plate 630, a second heat dissipation plate 640 and a third heat dissipation plate 650, the first heat dissipation plate 630 has a first sub-conductive surface and a first sub-dissipation surface arranged oppositely, the second heat dissipation plate 640 has a second sub-conductive surface 612 and a second sub-dissipation surface arranged oppositely, and the third heat dissipation plate 650 has a third sub-conductive surface and a third sub-dissipation surface arranged oppositely. In this embodiment, the conductive surfaces of the heat conduction device are collectively formed by the first sub-conductive surface, the second sub-conductive surface 612 and the third sub-conductive surface, and the heat dissipation surfaces of the heat conduction device are collectively formed by the first sub-dissipation surface, the second sub-dissipation surface and the third sub-dissipation surface. The first heat dissipation plate 630 and the second heat dissipation plate 640 are respectively arranged on the two sides of the third heat dissipation plate 650, the first sub-conductive surface and the second sub-conductive surface 612 are respectively in conductive connection with the second surface 320 of the main control board 300, the first heat dissipation fan 700 is arranged on the first sub-dissipation surface, the second heat dissipation fan 800 is arranged on the second sub-dissipation surface, the chip assembly 500 is in conductive connection with the third sub-conductive surface, and the air guide device is arranged on the third sub-dissipation surface. In order to achieve stable connection, the first heat dissipation plate 630, the second heat dissipation plate 640 and the third heat dissipation plate 650 are respectively tightly attached to the main control board 300 by connecting pieces. Specifically, the connecting pieces can be implemented by threaded connecting pieces. In other embodiments, the heat absorption device 600 can also be implemented by an integrally arranged heat dissipation plate. Preferably, in order to facilitate the layout, the air guide device is arranged on the middle part of the surface of the heat dissipation plate opposite to the main control board 300, and the first heat dissipation fan 700 and the second heat dissipation fan 800 are respectively arranged on the two sides of the air guide device.

[0045] In some embodiments, the first heat dissipation plate 630, the second heat dissipation plate 640 and the third heat dissipation plate 650 are in conductive connection with each other. In this way, the heat absorbed by the three heat dissipation plates can be conducted to each other. It can be understood that this embodiment helps to promote the heat dissipation of the heat generating devices inside the optical cable detection device. In other embodiments, the first heat dissipation plate 630, the second heat dissipation plate 640 and the third heat dissipation plate 650 can be arranged separately. In this way, the two air currents guided by the air guide device are almost only used for dissipating heat from the third heat dissipation plate 640. It can be understood that this embodiment can improve the cooling rate of the chip assembly 500.

[0046] In operation, the first heat dissipation fan 700 and the second heat dissipation fan 800 both introduce external air through the air inlet 110. Since the devices inside the optical cable detection equipment generate heat during operation, the temperature inside the shell rises. Generally, the temperature of the external air is lower than that of the shell. The air guide device can guide and combine the two air flows, so that the two air flows pass through the heat dissipation surface 620 corresponding to the position of the chip assembly 500 together. In this way, the air volume and cold quantity for dissipating heat from the chip assembly 500 can be increased, and the cooling rate of the chip assembly 500 can be further accelerated. In addition, the external air introduced by the first heat dissipation fan 700 and the second heat dissipation fan 800 can also accelerate the air flow in the space where the heat absorption device 600 is located, thereby accelerating the heat dissipation of the heat absorbed by the heat absorption device 600 from the main control board 100. As can be seen, the optical cable detection equipment can improve the cooling rate of the two main heat generating devices, i.e., the main control board 300 and the chip assembly 500, and solve the problem of poor heat dissipation of the optical cable detection equipment. It is easy to understand that, with reference to Figure 2 , if the optical cable detection equipment further includes other devices with high heat generation, such as light-emitting diodes, built-in power supplies, etc., the heat generating devices can be arranged in a similar manner to the chip assembly 500, for example, the heat generating devices are also arranged between the third heat dissipation plate 650 and the main control board 300 and are in thermal connection with the heat dissipation surface 610 of the third heat dissipation plate 650, so as to improve the heat dissipation efficiency by means of the air guide device, so that the optical cable detection equipment maintains good working performance.

[0047] With reference to Figures 2-3 , 5, the air guide device includes an air guide cover 900, the air guide cover 900 covers the heat dissipation surface 620 corresponding to the position of the chip assembly 500, the air guide cover 900 and the corresponding heat dissipation surface 620 form an air guide chamber, and the air guide cover 900 is provided with a first guide inlet 930, a second guide inlet 940 and a guide outlet 950 which are all in communication with the air guide chamber, wherein the first guide inlet 930 is in communication with the first air outlet 720, the second guide inlet 940 is in communication with the second air outlet 820, and the guide outlet 950 is in communication with the air outlet 120.

[0048] With reference to Figure 2 , 5 , in specific implementation, the air guide device includes a plurality of baffles 910 and a cover 920, the plurality of baffles 910 are protrudingly arranged on the heat dissipation surface 620 and surround the heat dissipation surface 620 corresponding to the position of the chip assembly 500, the baffles 910 form an opening on the side away from the heat dissipation surface 620, and the cover 920 covers the opening, wherein the baffles 910 corresponding to the two sides of the first air outlet 720 are arranged apart to form the first guide inlet 930; the baffles 910 corresponding to the two sides of the second air outlet 820 are arranged apart to form the second guide inlet 940; and the baffles 910 corresponding to the two sides of the air outlet 120 are arranged apart to form the guide outlet 950.

[0049] In implementation, referring to Figure 4 , the baffle 910 is arranged around the third heat dissipation surface of the third heat dissipation plate 650. In order to improve the heat dissipation effect, the baffle 910 and the cover 920 are made of materials with good heat conduction performance, such as aluminum, copper and the like. In some embodiments, referring to Figure 2 , the cover 920 can be embedded on the cover body 200, the cover body 200 is provided with an exposure hole 210 for exposing the cover body 200, and the connection between the cover 920 and the cover body 200 is sealed. In this way, the cover 920 can be exposed on the outer surface of the cover body 200, improving the heat exchange level, and preventing air in the air guide device from leaking from the connection, so as to maintain a high air volume and coldness in the air guide device, thereby efficiently cooling the chip assembly 500.

[0050] Continuing to refer to Figures 3-5 , in order to make full use of the air discharged from the first air outlet 720 and the second air outlet 820, the first air outlet 720 is in sealed connection with the first guide inlet 930, the second air outlet 820 is in sealed connection with the second guide inlet 940, and the guide outlet 950 is in connection with the air outlet 120. In this way, air leakage from the connection to the outside of the air guide device can be prevented, the air intake of the internal space of the air guide device is improved, so that the low-temperature air introduced from the outside can fully contact the heat dissipation surface 620 of the third heat dissipation plate 650, and then pass through the guide outlet 950 and the air outlet 120 in turn to be discharged from the shell, achieving the purpose of rapidly cooling the chip assembly 500.

[0051] Referring to Figure 5 , the first guide inlet 930 and the second guide inlet 940 are both directed towards the guide outlet 950. In implementation, the first guide inlet 930 and the second guide inlet 940 can be directly opposite the guide inlet, or can be inclined towards the guide outlet 950, as long as the airflow can flow smoothly from the first guide inlet 930 and the second guide inlet 940 to the guide outlet 950.

[0052] Referring to Figure 2 , 5 , in implementation, the chip assembly 500 can specifically include a processing chip 510 and a core board 520, the processing chip 510 and the core board 520 are arranged on the main control board 300, and the processing chip 510 and the core board 520 are in heat conduction connection with the heat conduction surface 610 of the heat conduction device 600, the first guide inlet 930 and the second guide inlet 940 are respectively arranged on both sides of the heat dissipation surface 620 corresponding to the position of the processing chip 510, and the guide outlet 950 is arranged on the heat dissipation surface 620 corresponding to the position of the core board 520.

[0053] Referring to Figures 4-5In order to improve the heat dissipation performance, the heat dissipation surface 620 corresponding to the position of the chip assembly 500 is provided with a plurality of first heat dissipation fins 651. Specifically, the plurality of first heat dissipation fins 651 are arranged on the heat dissipation surface 620 of the third heat dissipation plate 650.

[0054] With reference to the foregoing Figure 5 In some embodiments, at least part of the first heat dissipation fins 651 are arranged on the heat dissipation surface 620 close to the first air inlet 930, and a first air guide gap 652 is formed between adjacent first heat dissipation fins 651. The openings at both ends of the first air guide gap 652 are respectively directed towards the first air inlet 930 and the air outlet 950.

[0055] In some embodiments, at least part of the first heat dissipation fins 651 are arranged on the heat dissipation surface 620 close to the second air inlet 940, and a second air guide gap 653 is formed between adjacent first heat dissipation fins 651. The openings at both ends of the air guide gap are respectively directed towards the second air inlet 940 and the air outlet 950.

[0056] In some embodiments, at least part of the first heat dissipation fins 651 are arranged on the heat dissipation surface 620 close to the air outlet 950, and a third air guide gap 654 is formed between adjacent first heat dissipation fins 651. The opening at the first end of the third air guide gap 654 is directed towards the air outlet 950, and the opening at the second end of the third air guide gap 654 is directed towards the first air inlet 930 and / or the second air inlet 940.

[0057] It can be understood that the first heat dissipation fins 651 can increase the heat dissipation area of the third heat dissipation plate 650, and by arranging the first heat dissipation fins 651 to form the first air guide gap 652, the second air guide gap 653 and the third air guide gap 654, the first heat dissipation fins 651 can avoid blocking the airflow, thereby improving the circulation efficiency of the air in the air guide device.

[0058] With reference to the foregoing Figures 1-2 On two opposite sides of the shell, a plurality of convection ports 130 are arranged respectively. The convection ports 130 are all connected to the internal space of the shell where the heat absorption device 600 is located, so that the convection ports can guide the air to flow between the internal space of the shell where the heat dissipation surface 620 is located and the outside of the shell.

[0059] With reference to the foregoing Figure 2 , 4The heat dissipation surface 620 corresponding to the position of the first heat dissipation fan 700 is provided with a plurality of second heat dissipation fins 660, and / or the heat dissipation surface 620 corresponding to the position of the second heat dissipation fan 800 is provided with a plurality of third heat dissipation fins 670. In a specific implementation, gaps are provided between adjacent second heat dissipation fins 660 and / or adjacent third heat dissipation fins 670 to form air flow channels 661. In order to improve the air convection efficiency, the convection ports 130 are respectively arranged on the side surfaces of the shell corresponding to the openings of the air flow channels 661. In a preferred embodiment, referring to Figures 1-2 In order to avoid air flow interference, the air inlets 110 and the air outlets 120 are arranged on the cover body 200, and the convection ports 130 are arranged on the opposite two side surfaces of the main shell part 100. Among them, corresponding to the first heat dissipation fan and the second heat dissipation fan, two air inlets 110 are arranged on the cover body 200, and the two air inlets 110 are respectively communicated with the first air inlet 710 and the second air inlet 810.

[0060] Referring to Figures 1-4 In some embodiments, the air outlet 120 is connected with a wind guide 121, and in a specific implementation, the wind guide 121 is a pipe connected with the air outlet 120. In some embodiments, in order to improve the connection strength, the first end of the pipe extends into the shell interior through the air outlet 120 and is communicated with the guide outlet 950, and the second end of the pipe extends out of the shell, so that the air output from the guide outlet 950 can be output to the shell exterior under the guidance of the wind guide 121, so that the air flows in an orderly and stable manner.

[0061] Referring to Figure 2 In some embodiments, the heat conduction surface 610 corresponding to the position of the first heat dissipation fan 700 is in heat conduction connection with the laser emitter 400, and in a specific implementation, a plurality of laser emitters 400 are arranged, and the main control board 300 is provided with a through hole 330 for exposing at least one surface of the laser emitter 400, so that the laser emitter 400 is in heat conduction connection with the heat absorption device 600 through the through hole 330. At this time, the surface of the laser emitter 400 facing away from the heat absorption device 600 can be arranged in the main shell part 100 to improve the installation stability, and the laser emitter 400 can overlap with the main control board 300 in the thickness direction, which helps to reduce the thickness size of the optical cable detection equipment and improve the portability.

[0062] It can be understood that, since the heat generation of the laser emitter 400 is large when it is working, the laser emitter 400 is directly in heat conduction contact with the heat conduction surface 610 of the heat absorption device 600, which can improve the heat transfer efficiency, and then the hot air is driven out of the shell interior by the first heat dissipation fan 700 or the second heat dissipation fan 800.

[0063] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the technical solutions of the present application, and are not intended to limit the specific implementation manners of the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application claims shall be included in the protection scope of the present application claims.

Claims

1. An optical cable detection apparatus, characterized by, The shell is provided with an air inlet and an air outlet. The main control board is supported in the shell, the heat absorbing device has a heat conducting surface and a heat radiating surface arranged oppositely, the heat conducting surface is in heat conducting connection with the main control board, the chip assembly is arranged between the heat conducting surface and the main control board and is in heat conducting connection with the heat conducting surface, the first heat radiating fan and the second heat radiating fan are arranged on the heat radiating surface corresponding to the position of the chip assembly, the heat radiating surface corresponding to the position of the chip assembly is provided with a wind guiding device, the first heat radiating fan is provided with a first air inlet and a first air outlet, the second heat radiating fan is provided with a second air inlet and a second air outlet, the first air inlet and the second air inlet introduce external air through the air inlet, the first air outlet, the second air outlet and the air outlet are in communication with the wind guiding device, wherein the first air outlet and the second air outlet are directed to the heat radiating surface corresponding to the position of the chip assembly, the wind guiding device cooperates with the first heat radiating fan and the second heat radiating fan to guide air to pass through the heat radiating surface corresponding to the position of the chip assembly and to be discharged from the shell through the air outlet. The wind guiding device comprises a wind guiding cover, the wind guiding cover covers the heat radiating surface corresponding to the position of the chip assembly, the wind guiding cover and the corresponding heat radiating surface enclose a wind guiding chamber, the periphery of the wind guiding cover is provided with a first guide inlet, a second guide inlet and a guide outlet in communication with the wind guiding chamber, wherein the first guide inlet is in communication with the first air outlet, the second guide inlet is in communication with the second air outlet, and the guide outlet is in communication with the air outlet.

2. The optical cable detection apparatus of claim 1, wherein, The wind guiding cover comprises a cover piece and a plurality of baffles, the baffles are protruded from the heat radiating surface and enclose the periphery of the heat radiating surface corresponding to the position of the chip assembly, the baffles form an opening on the side away from the heat radiating surface, and the cover piece covers the opening; wherein, 3. The optical cable detection apparatus of claim 2, wherein, The baffles corresponding to the two sides of the first air outlet are arranged apart to form the first guide inlet; The baffles corresponding to the two sides of the second air outlet are arranged apart to form the second guide inlet; The baffles corresponding to the two sides of the air outlet are arranged apart to form the guide outlet. The cover piece is exposed on the outer surface of the shell through an exposing hole formed in the shell, and the connection between the cover piece and the shell is sealed.

4. The optical cable detection apparatus of claim 3, wherein, The chip assembly comprises a processing chip and a core board, the processing chip and the core board are arranged on the main control board and are in heat conducting connection with the heat conducting surface; 5. The optical cable detection apparatus of any of claims 2-4, wherein, The first guide inlet and the second guide inlet are arranged on the two sides of the heat radiating surface corresponding to the position of the processing chip, and the guide outlet is arranged on the heat radiating surface corresponding to the position of the core board. ​ 6. The optical cable detection apparatus of any of claims 2-4, wherein, The heat dissipation surface corresponding to the position of the chip assembly is provided with a plurality of first heat dissipation fins.

7. The optical cable detection apparatus of claim 6, wherein, At least part of the first heat dissipation fins are arranged on the heat dissipation surface close to the first inlet, and a first air guide gap is formed between adjacent first heat dissipation fins, and the openings at both ends of the first air guide gap are respectively directed towards the first inlet and the outlet; and / or, At least part of the first heat dissipation fins are arranged on the heat dissipation surface close to the second inlet, and a second air guide gap is formed between adjacent first heat dissipation fins, and the openings at both ends of the second air guide gap are respectively directed towards the second inlet and the outlet; and / or, At least part of the first heat dissipation fins are arranged on the heat dissipation surface close to the outlet, and a third air guide gap is formed between adjacent first heat dissipation fins, and the opening at the first end of the third air guide gap is directed towards the outlet, and the opening at the second end of the third air guide gap is directed towards the first inlet and / or the second inlet.

8. The optical cable detection apparatus of any of claims 1-4, wherein, The heat dissipation surface corresponding to the position of the first heat dissipation fan is provided with a plurality of second heat dissipation fins; and / or, The heat dissipation surface corresponding to the position of the second heat dissipation fan is provided with a plurality of third heat dissipation fins; and / or, The shell is provided with a plurality of convection ports on two opposite sides respectively, and the convection ports are used to guide air convection between the inside space of the shell where the heat dissipation surface is located and the outside of the shell; and / or, A wind guide member in communication with the air outlet is further provided.

9. The optical cable detection apparatus of any of claims 1-4, wherein, The heat conduction surface corresponding to the position of the first heat dissipation fan is in heat conduction connection with the laser emitter.

10. The optical cable detection apparatus of any of claims 1-4, wherein, The heat absorption device includes a first heat dissipation plate, a second heat dissipation plate and a third heat dissipation plate, the first heat dissipation plate has a first sub-heat dissipation surface and a first sub-heat dissipation surface arranged oppositely, the second heat dissipation plate has a second sub-heat dissipation surface and a second sub-heat dissipation surface arranged oppositely, and the third heat dissipation plate has a third sub-heat dissipation surface and a third sub-heat dissipation surface arranged oppositely, the heat dissipation surface includes the first sub-heat dissipation surface, the second sub-heat dissipation surface and the third sub-heat dissipation surface, and the heat conduction surface includes the first sub-heat dissipation surface, the second sub-heat dissipation surface and the third sub-heat dissipation surface. The first heat dissipation plate and the second heat dissipation plate are arranged on both sides of the third heat dissipation plate respectively, the first sub-heat dissipation surface and the second sub-heat dissipation surface are in heat conduction connection with the main control board respectively, the first sub-heat dissipation surface is provided with the first heat dissipation fan, the second sub-heat dissipation surface is provided with the second heat dissipation fan, the third sub-heat dissipation surface is in heat conduction connection with the chip assembly, and the third sub-heat dissipation surface is provided with the air guide device.

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