Miniaturized high-temperature-resistant reflow soldering optical module

Abstract

The utility model discloses a miniaturized high-temperature-resistant reflow-solderable optical module, which relates to the technical field of microsystem optical modules and comprises a substrate, an optical fiber array and a concave mounting sheet. A digging cavity is formed in the substrate, a driver and an amplifier are bonded in the digging cavity, and filler I is filled and solidified in the digging cavity, and the driver and the amplifier are connected with the substrate through gold wire bonding and are connected with a laser and a detector; the optical fiber array is plated with gold and assembled on the substrate, and the optical fiber array is coupled with the laser and the detector; the concave mounting sheet is assembled on the optical fiber array and is welded with the optical fiber array and the substrate, and a gap between the concave mounting sheet and the optical fiber array is filled and cured with a filler II. According to the utility model, a high-temperature-resistant material and a novel fiber array FA coupling fixing mode are adopted, so that the stability of a coupling structure under reflow soldering and high-temperature application is ensured, and the optical module outputs stable optical power and relatively high sensitivity.

Description

TECHNICAL FIELD

[0001] The utility model relates to microsystem optical module technical field more specifically relates to a miniaturized high temperature resistant reflow solderable optical module. BACKGROUND

[0002] The optical module is the photoelectric and electro-optical conversion optoelectronic device.

[0003] Specifically, the sending interface inputs a certain code rate of electric signal, and the corresponding rate of modulated light signal is emitted by the driven semiconductor laser (LD) or light emitting diode (LED) after the internal drive chip processing, and the receiving interface converts the optical signal into the electric signal by the light detection diode, and the corresponding code rate of electric signal is output after the preamplifier.

[0004] In the prior art, the coupling structure of the conventional optical module is unstable under reflow soldering and high temperature application, so that the optical power output by the optical module is unstable and the sensitivity is low. UTILITY MODEL CONTENT

[0005] In order to overcome the defects in the prior art, the utility model discloses a miniaturized high temperature resistant reflow solderable optical module, the laser, the driver, the detector and the amplifier are bonded at the specified position of the substrate, and the coordinate position of the fiber array FA is confirmed through the online coupling mode;A specially-made fiber array FA plated with gold on the surface is used, and a concave mounting sheet is fixed around the FA;The mounting sheet is welded on the surface of the FA through ultrasonic / laser welding, and the pin of the concave sheet is welded on the substrate;The gap between the concave sheet and the FA is filled with filler, and is heated and solidified;The cover plate is bonded on the substrate, the place where the tail fiber extends is injected with glue again, and finally the whole is heated and solidified to complete the packaging.

[0006] In order to achieve the above purpose, the utility model adopts the technical scheme of:

[0007] A miniaturized high temperature resistant reflow solderable optical module, comprising a substrate, a fiber array and a concave mounting sheet.

[0008] The substrate is provided with a cavity, the cavity is bonded with a driver and an amplifier and filled with a filler I, the driver and the amplifier are connected with the substrate through gold wire bonding, and are connected with a laser and a detector.

[0009] The optical fiber array is plated with gold and assembled on the substrate, the optical fiber array is coupled with the laser and the detector; the concave mounting sheet is assembled on the optical fiber array and welded with the optical fiber array and the substrate, and the gap between the concave mounting sheet and the optical fiber array is filled and solidified with the filler II.

[0010] Preferably, the substrate is covered with a cover plate, the optical fiber array is connected with optical fiber pigtails, the optical fiber pigtails extend out of the cover plate and the substrate, and the gap between the optical fiber pigtails and the cover plate and the substrate is filled with an adhesive layer.

[0011] Preferably, the inner side top surface of the concave mounting sheet and the gold-plated surface of the optical fiber array, and the pin of the concave mounting sheet and the substrate are provided with ultrasonic or laser welding points.

[0012] Preferably, the depth of the cavity is higher than the height of the driver and the amplifier.

[0013] Preferably, the bottom surface of the substrate is provided with a substrate pad and a substrate heat dissipation surface.

[0014] Preferably, the front surface of the substrate is provided with a micro control unit and a capacitor.

[0015] Preferably, the size of the optical module is 18mm*8mm*3.5mm.

[0016] The beneficial effects of the utility model are as follows:

[0017] The optical module provided by the utility model has the advantages that the high-temperature-resistant material and the novel optical fiber array FA coupling fixing mode are adopted, the coupling structure stability under reflow soldering and high-temperature application is ensured, the stable optical power and the high sensitivity of the optical module output are ensured. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the side view of the optical module of the utility model;

[0019] Figure 2 It is the top view of the optical module of the utility model;

[0020] Figure 3 It is the optical fiber direction axial section view of the optical module of the utility model;

[0021] Figure 4 It is the bottom view of the optical module of the utility model;

[0022] Figure 5 It is the size of the optical module of the utility model;

[0023] Figure 6 It is the height of the optical module of the utility model.

[0024] Reference signs:

[0025] 1, filler II; 2, concave mounting piece; 3, welding point; 4, cover plate; 5, driver; 6, amplifier; 7, laser; 8, detector; 9, fiber tail fiber; 10, substrate pad; 11, substrate heat dissipation surface; 12, substrate; 13, micro control unit; 14, capacitor; 15, filler I; 16, fiber array; 17, glue injection layer. DETAILED DESCRIPTION

[0026] The concept, specific structure and generated technical effects of the present application will be described clearly and completely in combination with the embodiments and drawings, so as to fully understand the purpose, features and effects of the present application.

[0027] A small high-temperature-resistant reflow solderable optical module, as shown in Figures 1-6 includes a substrate 12, a fiber array FA16 and a concave mounting piece 2;

[0028] The substrate 12 is provided with a cavity, the driver 5 and the amplifier 6 are bonded in the cavity, and the filler I 15 is filled and solidified in the cavity; the depth of the cavity is higher than the height of the driver 5 and the amplifier 6; the driver 5 and the amplifier 6 are connected with the substrate 12 through gold wire bonding, and are connected with the laser 7 and the detector 8;

[0029] The fiber array 16 is gold-plated and assembled on the substrate 12, and the fiber array 16 is coupled with the laser 7 and the detector 8; the concave mounting piece 2 is assembled on the fiber array 16 and is welded with the fiber array 16 and the substrate 12, and the gap between the concave mounting piece 2 and the fiber array 16 is filled and solidified with the filler II 1.

[0030] In this embodiment, the substrate 12 adopts a multi-layer substrate, and a cavity is designed at the place where the driver 5 and the amplifier 6 are bonded. The depth of the cavity is slightly higher than the height of the chip. The driver 5 and the amplifier 6 are bonded at the cavity, and the signals are linked with the substrate 12, the laser 7 and the detector 8 through gold wire bonding. The cavity is filled with filler and solidified.

[0031] In this embodiment, the gold-plated fiber array FA16 is coupled with the laser 7 and the detector 8 through online coupling, and the coupling position and the pre-solidification position are determined. The concave mounting piece 2 is installed at the position of the fiber array FA16, and the inner top surface of the concave mounting piece 2 is welded with the gold-plated surface of the fiber array FA16 through ultrasonic or laser welding, and the pin of the concave mounting piece 2 and the substrate 12 are welded together, and are provided with ultrasonic or laser welding points 3. The gap between the fiber array FA16 and the concave mounting piece 2 is filled with filler, and is heated and solidified after filling.

[0032] In the embodiment, the fiber array FA16 is gold-plated and high-temperature resistant, the gold-plated surface is welded with the concave mounting sheet 2, and the material of the high-temperature resistant fiber array FA16 is a silicon wafer or quartz glass.

[0033] As shown in Figure 1 The fiber array 16 is connected with the fiber pigtail 9, the fiber pigtail 9 extends out of the cover plate 4 and the substrate 12, and the gap between the fiber pigtail 9 and the cover plate 4 and the substrate 12 is filled with the glue injection layer 17. The cover plate 4 is bonded to cover the substrate 12, and the gap at the place where the fiber pigtail 9 extends out is filled by the glue injection mode, so as to ensure the stability of the fiber pigtail.

[0034] The fiber array FA16 is gold-plated and high-temperature resistant, and the concave mounting sheet 2 and the filler coupling fixing mode are arranged, so that the optical module is high-temperature resistant and stable in structure, the coupling structure is stable under reflow soldering and high-temperature application, and the optical module has stable optical power and high sensitivity.

[0035] As shown in Figure 4 The bottom surface of the substrate 12 is provided with the substrate pad 10 and the substrate heat dissipation surface 11.

[0036] As shown in Figure 1 And 2 The front surface of the substrate 12 is provided with the micro control unit 13 and the capacitor 14.

[0037] As shown in Figure 5 And Figure 6 The size of the optical module is 18mm*8mm*3.5mm.

[0038] In order to better understand the utility model, the working principle of the utility model is described once completely as follows:

[0039] As shown in Figures 1-6As shown, the driver 5 and the amplifier 6 are bonded in the cavity of the substrate 12, are interconnected with the substrate 12 and the laser 7 / detector 8 through gold wire bonding, and then are protected by the filler I 15; then the gold-plated fiber array FA 16 is coupled with the laser 7 and the detector 8, then the inner top surface of the concave mounting sheet 2 is welded with the gold-plated surface of the fiber array FA 16 through ultrasonic or laser welding, and the pin of the concave mounting sheet 2 is welded with the substrate 12; the gap between the fiber array FA 16 and the concave mounting sheet 2 is filled with the filler again, and is solidified after heating; further, the cover plate 4 is bonded, and the gap of the place where the fiber tail fiber 9 extends out is filled with glue, so that the tail fiber is stable. The utility model is characterized in that high-temperature-resistant materials and a new type of FA coupling fixing mode are adopted, the coupling structure is stable under reflow soldering and high-temperature application, the output stable optical power and high sensitivity of the optical module are ensured, the size of the optical module is 18mm*8mm*3.5mm, compared with the conventional LCC four-channel optical transceiver module, the volume is reduced by more than 58%, and the optical module is a new type of small four-channel optical module.

[0040] When the optical module is used, the sending interface inputs a certain code rate of electrical signal, the laser 7 emits a corresponding rate of modulated optical signal after the driver 5 processes, the optical signal is transmitted through the fiber array 16 and the fiber tail fiber 9, the receiving interface converts the optical signal into an electrical signal through the detector 8, and outputs a corresponding code rate of electrical signal after the preamplifier 6.

[0041] The embodiments of the utility model are specifically explained above, but the utility model is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the utility model, and these equivalent or replacements are all included in the range defined by the claims of the utility model.

Claims

1. A miniaturized high-temperature-resistant reflow-solderable optical module, characterized by, It comprises a substrate (12), a fiber array (16) and a concave mounting sheet (2); The substrate (12) is provided with a cavity, in which a driver (5) and an amplifier (6) are bonded and filled and solidified with filler I (15), the driver (5) and the amplifier (6) are connected with the substrate (12) through gold wire bonding, and connected with a laser (7) and a detector (8); The fiber array (16) is plated with gold and assembled on the substrate (12), the fiber array (16) is coupled with the laser (7) and the detector (8); the concave mounting sheet (2) is assembled on the fiber array (16) and welded with the fiber array (16) and the substrate (12), the gap between the concave mounting sheet (2) and the fiber array (16) is filled and solidified with filler II (1).

2. The miniaturized high-temperature-resistant reflow solderable optical module of claim 1, wherein, The substrate (12) is covered with a cover plate (4), the fiber array (16) is connected with a fiber pigtail (9), the fiber pigtail (9) extends out of the cover plate (4) and the substrate (12), the gap between the fiber pigtail (9) and the cover plate (4) and the substrate (12) is filled with a glue injection layer (17).

3. The miniaturized high-temperature-resistant reflow solderable optical module of claim 1, wherein, The inner top surface of the concave mounting sheet (2) and the gold-plated surface of the fiber array (16), and the pins of the concave mounting sheet (2) and the substrate (12) are provided with ultrasonic or laser welding points (3).

4. The miniaturized high temperature and reflow solderable optical module of claim 1, wherein, The depth of the cavity is higher than the height of the driver (5) and the amplifier (6).

5. The miniaturized high temperature and reflow solderable optical module of claim 1, wherein, The bottom surface of the substrate (12) is provided with a substrate pad (10) and a substrate heat dissipation surface (11).

6. The miniaturized high-temperature-resistant reflow solderable optical module of claim 1, wherein, The front surface of the substrate (12) is provided with a micro control unit (13) and a capacitor (14).

7. The miniaturized high-temperature-resistant reflow solderable optical module of claim 1, wherein, The size of the optical module is 18mm×8mm×3.5mm.

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