Integrated heat sink block and optical module

Abstract

The utility model provides an integrated heat sink block, which comprises a base part and two side parts formed by vertically extending upwards along two sides of the length direction of the base part, the base part comprises a first mounting section used for mounting the light emitting assembly and the light receiving assembly, a second mounting section used for mounting the first light chip and a third mounting section used for mounting the second light chip, the third mounting section and the second mounting section are arranged in sequence, a stepped structure is formed between the third mounting section and the second mounting section, and the two sides, close to the outside, of the rear end of the third mounting section are provided with the first mounting section and the second mounting section. The two side portions are respectively provided with a positioning clamping block used for fixing the PCB, and the positions, opposite to the first installation section, of the two side portions are respectively provided with a heat dissipation structure. The utility model further provides an optical module which comprises a light emitting assembly, a light receiving assembly, a first optical chip, a second optical chip, a PCB (printed circuit board), an upper shell, a lower shell and the integrated heat sink block, the integrated heat sink block is fixed on the lower shell, and the upper shell and the lower shell are correspondingly connected up and down. According to the utility model, each photoelectric device can be ensured to achieve a good heat dissipation effect, and signal transmission is stable.

Description

TECHNICAL FIELD

[0001] The utility model belongs to optical communication technical field, especially relate to an integrated heat sink and optical module. BACKGROUND

[0002] With the continuous development of communication technology, the data volume is getting larger and larger, the data center scale expands and the 5G network is deployed comprehensively, and the demand of optical communication system for transmission rate increases exponentially. The current mainstream 400G optical module has gradually upgraded to 800G or even 1.6T rate, and the single-channel baud rate breaks through 56Gbaud. However, the improvement of the integration of optoelectronic devices brings significant increase in power consumption, for example, the power consumption of 800G optical module can reach more than 20W. However, the laser chip, silicon optical chip and driving circuit and other core heating elements in the optical transmitter sub-module (TOSA) will have problems such as optical power attenuation and signal distortion under high temperature environment, and the traditional heat dissipation scheme has been difficult to meet the reliability requirements of high-speed optical modules.

[0003] The traditional optical module usually adopts a separate heat dissipation structure, and the heat dissipation fins, heat pipes and other independent components are fixed on the heat sink surface through thermal conductive glue or screws. This design has the problems of high contact thermal resistance, high assembly complexity and insufficient positioning accuracy, specifically, the multi-layer interface leads to low heat transfer efficiency, and the thermal resistance is usually higher than 0.5℃ / W; additional positioning structure and fasteners are needed, which increases the production process and cost; the alignment error of the optical transmitter / receiver sub-module and the optical fiber is easy to exceed ±10μm, which affects the optical coupling efficiency.

[0004] The prior art tries to improve the heat dissipation efficiency by optimizing the heat dissipation material or increasing the density of the heat dissipation fins. These schemes have the problems of heat dissipation and volume contradiction, insufficient structural strength and model interference, specifically, the high-density fin design leads to an increase in module volume, which is contrary to the trend of miniaturization of optical communication equipment, and may have electromagnetic shielding effect on high-frequency electrical signals, resulting in a decrease in signal integrity. SUMMARY

[0005] The utility model aims at overcoming the prior art defects, and first provides an integrated heat sink block for injection molding in an optical module.

[0006] The utility model provides an integrated heat sink block, which comprises:

[0007] The base is substantially in a plate-like structure, comprising a first mounting section for mounting an optical transmitting assembly and an optical receiving assembly, a second mounting section for mounting a first optical chip, and a third mounting section for mounting a second optical chip, the third mounting section and the second mounting section are in a stepped structure, and positioning blocks are arranged on the two sides of the rear end of the third mounting section, for fixing a PCB connected with the second optical chip 7.

[0008] Two side parts are vertically extended upwards along two side ends of the base part in the length direction, and the two side parts are respectively provided with heat dissipation structures relative to positions of the first mounting section.

[0009] In the integrated heat sink block embodiment, the first mounting section includes a first hollow area, a first supporting plate, and a cavity adjacent to the first supporting plate and opening outward, and the first hollow area is provided with a first positioning flange for positioning the light emitting assembly and the light receiving assembly.

[0010] In the integrated heat sink block embodiment, the second mounting section includes a second supporting plate, and the second supporting plate is provided with a second hollow area, and the second hollow area is provided with a second positioning flange, so that the first optical chip is embedded and mounted in the second hollow area after being positioned by the second positioning flange.

[0011] In the integrated heat sink block embodiment, the third mounting section includes a third supporting plate, and the third supporting plate is provided with a third hollow area, and the third hollow area is provided with a third positioning flange, so that the second optical chip is embedded and mounted in the third hollow area after being positioned by the third positioning flange.

[0012] In the integrated heat sink block embodiment, at least one optical fiber through hole is arranged on a stepped surface between the third mounting section and the second mounting section.

[0013] In the integrated heat sink block embodiment, the heat dissipation structure is a plurality of connected arc-shaped grooves, triangular grooves or square grooves arranged on the top of the two side parts.

[0014] The integrated heat sink block provided by the utility model divides a functional area according to devices mounted thereon, so that the light emitting assembly and the light receiving assembly in the devices are arranged in a first mounting section in a side-by-side symmetrical isolation manner, a second mounting section provided with a first optical chip and a third mounting section provided with a second optical chip are arranged in front and back of each other and have a height difference, and a hollow area is arranged in each mounting section, and the heat dissipation performance of each device placed in the integrated heat sink block is improved by using the heat dissipation structure of the two side parts, so that each device achieves good heat dissipation effect, which is conducive to realizing high-speed and stable transmission of optical signals.

[0015] The utility model also provides an optical module, which comprises:

[0016] a light emitting assembly, a light receiving assembly, a first optical chip, a second optical chip, a PCB board, an upper shell, a lower shell, and the integrated heat sink block,

[0017] The integrated heat sink block is fixed on the lower shell, the first optical chip and the second optical chip are respectively fixed on the integrated heat sink block, one end of the PCB board is fixed on the integrated heat sink block and connected with the second optical chip through a connector, and the other end of the PCB board is located on the lower shell; and the upper shell and the lower shell are connected in a top-to-bottom corresponding mode.

[0018] In the optical module, the upper shell comprises a cover plate and two first side plates, the two first side plates have two-stage stepped structures, a first stop surface and a second stop surface are formed, a first positioning protrusion is arranged between the first stop surface and the second stop surface, and a first positioning groove is further arranged on each of the two first side plates.

[0019] In the optical module, the two side portions of the integrated heat sink block have two-stage stepped structures, a fourth stop surface and a fifth stop surface are formed, a second positioning groove is arranged between the fourth stop surface and the fifth stop surface, and a first positioning protrusion is further arranged at a position spaced apart from the fourth stop surface.

[0020] In the optical module, a positioning rod is further arranged on the upper shell, and a positioning hole corresponding to the positioning rod is arranged on the integrated heat sink block.

[0021] The utility model provides light module structure, utilize the stop surface formed by step structure, and the cooperation of the matching of bump and card slot structure, can effectively guarantee the accurate positioning between upper casing, integrated heat sink block and lower casing, and the simple, fast, convenient assembling flow, and utilize integrated heat sink block both sides heat dissipation structure realizes light module high efficiency heat dissipation, ensures that photoelectric device stable operation can satisfy 400G or 800G photoelectric communication module's high speed, high reliability requirement. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is the integrated heat sink block embodiment structure schematic diagram of the utility model,

[0023] Figure 2 It is integrated heat sink block embodiment sintered embryo structure schematic diagram of the utility model,

[0024] Figure 3 It is the light module structure schematic diagram of the utility model embodiment Figure 1 ;

[0025] Figure 4 It is the light module structure schematic diagram of the utility model embodiment Figure 2 ;

[0026] Figure 5 It is the light module structure schematic diagram of the utility model embodiment Figure 3 ;

[0027] Figure 6 It is the upper casing structure schematic diagram in the light module of the utility model embodiment,

[0028] Figure 7 It is the lower casing structure schematic diagram in the light module of the utility model embodiment. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the utility model more clearly, the following is combined with embodiment, and the utility model is further detailedly explained.It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.

[0030] It should be noted that when an element is referred to as being "connected", "disposed" or "arranged" with another element, it can be directly on the other element or can have an intervening element. In addition, the "connection" between elements includes "mechanical connection" or "electrical connection".

[0031] It should be further noted that the "one end", "the other end", "upper", "lower", "front end", "rear end", "two sides" and other directional terms in the embodiments of the present application are only relative concepts or are referenced to the normal use state of the product, or are referenced to the positions displayed based on the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore should not be considered as indicating or implying that the devices or elements referred to must have a specific orientation, structure and operation, and therefore should not be considered as being limited.

[0032] For the convenience of description, in the embodiments of the present application, "Q" in the drawings represents the front end, and "H" represents the rear end.

[0033] Referring to Figures 1-5 , the embodiments of the present application first provide an integrated heat sink block 2, which comprises a base 21 and two side portions 22, wherein the base 21 is substantially in a plate structure and sequentially arranged with a first mounting section 211, a second mounting section 212 and a third mounting section 213, wherein the first mounting section 211 is used for mounting a light emitting assembly 4 and a light receiving assembly 5, the light emitting assembly 4 and the light receiving assembly 5 are arranged side by side, the second mounting section 212 is used for mounting a first optical chip 6, and the third mounting section 213 is used for mounting a second optical chip 7. In the embodiments of the present application, the third mounting section 213 and the second mounting section 212 are in a stepped structure, have a stepped surface 2136, so that the first optical chip 6 is arranged in a height staggered manner relative to the second optical chip 7, and the first optical chip 6 and the second optical chip 7 can be effectively cooled. On the outer sides of the rear end of the third mounting section 213, positioning clamping blocks 2133 are respectively arranged, which are used for fixing a PCB 9 connected with the second optical chip 7. Along the length direction of the base 21, two side portions 22 are respectively formed by vertically extending upwards, and heat dissipation structures 221 are respectively arranged at the positions of the two side portions 22 relative to the first mounting section 211. The integrated heat sink block 2 is designed according to the functional areas of the devices mounted thereon, the light emitting assembly 4 and the light receiving assembly 5 in the devices are arranged in a side-by-side symmetrical and isolated manner, the first optical chip 6 and the second optical chip 7 are arranged in front and back, and the height positions are different, and the heat dissipation structures 221 of the two side portions 22 are used to effectively enhance the heat dissipation performance of the devices arranged in the integrated heat sink block 2, so that the reliable heat dissipation effect of the devices is good, and then the better high-speed transmission of optical signals is facilitated.

[0034] Referring to Figures 1-5In the embodiment of the integrated heat sink block 2, the first mounting section 211 comprises a first hollow area 2112, a first supporting plate 2111 and a cavity 2115 opening outwardly adjacent to the first supporting plate 2111, the first supporting plate 2111 is used for supporting the middle part of the light emitting assembly 4 and the light receiving assembly 5, the front end and the rear end of the light emitting assembly 4 and the light receiving assembly 5 are respectively suspended in the cavity 2115 and the first hollow area 2112, and the heat dissipation effect of the light emitting assembly 4 and the light receiving assembly 5 can be improved. In the middle position of the end of the first hollow area 2112 away from the light emitting assembly 4 and the light receiving assembly 5, a first positioning flange 2114 is arranged in the direction of the center of the first hollow area 2112, and the rear end of the light emitting assembly 4 and the light receiving assembly 5 can be positioned. In the middle position of the first supporting plate 2111, a partition 2113 is arranged in the length direction of the base 21, the partition 2113 is formed by upward protruding from the plane of the supporting bottom plate 2111, the light emitting assembly 4 and the light receiving assembly 5 can be arranged separately, which is beneficial to the positioning and isolation of the light emitting assembly 4 and the light receiving assembly 5, and heat dissipation is facilitated.

[0035] The second mounting section 212 comprises a second supporting plate 2121, the second supporting plate 2121 is provided with a second hollow area 2122, the second hollow area 2122 is provided with a second positioning flange 2124 in the direction of the center of the second hollow area 2122 adjacent to one end of the first hollow area 2112, and the first light chip 6 can be positioned and embedded and mounted in the second hollow area 2122 through the second positioning flange 2124.

[0036] The third mounting section 213 comprises a third supporting plate 2131, the third supporting plate 2131 is provided with a third hollow area 2132, the third hollow area 2132 is provided with a third positioning flange 2135 in the direction of the center of the third hollow area 2132 adjacent to one end of the second hollow area 2122, and the second light chip 7 can be positioned and embedded and mounted in the third hollow area 2132 through the third positioning flange 2135.

[0037] The embodiment of the integrated heat sink block 2 is provided with a hollow area in each mounting section, and the heat dissipation effect is further improved while positioning and fixing each device.

[0038] Based on the above structure, referring to Figure 2 The integrated heat sink block 2 adopts tungsten-copper alloy material (thermal conductivity coefficient ≥200.00 W•m -1 •K -1 , and the thermal expansion coefficient is 7.4-7.9*10 -6 K -1), by injection molding to form an integrated structure, which sintering embryo is respectively provided with reinforcing ribs A, B at the front and rear end, which are removed by processing after injection molding, aiming to ensure the strength and dimensional accuracy of the integrated heat sink block 2 containing multiple cavity structures after injection molding.

[0039] Referring to Figure 1 , in the embodiment of the integrated heat sink block 2 of the utility model, at least one optical fiber through hole 2125 is arranged on the stepped surface 2136 between the third mounting section 213 and the second mounting section 212, which facilitates the connection of the first optical chip 6 and the second optical chip 7.

[0040] Referring to Figures 1-5 , in the embodiment of the integrated heat sink block 2 of the utility model, the heat dissipation structure 221 is a plurality of connected circular arc grooves, triangular grooves or square grooves arranged at the top of the two side portions 22, and the illustrated embodiment is an arc-shaped groove, the center distance between each semicircular arc groove, triangular groove or square groove is 0.15-0.3mm, and the height is 0.05-0.10mm.

[0041] Referring to Figure 1 , 3 -7, the utility model also provides a kind of optical module, comprising: optical emission assembly 4, optical receiving assembly 5, first optical chip 6, second optical chip 7, PCB 9, upper shell 1, lower shell 3 and the integrated heat sink block 2 described above.Optical emission assembly 4 is optical emission sub-module (TOSA), including laser, modulator, coupling lens and other elements;Optical receiving assembly 5 is optical receiving sub-module (ROSA), including photodetector, transimpedance amplifier, limiting amplifier, filter, demultiplexer and other elements;First optical chip 6 and second optical chip 7 adopt silicon optical chip, for high-speed, high-bandwidth data transmission and processing;PCB 9 adopts flexible circuit board.Integrated heat sink block 2 is fixed on lower shell 3, and upper shell 1 and lower shell 2 are connected in correspondence, so that each device is covered in the cavity formed by upper shell 1 and lower shell 2 with integrated heat sink block 2.

[0042] Referring to Figure 1 and Figure 5 , first positioning slot 61 is arranged on first optical chip 6, and is buckled with second positioning flange 2124 arranged on integrated heat sink block 2, so that first optical chip 6 is embedded and fixed in second hollow area 2122 of integrated heat sink block 2;Second positioning slot 71 is arranged on second optical chip 7, and is buckled with third positioning flange 2135 arranged on integrated heat sink block 2, so that second optical chip 7 is embedded and fixed in third hollow area 2132 of integrated heat sink block 2.

[0043] Referring to 1, Figure 3 and Figure 5The PCB 9 is provided with a functional chip 10, and the functional chip 10 comprises at least one of a driving chip, a trans-impedance amplifier chip, a clock data recovery chip, a digital signal processor chip or a microcontroller chip. One end of the PCB 9 is fixed on the third supporting plate 2131 of the integrated heat sink block 2, and the third supporting plate 2131 is provided with a positioning clamping block 2133 at each end adjacent to the two first side plates 22 and close to the rear end position, and the two ends of the positioning clamping block 2133 are provided with clamping grooves 2134. The two sides of one end (the front end) of the PCB 9 are correspondingly provided with clamping blocks 91 corresponding to the clamping grooves 2134. The one end of the PCB 9 is fixed on the integrated heat sink block 2 through the cooperation of the clamping blocks 91 and the clamping grooves 2134, which is convenient and fast. The other end (the rear end) of the PCB 9 is located on the lower shell 3. At the same time, the first connecting end 92 provided at the front end of the PCB 9 is overlapped with the second connecting end 82 provided at one end of the connector 8, and the other end 81 of the connector 8 is inserted into the insertion opening 72 correspondingly provided at the second optical chip 7, so that the second optical chip 7 and the PCB 9 are electrically connected through the connector 8.

[0044] Referring to Figure 5 and Figure 6 , in the embodiment of the optical module, the upper shell 1 comprises a cover plate 11 and two first side plates 12 vertically extending downwards along the length direction of the two cover plates 11. The two first side plates 12 have two-stage stepped structures upward from the rear end to the front end direction, and are provided with a first stop surface 122 and a second stop surface 124. A first positioning protrusion 123 is arranged between the first stop surface 122 and the second stop surface 124, and the first positioning protrusion 123 is an arc structure. First positioning recesses 121 are also arranged on the two first side plates 12 close to the rear end position.

[0045] Further referring to Figure 7 , the lower shell 3 comprises a bottom plate 31, a top plate 33 and two second side plates 32 vertically extending upwards along the length direction of the bottom plate 31. The bottom plate 31 and the top plate 33 are in a stepped structure, so that a third stop surface 332 is formed between the bottom plate 31 and the top plate 33. When the upper shell 1 and the integrated heat sink block 2 are installed, the end face of the front end of the upper shell 1 abuts against the third stop surface 332. Two through grooves 331 are arranged on the third stop surface 332, which are used for clamping and fixing the front ends of the optical transmitting assembly 4 and the optical receiving assembly 5 in the two through grooves 331. Second positioning protrusions 321 corresponding to the first positioning recesses 121 are arranged on the top of the two second side plates 32, and the second positioning protrusions 321 are arc structures. When the upper shell 1 and the lower shell 3 are connected, the second positioning protrusions 321 and the first positioning recesses 121 can be positioned by cooperation. Second positioning protrusions 311 are also arranged on the bottom plate 31 close to the two second side plates 32, referring to Figure 5The bottom of the base 21 of the integrated heat sink block 2 is correspondingly provided with a third positioning clamping groove 2137, when the integrated heat sink block 2 is installed on the lower shell 3, the second positioning protrusion 311 is matched and inserted into the third positioning clamping groove 2137, so that the integrated heat sink block 2 is positioned on the lower shell 3, and then is fixed through fasteners.

[0046] In the embodiment of the utility model discloses optical module, see Figure 1 The two side portions 22 of the integrated heat sink block 2 have two-stage stepped structures upward from the front end to the rear end direction, and are formed with a fourth stop surface 223 and a fifth stop surface 225, and a second positioning groove 224 is arranged between the fourth stop surface 223 and the fifth stop surface 225, and a first positioning protrusion 222 is also arranged at a position spaced apart from the fourth stop surface 223 and facing the front end. Figure 6 On the inner sides of the two second side plates 32 of the upper shell 1 opposite to each other, a stepped positioning plate 125 is arranged, so that a sixth stop surface 1251 and a seventh stop surface 1253 are formed at the bottom of the positioning plate 125, a third positioning protrusion 1252 is arranged between the sixth stop surface 1251 and the seventh stop surface 1253, and the third positioning protrusion 1252 has an arc structure.

[0047] Further see Figure 1 And Figure 6 On the inner wall of the cover plate 11 of the upper shell 1 facing the lower shell 3, a connecting rib 126 is also transversely arranged, which can be used for fastening between the two first side plates 12 of the upper shell 1. On the connecting rib 126, at least two positioning rods 127 are vertically arranged in the direction facing the lower shell 3, and correspondingly, at least two positioning holes 2213 are arranged on the second supporting plate 2121 of the second mounting section 212 of the integrated heat sink block 2.

[0048] In the above structure design, the stop surfaces formed by the stepped structures are used, and the insertion and cooperation of the protrusion and the clamping groove structure are supplemented, and the insertion structure of the positioning rod and the positioning hole is also designed, which can effectively ensure the accurate positioning and fixing between the upper shell 1, the integrated heat sink block 2 and the lower shell 3, and the positioning precision error is not more than 0.01mm.

[0049] The above embodiments shown in the utility model are only part of the preferred embodiments of the utility model, and cannot be understood as a limitation on the utility model, and any modification, change, replacement and transformation made by the person skilled in the art without departing from the essence of the utility model are within the protection scope of the utility model.

Claims

1. An integrated heat sink block, characterized by, Comprising: a base, substantially a plate structure, comprising a first mounting section for mounting a light emitting assembly and a light receiving assembly, a second mounting section for mounting a first optical chip, and a third mounting section for mounting a second optical chip, the third mounting section being in a stepped structure with the second mounting section, and at the outer sides of the rear end of the third mounting section, positioning blocks are respectively arranged for fixing a PCB board connected with the second optical chip 7; two side portions, vertically extending upwards along the length direction of the base, and the heat dissipation structures are respectively arranged at the positions of the side portions relative to the first mounting section.

2. The integrated heat sink block of claim 1, wherein, The first mounting section comprises a first hollow area, a first supporting plate, and a cavity opening outwardly adjacent to the first supporting plate, the first hollow area is provided with a first positioning flange for positioning the light emitting assembly and the light receiving assembly; a partition is arranged at the middle position of the first supporting plate along the length direction of the base.

3. The integrated heat sink block of claim 1, wherein, The second mounting section comprises a second supporting plate, and the second supporting plate is provided with a second hollow area, and the second hollow area is provided with a second positioning flange, so that the first optical chip is embedded and mounted in the second hollow area after being positioned by the second positioning flange.

4. The integrated heat sink block of claim 1, wherein, The third mounting section comprises a third supporting plate, and the third supporting plate is provided with a third hollow area, and the third hollow area is provided with a third positioning flange, so that the second optical chip is embedded and mounted in the third hollow area after being positioned by the third positioning flange.

5. The integrated heat sink block of claim 1, wherein, At least one optical fiber through hole is arranged on the stepped surface between the third mounting section and the second mounting section.

6. The integrated heat sink block of any of claims 1-5, wherein, The heat dissipation structure is a plurality of connected arc-shaped grooves, triangular grooves or square grooves arranged on the top of the two side portions.

7. An optical module characterized by comprising: Comprising: a light emitting assembly, a light receiving assembly, a first optical chip, a second optical chip, a PCB board, an upper shell, a lower shell, and the integrated heat sink block of any one of claims 1-6, wherein the integrated heat sink block is fixed on the lower shell, the first optical chip and the second optical chip are respectively fixed on the integrated heat sink block, one end of the PCB board is fixed on the integrated heat sink block and connected with the second optical chip through a connector, and the other end of the PCB board is located on the lower shell; the upper shell and the lower shell are connected in a top-to-bottom manner.

8. The optical module according to claim 7, characterized by The upper shell comprises a cover plate and two first side plates with two-step structures, forming a first stop surface and a second stop surface, and a first positioning protrusion is arranged between the first stop surface and the second stop surface, and a first positioning groove is arranged on each of the first side plates; the lower shell comprises a bottom plate, a top plate, and two second side plates vertically extending upwards along the length direction of the bottom plate, the bottom plate and the top plate are in a stepped structure, forming a third stop surface between the bottom plate and the top plate; two through grooves are arranged on the third stop surface, and the front ends of the light emitting assembly and the light receiving assembly are clamped and fixed in the through grooves; a second positioning protrusion matched with the first positioning groove is arranged on the top of each of the second side plates; a second positioning protrusion is arranged on each side of the bottom plate, and the bottom of the integrated heat sink block is correspondingly provided with a third positioning clamping groove matched with the second positioning protrusion.

9. The optical module according to claim 8, characterized by The two side parts of the integrated heat sink block have two-step structures, forming a fourth stop surface and a fifth stop surface, and a second positioning groove is arranged between the fourth stop surface and the fifth stop surface, and a first positioning protrusion is arranged at a position spaced from the fourth stop surface; a stepped positioning plate is arranged on the inner side of each of the second side plates, the bottom of the positioning plate forms a sixth stop surface and a seventh stop surface, and a third positioning protrusion is arranged between the sixth stop surface and the seventh stop surface, and a fourth positioning clamping groove is arranged on the bottom of the positioning plate; the sixth stop surface, the third positioning protrusion, the seventh stop surface, and the fourth positioning clamping groove are correspondingly matched with the fifth stop surface, the second positioning groove, the fourth stop surface, and the first positioning protrusion, so that the upper shell is correspondingly connected with the lower shell and is clamped and engaged with the integrated heat sink block.

10. The optical module of claim 7, wherein, A positioning rod is arranged on the upper shell, and a positioning hole matched with the positioning rod is correspondingly arranged on the integrated heat sink block.

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