Mobile phone camera module

Abstract

The utility model relates to the field of mobile phone cameras, and discloses a mobile phone camera module, which is characterized in that a hollow area is arranged on a substrate, a bracket is arranged above the hollow area, the bottom of the bracket extends to form a connecting part, the connecting part penetrates through the hollow area and is connected with a chip, and the chip is electrically connected with the substrate. Therefore, the dual requirements of the mobile terminal equipment on miniaturization and low cost can be met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of mobile phone camera, concretely relates to a mobile phone camera module. BACKGROUND

[0002] In recent years, with the rapid development of mobile terminal equipment to the light and thin, miniaturization direction, the height of camera module reduces demand increasingly urgent. The traditional camera module usually adopts the following packaging process: first, the image sensor chip is welded on the surface of the circuit substrate, then the electrical interconnection between the chip pad and the substrate pad is realized through the wire bonding technology, then the chip is protected by the packaging shell, finally the infrared cutoff filter and the lens assembly are assembled. The process contains the wire bonding process and the multilayer packaging structure, which leads to the difficulty of compressing the overall height of the module, and cannot meet the increasingly stringent thickness control requirements of mobile terminal.

[0003] In order to reduce the height of the module, flip chip (Flip Chip) packaging scheme has been adopted in the prior art. The chip is inverted and directly interconnected with the substrate through the solder ball array, which eliminates the wire bonding process. However, due to the difference in the thermal expansion coefficient (CTE) of the conventional PCB substrate, significant mechanical stress will be generated at the solder ball interface during temperature cycling, which easily causes problems such as pad cracking or solder ball fracture. Therefore, the scheme usually needs to use ceramic substrate with anisotropic conductive adhesive (ACF) pressing process, which greatly increases the material cost and processing complexity. Especially for cost-sensitive application fields such as consumer electronics products, the high manufacturing cost seriously restricts the popularization and application of the technology.

[0004] Therefore, it can be seen that the existing camera module packaging technology has the contradiction of being difficult to balance the compactness and economy: the traditional wire bonding scheme has controllable cost but the module height is too large, while the flip chip scheme can reduce the height but faces the defect of cost surge. Therefore, it is urgent to develop a new packaging method to realize the thinning of the module height while maintaining the cost advantage, so as to meet the dual requirements of miniaturization and low cost of mobile terminal equipment. CONTENT OF THE UTILITY MODEL

[0005] The utility model intends to provide a kind of mobile phone camera module, to meet the dual requirements of miniaturization and low cost of mobile terminal equipment.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme: a kind of mobile phone camera module, including substrate and chip, substrate is equipped with hollow area, hollow area top is equipped with support, support bottom extends and forms connecting portion, connecting portion penetrates hollow area and is connected with chip, chip and substrate are connected by gold wire, to form electrical connection.

[0007] The beneficial effects of the present application are as follows:

[0008] 1. By using Goke microelectronic COM process route, redesigning COM chip support, sinking COM chip part into hollowed PCB substrate, then dispensing sealing on back, under the premise of fixed distance between support upper surface and chip, reducing overall height by substrate thickness, effectively reducing overall height of camera module, meeting the demand of terminal equipment light, thin and small;

[0009] 2. By using the assembly method, without using expensive flip chip (Flip Chip) process, without special requirements for substrate material, using lower cost to achieve module height comparable to Flip Chip process, reducing manufacturing cost; the assembly method simultaneously realizes the goals of reducing camera module height and reducing manufacturing cost, and can be widely used in various cost-sensitive products.

[0010] Further, the connecting part is a downwardly extending annular boss, and the lower end of the connecting part is bonded to the chip.

[0011] Further, a gold wire is provided on the chip, the gold wire is connected to the upper surface of the substrate, and the gold wire is arranged in the gap between the inner walls of the hollowed area of the connecting part.

[0012] Further, a black glue layer is provided between the upper surface of the substrate and the support.

[0013] Further, the chip and the connecting part are filled with UV glue.

[0014] Further, the support is bonded to the substrate.

[0015] The present scheme has the following effects:

[0016] 1. A horizontal buffer gap is reserved between the chip and the inner wall of the hollowed area, so as to facilitate the installation of the support and the chip on the substrate;

[0017] 2. The assembly method of the present module has a simple process flow and high production efficiency, the gap between the chip and the PCB is filled with UV glue with low hardness, which does not affect the image quality;

[0018] 3. The method still connects the chip and the substrate through a gold wire (flexible conductive line), and the chip is not affected by the expansion and contraction of the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a three-dimensional axonometric view of an embodiment;

[0020] Figure 2 is a top view of an embodiment;

[0021] Figure 3 is Figure 2 A-A sectional view of the embodiment. Detailed Implementation

[0022] The following detailed description illustrates the specific implementation method:

[0023] The reference numerals in the accompanying drawings include: camera module 1, bracket 2, connector 3, substrate 4, chip 5, UV adhesive 6, and gold wire 7.

[0024] Example

[0025] The implementation examples are basically as follows Figures 1-3 As shown: A mobile phone camera module includes a substrate 4 and a chip 5. The substrate 4 is a PCB with a hollow area. A bracket 2 is provided above the hollow area. The camera module 1 and the glass at the bottom of the camera module 1 are supported on the bracket 2. The bottom of the bracket 2 extends downward to form a connecting part 3. The connecting part 3 is an annular boss. The connecting part 3 passes through the hollow area and is bonded to the chip 5. That is, UV glue 6 is filled between the chip 5 and the connecting part 3.

[0026] Metal pads are provided on the side of the substrate 4 near the hollow area and on the edge of the upper surface of the chip 5. The metal pads of the chip 5 are connected to the metal pads on the upper surface of the substrate 4 through flexible conductive lines. In this embodiment, the flexible conductive lines are composed of several gold wires 7. The gold wires 7 pass through the gap between the inner walls of the hollow area of ​​the connecting part 3, so that the chip 5 and the substrate 4 form an electrical connection.

[0027] A horizontal buffer gap is reserved between chip 5 and the inner wall of the cutout area, and UV glue 6 is applied to seal it.

[0028] The bracket 2 is bonded to the substrate 4 with black adhesive.

[0029] The following is a method for assembling a mobile phone camera module:

[0030] Step 1: Design a new type of bracket 2 for COM chip 5. The structure of bracket 2 allows COM chip 5 to be recessed into PCB substrate 4; gold wires 7 are attached to the edge of the upper surface of COM chip 5.

[0031] Step 2: Assemble the COM chip 5 onto the hollowed-out PCB substrate 4. A black adhesive layer is provided between the lower edge of the bracket 2 and the upper edge of the substrate, which is used to bond the bracket and the substrate. The gold wire 7 is attached to the end with solder paste, which is bonded to the pads on the PCB substrate to achieve electrical connection. The chip 5 is partially recessed into the hollowed-out PCB substrate 4, and the distance between the chip 5 and the back of the PCB substrate 4 is 0.05mm.

[0032] Step 3: Apply UV adhesive 6 to the back of COM chip 5 to seal the horizontal buffer gap.

[0033] Step 4: Assemble other module components.

[0034] The above is only the embodiment of the present application, and the common technical solutions and / or characteristics in the scheme are not described in detail. It should be pointed out that, for those skilled in the art, without departing from the technical solutions of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, and these will not affect the effect and practicality of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like in the specification can be used to explain the content of the claims.

Claims

1. A mobile phone camera module, comprising a substrate and a chip, characterized in that: A hollow region is arranged on the substrate, a support is arranged above the hollow region, a connecting portion is formed by extending the bottom of the support, the connecting portion penetrates the hollow region and is connected with the chip, and the chip and the substrate are electrically connected.

2. The mobile phone camera module of claim 1, wherein: A horizontal buffer gap is reserved between the chip and the inner wall of the hollow region.

3. The mobile phone camera module of claim 1, wherein: The connecting portion is a downwardly extending annular boss, and the lower end of the connecting portion is bonded to the chip.

4. The mobile phone camera module of claim 1, wherein: A gold wire is arranged on the chip, the gold wire is connected with the upper surface of the substrate, and the gold wire is arranged in the gap between the connecting portion and the inner wall of the hollow region.

5. The mobile phone camera module of claim 4, wherein: A black adhesive layer is arranged between the upper surface of the substrate and the support.

6. The mobile phone camera module of claim 1, wherein: UV adhesive is filled between the chip and the connecting portion.

7. The mobile phone camera module of claim 1, wherein: The support is bonded to the substrate.

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