Flexible circuit board and display module
By setting an energy-absorbing structure on the reinforcing plate of the flexible circuit board, the noise problem generated during the operation of the capacitor is solved, the howling phenomenon is reduced, and the user experience and product competitiveness are improved.
Patent Information
- Application Number
- CN202520003779.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-01-02
AI Technical Summary
During operation, the capacitors on the flexible circuit board generate noise due to the vibration of the plates, resulting in a whistling phenomenon that affects the user experience.
An energy-absorbing structure is installed on the reinforcing plate of the flexible circuit board to absorb the vibration energy generated by the device, thereby reducing noise and improving the howling phenomenon.
By absorbing vibration energy through energy-absorbing structures, noise can be reduced, user experience can be improved, the design rationality of device layout can be enhanced, and product competitiveness can be increased.
Smart Images
Figure CN223859309U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of display, and specifically provides a flexible circuit board and a display module. BACKGROUND
[0002] In the display module, the flexible circuit board (Flexible Printed Circuit Board, commonly known as FPC in the industry) is a component for connecting the bonding area on the front surface of the display panel to the circuit on the back surface. The flexible circuit board usually has a concentrated device setting area for setting driving chips, touch control chips, and various capacitors, resistors, connectors, and other devices.
[0003] During the operation of some capacitor devices in the device setting area on the flexible circuit board, the electrode plate will stretch and contract along the stacking direction under the action of the electric field, thereby forming vibration in the process of such reciprocating mechanical deformation and generating "whistling sound". Thus, the user experience will be affected. CONTENT OF THE UTILITY MODEL
[0004] The present application aims to solve or improve the above technical problems, i.e., to solve or improve the problem of whistling sound generated during the operation of the existing display module.
[0005] In a first aspect, the present application provides a flexible circuit board, which comprises a first surface and a second surface opposite to the first surface, the first surface having a device setting area thereon, and a reinforcing plate arranged at a position corresponding to the device setting area on the second surface.
[0006] The reinforcing plate is provided with an energy absorption structure, which is used to absorb the vibration energy generated by the device to reduce noise.
[0007] In the above technical solution, the energy absorption structure is arranged on the reinforcing plate of the flexible circuit board, which absorbs the vibration energy generated during the operation of the device under the premise of ensuring the supporting and fixing effect of the reinforcing plate on the device setting area, thereby reducing the noise generated during the operation of the device, improving the "whistling" phenomenon of the device, and improving the user experience. Based on this, when the capacitor devices and other devices that generate noise during operation are arranged in the device setting area, the installation position of the device can be selected according to the actual needs to meet the product design requirements, improve the limitations of the design of the device on the flexible circuit board, make the design and layout of the device more reasonable, and thus improve the product competitiveness.
[0008] In one of the above technical solutions of the flexible circuit board, a through hole is formed in the reinforcing plate along the thickness direction thereof, and the energy absorption structure is filled in the through hole.
[0009] In the technical scheme, the energy absorption structure is filled in the through hole, so that the overall thickness of the reinforcing plate is not increased, the reinforcing plate does not occupy too much space, and the compactness of the flexible circuit board is ensured.
[0010] In one of the technical schemes of the flexible circuit board, the through hole is located in the central region of the reinforcing plate, and the distances from the four peripheral edges of the reinforcing plate to the side wall of the through hole are equal.
[0011] In the technical scheme, the overall reinforcing plate has a ring-shaped frame structure, so that the structural rigidity of the reinforcing plate is not greatly reduced due to the fact that the local position of the reinforcing plate is completely blocked by the through hole.
[0012] In one of the technical schemes of the flexible circuit board, a plurality of through holes are arranged on the reinforcing plate in a spaced manner, and each through hole corresponds to each device in the device arrangement area.
[0013] In the technical scheme, the energy absorption structure in each through hole can more specifically reduce the noise of each device that generates vibration, and the noise reduction effect is improved.
[0014] In one of the technical schemes of the flexible circuit board, a plurality of through holes are arranged on the reinforcing plate in a spaced manner, and each through hole is arranged in an array on the reinforcing plate.
[0015] In the technical scheme, each device can correspond to one or more energy absorption structures, and each energy absorption structure can absorb the vibration energy generated by the device in the device arrangement area. Moreover, the overall reinforcing plate has a mesh plate structure, and the overall structural rigidity of the reinforcing plate is stronger, so that the ability of the reinforcing plate to resist bending force, torsion force and shear force is improved, the supporting and fixing effect of the reinforcing plate on the device arrangement area is ensured, and the mechanical strength of the flexible circuit board is improved.
[0016] In one of the technical schemes of the flexible circuit board, the energy absorption structure is located between the reinforcing plate and the second surface, and the energy absorption structure extends along the plane in which the second surface is located.
[0017] In one of the technical schemes of the flexible circuit board, the projection of the reinforcing plate on the second surface covers the projection of the device arrangement area on the second surface.
[0018] In the technical scheme, the mechanical strength of the device arrangement area is ensured, and the possibility that the devices in the edge region of the device arrangement area are damaged due to external force impact is reduced.
[0019] In one of the technical schemes of the flexible circuit board, the energy absorption structure is a porous material layer or a damping vibration reduction layer.
[0020] In one of the technical solutions of the flexible circuit board, the second surface is provided with a conductive adhesive layer at a position corresponding to the device arrangement area, and the reinforcing plate and / or the energy absorption structure is fixed to the second surface through the conductive adhesive layer.
[0021] In the case of using the above technical solution, the flexible circuit board is grounded through the conductive adhesive layer, which can prevent the circuit structure on the flexible circuit board from forming static electricity accumulation, thereby preventing damage to the display module.
[0022] In a second aspect, the present application provides a display module comprising the flexible circuit board of any one of the first aspect. BRIEF DESCRIPTION OF DRAWINGS
[0023] The preferred embodiments of the present application will be described below with reference to the accompanying drawings, in which:
[0024] Figure 1 is a longitudinal sectional view of a flexible circuit board according to one embodiment of the present application;
[0025] Figure 2 is a top view of a reinforcing plate according to one embodiment of the present application;
[0026] Figure 3 is a longitudinal sectional view of a reinforcing plate in Figure 2
[0027] Figure 4 is a top view of a reinforcing plate according to another embodiment of the present application
[0028] Figure 5 is a longitudinal sectional view of a flexible circuit board according to another embodiment of the present application.
[0029] In the drawings, the reference signs refer to the following:
[0030] 100, first surface; 200, second surface; 300, device arrangement area; 400, reinforcing plate; 410, protective film; 420, through hole; 500, conductive adhesive layer; 600, energy absorption structure. DETAILED DESCRIPTION
[0031] The preferred embodiments of the present application will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application, and are not used to limit the protection scope of the present application. Those skilled in the art can make adjustments as needed to adapt to specific application occasions.
[0032] It should be noted that in the description of this application, terms such as "upper," "lower," "left," "right," "inner," and "outer," which indicate direction or positional relationship, are based on the direction or positional relationship shown in the accompanying drawings. These terms are used merely for ease of description and do not indicate or imply that the relevant device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, ordinal numbers such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0033] Furthermore, it should be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0034] In display modules, the capacitors on flexible circuit boards are subjected to electric field forces, causing noise to be generated during operation due to plate vibration. This noise is especially noticeable when display modules are used in mobile terminals such as mobile phones, as the mobile terminals are closer to the user, resulting in a reduced user experience.
[0035] Reference Figure 1 This is a longitudinal cross-sectional view of a flexible circuit board according to an embodiment of this application. The flexible circuit board includes components such as a substrate, a metal trace layer, an adhesive layer, and a cover film, which are well known in the art and will not be described in detail here.
[0036] The flexible circuit board has a first surface 100 and a second surface 200 opposite to the first surface 100. The first surface 100 has a device mounting area 300, which is used to centrally mount driver chips, touch chips, and other devices such as capacitors, resistors, and connectors. All of the above devices can be electrically connected to the metal traces in the flexible circuit board by means of soldering or other methods.
[0037] The second surface 200 is provided with a reinforcing plate 400 at a position corresponding to the device setting area 300. The reinforcing plate 400 is used to support and fix the device setting area 300, so as to enhance the overall mechanical strength of the flexible circuit board, prevent the flexible circuit board from being damaged due to external force such as bending or folding during installation or use, and is crucial to ensure the stability and reliability of the display module. In some cases, the reinforcing plate 400 may also need to be grounded to prevent static electricity from accumulating and damaging the display module. In this case, the reinforcing plate 400 should be a conductive structure, such as a steel sheet, and the reinforcing plate 400 and the second surface 200 can be bonded and fixed by a conductive adhesive layer 500 to ensure that the reinforcing plate 400 forms an electrical connection with the circuit structure on the flexible circuit board through the conductive adhesive layer 500, so that static electricity can safely flow to the ground.
[0038] In an implementation, the area of the reinforcing plate 400 is greater than the area of the device setting area 300, and the orthographic projection of the reinforcing plate 400 on the second surface 200 covers the orthographic projection of the device setting area 300 on the second surface 200, so as to further ensure the mechanical strength of the device setting area 300 and reduce the possibility that the devices at the edge region of the device setting area 300 are damaged due to external force impact. In an embodiment, the surface of the reinforcing plate 400 away from the flexible circuit board is further provided with a protective film 410.
[0039] The reinforcing plate 400 is provided with an energy absorption structure 600, which is used to absorb the vibration energy generated by the devices in the device setting area 300 during operation, so as to reduce noise and improve the "whistling" phenomenon.
[0040] In combination with Figure 2 and Figure 3 wherein, Figure 2 is a top view of the reinforcing plate 400 according to an embodiment of the present application, Figure 3 is a longitudinal sectional view of the reinforcing plate 400 according to an embodiment of the present application. In Figure 2 and Figure 3 the embodiment shown, the reinforcing plate 400 is provided with a through hole 420 in the thickness direction, and the energy absorption structure 600 is filled in the through hole 420. In this way, the main part of the reinforcing plate 400 is responsible for supporting and fixing the device setting area 300 and ensuring the mechanical strength of the flexible circuit board, and the energy absorption structure 600 is responsible for absorbing the vibration energy generated by the devices to reduce noise. At the same time, the energy absorption structure 600 is filled in the through hole 420, which does not increase the overall thickness of the reinforcing plate 400, avoids occupying too much space, and helps to ensure the compactness of the overall flexible circuit board.
[0041] Optionally, the through hole 420 is located in the central region of the reinforcing plate 400, and the distance from the four peripheral edges of the reinforcing plate 400 to the side wall of the through hole 420 is equal. In this way, the normal projection of the devices in the device setting area 300 on the reinforcing plate 400 can overlap the through hole 420 as much as possible, so as to more facilitate the energy absorption structure 600 to absorb the vibration energy generated by the devices. On the other hand, through the above arrangement, the reinforcing plate 400 as a whole has a ring-shaped frame structure, which prevents the structural stiffness of the reinforcing plate 400 from being greatly reduced due to the local position of the reinforcing plate 400 being completely blocked by the through hole 420.
[0042] In some implementations of the present application, a plurality of through holes 420 can also be arranged at intervals on the reinforcing plate 400, and each through hole 420 is filled with an energy absorption structure 600 adapted to the cross section of the through hole 420.
[0043] For example, referring to Figure 4 In one embodiment, a plurality of through holes 420 are arranged in an array on the reinforcing plate 400. In this way, the projection of each device in the device setting area 300 on the reinforcing plate 400 can overlap one or more through holes 420, that is, each device can correspond to one or more energy absorption structures 600, and each energy absorption structure 600 can simultaneously absorb the vibration energy generated by the devices in the device setting area 300. Moreover, compared with the way of arranging one large through hole 420, the plurality of through holes 420 arranged at intervals form a mesh structure as a whole, and the overall structural stiffness of the reinforcing plate 400 is stronger than the "ring-shaped frame structure" described above. Therefore, the ability of the reinforcing plate 400 to resist bending force, torsional force and shear force can be improved, which helps to ensure the supporting and fixing effect of the reinforcing plate 400 on the device setting area 300 and improve the mechanical strength of the flexible circuit board.
[0044] Of course, the specific arrangement of the through holes 420 is not limited to the above manner, and in other embodiments, the layout of the through holes 420 can also be arranged such that each through hole 420 corresponds to each device in the device setting area 300. Specifically, the arrangement position of each through hole 420 corresponds to each device in the device setting area 300 that can generate noise, such as various capacitor devices. In this way, the energy absorption structure 600 in each through hole 420 can more specifically reduce the noise of each vibrating device and improve the noise reduction effect.
[0045] For example, referring to Figure 5As an implementation manner of the present application, the energy absorption structure 600 is provided as a plate-shaped structure similar to the structure of the reinforcing plate 400, the energy absorption structure 600 can be fixedly bonded between the reinforcing plate 400 and the second surface of the flexible circuit board, so that the energy absorption structure 600 extends along the plane where the second surface is located, thus, the through hole 420 does not need to be formed on the reinforcing plate 400, and the energy absorption structure 600 is arranged closer to the device arrangement area 300 relative to the reinforcing plate 400, so as to directly absorb the vibration energy generated by the device in the device arrangement area 300.
[0046] It can be understood that in the case of using the above manner, when the reinforcing plate 400 needs to be grounded to conduct static electricity on the flexible circuit board, the reinforcing plate 400 can be electrically connected with the conductive adhesive layer 500 through other conductive components, or the conductive components in the form of protrusions can be fixedly arranged at the edges of the reinforcing plate 400 and bonded and fixed with the conductive adhesive layer 500, and those skilled in the art can make adaptive settings based on the above scenarios, which is not limited in the present application.
[0047] The energy absorption structure 600 in the present application can be a porous material layer such as an organic fiber material, foam, glass wool, foamed plastic, etc. After the sound wave generated by the device enters the porous material layer, it is repeatedly reflected, refracted and scattered in the pores, and in this process, the sound energy is continuously consumed, and at the same time, the air in the pores exchanges heat due to vibration, further converting the sound energy into heat energy, thereby effectively reducing the sound wave intensity and achieving the noise reduction effect.
[0048] In other embodiments, the energy absorption structure 600 can also be a damping and vibration reduction layer such as silica gel, elastic damping pad, damping paint, etc. The damping and vibration reduction layer absorbs sound wave energy or consumes sound energy through internal friction, effectively suppresses structural vibration, thereby reducing solid-borne sound, and achieves the noise reduction effect.
[0049] Of course, the above is only part of the structure of the energy absorption structure 600 given by the present application, which does not constitute a limitation on the present application, and those skilled in the art can select the specific form of the energy absorption structure 600 according to actual needs, for example, the energy absorption structure 600 can also be a resonator based on the principle of resonance sound absorption, or other sound absorption bodies with special spatial structures, etc.
[0050] The application sets the energy absorption structure 600 on the reinforcing plate 400 of the flexible circuit board, absorbs the vibration energy generated in the device working process under the premise of ensuring the supporting and fixing effect of the reinforcing plate 400 on the device setting area 300, thereby reducing the noise generated in the device working process, improving the "howling" phenomenon of the device, and further improving the user experience. Based on this, when the capacitor device and other devices that generate noise in the working process are laid out in the device setting area 300, the installation position of the device can be selected according to the actual needs, meeting the product design requirements, improving the limitations of the design of the device on the flexible circuit board, making the design and layout of the device more reasonable, and further improving the product competitiveness.
[0051] The application also discloses a display module, which comprises the flexible circuit board in any of the above embodiments, and is connected between the bonding area on the front of the display module and the circuit structure on the back of the display module. This is a known technology in the field, and will not be described here. The above display module can be applied to mobile phones, tablets, displays or other electronic products. By setting the energy absorption structure 600, the noise generated in the working process of the electronic product is reduced, thereby improving the user experience.
[0052] So far, the technical solution of the application has been described in combination with the preferred embodiments shown in the drawings, but those skilled in the art can easily understand that the protection scope of the application is obviously not limited to these specific embodiments. Those skilled in the art can make equivalent changes or replacements to the related technical features without departing from the principles of the application, and the technical solutions after the changes or replacements will fall within the protection scope of the application.
Claims
1. A flexible circuit board, characterized by, The flexible circuit board comprises a first surface (100) and a second surface (200) opposite to the first surface (100), the first surface (100) is provided with a device arrangement area (300), and the second surface (200) is provided with a reinforcing plate (400) at a position corresponding to the device arrangement area (300). The reinforcing plate (400) is provided with an energy absorption structure (600), and the energy absorption structure (600) is used for absorbing vibration energy generated by the device to reduce noise.
2. The flexible circuit board of claim 1, wherein, The reinforcing plate (400) is provided with a through hole (420) along the thickness direction of the reinforcing plate (400), and the energy absorption structure (600) is filled in the through hole (420).
3. The flexible circuit board of claim 2, wherein, The through hole (420) is located in the central region of the reinforcing plate (400), and the distance from the four peripheral edges of the reinforcing plate (400) to the side wall of the through hole (420) is equal.
4. The flexible circuit board of claim 2, wherein, The through hole (420) is provided with a plurality of through holes (420) on the reinforcing plate (400), and each through hole (420) corresponds to each device in the device arrangement area (300).
5. The flexible circuit board of claim 2, wherein, The through hole (420) is provided with a plurality of through holes (420) on the reinforcing plate (400), and each through hole (420) is arranged in an array on the reinforcing plate (400).
6. The flexible circuit board of claim 1, wherein, The energy absorption structure (600) is located between the reinforcing plate (400) and the second surface (200), and the energy absorption structure (600) extends along the plane where the second surface (200) is located.
7. The flexible circuit board of claim 1, wherein, The reinforcing plate (400) covers the projection of the device arrangement area (300) on the second surface (200).
8. The flexible circuit board according to any one of claims 1 to 7, characterized by, The energy absorption structure (600) is a porous material layer or a damping vibration reduction layer.
9. The flexible circuit board of claim 1, wherein, The second surface (200) is provided with a conductive adhesive layer (500) at a position corresponding to the device arrangement area (300), and the reinforcing plate (400) and / or the energy absorption structure (600) are fixed to the second surface (200) through the conductive adhesive layer (500).
10. A display module, characterized by The flexible circuit board comprises a first surface (100) and a second surface (200) opposite to the first surface (100), the first surface (100) is provided with a device arrangement area (300), and the second surface (200) is provided with a reinforcing plate (400) at a position corresponding to the device arrangement area (300).