Partition temperature control system suitable for chip packaging equipment

Abstract

The utility model relates to a partition temperature control system suitable for chip packaging equipment, which comprises a plurality of mounting brackets corresponding to packaging stations, liquid cooling blowing devices are mounted on the mounting brackets, independent medium pipelines are mounted on the liquid cooling blowing devices, circulation driving devices are mounted in the medium pipelines, cooling devices are connected onto the circulation driving devices, and the cooling devices are connected onto the liquid cooling blowing devices. The cooling device is connected with a heat dissipation device, and the circulation driving device is connected with a control device. Therefore, independent temperature control of the environment where the packaging station is located in the temperature control chamber is achieved through cooperation of the independent medium pipeline and the liquid cooling blowing device, the corresponding environment temperature can be provided according to the current packaging requirement, and the temperature control device can also be applied to an ATE testing machine and the like to achieve auxiliary heat dissipation. And through mutual cooperation of the circulation driving device and the cooling device, circulation cooling of the cooling liquid can be achieved, and the requirements for the efficiency and continuity of subsequent temperature control are met.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of partition temperature control equipment, especially a kind of partition temperature control system suitable for chip packaging equipment. BACKGROUND

[0002] For the current integrated circuit packaging and related ATE test, different test boards are different in power, and the heat quantity is also different, which can easily lead to a large temperature difference in the detection area environment of test station, affecting the packaging and test effect. At the same time, during packaging and testing, if the test board cannot be effectively cooled, it will also lead to the decline of the overall efficiency of the test system.

[0003] Therefore, the packaging equipment or the test equipment corresponding to the station is currently installed with a cooling device. However, the current cooling device is only a simple air-cooled fan, and the temperature control effect is general. Alternatively, the overall cooling is performed by relying on the air conditioner in the plant where the equipment is located, and the temperature control effect on the area where the station is located is also poor.

[0004] In view of the above defects, the present design person actively researches and innovates to create a partition temperature control system suitable for chip packaging equipment, so that it has more industrial utilization value. CONTENT OF THE UTILITY MODEL

[0005] To solve the above technical problems, the purpose of the utility model is to provide a partition temperature control system suitable for chip packaging equipment.

[0006] The partition temperature control system suitable for chip packaging equipment of the utility model comprises a plurality of installation supports corresponding to packaging stations, wherein: a liquid cooling blowing device is installed on the installation support, the liquid cooling blowing device is installed with an independent medium pipeline, a circulating driving device is installed in the medium pipeline, a cooling device is connected to the circulating driving device, a heat dissipation device is connected to the cooling device, and a control device is connected to the circulating driving device.

[0007] Further, the partition temperature control system suitable for chip packaging equipment, wherein the liquid cooling blowing device is a liquid cooling fan, comprising a medium containing chamber connected with the installation support, and a pair of blowing heat dissipation fans are installed at the front end of the medium containing chamber.

[0008] Further, the partition temperature control system suitable for chip packaging equipment, wherein the air outlet of the pair of blowing heat dissipation fans is provided with a wind guide culvert.

[0009] Further, the partition temperature control system suitable for chip packaging equipment, wherein the installation support is located at the air outlet of the liquid cooling blowing device, provided with a temperature sensor, and the temperature sensor is electrically connected with the liquid cooling blowing device.

[0010] Further, the partition temperature control system for the chip packaging equipment, wherein the medium pipeline comprises a pipeline body, and a check valve is installed at the docking position of the pipeline body and the circulating driving device.

[0011] Further, the partition temperature control system for the chip packaging equipment, wherein the pipeline body is wrapped with a heat insulation cotton sleeve.

[0012] Further, the partition temperature control system for the chip packaging equipment, wherein the circulating driving device is a circulating pump, and the circulating pump is provided with a pressure regulating module.

[0013] Further, the partition temperature control system for the chip packaging equipment, wherein the cooling device comprises a semiconductor refrigeration device installed at the inlet position of the circulating driving device and docked with the medium pipeline, the semiconductor refrigeration device comprises a device body, the device body is distributed with a refrigeration pipe docked with the medium pipeline, the refrigeration pipe is connected with a semiconductor refrigeration assembly, the semiconductor refrigeration assembly is installed with a plurality of heat dissipation fins, the semiconductor refrigeration assembly is located at the side end of the heat dissipation fins, and an auxiliary heat dissipation fan is installed.

[0014] Further, the partition temperature control system for the chip packaging equipment, wherein the control device is an industrial computer, or the control device is a single-chip microcomputer, the control device is installed with a communication assembly, the communication assembly is a WIFI assembly, or the communication assembly is a 5G communication module.

[0015] Through the above scheme, the utility model at least has the following advantages:

[0016] 1. Through the independent medium pipeline cooperating with the liquid cooling blowing device, the independent temperature control of the environment of the packaging station in the temperature control room is realized, the corresponding environmental temperature can be provided according to the current packaging demand, and the liquid cooling blowing device can also be applied to ATE testing machines to realize auxiliary heat dissipation.

[0017] 2. Through the mutual cooperation of the circulating driving device and the cooling device, the circulating cooling of the cooling liquid can be realized, and the efficiency and continuity of subsequent temperature control are met.

[0018] 3. The independent heat dissipation device is provided, the heat exchange efficiency of the cooling liquid can be improved, and the continuous and effective cooling circulation is met.

[0019] 4. The control device is installed, different coordinated control can be provided according to the need.

[0020] 5. The overall structure is simple, the existing packaging equipment, ATE testing machines and the like can be transformed, and the versatility is good.

[0021] The above description is only a summary of the technical scheme of the present application, in order to make the technical means of the present application more clearly understood, and can be implemented according to the content of the specification, the following is a preferred embodiment of the present application and the detailed description of the drawings as follows. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a layout schematic diagram of the partition temperature control system suitable for the chip packaging equipment.

[0023] The meanings of the reference signs in the drawings are as follows.

[0024] 1 mounting bracket 2 liquid cooling blowing device

[0025] 3 medium pipeline 4 circulating driving device

[0026] 5 medium containing chamber 6 flow guide heat dissipation fan

[0027] 7 wind guide culvert 8 temperature sensor

[0028] 9 pressure regulating module 10 cooling device

[0029] 11 refrigeration pipe 12 semiconductor refrigeration assembly

[0030] 13 heat dissipation fin 14 auxiliary heat dissipation fan

[0031] 15 control device 16 communication assembly DETAILED DESCRIPTION

[0032] The specific implementation of the present application will be further described in detail in combination with the drawings and examples. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

[0033] As Figure 1The utility model provides a partition temperature control system suitable for chip packaging equipment, which comprises a plurality of mounting supports 1 corresponding to packaging stations, and is different in that a liquid cooling blowing device 2 is mounted on the mounting support 1, and the liquid cooling blowing device 2 is mounted with an independent medium pipeline 3. In this way, independent cooling liquid supply of the liquid cooling blowing device 2 can be realized, and the temperature of the working area where the liquid cooling blowing device 2 is located can be controlled by adjusting the power of the liquid cooling blowing device 2 itself. During implementation, the area corresponding to a single liquid cooling blowing device 2 can be additionally provided with a partition to form an independent temperature control room, and the corresponding packaging equipment is placed in the temperature control room, so that independent packaging working temperature can be met. Meanwhile, the medium pipeline 3 is mounted with a circulating driving device 4, the circulating driving device 4 is connected with a cooling device 10, and the cooling device 10 is connected with a heat dissipation device. In this way, the circulating cooling of the cooling liquid in the medium pipeline 3 can be met, and the heat exchange efficiency with the external environment is improved, so that the cooling liquid is kept in a suitable temperature range. Furthermore, a control device 15 can be connected to the circulating driving device 4 for the convenience of control. In this way, the effective control of the circulating rate of the cooling liquid is met, and stable cooling circulation is met.

[0034] In combination with a preferred embodiment of the utility model, the liquid cooling blowing device 2 is a liquid cooling fan, which comprises a medium containing chamber 5 connected with the mounting support 1, and a flow guide heat dissipation fan 6 is mounted at the front end of the medium containing chamber 5. In this way, the cooling medium can circulate through the medium containing chamber 5 and effectively fill the medium containing chamber 5, so that the heat exchange efficiency is improved. Meanwhile, the heat exchange efficiency in the current temperature control room is controlled by controlling the operating power of the flow guide heat dissipation fan 6, so that independent temperature zone control is realized. For the centralized regional cooling demand of some chip packaging, a wind guide channel 7 can be arranged at the air outlet of the flow guide heat dissipation fan 6. In this way, the wind guide channel 7 is connected with the station where the packaging equipment is located, and direct air flow blowing type cooling is carried out. Furthermore, in order to realize accurate temperature control, the utility model mounting support 1 is located at the air outlet of the liquid cooling blowing device 2, and a temperature sensor 8 is arranged. The temperature sensor 8 is electrically connected with the flow guide heat dissipation fan 6 of the liquid cooling blowing device 2. In this way, by setting a temperature threshold, the working efficiency of the flow guide heat dissipation fan 6 can be controlled, and independent temperature setting is realized.

[0035] Further, the medium pipeline 3 comprises a pipeline body, and a check valve is mounted at the connection position of the pipeline body and the circulating driving device 4. In this way, the flow of the cooling liquid can be realized according to the preset flow direction, so that the circulating cooling is facilitated, and the cold and hot shock flow is avoided. Meanwhile, the pipeline body is wrapped with a heat insulation cotton sleeve. In this way, the cooling liquid is prevented from being affected by the room temperature in the factory area as much as possible during transportation, and the energy consumption is reduced.

[0036] In combination with actual implementation, the circulating driving device 4 adopted is a circulating pump, which can meet the circulating loop planning control of the cooling liquid. Meanwhile, the circulating pump is provided with a pressure regulating module 9, so as to realize the operation power control of the circulating pump and provide different cooling liquid flow rates for different temperature controls. Of course, considering the convenience of implementation, the circulating pump can be preferably a commercially available direct current motor driven pump body.

[0037] Further, in order to meet the continuous and stable heat exchange for cooling, the cooling device 10 adopted comprises a semiconductor refrigeration device installed at the heat dissipation branch interface of the circulating driving device 4. Specifically, the semiconductor refrigeration device comprises a device body, the device body is distributed with a refrigeration pipe 11 connected with the medium pipeline 3, and the refrigeration pipe 11 is connected with a semiconductor refrigeration assembly 12. Meanwhile, a plurality of heat dissipation fins 13 are installed on the semiconductor refrigeration assembly 12, so as to improve the heat exchange efficiency. Moreover, the semiconductor refrigeration assembly 12 is located at the side end of the heat dissipation fins 13 and is installed with an auxiliary heat dissipation fan 14. In this way, the airflow heat exchange efficiency of the surface of the heat dissipation fins 13 can be improved. Considering the convenience of implementation, the semiconductor refrigeration device can be selected from commercially available equipment.

[0038] Furthermore, considering the convenience of coordinated control, the control device 15 is an industrial computer or a single-chip microcomputer, and corresponding programs can be inputted. Meanwhile, it is also convenient to make customized adjustment according to the actual application needs on site. Moreover, the utility model is installed with a communication assembly 16 on the control device 15. In this way, the control device 15 can be connected to the back-end control module of the chip packaging equipment, so as to meet the communication needs of coordinated control. Moreover, in order to reduce the field wiring, the communication assembly 16 adopted is a WI-FI assembly or a 5G communication module.

[0039] The working principle of the utility model is as follows:

[0040] The temperature sensor 8 collects the ambient temperature in the current temperature control room, and if the threshold value above the standard temperature is about to be reached, the heating efficiency of the flow guide heat dissipation fan 6 is improved, so that the relatively cold air around the medium containing chamber 5 is blown to the packaging station.

[0041] During this period, the cooling liquid with slightly high temperature in the medium containing chamber 5 flows into the cooling device 10 under the guidance of the medium pipeline 3 through the circulating driving device 4. Then, through the cooperation of the cooling device 10 and the heat dissipation device, heat dissipation and cooling are realized.

[0042] Subsequently, the cooled cooling liquid reflows into the medium containing chamber 5, forming a cooling cycle.

[0043] Meanwhile, the operation of each device can be coordinated through the control device 15, and in particular, the power of the circulating driving device 4 can be adjusted for different packaging needs, so as to provide different cooling liquid flow rates and heat dissipation effects.

[0044] As can be seen from the above text expression and in combination with the drawings, after the utility model is adopted, the following advantages are possessed.

[0045] 1. By independent medium pipeline cooperating with liquid cooling blowing device, independent temperature control of the environment of the packaging station in the temperature control room is realized, corresponding environment temperature can be provided according to current packaging requirement, and the liquid cooling blowing device can be applied to ATE testing machine to realize auxiliary heat dissipation.

[0046] 2. By mutual cooperation of circulating driving device and cooling device, circulating cooling of the cooling liquid can be realized, and the efficiency and continuity of subsequent temperature control are satisfied.

[0047] 3. The independent heat dissipation device is provided, the heat exchange efficiency of the cooling liquid can be improved, and the continuously effective cooling circulation is satisfied.

[0048] 4. The control device is installed, different coordinated control can be provided according to requirement.

[0049] 5. The overall structure is simple, the existing packaging equipment, ATE testing machine and the like can be modified, and the general applicability is better.

[0050] In addition, the indication direction or position relationship described in the utility model is the direction or position relationship shown based on the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or structure indicated must have a specific direction or be operated in a specific direction, so it cannot be understood as a limitation on the utility model.

[0051] The preferred embodiments described above are only the preferred embodiments of the utility model, and are not used for limiting the utility model, and it should be pointed out that, for ordinary skilled persons in the technical field, on the premise that the technical principles of the utility model are not departed from, a plurality of improvements and modifications can be made, and the improvements and modifications should also be regarded as the protection range of the utility model.

Claims

1. A partitioned temperature control system for a chip packaging apparatus, comprising a plurality of mounting supports corresponding to packaging stations, characterized in that: The mounting bracket is provided with a liquid cooling blowing device, the liquid cooling blowing device is provided with a separate medium pipeline, the medium pipeline is provided with a circulating driving device, the circulating driving device is connected with a cooling device, the cooling device is connected with a heat dissipation device, and the circulating driving device is connected with a control device.

2. The zoned temperature control system suitable for a chip packaging facility of claim 1, wherein: The liquid cooling blowing device is a liquid cooling fan, which comprises a medium containing chamber connected with the mounting bracket, and a flow guide heat dissipation fan is arranged at the front end of the medium containing chamber.

3. The zoned temperature control system suitable for a chip packaging facility of claim 2, wherein: The air outlet of the flow guide heat dissipation fan is provided with a wind guide culvert.

4. The zoned temperature control system suitable for a chip packaging facility of claim 1, wherein: The mounting bracket is located at the air outlet of the liquid cooling blowing device and is provided with a temperature sensor, and the temperature sensor is electrically connected with the liquid cooling blowing device.

5. The zoned temperature control system suitable for a chip packaging facility of claim 1, wherein: The medium pipeline comprises a pipeline body, and a check valve is arranged at the butt joint position of the pipeline body and the circulating driving device.

6. The zoned temperature control system suitable for a chip packaging facility of claim 5, wherein: The pipeline body is wrapped with a heat insulation cotton sleeve.

7. The zoned temperature control system suitable for use in a chip packaging facility of claim 1, wherein: The circulating driving device is a circulating pump, and the circulating pump is provided with a pressure regulating module.

8. The zoned temperature control system suitable for use in a chip packaging facility of claim 1, wherein: The cooling device comprises a semiconductor refrigeration device arranged at the heat dissipation branch interface of the circulating driving device, the semiconductor refrigeration device comprises a device body, the device body is distributed with a refrigeration pipe butt jointed with the medium pipeline, the refrigeration pipe is connected with a semiconductor refrigeration assembly, a plurality of heat dissipation fins are arranged on the semiconductor refrigeration assembly, the semiconductor refrigeration assembly is located at the side end of the heat dissipation fins, and an auxiliary heat dissipation fan is arranged.

9. The zoned temperature control system suitable for use in a chip packaging facility of claim 1, wherein: The control device is an industrial computer, or the control device is a single-chip microcomputer, the control device is provided with a communication assembly, the communication assembly is a WI-FI assembly, or the communication assembly is a 5G communication module.

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