Heat dissipation plate with efficient heat conduction

Abstract

The utility model discloses an efficient heat conduction heat dissipation plate, which comprises a heat dissipation assembly and a limiting assembly, the limiting assembly is arranged inside the heat dissipation assembly and is used for limiting parts of the heat dissipation assembly, the heat dissipation assembly comprises a heat dissipation plate body, the heat dissipation plate body extends outwards to be provided with heat dissipation fins for heat dissipation, and the heat dissipation fins are used for heat dissipation. The radiating fins are arranged on the upper surface of the radiating body, the plurality of radiating fins are arranged at intervals, and through the design of the radiating structure and the plurality of radiating fins arranged on the radiating plate body at intervals, the radiating area is increased, and the radiating efficiency of heat is effectively improved. Meanwhile, due to the arrangement of the heat dissipation grooves, an additional heat dissipation channel is provided for heat, and heat transfer and release are further accelerated through the internal air convection effect, so that temperature control of the high-performance electronic equipment under high-load operation is ensured, and the stability and reliability of the system are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator technical field, concretely is a high -efficient heat conduction's radiating plate. BACKGROUND

[0002] Under the background of the current high-tech rapid development era, high-performance electronic devices such as smart phones, tablet computers, high-performance computers, data center servers and automobile electronics are updated at an unprecedented speed. These devices, while providing excellent performance, also face serious heat management challenges. As the power density and operating speed of processors, graphics processing units (GPU), batteries and other key components continue to increase, the heat generated also increases dramatically, which puts higher requirements on the heat dissipation system. Traditional heat dissipation solutions, such as fan cooling and heat sinks, have played a key role in the past, but have been unable to meet the heat dissipation needs of modern high-performance devices. To solve this problem, the present inventors have proposed a high-efficiency heat-conducting radiator. SUMMARY

[0003] In view of the deficiencies in the above-mentioned technology, the utility model provides a high-efficiency heat-conducting radiator.

[0004] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a high-efficiency heat-conducting radiator, comprising a heat dissipation assembly and a limiting assembly, the limiting assembly is arranged inside the heat dissipation assembly for limiting the parts of the heat dissipation assembly, the heat dissipation assembly comprises a heat dissipation plate body, the heat dissipation plate body extends outward to provide heat dissipation fins for heat dissipation, the heat dissipation fins are arranged on the upper surface of the heat dissipation body, and the heat dissipation fins are arranged in multiple and spaced apart.

[0005] As a further elaboration, the heat dissipation plate body extends inward to provide a heat dissipation groove, the heat dissipation groove is provided on the inner side of the heat dissipation plate body, and the heat dissipation plate body is convenient for heat dissipation.

[0006] As a further elaboration, the heat dissipation groove extends outward to provide a heat insulation plate, the heat insulation plate is arranged on the inner side wall of the heat dissipation groove, and is bonded with the heat dissipation plate body.

[0007] As a further elaboration, the limiting assembly comprises a mounting plate, the mounting plate is arranged at one end of the heat dissipation plate body, and the mounting plate is convenient for placing a radiator (not shown), the mounting plate extends outward to provide a mounting hole, the mounting hole is provided on the inner side wall of the mounting plate, and the mounting hole is arranged in multiple and spaced apart.

[0008] As a further elaboration, it further comprises a mounting groove, the mounting groove is provided on the inner side wall of the heat dissipation plate body.

[0009] As further elaboration, the heat dissipation plate body is provided with an arc-shaped plate extending outward from the inner side wall of the heat dissipation plate body.

[0010] As further elaboration, the heat dissipation plate body is provided with an arc-shaped plate extending outward from the inner side wall of the heat dissipation plate body.

[0011] As further elaboration, the mounting plate is provided with a U-shaped groove extending outward from the middle portion of the mounting plate.

[0012] In summary, the utility model has the following beneficial effects: the utility model relates to a high-efficiency heat-conducting heat dissipation plate, through the design of the heat dissipation structure, the plurality of interval heat dissipation fins arranged on the heat dissipation plate body increase the heat dissipation area and effectively improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a three-dimensional structure schematic view of the utility model high-efficiency heat-conducting heat dissipation plate.

[0014] Figure 2 It is a structure schematic view of the utility model high-efficiency heat-conducting heat dissipation plate.

[0015] Figure 3 It is a structure schematic view of the utility model high-efficiency heat-conducting heat dissipation plate.

[0016] Figure 4 It is an explosion schematic view of the utility model high-efficiency heat-conducting heat dissipation plate. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, and obviously, the described embodiments only represent some of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0018] As Figures 1-4The utility model discloses a high -efficient heat conduction's radiating plate, including radiating subassembly and stoping subassembly, stoping subassembly is located the inside of radiating subassembly for the part of radiating subassembly is positioned, radiating subassembly includes radiating plate body 11, and radiating plate body 11 extends outward is equipped with the radiating fin 12 for radiating, and the radiating fin 12 is equipped with on the radiating body upper surface, and the radiating fin 12 is equipped with multiple and interval arrangement.

[0019] Specific speaking, heat first passes through the mode of direct contact, from heat source (such as processor) is transmitted to radiating plate body 11.Radiating plate body 11 adopts the material of high thermal conductivity, such as copper or aluminum alloy, to ensure that heat can be rapidly and evenly distributed on the entire radiating plate, and the multiple interval radiating fins 12 arranged on the upper surface of the radiating plate body 11 further increase the heat dissipation area and improve the heat conduction efficiency. The radiating fins 12 transmit heat to the surrounding environment by directly contacting with air.

[0020] Radiating plate body 11 extends inward to open radiating groove 13, and the radiating groove 13 is arranged on the inner side of the radiating plate body 11, so that the radiating plate body 11 can be cooled.

[0021] Specific speaking, the radiating groove 13 arranged on the radiating plate body 11 not only increases the heat dissipation area, but also promotes the convection cooling of air. When heat is transmitted to the radiating groove 13, the air in the groove is heated, forming a hot air current and rising up, at the same time, the cold air above the radiating groove 13 sinks due to its larger density, filling the space occupied by the hot air current, forming a continuous air flow. This natural convection of cold and hot air accelerates the dissipation of heat, further improving the cooling efficiency.

[0022] The radiating groove 13 extends outward to be provided with a heat insulation plate 14, and the heat insulation plate 14 is arranged on the inner side wall of the radiating groove 13 and is tightly combined with the radiating plate body 11.

[0023] Specific speaking, the heat insulation plate 14 is arranged on the inner side wall of the radiating groove 13 and is tightly combined with the radiating plate body 11, effectively isolating the high-temperature area inside the radiating groove 13 from the external environment, preventing the disorderly diffusion of heat. The heat insulation plate 14 not only isolates the high-temperature area inside the radiating groove 13, but also reduces the possibility of heat being directly transmitted to the external environment through the radiating groove 13. This helps to maintain the convection cooling environment inside the radiating groove 13 and improves the overall cooling efficiency.

[0024] The limiting assembly comprises a mounting plate 21 arranged at one end of the heat dissipation plate body 11, facilitating the placement of a radiator (not shown), the mounting plate 21 extends outwardly and is provided with mounting holes 22, the mounting holes 22 are arranged on the inner side wall of the mounting plate 21, the mounting holes 22 are arranged in multiple and are arranged at intervals, further comprising a mounting groove 201 arranged on the inner side wall of the heat dissipation plate body 11, further comprising a groove 210 arranged on the inner side wall of the heat dissipation plate body 11, and further comprising a limiting hole 220 arranged on the inner side wall of the heat dissipation plate body 11, facilitating the limiting of the heat dissipation plate body 11 and the heat insulation plate 14.

[0025] Specifically, the mounting plate 21 is arranged at one end of the heat dissipation plate body 11, facilitating the placement and fixation of the radiator. The multiple and interval arranged mounting holes 22 on the mounting plate 21 provide stable support points for the installation of the radiator, and ensure the close contact between the radiator and the heat dissipation plate body 11, improving the heat conduction efficiency.

[0026] The design of the mounting groove 201, the groove 210 and the limiting hole 220 not only facilitates the assembly of the heat dissipation plate body 11 and the heat insulation plate 14 and other components, but also ensures the accurate alignment and limiting between the components, preventing the decrease of the heat dissipation efficiency caused by looseness or misalignment.

[0027] The heat dissipation plate body 11 extends outwardly and is provided with an arc-shaped plate 1 arranged on the side wall of the heat dissipation plate body 11, and the mounting plate 21 extends outwardly and is provided with a U-shaped groove 2 arranged in the middle of the mounting plate 21.

[0028] Specifically, the design of the arc-shaped plate 1 extending outwardly from the heat dissipation plate body 11 not only improves the aesthetics of the heat dissipation plate, but also enhances the structural strength of the heat dissipation plate. At the same time, the arc-shaped plate 1 also has a certain guiding effect, which is conducive to air flow and heat dissipation.

[0029] The design of the U-shaped groove 2 extending outwardly from the mounting plate 21 provides additional space for the installation of the radiator, facilitating the quick installation and disassembly of the radiator. At the same time, the U-shaped groove 2 can also be used as part of the heat dissipation channel, promoting the emission of heat.

[0030] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0031] Furthermore, it should be understood that although the description is made according to the embodiments, not every embodiment contains only one independent technical solution, and the description is made in this way only for the sake of clarity, and the person skilled in the art should consider the description as a whole, and the technical solutions in each embodiment can also be combined appropriately to form other embodiments that the person skilled in the art can understand.

Claims

1. A heat spreading plate with high thermal conductivity, characterized by: Including heat dissipation assembly; The limiting assembly is arranged in the heat dissipation assembly, and is used for limiting parts of the heat dissipation assembly. The heat dissipation assembly comprises a heat dissipation plate body, the heat dissipation plate body extends outward and is provided with heat dissipation fins for heat dissipation, the heat dissipation fins are arranged on the upper surface of the heat dissipation plate body, and a plurality of heat dissipation fins are arranged at intervals.

2. The heat plate of claim 1, wherein: The heat dissipation plate body extends inward and is provided with a heat dissipation groove, the heat dissipation groove is arranged on the inner side of the heat dissipation plate body, and the heat dissipation plate body is convenient for heat dissipation.

3. A high efficiency heat conducting heat sink as claimed in claim 2, wherein: The heat dissipation groove extends outward and is provided with a heat insulation plate, the heat insulation plate is arranged on the inner side wall of the heat dissipation groove and is attached to the heat dissipation plate body.

4. The high efficiency heat conducting heat sink plate of claim 3, wherein: The limiting assembly comprises a mounting plate, the mounting plate is arranged at one end of the heat dissipation plate body, the mounting plate is convenient for placing the radiator, the mounting plate extends outward and is provided with a mounting hole, the mounting hole is arranged on the inner side wall of the mounting plate, and a plurality of mounting holes are arranged at intervals.

5. A high efficiency heat conducting heat sink plate according to claim 4, characterized in that: Further comprising an installation groove, the installation groove is arranged on the inner side wall of the heat dissipation plate body.

6. A high efficiency heat conducting heat sink plate according to claim 5, characterized in that: Further comprising a groove, the groove is arranged on the inner side wall of the heat dissipation plate body, further comprising a limiting hole, the limiting hole is arranged on the inner side wall of the heat dissipation plate body, and the heat dissipation plate body and the heat insulation plate are limited.

7. A high efficiency heat conducting heat sink plate according to claim 6, characterized in that: The heat dissipation plate body extends outward and is provided with an arc-shaped plate, and the arc-shaped plate is arranged on the side wall of the heat dissipation plate body.

8. A high efficiency heat conducting heat sink plate according to claim 7, characterized in that: The mounting plate extends outward and is provided with a U-shaped groove, and the U-shaped groove is arranged in the middle of the mounting plate.

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