Array type diode

By designing an array frame and positioning cover structure in the array diode, electrostatic discharge, thermal control and overvoltage protection are achieved, solving the stability and reliability problems of array diodes during use, preventing shaking, and improving the stability and safety of the circuit.

CN223859673UActive Publication Date: 2026-01-30ZHONGSHAN LVMING LIGHTING TECH CO LTD
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Patent Information

Application Number
CN202520325190.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-27
Publication Date
2026-01-30
Estimated Expiration
2035-02-27

AI Technical Summary

Technical Problem

In the existing technology, array diodes lack electrostatic discharge protection, thermal control and overvoltage transient protection during use, which leads to reduced circuit stability and reliability. They also have problems such as unstable placement and easy shaking.

Method used

An array-type diode structure was designed, comprising an array frame, a positioning cover, and a through-hole. The diodes are arranged in an array and connected in parallel through the diode placement slots. The structure is protected by the through-hole and the bottom slot of the diodes. It is fixed by mounting screws and a dustproof cover to achieve electrostatic discharge, thermal control, and overvoltage protection, and to prevent shaking.

Benefits of technology

It improves the circuit stability and reliability of array diodes, prevents diodes from shaking during use, and enhances stability and safety in use.

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Abstract

The utility model belongs to the technical field of diodes, and particularly relates to an array type diode, which comprises an array frame and further comprises diode placing grooves arranged in the array frame in a penetrating manner, threading line grooves arranged among the diode placing grooves in a penetrating manner, diode bottom notches arranged at the bottoms of the diode placing grooves in a penetrating manner, and the diode bottom notches arranged at the bottoms of the diode placing grooves in a penetrating manner. Diode placing grooves are formed in the top of the array frame, diode bodies are movably installed in the diode placing grooves, a positioning cover is movably installed at the top of the array frame, a cover dustproof pad is fixedly installed at the bottom of the positioning cover, and the multiple diode bodies are placed in an array through the diode placing grooves in the array frame. Then, the diode bodies placed in an array are connected in parallel by using the threading line grooves, and then the plurality of diode bodies are subjected to threading connection by using the diode bottom groove openings, so that the plurality of diodes can be subjected to array type placement electrostatic discharge protection, thermal control and overvoltage transient protection; therefore, the stability and the reliability of the circuit are improved when the diode array is used.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to diode technical field, especially relate to an array diode. BACKGROUND

[0002] Diode is with semiconductor material made one kind of electronic device, it has unidirectional conductivity, when the diode anode and cathode are given forward voltage, the diode is on, when the anode and cathode are given reverse voltage, the diode is cut off, therefore, the diode is on and cut off, it is equivalent to the switch on and off, and diode is one of the earliest born semiconductor devices, and its application is very wide.Especially in various electronic circuits, utilize diode and resistance, capacitor, inductor and other components and devices to connect reasonably, constitute the circuit of different functions, can realize the rectification of alternating current, the detection of modulated signal, amplitude limiting and clamping and the voltage stabilization of power supply voltage and other functions, no matter in the common radio circuit or in other household appliance products or industrial control circuit, can find the trace of diode, for this, an array diode is proposed.

[0003] For example, the Chinese patent with the authorization announcement number CN212587502U discloses an array diode, which comprises a mounting frame, a clamping pipe and a diode body; the clamping pipe is fixedly installed at the center hole of the mounting frame, and multiple clamping pipes are arranged side by side; the diode body is clamped inside the clamping pipe, the pins of the diode body pass through the clamping pipe and are in sliding connection with the clamping pipe; and screws are arranged at the four corners of the mounting frame.

[0004] The patent has the following problems:

[0005] The prior art document is inconvenient to use for electrostatic discharge protection, heat control and overvoltage transient protection for multiple diodes, thereby reducing the stability and reliability of the circuit when the diode array is used, and the prior art document is inconvenient to use for positioning the diode placed and used in the array, and the array diode may be biased and shaken during use, thereby reducing the stability of the array diode. In view of this, an array diode is proposed. UTILITY MODEL CONTENTS

[0006] The utility model aims at the above-mentioned technical problem, provides an array diode, achieves the effect of improving the stability and reliability of the circuit when the diode array is used, and achieves the effect of improving the stability of the array diode.

[0007] In view of the above, the utility model provides an array type diode, including array frame, still include: the inside of array frame is all through diode placement slot setting, diode placement slot between all is through the wire slot setting, the bottom of diode placement slot all is through diode bottom slot mouth setting, the inside of diode placement slot all mobile mounting has diode body, the top of array frame mobile mounting has positioning cover, the bottom of positioning cover fixed mounting has cover dustproof pad, the inside of positioning cover all is through cover wire slot hole setting, the both sides of cover wire slot hole all are screw -threaded mounting has installation screw.

[0008] Based on the above structure, the diode placement slot inside the array frame is used to array the plurality of diode bodies, then the wire slot is used to make the arrayed diode bodies in parallel, then the diode bottom slot mouth is used to wire connect the plurality of diode bodies, so that the plurality of diodes can be arrayed and placed for electrostatic discharge protection and overvoltage transient protection, then the installation screw is screwed through the positioning cover and the cover dustproof pad and is screwed on the top of the array frame, then the plurality of cover wire slot holes are used to wire the diodes, so that the plurality of arrayed diodes can be stably placed, thereby improving the stability of the arrayed diode.

[0009] Preferably, the outside of the array frame is movably sleeved with an expansion frame, and the bottom of the array frame is fixedly installed with a mounting bottom plate.

[0010] Preferably, the bottom of the expansion frame is fixedly installed with a connecting side strip block, the both sides of the connecting side strip block are fixedly installed with buffer side strip plates, and the both ends of the expansion frame are fixedly installed with expansion strips.

[0011] Preferably, the both ends of the expansion strip are fixedly installed with top installation strips, and the inside of the top installation strip is penetratedly installed with a top installation sleeve.

[0012] Preferably, the bottom of the top installation strip is fixedly installed with an expansion adhering strip, and the both ends of the expansion adhering strip are fixedly installed with expansion protection strips.

[0013] Preferably, the bottom of the expansion adhering strip is fixedly installed with a bottom installation strip, and the inside of the bottom installation strip is penetratedly installed with a bottom installation sleeve.

[0014] Preferably, the inside of the mounting bottom plate is penetratedly installed with a bottom plate slot, and the both sides of the bottom plate slot are penetratedly installed with bottom plate mounting holes.

[0015] Compared with the prior art, the utility model has the advantages that:

[0016] 1. The utility model discloses a diode body is placed to multiple array through the diode placing groove inside array frame, then utilizes the threading groove to make the diode body of array placement parallel connection, then utilizes diode bottom groove mouth to carry out threading connection to multiple diode bodies, can make multiple diodes array type placement electrostatic discharge protection, heat control and overvoltage transient protection, thereby improved the stability and reliability of circuit when using diode array.

[0017] 2. The utility model discloses through installing screw thread through positioning cover and cover dustproof pad is installed on the top of array frame in screw thread, then utilizes a plurality of cover threading groove hole to make diode threading use, can make multiple array type placement diode to be placed stably, and diode will not appear the condition of shaking when array placement, thereby improved the stability of array type diode use. DRAWINGS

[0018] Figure 1 It is the overall perspective drawing of the utility model;

[0019] Figure 2 It is the overall structure schematic drawing in the utility model;

[0020] Figure 3 It is the array frame local structure schematic drawing in the utility model;

[0021] Figure 4 It is the connecting side strip block partial perspective drawing in the utility model;

[0022] Figure 5 It is the installation bottom plate partial perspective drawing in the utility model.

[0023] Marked in the drawing as:

[0024] 1, expansion frame, 2, connecting side strip block, 201, buffer side strip board, 3, installation bottom plate, 301, bottom plate slot, 302, bottom plate mounting hole, 4, expansion strip, 5, expansion bonding strip, 501, expansion protection strip, 6, top installation strip, 601, top installation sleeve, 7, bottom installation strip, 701, bottom installation sleeve, 8, array frame, 801, diode placing groove, 802, diode bottom groove mouth, 803, threading groove, 804, diode body, 9, positioning cover, 901, cover threading groove hole, 902, cover dustproof pad, 903, installation screw. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0026] The embodiment of the application discloses an array diode, please refer to Figures 1-5 , including the array frame 8, still include: the inside of array frame 8 is all through diode placement slot 801 is arranged, diode placement slot 801 between all through the wire slot 803 is arranged, the bottom of diode placement slot 801 all through diode bottom slot mouth 802 is arranged, the inside of diode placement slot 801 all movable mounting diode body 804, the top of array frame 8 movable mounting is positioned cover 9, the bottom of positioning cover 9 fixed mounting is cover dustproof pad 902, the inside of positioning cover 9 all through cover wire slot hole 901 is arranged, the both sides of cover wire slot hole 901 all screw thread installation mounting screw 903.

[0027] Based on the above structure, through the diode placement slot 801 inside array frame 8 multiple diode body 804 is placed in array, then utilize wire slot 803 and make the diode body 804 of array placement parallel connection, then utilize diode bottom slot mouth 802 and multiple diode body 804 are connected, can make multiple diodes and array placement electrostatic discharge protection, heat control and overvoltage transient protection, thereby improve the stability and reliability of diode array in the use of circuit, then utilize mounting screw 903 and screw through positioning cover 9 and cover dustproof pad 902 in the top of array frame 8 is screwed, then utilize multiple cover wire slot hole 901 and make diode and wire use, can make multiple array placement diode and stable placement, diode in array placement will not appear shaking condition, thereby improve the stability of array diode use.

[0028] In one embodiment, the outside of array frame 8 movable sleeve joint installation has expansion frame 1, the bottom of array frame 8 fixed mounting has installation bottom plate 3.

[0029] Specifically, the outside of array frame 8 movable sleeve joint installation has expansion frame 1.

[0030] In the embodiment, expansion frame 1 can be used in the outside of array frame 8 movable sleeve joint, so as to facilitate the expansion of array arrangement diode.

[0031] In one of the embodiments, the bottom of the expansion rack 1 is fixedly installed with a connecting side block 2, both sides of the connecting side block 2 are fixedly installed with a buffer side plate 201, and both ends of the expansion rack 1 are fixedly installed with an expansion strip 4.

[0032] Specifically, both sides of the connecting side block 2 are fixedly installed with a buffer side plate 201.

[0033] In this embodiment, the buffer side plate 201 on both sides can be used to buffer and protect the diode, thereby improving the safety of the diode in use.

[0034] In one of the embodiments, both ends of the expansion strip 4 are fixedly installed with a top mounting strip 6, and the inside of the top mounting strip 6 is installed with a top mounting sleeve 601.

[0035] Specifically, the inside of the top mounting strip 6 is installed with a top mounting sleeve 601.

[0036] In this embodiment, the top mounting strip 6 and the inside top mounting sleeve 601 can be used to allow the diode to be installed on the device, thereby improving the stability of the array diode installation.

[0037] In one of the embodiments, the bottom of the top mounting strip 6 is fixedly installed with an expansion fitting strip 5, and both ends of the expansion fitting strip 5 are fixedly installed with an expansion protection strip 501.

[0038] Specifically, both ends of the expansion fitting strip 5 are fixedly installed with an expansion protection strip 501.

[0039] In this embodiment, the expansion protection strip 501 can be used to protect the diode, thereby improving the safety of the diode in use.

[0040] In one of the embodiments, the bottom of the expansion fitting strip 5 is fixedly installed with a bottom mounting strip 7, and the inside of the bottom mounting strip 7 is installed with a bottom mounting sleeve 701.

[0041] Specifically, the inside of the bottom mounting strip 7 is installed with a bottom mounting sleeve 701.

[0042] In this embodiment, the bottom mounting strip 7 and the inside bottom mounting sleeve 701 can be used to allow the diode to be installed on the device, thereby improving the stability of the array diode installation.

[0043] In one of the embodiments, the inside of the mounting bottom plate 3 is provided with a bottom plate slot 301, and both sides of the bottom plate slot 301 are provided with a bottom plate mounting hole 302.

[0044] Specifically, the inside of the mounting bottom plate 3 is provided with a bottom plate slot 301, and both sides of the bottom plate slot 301 are provided with a bottom plate mounting hole 302.

[0045] In the embodiment, the bottom of the diode is threaded through the bottom plate slot 301, then the mounting bottom plate 3 is bolted and movably mounted on the top of the device through the plurality of bottom plate mounting holes 302, thereby improving the convenience of diode installation.

[0046] In use, the plurality of diode bodies 804 are arrayed and placed in the diode placing slot 801 inside the array frame 8, then the arrayed and placed diode bodies 804 are connected in parallel through the threading slot 803, then the plurality of diode bodies 804 are threaded and connected through the diode bottom slot 802, then the diode is threaded and used through the plurality of cover threading slot holes 901, then the diode is movably sleeved and used outside the array frame 8 through the expansion frame 1, then the diode is buffered and protected through the two buffer side plates 201, then the diode is movably mounted on the device through the top mounting strip 6 and the internal top mounting sleeve 601, then the diode is protected through the expansion protection strip 501, then the diode is movably mounted on the device through the bottom mounting strip 7 and the internal bottom mounting sleeve 701, then the bottom of the diode is threaded and used through the bottom plate slot 301, then the mounting bottom plate 3 is bolted and movably mounted on the top of the device through the plurality of bottom plate mounting holes 302.

[0047] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0048] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise specifically limited.

[0049] In the utility model, unless another definite provision and limitation, the term " install " " link " " connect " " fixed " and so on term should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electric connection, also can be communication;Can be direct connection, also can pass through intermediate medium indirectly connect, can be two element inside's intercommunication or two element's interaction relation. For ordinary skilled person in the art, can understand the concrete meaning of above -mentioned term in the utility model according to specific circumstances.

[0050] In the utility model, unless another definite provision and limitation, first feature is " on " or " under " second feature can be first and second feature direct contact, or first and second feature indirectly contact by intermediate medium. In the description of the present specification, the description of reference terms " one scheme " " some schemes " " example " " specific example " or " some examples " means that the specific features, structures, materials or characteristics described in conjunction with the scheme or example are included in at least one scheme or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same scheme or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more schemes or examples in a suitable manner.

Claims

1. An array diode comprising a column array frame (8), characterized in that, Also include: The inside of the column array frame (8) is provided with a diode placement slot (801), the diode placement slot (801) is provided with a threading slot (803), the bottom of the diode placement slot (801) is provided with a diode bottom slot (802), the inside of the diode placement slot (801) is movably installed with a diode body (804), the top of the column array frame (8) is movably installed with a positioning cover (9), the bottom of the positioning cover (9) is fixedly installed with a cover dustproof pad (902), the inside of the positioning cover (9) is provided with a cover threading slot hole (901), both sides of the cover threading slot hole (901) are screw installed with mounting screws (903).

2. An arrayed diode according to claim 1, wherein The outside of the column array frame (8) is movably sleeved with an expansion frame (1), and the bottom of the column array frame (8) is fixedly installed with a mounting bottom plate (3).

3. An arrayed diode according to claim 2, wherein, The bottom of the expansion frame (1) is fixedly installed with a connecting side strip block (2), both sides of the connecting side strip block (2) are fixedly installed with a buffer side strip plate (201), both ends of the expansion frame (1) are fixedly installed with an expansion strip (4).

4. An arrayed diode according to claim 3, wherein, Both ends of the expansion strip (4) are fixedly installed with a top mounting strip (6), and the inside of the top mounting strip (6) is provided with a top mounting sleeve (601).

5. An arrayed diode according to claim 4, wherein, The bottom of the top mounting strip (6) is fixedly installed with an expansion adhering strip (5), and both ends of the expansion adhering strip (5) are fixedly installed with an expansion protection strip (501).

6. An arrayed diode according to claim 5, wherein, The bottom of the expansion adhering strip (5) is fixedly installed with a bottom mounting strip (7), and the inside of the bottom mounting strip (7) is provided with a bottom mounting sleeve (701).

7. The arrayed diode of claim 2, wherein: The inside of the mounting bottom plate (3) is provided with a bottom plate slot (301), and both sides of the bottom plate slot (301) are provided with a bottom plate mounting hole (302).

Citation Information

Patent Citations

  • Array type diode

    CN212587502U