Micro heat source structure, insertion finger structure, atomizing core and electronic device
By introducing a thermally conductive layer into the resistive component and connecting it to the impedance body, the problem of low thermal conductivity of the resistive component is solved, enabling rapid heat conduction and improving the functional efficiency of the electronic device.
Patent Information
- Application Number
- CN202520174418.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-26
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-01-26
AI Technical Summary
Existing resistive components have low thermal conductivity, which affects the functionality of electronic devices.
A micro heat source structure is provided, including a substrate, an impedance body, and a thermally conductive layer. The thermally conductive layer covers the impedance body and exposes electrodes through windows. The thermally conductive layer is connected to the impedance body. The thermally conductive layer is made of a material with high thermal conductivity and has a thickness of 0.1 micrometers to 20 micrometers, and is used to quickly conduct heat generated by the impedance body.
It improves heat transfer efficiency, ensuring the realization of product functions, especially in the efficiency of heating liquid medicine or gas in medical devices and nebulizers.
Smart Images
Figure CN223860205U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic component technology, and particularly relates to a micro heat source structure, interdigitated structure, atomizing core and electronic device. Background Technology
[0002] Electronic devices typically contain various electronic components, such as resistors. Resistors are conductors that impede the flow of electric current. The most important characteristic of a resistor is its resistance value. Generally, the resistance value of a resistor can be adjusted by changing its cross-sectional area, length, or material.
[0003] Because resistive components generate heat during application, electronic devices can utilize this heat to achieve certain functions. For example, nebulizers use resistive components to heat and atomize gases or liquids, and some drug delivery devices use resistive components as heat sources to heat the medication. However, existing resistive components have low thermal conductivity, which affects the realization of product functions. Utility Model Content
[0004] This application provides a micro heat source structure, which aims to solve the problem that existing resistive components have low thermal conductivity, thus affecting the function of electronic devices.
[0005] The embodiments of this application provide a micro heat source structure, including:
[0006] A substrate having a first surface;
[0007] The impedance body is disposed on the first surface; and
[0008] A thermally conductive layer is disposed on the first surface and covers at least a portion of the impedance body connection.
[0009] Furthermore, a thermally conductive layer covers the impedance body, which has electrodes, and the thermally conductive layer is provided with windows that extend into the impedance body to expose the electrodes.
[0010] Furthermore, the impedance body can be a resistor body or an interpolation structure.
[0011] Furthermore, a metal lead-out pillar is provided inside the window, and a pad is provided on the side of the heat-conducting layer away from the substrate. The first end of the metal lead-out pillar is electrically connected to the electrode of the impedance body, and the second end of the metal lead-out pillar is electrically connected to the pad.
[0012] Furthermore, the thickness of the thermally conductive layer ranges from 0.1 micrometers to 20 micrometers.
[0013] Furthermore, the substrate has a second surface opposite to the first surface, and the substrate is provided with a first through hole that penetrates the first surface and the second surface of the substrate. The projection of the first through hole on the first surface does not coincide with the projection of the impedance body on the first surface.
[0014] Furthermore, the substrate has a second surface opposite to the first surface, and the substrate is provided with a second through hole that penetrates the first surface and the second surface of the substrate. The second through hole is filled with a conductive structure, and a heat dissipation layer is provided on the second surface, which is connected to the conductive structure.
[0015] Furthermore, the impedance body includes a multidimensional tortuous structure, and the thermally conductive layer covers the multidimensional tortuous structure.
[0016] Secondly, this application also provides a micro heat source structure, comprising:
[0017] A substrate having a first surface;
[0018] A thermally conductive layer is disposed on the first surface; and
[0019] The impedance body is set on the thermally conductive layer.
[0020] Furthermore, the impedance body can be a resistor body or an interpolation structure.
[0021] Furthermore, the substrate has a second surface opposite to the first surface, and the substrate is provided with a first through hole that penetrates the first surface and the second surface of the substrate. The projection of the first through hole on the first surface does not coincide with the projection of the impedance body on the first surface.
[0022] Furthermore, it also includes a protective layer that covers the impedance body.
[0023] Thirdly, this application also provides a finger insertion structure, including:
[0024] A substrate having a first surface;
[0025] The inserter body is disposed on the first surface; and
[0026] A thermally conductive layer is disposed on the first surface and covers at least a portion of the interdigitated body.
[0027] Fourthly, this application also provides an atomizing core, including the micro heat source structure as described above.
[0028] Fifthly, this application also provides an electronic device including the micro heat source structure as described above.
[0029] The beneficial effects of this application are as follows: The micro heat source structure provided by this application includes a substrate having a first surface; an impedance body disposed on the first surface; and a thermally conductive layer disposed on the first surface and covering at least a portion of the impedance body. By connecting the thermally conductive layer to the impedance body, the heat generated by the impedance body can be quickly conducted to the thermally conductive layer, and then conducted from the thermally conductive layer to the location requiring heating, thereby improving heat conduction efficiency and ensuring product functionality. Attached Figure Description
[0030] Figure 1 This is a schematic diagram of one embodiment of the micro heat source structure provided in this application;
[0031] Figure 2 This is a schematic diagram of an embodiment of the micro heat source structure provided in this application, which includes solder pads.
[0032] Figure 3 This is a schematic diagram of a substrate with a second through hole in one embodiment of the micro heat source structure provided in this application;
[0033] Figure 4 This is a schematic diagram of an embodiment of the micro heat source structure provided in this application, which includes a heat dissipation layer.
[0034] Figure 5 This is a schematic diagram of an embodiment of the micro heat source structure provided in this application, showing the impedance body forming a serpentine shape.
[0035] Figure 6 This is a schematic diagram of an embodiment of the micro heat source structure provided in this application, showing that the impedance body is in a finger-like shape.
[0036] Figure 7 This is a schematic diagram of a substrate having multiple first through holes, representing an embodiment of the micro heat source structure provided in this application.
[0037] Figure 8 This is a schematic diagram of another embodiment of the micro heat source structure provided in this application;
[0038] Figure 9 This is a schematic diagram of another embodiment of the micro heat source structure provided in this application, showing a substrate with multiple through holes.
[0039] Explanation of reference numerals in the attached drawings: 100-substrate, 110-second through hole, 120-first through hole, 130-conductive structure, 200-impedance body, 300-thermal conductive layer, 310-window, 400-pad, 500-heat dissipation layer, 600-protective layer. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this application and are not intended to limit this application.
[0041] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0043] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0044] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0045] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference values and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0046] The micro heat source structure provided in this application includes a substrate having a first surface; an impedance body disposed on the first surface; and a thermally conductive layer disposed on the first surface and covering at least a portion of the impedance body. By connecting the thermally conductive layer to the impedance body, the heat generated by the impedance body can be quickly conducted to the thermally conductive layer, and then conducted from the thermally conductive layer to the location requiring heating, thereby improving heat transfer efficiency and ensuring product functionality.
[0047] like Figures 1 to 9 As shown, one embodiment of this application provides a micro heat source structure, including:
[0048] Substrate 100, substrate 100 having a first surface;
[0049] Impedance body 200 is disposed on the first surface; and
[0050] A thermally conductive layer 300 is disposed on the first surface and covers at least a portion of the impedance body 200.
[0051] In practice, the micro heat source structure provided in this application can be regarded as a resistive element, wherein the substrate 100 is used to support the impedance body 200.
[0052] Optionally, the substrate 100 may be made of an insulating material, such as glass, plastic or other insulating materials. The substrate 100 is preferably made of glass substrate, but there is no limitation.
[0053] The impedance body 200 is the core of the micro heat source structure and acts as a heat source. The impedance body 200 can be a resistor body or an interdigitated (forked) structure body.
[0054] Optionally, the impedance body 200 can be in the form of a strip or a block structure. For example, the impedance body 200 can be designed as a long strip that is straight, curved, spiral or wavy.
[0055] It should be noted that the shape of the impedance body 200 described above is an illustrative example of the embodiments of this application, and not a specific limitation of this application. In other embodiments, the impedance body 200 may also adopt other shapes, for example, all or part of the impedance body 200 may be designed as a snake shape, such as... Figure 5 As shown, the impedance body 200 can be designed to include a multi-dimensional meandering structure, with the thermally conductive layer 300 covering the multi-dimensional meandering structure. A portion of the multi-dimensional meandering structure can be serpentine, such as... Figure 5 As shown, or all or part of the impedance body 200 can be designed as a finger-type connector, such as... Figure 6 As shown, no limitations are imposed.
[0056] The heat-conducting layer 300 is connected to the impedance body 200 to absorb the heat generated by the impedance body 200 and conduct it to the required location. For example, taking a drug delivery system in a medical device as an example, the impedance body 200 is the heating wire of the drug delivery system. Since the heat-conducting layer 300 is connected to the impedance body 200, the heat-conducting layer 300 can quickly conduct and dissipate the heat generated by the impedance body 200. At this time, the heat-conducting layer 300 and the impedance body 200 can be regarded as a whole. That is, by setting the heat-conducting layer 300 to increase the heat conduction surface area, the heat generated by the impedance body 200 can be quickly conducted to the drug delivery system in the medical device through the heat-conducting layer 300 to heat the liquid medicine passing through the drug delivery system, resulting in higher heat conduction efficiency.
[0057] Optionally, the impedance body 200 is provided with electrodes for electrical connection with an external circuit to connect resistive components into the circuit and achieve the corresponding function.
[0058] The thermally conductive layer 300 covers the impedance body 200. The thermally conductive layer 300 not only plays a role in heat conduction, but also plays a role in protecting the impedance body 200 from oxidation.
[0059] As one possible implementation, taking an atomizer as an example, the atomizer is provided with an atomization chamber. The heat generated by the impedance body 200 can be quickly conducted to the atomization chamber through the heat-conducting layer 300 to heat the gas or liquid in the atomization chamber for atomization, thereby improving the atomization efficiency.
[0060] In implementation, the thermally conductive layer 300 is made of a material with high resistivity and high thermal conductivity. For example, the thermally conductive layer 300 is a high-resistivity metal layer. Optionally, the high-resistivity metal layer may be at least one of nickel-chromium alloy, platinum-rhodium alloy, copper-nickel alloy, aluminum alloy, DLC (diamond-like carbon), and titanium + titanium nitride alloy, as long as it meets the requirements of high resistivity and high thermal conductivity, without limitation.
[0061] For example, nickel-chromium alloys have a high resistivity and are widely used in electric heaters, thermocouples and other fields. In addition, nickel-chromium alloys also have excellent resistance to oxidation and corrosion, which will not be elaborated further.
[0062] In some embodiments, the thermally conductive layer 300 may not be in contact with the electrodes of the impedance body 200, that is, the thermally conductive layer 300 is only in thermal contact with the impedance body 200, and the heat generated by the impedance body 200 can be conducted by the thermally conductive layer 300.
[0063] As one possible implementation, the thermally conductive layer 300 can contact the electrodes of the impedance body 200, that is, the thermally conductive layer 300 only has thermal and electrical contact with the impedance body 200. In this case, the thermally conductive layer 300 and the impedance body 200 can be regarded as being connected in parallel.
[0064] Because the heat-conducting layer 300 has resistivity characteristics, its resistance value is much higher than that of the impedance body 200. In a parallel circuit, when two resistors are connected in parallel, for example, let the impedance body 200 and the heat-conducting layer 300 be R... a and R b For example, the equivalent resistance R after the impedance body 200 and the heat-conducting layer 300 are connected in parallel eq It can be calculated using the following formula:
[0065]
[0066] If R b Very large (approaching infinity), optionally, R can be... b Designed as R a A large multiple of R, for example, R b Designed as R a The value can be 100 times, 200 times, 500 times, 1000 times, or greater than 1000 times, without limitation. Therefore, because R... b It's very large, so 1 / R b It will be very small, almost negligible. Therefore, in R b As the value approaches infinity, we can obtain:
[0067] R eq ≈R a
[0068] In other words, when R b Relative to R a When the value is very large, the equivalent resistance after parallel connection will be close to the smaller resistance R. a Therefore, the final combined resistance of the thermally conductive layer 300 and the impedance body 200 connected in parallel is basically R. a The value of .
[0069] Optionally, the thermally conductive layer 300 can be prepared by PVD (Physical Vapor Deposition), electroplating, CVD (Chemical Vapor Deposition), PCVD (plasma chemical vapor deposition) or other methods, without limitation.
[0070] Optionally, the thickness of the thermal conductive layer 300 ranges from 0.1 micrometers to 20 micrometers. For example, the thickness of the thermal conductive layer 300 can be any value from 0.2 micrometers, 0.5 micrometers, 1 micrometer, 2 micrometers, 5 micrometers, 8 micrometers, 10 micrometers, 12 micrometers, 15 micrometers, 18 micrometers or 0.1 micrometers to 20 micrometers, without limitation.
[0071] The thermally conductive layer 300 is provided with an opening 310, such as Figure 1 As shown, the window 310 can expose the electrodes of the impedance body 200, so that the impedance body 200 can be electrically connected to an external circuit through the window 310.
[0072] The micro heat source structure provided in this application includes a substrate 100 having a first surface; an impedance body 200 disposed on the first surface; and a thermally conductive layer 300 disposed on the first surface and covering at least a portion of the impedance body 200. By connecting the thermally conductive layer 300 to the impedance body 200, the heat generated by the impedance body 200 can be quickly conducted to the thermally conductive layer 300, and then conducted from the thermally conductive layer 300 to the location requiring heating, thereby improving heat transfer efficiency and ensuring product functionality.
[0073] In some optional embodiments, a lead-out metal pillar is provided within the window 310, and a pad 400 is provided on the side of the heat-conducting layer 300 away from the substrate 100. The first end of the lead-out metal pillar is electrically connected to the electrode of the impedance body 200, and the second end of the lead-out metal pillar is electrically connected to the pad 400. Figure 2 As shown.
[0074] In implementation, the pads 400 facilitate the electrical connection between the impedance body 200 and the external circuit. The pads 400 can be configured as metal sheets or micro-bumps on the side of the thermally conductive layer 300 away from the substrate 100. Optionally, metal lines (not shown) can also be provided on the pads 400 to facilitate subsequent wire bonding processes.
[0075] Optionally, solder paste or other solder can also be provided on the solder pads 400 to facilitate soldering and improve soldering reliability.
[0076] As one possible implementation, the substrate 100 may also be provided with a plurality of first through holes 120, such as Figure 7As shown. The first through-hole 120 penetrates the substrate 100, meaning the second through-hole 120 penetrates both the first and second surfaces of the substrate 100. The projection of the first through-hole 120 onto the first surface does not coincide with the projection of the impedance body 200 onto the first surface. When the thermally conductive layer 300 is disposed on the first surface, a portion of the thermally conductive layer 300 is embedded in the first through-hole 120 to form a protrusion. This protrusion can be partially or completely embedded in the first through-hole 120, without limitation. Through the above arrangement, the thermally conductive layer 300 partially conducts the heat generated by the impedance body 200 to the first through-hole 120, allowing the heat to be further conducted to the second surface of the substrate 100, thereby improving the heat conduction efficiency.
[0077] Optionally, when the thermally conductive layer 300 is disposed on the first surface, a portion of the thermally conductive layer 300 may be suspended in the first through-hole 120. That is, the portion of the thermally conductive layer 300 filling the first through-hole 120 cannot completely fill the first through-hole 120 to form a filling hole. This filling hole and the first through-hole 120 together penetrate the side of the thermally conductive layer 300 away from the substrate 100 and the second surface of the thermally conductive layer 300, such as... Figure 3 and Figure 4 As shown.
[0078] In some alternative embodiments, the substrate 100 has a second surface opposite to the first surface, the substrate 100 is provided with a second through hole 110, the second through hole 110 penetrates the first surface and the second surface of the substrate 100, the second through hole 110 is filled with a conductive structure 130, and a heat dissipation layer 500 is provided on the second surface, the heat dissipation layer 500 is connected to the conductive structure.
[0079] It should be noted that the conductive structure 130 can completely fill the second through hole 110 or partially fill it. The conductive structure can be fabricated in the same process (e.g., PVD) as the heat dissipation layer 500. The second through hole 110, which is partially filled with the conductive structure 130, is connected to the external environment without affecting the flow of air around it.
[0080] Optionally, the heat dissipation layer 500 can refer to the heat conduction layer 300 described above, that is, the material of the heat dissipation layer 500 is the same as that of the heat conduction layer 300, and the function is the same, which will not be elaborated here. Through the above settings, the heat conduction efficiency can be further improved.
[0081] Optionally, the free end of the protrusion can also be connected to the heat dissipation layer 500 to conduct heat to the heat dissipation layer 500, thereby further improving the heat conduction efficiency.
[0082] In some alternative embodiments, such as Figure 8 As shown, this application also provides a micro heat source structure, including:
[0083] Substrate 100, substrate 100 having a first surface;
[0084] A thermally conductive layer 300 is disposed on the first surface; and
[0085] The impedance body 200 is disposed on the heat-conducting layer 200.
[0086] The substrate 100, the impedance body 200, and the thermally conductive layer 300 can be described as above, except that the thermally conductive layer 300 is located between the substrate 100 and the impedance body 200. In this case, the thermally conductive layer 300 can not only conduct heat, but also serve as a bonding layer between the substrate 100 and the impedance body 200, thereby improving the adhesion between the substrate 100 and the impedance body 200.
[0087] Optionally, the impedance body 200 can be a resistor body or an interdigitated structure.
[0088] Optionally, the substrate 100 has a second surface opposite to the first surface. The substrate 100 is provided with a first through-hole 120, which penetrates both the first and second surfaces of the substrate 100. The projection of the first through-hole 120 on the first surface does not coincide with the projection of the impedance body 200 on the first surface. With the above arrangement, the first through-hole 120 penetrates the entire micro heat source structure, thus not affecting the flow of surrounding gas. Furthermore, the thermally conductive layer 300 conducts part of the heat generated by the impedance body 200 to the first through-hole 120, allowing the heat to be further conducted to the second surface of the substrate 100, thereby improving the heat conduction efficiency.
[0089] Optionally, when the thermally conductive layer 300 is disposed on the first surface, a portion of the thermally conductive layer 300 fills the first through-hole 120 (e.g., hangs on the wall of the first through-hole 120), and this portion does not completely fill the first through-hole 120, thereby forming a filling hole. This filling hole penetrates the combined substrate formed by the thermally conductive layer 300 and the substrate 100, such as... Figure 8 and Figure 9 As shown, this allows the upper and lower surfaces of the entire micro-heat source structure to be connected through the filling hole.
[0090] Optionally, it also includes a protective layer 600, which covers the impedance body 200. That is, the substrate 100, the thermally conductive layer 300, the impedance body 200, and the protective layer 600 are arranged sequentially, such as... Figure 9 As shown. By setting the protective layer 600, the impedance body 200 can be protected against oxidation and corrosion.
[0091] Furthermore, the protective layer 600 can also be made of a material with high thermal conductivity. The thermally conductive layer 300 not only protects the impedance body 200 from oxidation, but also conducts heat and improves the heat transfer efficiency.
[0092] In some alternative embodiments, this application also provides an intercalation structure, including:
[0093] Substrate 100, substrate 100 having a first surface;
[0094] The inserter body is disposed on the first surface; and
[0095] A thermally conductive layer 300 is disposed on the first surface and covers at least a portion of the interdigitated body.
[0096] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the interpolation body can be regarded as the impedance body 200 described above. The structure and implementation principle of the interpolation structure described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0097] In some alternative embodiments, this application also provides an atomizing core, including the micro heat source structure as described above, that is, a micro heat source structure including a resistor or interdigitated structure.
[0098] The atomizer core is the core component of atomizers, e-cigarettes, or other atomizing electronic products. It is mainly responsible for heating and vaporizing liquid drugs, e-liquids, or other liquids that need to be atomized to produce mist particles and achieve the atomization effect.
[0099] Those skilled in the art will understand that, for the sake of convenience and brevity, the structure and implementation principle of the atomizing core described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0100] In some alternative embodiments, this application also provides an electronic device including the micro heat source structure as described above.
[0101] In practice, electronic devices include, but are not limited to, atomizers, humidifiers, temperature controllers, drug delivery systems, smart wearable devices, micro-analytical instruments, beauty devices, de-icers for automobiles or aerospace, exhaust gas treatment equipment for vehicles or equipment, and related components, without specific limitations.
[0102] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the structure and implementation principle of the electronic device described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0103] The micro heat source structure provided in this application includes a substrate 100 having a first surface; an impedance body 200 disposed on the first surface; and a thermally conductive layer 300 disposed on the first surface and covering at least a portion of the impedance body 200. By connecting the thermally conductive layer 300 to the impedance body 200, the heat generated by the impedance body 200 can be quickly conducted to the thermally conductive layer 300, and then conducted from the thermally conductive layer 300 to the location requiring heating, thereby improving heat transfer efficiency and ensuring product functionality.
[0104] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A micro heat source structure, characterized in that, include: A substrate having a first surface; An impedance body is disposed on the first surface; as well as A thermally conductive layer is disposed on the first surface and covers at least a portion of the impedance body.
2. The micro heat source structure as described in claim 1, characterized in that, The thermally conductive layer covers the impedance body, which has electrodes, and the thermally conductive layer has a window that extends into the impedance body to expose the electrodes.
3. The micro heat source structure as described in claim 1, characterized in that, The impedance body is a resistor body or an interpolation structure.
4. The micro heat source structure as described in claim 2, characterized in that, A metal lead-out pillar is provided inside the window, and a solder pad is provided on the side of the thermally conductive layer away from the substrate. The first end of the metal lead-out pillar is electrically connected to the electrode of the impedance body, and the second end of the metal lead-out pillar is electrically connected to the solder pad.
5. The micro heat source structure as described in claim 4, characterized in that, The thickness of the thermally conductive layer ranges from 0.1 micrometers to 20 micrometers.
6. The micro heat source structure as described in claim 1, characterized in that, The substrate has a second surface opposite to the first surface, and the substrate is provided with a first through hole that penetrates the first surface and the second surface of the substrate. The projection of the first through hole on the first surface does not coincide with the projection of the impedance body on the first surface.
7. The micro heat source structure as described in claim 1, characterized in that, The substrate has a second surface opposite to the first surface. The substrate is provided with a second through hole that penetrates the first surface and the second surface of the substrate. The second through hole is filled with a conductive structure. The second surface is provided with a heat dissipation layer that is connected to the conductive structure.
8. The micro heat source structure as described in claim 1, characterized in that, The impedance body includes a multidimensional meandering structure, and the thermally conductive layer covers the multidimensional meandering structure.
9. A micro heat source structure, characterized in that, include: A substrate having a first surface; A thermally conductive layer is disposed on the first surface; as well as The impedance body is disposed on the thermally conductive layer.
10. The micro heat source structure as described in claim 9, characterized in that, The impedance body is a resistor body or an interpolation structure.
11. The micro heat source structure as described in claim 9, characterized in that, The substrate has a second surface opposite to the first surface, and the substrate is provided with a first through hole that penetrates the first surface and the second surface of the substrate. The projection of the first through hole on the first surface does not coincide with the projection of the impedance body on the first surface.
12. The micro heat source structure as described in claim 9, characterized in that, It also includes a protective layer that covers the impedance body.
13. A finger insertion structure, characterized in that, include: A substrate having a first surface; The inserter body is disposed on the first surface; as well as A thermally conductive layer is disposed on the first surface and covers at least a portion of the interdigital body.
14. An atomizing core, characterized in that, Includes the micro heat source structure as described in any one of claims 1 to 12.
15. An electronic device, characterized in that, Includes the micro heat source structure as described in any one of claims 1 to 12.