Probe card electroplating tool

Abstract

The embodiment of the utility model discloses an electroplating tool for a probe card. The electroplating tool comprises a direct-current power supply, a multi-layer organic substrate, a PCBA (Printed Circuit Board Assembly), a conductive sponge and an electroplating jig, a first internal circuit on the multi-layer organic substrate is electrically connected with a second internal circuit on the PCBA, and the electroplating jig is electrically connected with a first matrix electric connection point on the PCBA through a conductive sponge; the first matrix electric connection points comprise a plurality of first connection points arranged in an array, and the conductive sponge is electrically connected with all the first connection points in the first matrix electric connection points; the positive electrode of the direct-current power source is electrically connected with the first internal circuit, and the negative electrode of the direct-current power source is electrically connected with the electroplating jig. The electric connection between the first matrix electric connection points and the negative electrode of the direct current power supply can be realized by pressing the conductive sponge on the first matrix electric connection points of the PCBA through the electroplating jig, so that the whole probe card electroplating tool is more convenient and simpler to use, and the electroplating efficiency of the electric connection points on the PCBA is improved.

Description

Technical Field

[0001] This application relates to the field of probe card electroplating technology, and in particular to a probe card electroplating fixture. Background Technology

[0002] A probe card is a device used for semiconductor testing, primarily for testing the electrical performance of integrated circuit chips. It uses multiple tiny probes to contact the test points on the chip, thereby performing various electrical tests and measurements. Probe cards are typically used in the wafer testing stage, that is, testing performed before the chip is diced and packaged.

[0003] When manufacturing vertical probe cards, the surface of the MLO (Multi-Layer Organic) substrate needs to be in continuous contact with the vertical probe during the testing process. The contact points must have a strong and robust conductive function. Therefore, it is a necessary manufacturing process to plate nickel and gold layers onto the copper surface of the MLO matrix connection points to improve the test life of the vertical probe card.

[0004] During the electroplating process, the connection points of the circuit matrix on the PCBA (Printed Circuit Board Assembly) need to be connected in parallel using either wire soldering or conductive resin coating. However, when electroplating on probe cards with numerous circuit points, manual wire soldering is time-consuming and prone to causing missed solder joints, resulting in some points not being plated. Furthermore, thoroughly cleaning flux and solder dross after desoldering the wires after electroplating is difficult, and incomplete cleaning can lead to residual solder dross causing localized short circuits. While applying conductive resin for parallel connection is less time-consuming, completely removing the resin after electroplating is also time-consuming, and there is a risk of incomplete resin removal causing localized short circuits on the probe card. Both methods result in low production efficiency, long lead times, and insufficient market competitiveness. Utility Model Content

[0005] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a probe card electroplating fixture to solve the problems of low production efficiency, long delivery times, and insufficient market competitiveness in existing production methods.

[0006] This application provides a probe card electroplating fixture, including: a DC power supply, a multilayer organic substrate, a PCBA, a conductive sponge, and an electroplating jig;

[0007] The first internal circuit on the multilayer organic substrate is electrically connected to the second internal circuit on the PCBA, and the electroplating fixture is electrically connected to the first matrix electrical connection point on the PCBA through conductive sponge.

[0008] The first matrix electrical connection point includes a plurality of first connection points arranged in an array, and the conductive sponge is electrically connected to all the first connection points located in the first matrix electrical connection point;

[0009] The positive terminal of the DC power supply is electrically connected to the first internal circuit, and the negative terminal of the DC power supply is electrically connected to the electroplating fixture.

[0010] Based on the probe card electroplating fixture, a complete circuit is formed by a DC power supply, a multilayer organic substrate, a PCBA, conductive sponge, and an electroplating fixture. By pressing the conductive sponge onto the first matrix electrical connection point of the PCBA through the electroplating fixture, the first matrix electrical connection point can be electrically connected to the negative terminal of the DC power supply. This makes the use of the entire probe card electroplating fixture more convenient and simple, thereby effectively improving the electroplating efficiency of the electrical connection points on the PCBA.

[0011] Optionally, the probe card electroplating fixture further includes an electroplating pen, the positive terminal of the DC power supply is electrically connected to the electroplating pen, and the electroplating pen is configured to be electrically connected to the first internal circuit.

[0012] Furthermore, based on the aforementioned electroplating fixture, the electroplating pen can more reliably and stably connect the DC power supply to the first internal circuit, thereby improving the reliability and stability of the electroplating process.

[0013] Optionally, the probe card electroplating fixture further includes an ammeter and an adjusting element. The ammeter is connected in series between the positive terminal of the DC power supply and the multilayer organic substrate, and the adjusting element is configured to adjust the voltage or current output by the DC power supply.

[0014] Furthermore, based on the aforementioned ammeter and regulating components, the output current of the DC power supply can be monitored in real time, and the output current or voltage of the DC power supply can be controlled, thereby significantly improving the quality of the probe card electroplating fixture.

[0015] Optionally, all the first connection points located within the first matrix electrical connection points are located within the projection range of the electroplating fixture in the first direction.

[0016] Furthermore, based on the above-mentioned electroplating fixture, the reliability and stability of the electroplating fixture pressing the conductive sponge to the first connection point can be improved, and the probability that some of the first connection points are not connected to the circuit formed by the probe card electroplating fixture can be reduced.

[0017] Optionally, in the first direction, the projection of the conductive sponge coincides with the projection of the electroplating fixture, or the projection of the conductive sponge is located within the projection range of the electroplating fixture.

[0018] Furthermore, based on the aforementioned conductive sponge and electroplating fixture, the service life of the entire probe card electroplating fixture can be significantly improved, and the reliability of the conductive sponge after repeated use can be enhanced.

[0019] Optionally, the PCBA includes at least two sets of the first matrix electrical connection points, and the conductive sponge and the electroplating fixture are each configured to correspond one-to-one with the first matrix electrical connection points.

[0020] Furthermore, based on the aforementioned PCBA, a set of first matrix electrical connection points, conductive sponge, and electroplating fixture can be formed into a unit, thereby allowing selective connection of one or more sets of first matrix electrical connection points to the circuit for electroplating, or simultaneous connection of all first matrix electrical connection points to the circuit for electroplating, resulting in greater flexibility and higher electroplating efficiency.

[0021] Optionally, all of the electroplating fixtures are electrically connected, and / or all of the conductive sponges are electrically connected.

[0022] Furthermore, based on the aforementioned electroplating fixture and conductive sponge, all electrical connection points on the PCBA that form a circuit with the first matrix electrical connection points can be electroplated simultaneously, thereby improving electroplating efficiency and enhancing the consistency of electroplating effects across all electrical connection points, thus further improving the electroplating effect.

[0023] Optionally, any two of the electroplating fixtures are electrically connected by a conductive connector, which is a rigid structure, and all the electroplating fixtures are connected into an integral fixture assembly.

[0024] Furthermore, based on the aforementioned electroplating fixtures, all electroplating fixtures are connected into a single structure, which improves the consistency of the action of all electroplating fixtures pressing the conductive sponge onto the PCBA, and also improves the consistency of the pressure provided by all electroplating fixtures, thereby improving the electroplating effect of electrical connection points on the PCBA.

[0025] Optionally, the fixture assembly slides with the PCBA in a first direction via a guide structure.

[0026] Furthermore, based on the aforementioned guiding structure, the stability of the fixture assembly during movement in the first direction can be improved, ensuring that the fixture assembly and the PCBA remain parallel. This further enhances the consistency of the action of all electroplating fixtures pressing the conductive sponge onto the PCBA, and also improves the consistency of the pressure provided by all electroplating fixtures, thereby improving the electroplating effect of the electrical connection points on the PCBA.

[0027] Optionally, at least two sets of the first matrix electrical connection points are located on both sides of the PCBA and are arranged opposite to each other in a first direction.

[0028] Furthermore, based on the above-mentioned electroplating fixture, the PCBA's own structure can be protected during electroplating. The pressure exerted on the PCBA by the electroplating fixtures located on both sides of the PCBA can cancel each other out, preventing the PCBA from being bent or deformed by the electroplating fixtures.

[0029] The above-described one or more embodiments of this application have at least one or more of the following beneficial effects:

[0030] A complete circuit is formed by a DC power supply, a multilayer organic substrate, a PCBA, conductive sponge, and an electroplating fixture. By pressing the conductive sponge onto the first matrix electrical connection point of the PCBA using the electroplating fixture, the first matrix electrical connection point can be electrically connected to the negative terminal of the DC power supply. This makes the use of the entire probe card electroplating fixture more convenient and simple, thereby effectively improving the electroplating efficiency of the electrical connection points on the PCBA.

[0031] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0032] The disclosure of this application will become more readily understood with reference to the accompanying drawings. It will be readily understood by those skilled in the art that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the drawings are used to denote similar components, wherein:

[0033] Figure 1 This is a schematic diagram of the circuit loop formed by the probe card electroplating fixture described in the embodiments of this application;

[0034] Figure 2 This is a top view of the probe card electroplating fixture described in the embodiments of this application.

[0035] Explanation of reference numerals in the attached figures

[0036] 1. DC power supply; 2. Multilayer organic substrate; 21. First internal circuit; 3. PCBA; 31. Second internal circuit; 32. First matrix electrical connection point; 4. Conductive sponge; 5. Electroplating fixture; 6. Electroplating pen; 7. Ammeter. Detailed Implementation

[0037] Some embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application.

[0038] Currently, in the electroplating process, the connection points of the circuit matrix on the PCBA (Printed Circuit Board Assembly) board need to be connected in parallel using either wire soldering or conductive resin coating. However, when electroplating on probe cards with numerous circuit points, manual wire soldering is time-consuming and prone to causing some circuits to be missed, resulting in some points not being plated. Furthermore, thoroughly cleaning the flux and solder dross after desoldering the wires after electroplating is difficult, and incomplete cleaning can lead to residual solder dross causing localized short circuits. While applying conductive resin for parallel connection is less time-consuming, completely removing the resin after electroplating also takes considerable time and carries the risk of incomplete resin removal causing localized short circuits on the probe card. Both methods result in low production efficiency, long lead times, and insufficient market competitiveness.

[0039] Based on this, this application provides a probe card electroplating fixture, in which a DC power supply, a multilayer organic substrate, a PCBA, a conductive sponge, and an electroplating fixture form a complete circuit. By pressing the conductive sponge onto the first matrix electrical connection point of the PCBA using the electroplating fixture, the first matrix electrical connection point can be electrically connected to the negative terminal of the DC power supply. This makes the use of the entire probe card electroplating fixture more convenient and simple, thereby effectively improving the electroplating efficiency of the electrical connection points on the PCBA.

[0040] The present application will be described in detail below through specific embodiments.

[0041] Reference Figure 1 and Figure 2 As shown, this embodiment provides a probe card electroplating fixture, including: a DC power supply 1, a multilayer organic substrate 2, a PCBA 3, a conductive sponge 4, and an electroplating fixture 5; a first internal circuit 21 on the multilayer organic substrate 2 is electrically connected to a second internal circuit 31 on the PCBA 3, and the electroplating fixture 5 is electrically connected to a first matrix electrical connection point 32 on the PCBA 3 through the conductive sponge 4; the first matrix electrical connection point 32 includes a plurality of first connection points arranged in an array, and the conductive sponge 4 is electrically connected to all the first connection points located in the first matrix electrical connection point 32; the positive terminal of the DC power supply 1 is electrically connected to the first internal circuit 21, and the negative terminal of the DC power supply 1 is electrically connected to the electroplating fixture 5.

[0042] The probe card electroplating fixture provided in this embodiment forms a complete circuit with a DC power supply 1, a multilayer organic substrate 2, a PCBA 3, a conductive sponge 4, and an electroplating fixture 5. By pressing the conductive sponge 4 onto the first matrix electrical connection point 32 of the PCBA 3 through the electroplating fixture 5, the first matrix electrical connection point 32 can be electrically connected to the negative terminal of the DC power supply 1. This makes the use of the entire probe card electroplating fixture more convenient and simple, thereby effectively improving the electroplating efficiency of the electrical connection points on the PCBA 3.

[0043] Optionally, the probe card electroplating fixture also includes an electroplating pen 6, the positive terminal of the DC power supply 1 is electrically connected to the electroplating pen 6, and the electroplating pen 6 is configured to be electrically connected to the first internal circuit 21; wherein, the electroplating pen 6 can be a metal rod-shaped structure, or the electroplating pen 6 can be a conductive structure of other shapes, as long as it can reliably connect the positive terminal of the DC power supply 1 to the first internal circuit 21.

[0044] Furthermore, based on the above-mentioned electroplating fixture, the electroplating pen 6 can more reliably and stably connect the DC power supply 1 to the first internal circuit 21, thereby improving the reliability and stability of the electroplating process.

[0045] Continue to refer to Figure 1 As shown, the probe card electroplating fixture also includes an ammeter 7 and an adjusting component. The ammeter 7 is connected in series between the positive terminal of the DC power supply 1 and the multilayer organic substrate 2. The adjusting component is configured to adjust the voltage or current output by the DC power supply 1. The adjusting component can be a knob structure or other adjustable structure, specifically a variable resistor. If the current value displayed on the ammeter 7 is not within the set range, the output current of the DC power supply 1 can be adjusted to the set range by adjusting the adjusting component.

[0046] Furthermore, based on the aforementioned ammeter 7 and regulating components, the output current of the DC power supply 1 can be monitored in real time, and the output current or voltage of the DC power supply 1 can be controlled, thereby significantly improving the quality of the probe card electroplating fixture.

[0047] Optionally, all the first connection points located within the first matrix electrical connection point 32 are located within the projection range of the electroplating fixture 5 in the first direction. That is, when the electroplating fixture 5 presses the conductive sponge 4 onto its corresponding first matrix electrical connection point 32, all the first connection points can be stably and reliably connected to the circuit of the probe card electroplating fixture. The first direction can be a direction perpendicular to the plane of the PCBA3.

[0048] Furthermore, based on the above-mentioned electroplating fixture, the reliability and stability of the electroplating fixture 5 pressing the conductive sponge 4 to the first connection point can be improved, and the probability that some of the first connection points are not connected to the circuit formed by the probe card electroplating fixture can be reduced.

[0049] Optionally, in the first direction, the projection of the conductive sponge 4 coincides with the projection of the electroplating fixture 5, or the projection of the conductive sponge 4 is located within the projection range of the electroplating fixture 5. This arrangement can prevent the peripheral side of the conductive sponge 4 from having an area that can be excessively deformed by being squeezed at the edge of the electroplating fixture 5, thereby reducing the probability that the conductive sponge 4 will be damaged as a whole after being repeatedly and excessively squeezed by the electroplating fixture 5.

[0050] Furthermore, based on the aforementioned conductive sponge 4 and electroplating fixture 5, the service life of the entire probe card electroplating fixture can be significantly improved, and the reliability of the conductive sponge 4 after repeated use can be enhanced.

[0051] Continue to refer to Figure 2 As shown, PCBA3 includes at least two sets of first matrix electrical connection points 32. The conductive sponge 4 and the electroplating fixture 5 are each set to correspond one-to-one with the first matrix electrical connection points 32. Optionally, the conductive sponge 4 and the electroplating fixture 5 can be connected to one set of first matrix electrical connection points 32 to achieve conductivity. The conductive sponge 4 and the electroplating fixture 5 can also be connected to two or more sets of first matrix electrical connection points 32 at the same time. The specific choice can be made according to actual needs.

[0052] Furthermore, based on the PCBA3 described above, a set of first matrix electrical connection points 32, conductive sponge 4, and electroplating fixture 5 can be formed into a unit, thereby allowing selective connection of one or more sets of first matrix electrical connection points 32 to the circuit for electroplating, or simultaneous connection of all first matrix electrical connection points 32 to the circuit for electroplating, resulting in greater flexibility and higher electroplating efficiency.

[0053] In some embodiments, all electroplating fixtures 5 are electrically connected, and / or all conductive sponges 4 are electrically connected.

[0054] Furthermore, based on the aforementioned electroplating fixture 5 and conductive sponge 4, all electrical connection points on PCBA3 that form a circuit with the first matrix electrical connection point 32 can be electroplated simultaneously, thereby improving electroplating efficiency and enhancing the consistency of electroplating effects at all electrical connection points, thus further improving the electroplating effect.

[0055] Optionally, any two electroplating fixtures 5 can be electrically connected by a conductive connector. The conductive connector is a rigid structure, and all electroplating fixtures 5 can be connected into an integral fixture assembly. In other words, the conductive connector can connect all electroplating fixtures 5 into a single rigid structure.

[0056] Furthermore, based on the aforementioned electroplating fixture 5, all electroplating fixtures 5 are connected into a single structure, which can improve the consistency of the action of all electroplating fixtures 5 pressing the conductive sponge 4 onto the PCBA3, and also improve the consistency of the pressure provided by all electroplating fixtures 5, thereby improving the electroplating effect of the electrical connection points on the PCBA3.

[0057] In some embodiments, the fixture assembly slides in cooperation with the PCBA3 in a first direction via a guide structure. The guide structure may be a guide rod structure, in which the fixture assembly is slidably disposed on the guide rod fixed to the PCBA3. Alternatively, the guide structure may be a telescopic rod structure, in which the fixture assembly and the PCBA3 are respectively located on two relatively movable segments of the telescopic rod.

[0058] Furthermore, based on the above-mentioned guiding structure, the stability of the fixture assembly during movement in the first direction can be improved, and the fixture assembly and PCBA3 can always be kept in a parallel relationship. This further improves the consistency of the action of all electroplating fixtures 5 pressing the conductive sponge 4 onto PCBA3, and also further improves the consistency of the pressure provided by all electroplating fixtures 5, thereby improving the electroplating effect of the electrical connection points on PCBA3.

[0059] Continue to refer to Figure 1 As shown, at least two sets of first matrix electrical connection points 32 are located on both sides of PCBA3 and are arranged opposite to each other in the first direction. That is, the electrical connection points on both sides of PCBA3 can be electroplated at the same time, and the electroplating fixtures 5 on both sides of PCBA3 apply pressure to PCBA3 at opposite positions on both sides of PCBA3 at the same time.

[0060] Furthermore, based on the above-mentioned electroplating fixture, the PCBA3 itself can be protected during electroplating. The pressure applied to the PCBA3 by the electroplating fixtures 5 located on both sides of the PCBA3 can cancel each other out, thus preventing the PCBA3 from being bent or deformed by the electroplating fixtures 5.

[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A probe card electroplating tooling, characterized by, The probe card electroplating tool comprises a direct current power supply (1), a multilayer organic substrate (2), a PCBA (3), a conductive sponge (4), an electroplating jig (5), and an electroplating pen (6). A first internal circuit (21) on the multilayer organic substrate (2) is electrically connected to a second internal circuit (31) on the PCBA (3), and the electroplating jig (5) is electrically connected to a first matrix electrical connection point (32) on the PCBA (3) through the conductive sponge (4). The first matrix electrical connection point (32) comprises a plurality of first connection points arranged in an array, and the conductive sponge (4) is electrically connected to all the first connection points in the first matrix electrical connection point (32). The positive electrode of the direct current power supply (1) is electrically connected to the first internal circuit (21), and the negative electrode of the direct current power supply (1) is electrically connected to the electroplating jig (5). The positive electrode of the direct current power supply (1) is electrically connected to the electroplating pen (6), and the electroplating pen (6) is configured to be electrically connected to the first internal circuit (21). The probe card electroplating tool further comprises an ammeter (7) and an adjusting member, the ammeter (7) is connected in series between the positive electrode of the direct current power supply (1) and the multilayer organic substrate (2), and the adjusting member is configured to adjust the voltage or current output by the direct current power supply (1).

2. The probe card electroplating tool of claim 1, wherein, All the first connection points in the first matrix electrical connection point (32) are located within the projection range of the electroplating jig (5) in the first direction.

3. The probe card electroplating tool of claim 1, wherein, In the first direction, the projection of the conductive sponge (4) coincides with the projection of the electroplating jig (5), or the projection of the conductive sponge (4) is located within the projection range of the electroplating jig (5).

4. The probe card electroplating tool of claim 1, wherein, The PCBA (3) comprises at least two groups of first matrix electrical connection points (32), and the conductive sponge (4) and the electroplating jig (5) are one-to-one correspondingly arranged with the first matrix electrical connection points (32).

5. The probe card electroplating tooling of any of claims 1 to 4, wherein, All the electroplating jigs (5) are electrically connected, and / or all the conductive sponges (4) are electrically connected.

6. The probe card electroplating tool of claim 5, wherein, Any two electroplating jigs (5) are electrically connected through a conductive connecting member, the conductive connecting member is a rigid structure, and all the electroplating jigs (5) are connected into an integrated jig assembly.

7. The probe card electroplating tool of claim 6, wherein, The jig assembly is slidingly fitted with the PCBA (3) in the first direction through a guide structure.

8. The probe card electroplating tool of claim 7, wherein, At least two groups of first matrix electrical connection points (32) are located on two side surfaces of the PCBA (3) and are oppositely arranged in the first direction.

9. The probe card electroplating tool of claim 5, wherein, ​

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