Wavelength division multiplexing optical transceiver integrated device

Abstract

The utility model relates to the technical field of optical communication, in particular to a wavelength division multiplexing optical transceiving integrated device. Comprising a transmitting assembly and a receiving assembly, the transmitting assembly comprises a plurality of laser chips, a first array waveguide grating and a first optical fiber, the first array waveguide grating is used for receiving internal optical signals transmitted by each laser chip, combining the plurality of internal optical signals and then transmitting the combined signals to the first optical fiber, and the first optical fiber is used for being communicated with external communication equipment; the receiving assembly comprises a plurality of PD chips, a second array waveguide grating and a second optical fiber, the second optical fiber is used for receiving external optical signals and sending the external optical signals to the second array waveguide grating, and the second array waveguide grating is used for dividing the external optical signals into multiple beams and sending the multiple beams to the PD chips in a one-to-one correspondence mode. According to the utility model, the number of used optical fibers is reduced, the number of parts in the device is further reduced, the structure is simple, the size of the device is reduced, the overall packaging cost is reduced, and the working stability is high.

Description

Technical Field

[0001] This utility model relates to the field of optical fiber communication technology, and in particular to a wavelength division multiplexing optical transceiver device. Background Technology

[0002] In optical fiber communication systems, for general optical communication devices, multi-channel transmission and multi-channel reception (e.g., 4-channel transmission and 4-channel reception) typically requires 8 optical fibers (8-channel signal transmission). The wiring of 8 optical fibers requires more space, resulting in an increase in the device packaging size. At the same time, crosstalk exists between channels when multiple optical fibers are transmitted in parallel, leading to poor stability of the optical communication device. Utility Model Content

[0003] The technical problem to be solved by this utility model embodiment is to provide a wavelength division multiplexing optical transceiver integrated device to solve the problems in the prior art where the wiring of 8 optical fibers requires more space, resulting in an increased device packaging volume, and at the same time, crosstalk exists between channels when multiple optical fibers are transmitted in parallel, resulting in poor stability of optical communication devices.

[0004] This utility model discloses a wavelength division multiplexing (WDM) optical transceiver device, comprising: a transmitting component and a receiving component. The transmitting component includes multiple laser chips, a first arrayed waveguide grating, and a first optical fiber. The first arrayed waveguide grating is used to receive internal optical signals emitted by each of the laser chips, and to combine the multiple internal optical signals before transmitting them to the first optical fiber. The first optical fiber is used to connect with an external communication device. The receiving component includes multiple PD chips, a second arrayed waveguide grating, and a second optical fiber. The second optical fiber is used to receive external optical signals and transmit them to the second arrayed waveguide grating. The second arrayed waveguide grating is used to divide the external optical signals into multiple beams and transmit them one by one to each of the PD chips.

[0005] Optionally, the wavelength division multiplexing optical transceiver further includes: a mounting housing, wherein the laser chip, the first arrayed waveguide grating, the PD chip and the second arrayed waveguide grating are located inside the mounting housing, a first through hole and a second through hole are formed on the side wall of the mounting housing, one end of the first optical fiber and the second optical fiber are located inside the mounting housing, and the other end extends through the first through hole and the second through hole to the outside of the mounting housing.

[0006] Optionally, a coupling lens is provided in the optical path between each laser chip and the first array waveguide grating.

[0007] Optionally, each laser chip has an MPD chip disposed on the side away from the coupling lens.

[0008] Optionally, a third optical fiber is disposed between the second arrayed waveguide grating and each of the PD chips. The two ends of the third optical fiber are a first end face and a second end face, respectively. The first end face is disposed on the side closer to the first arrayed waveguide grating and is at zero degrees. The second end face is disposed on the side closer to the PD chip and is at 45 degrees. External optical signals enter the third optical fiber along the first end face and are reflected into the PD chip through the second end face.

[0009] Optionally, the mounting housing contains a first carrier and a plurality of second carriers; a plurality of PD chips are disposed on the first carrier; each MPD chip, each laser chip and each coupling lens are disposed on a second carrier, and the plurality of second carriers are distributed in an array.

[0010] Optionally, the mounting housing is provided with an optical fiber ferrule, and the optical fiber ferrule has a plurality of arrayed mounting holes, through which a plurality of the third optical fibers pass and are fixed on the optical fiber ferrule.

[0011] Optionally, a ceramic substrate is disposed inside the mounting housing, and a first mounting platform and a second mounting platform are formed on the ceramic substrate. A first mounting groove and a second mounting groove are disposed on the second mounting platform. The first arrayed waveguide grating and the second arrayed waveguide grating are both disposed adjacent to each other on the first mounting platform. A first collimator is disposed at one end of the first optical fiber, and a second collimator is disposed at the other end of the first optical fiber. The first collimator is disposed on the first mounting groove, and the second collimator is disposed on the second mounting groove.

[0012] Optionally, a semiconductor cooler is also provided inside the mounting housing. The semiconductor cooler is located on one side of the ceramic substrate, and the first carrier, a plurality of second carriers, and the optical fiber ferrule are all disposed on the semiconductor cooler.

[0013] Optionally, the number of laser chips and PD chips is four.

[0014] Compared with the prior art, the beneficial effects of the wavelength division multiplexing optical transceiver device provided by this utility model embodiment are as follows: In the transmitting and receiving components, a first arrayed waveguide grating and a second arrayed waveguide grating are respectively used to reduce the size of the device and the number of components. Specifically, in the transmitting component, the first arrayed waveguide grating is used to combine multiple internal optical signals emitted by multiple laser chips into one channel, and communicate with external communication equipment through a first optical fiber. The first arrayed waveguide grating is used for wavelength division multiplexing, reducing the number of optical fibers in the transmitting component, reducing the size of the device, and reducing signal interference between channels; in the receiving component, the first arrayed waveguide grating... Two optical fibers are used to receive external optical signals and transmit them to a second arrayed waveguide grating. The second arrayed waveguide grating is used to divide the external optical signals into multiple beams and transmit them one by one to each of the PD chips. The second arrayed waveguide grating is used for demultiplexing. This reduces the number of optical fibers in the receiving component, reduces the size of the device, and reduces signal interference between channels. The wavelength division multiplexing optical transceiver device of this embodiment can reduce the number of optical fibers used when realizing multi-channel transmission and multi-channel reception optical communication, thereby reducing the number of internal components of the device. The structure is simple, the size of the device is reduced, the overall packaging cost is reduced, and the working stability is high. Attached Figure Description

[0015] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0016] Figure 1 This is a top view of the wavelength division multiplexing optical transceiver device provided in this embodiment of the present invention;

[0017] Figure 2 This is a three-dimensional schematic diagram of the wavelength division multiplexing optical transceiver device provided in this embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the structure of the transmitting component and the receiving component provided in this embodiment of the utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the ceramic substrate provided in this embodiment of the utility model;

[0020] Figure 5 This is a schematic diagram of the structure of the optical fiber ferrule provided in this embodiment of the utility model;

[0021] Figure 6 This is a schematic diagram of the structure of the third optical fiber and optical fiber ferrule provided in this embodiment of the utility model.

[0022] The labels for the attached figures are as follows:

[0023] 10. Transmitting component; 110. Laser chip; 120. First arrayed waveguide grating; 130. First optical fiber; 131. First collimator; 20. Receiving component; 210. PD chip; 220. Second arrayed waveguide grating; 230. Second optical fiber; 231. Second collimator; 30. Mounting housing; 310. First carrier; 320. Second carrier; 330. Optical fiber ferrule; 331. Mounting hole; 340. Ceramic substrate; 341. First setting platform; 342. Second setting platform; 3421. First mounting slot; 3422. Second mounting slot; 40. Coupling lens; 50. MPD chip; 60. Third optical fiber; 610. First end face; 620. Second end face; 70. Semiconductor cooler. Detailed Implementation

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0025] This utility model embodiment provides a wavelength division multiplexing optical transceiver integrated device, such as... Figures 1 to 3 As shown, the system includes a transmitting component 10 and a receiving component 20. The transmitting component 10 includes multiple laser chips 110, a first arrayed waveguide grating 120, and a first optical fiber 130. The first arrayed waveguide grating 120 is used to receive the internal optical signals emitted by each laser chip 110, and combines the multiple internal optical signals before sending them to the first optical fiber 130. The first optical fiber 130 is used to connect with external communication equipment. The receiving component 20 includes multiple PD chips 210, a second arrayed waveguide grating 220, and a second optical fiber 230. The second optical fiber 230 is used to receive external optical signals and send them to the second arrayed waveguide grating 220. The second arrayed waveguide grating 220 is used to divide the external optical signals into multiple beams and send them one by one to each PD chip 210.

[0026] In this embodiment, a first arrayed waveguide grating 120 and a second arrayed waveguide grating 220 are used in the transmitting component 10 and the receiving component 20, respectively, to reduce the size of the devices and the number of components. Specifically, in the transmitting component 10, the first arrayed waveguide grating 120 is used to combine multiple internal optical signals emitted by multiple laser chips 110 into one channel, and communicate with external communication equipment through the first optical fiber 130. The first arrayed waveguide grating 120 is used for wavelength division multiplexing, which reduces the number of optical fibers in the transmitting component 10, reduces the size of the devices, and reduces signal interference between channels. In the receiving component 20, the second optical fiber 230 is used to receive... The external optical signal is received and sent to the second arrayed waveguide grating 220. The second arrayed waveguide grating 220 is used to divide the external optical signal into multiple beams and send them one by one to each PD chip 210. The second arrayed waveguide grating 220 is used for demultiplexing. This reduces the number of optical fibers in the receiving component 20, reduces the size of the device, and reduces signal interference between channels. The wavelength division multiplexing optical transceiver device of this embodiment can reduce the number of optical fibers used when realizing multi-channel transmission and multi-channel reception optical communication, thereby reducing the number of internal components of the device. The structure is simple, the size of the device is reduced, the overall packaging cost is reduced, and the working stability is high.

[0027] As a preferred embodiment, refer to Figure 1 and Figure 2 The wavelength division multiplexing optical transceiver device also includes: a mounting housing 30, a laser chip 110, a first arrayed waveguide grating 120, a PD chip 210 and a second arrayed waveguide grating 220 located inside the mounting housing 30, a first through hole (not shown in the figure) and a second through hole (not shown in the figure) formed on the side wall of the mounting housing 30, one end of the first optical fiber 130 and the second optical fiber 230 located inside the mounting housing 30, and the other end extending outside the mounting housing 30 through the first through hole and the second through hole respectively.

[0028] The mounting housing 30 provides an installation environment for the transmitting component 10 and the receiving component 20. Specifically, the laser chip 110, the first arrayed waveguide grating 120, the PD chip 210, and the second arrayed waveguide grating 220 are located inside the mounting housing 30. One end of the first optical fiber 130 and the second optical fiber 230 are located inside the mounting housing 30, while the other end passes through the first and second through holes on the mounting housing 30 and extends outside the mounting housing 30 for communication with external communication equipment. Simultaneously, the first optical fiber 130 and the second optical fiber 230 can be fixed to the mounting housing 30 with adhesive. This configuration improves the overall integration of the wavelength division multiplexing (WDM) optical transceiver and facilitates its packaging and fixation.

[0029] As a preferred embodiment, refer to Figure 1 and Figure 3Each laser chip 110 is provided with a coupling lens 40 in the optical path between it and the first array waveguide grating 120.

[0030] The coupling lens 40 is used to couple the laser beam emitted by the corresponding laser chip 110 into the first array waveguide grating 120 for transmission. This solves the problems of laser beam divergence and interference during transmission, improves the transmission efficiency and reliability of the laser beam, and ensures the stability of the wavelength division multiplexing optical transceiver device.

[0031] As a preferred embodiment, refer to Figure 1 and Figure 3 Each laser chip 110 has an MPD chip 50 on the side away from the coupling lens 40.

[0032] The MPD chip 50 is used to receive the back-emitting light from the laser chip 110 and to monitor the emission status of each laser chip 110 in real time.

[0033] As a preferred embodiment, refer to Figure 1 , Figure 3 and Figure 6 A third optical fiber 60 is provided between the second array waveguide grating 220 and each PD chip 210. The two ends of the third optical fiber 60 are a first end face 610 and a second end face 620, respectively. The first end face 610 is located on the side closer to the first array waveguide grating 120 and is at zero degrees. The second end face 620 is located on the side closer to the PD chip 210 and is at 45 degrees. External optical signals enter the third optical fiber 60 along the first end face 610 and are reflected into the PD chip 210 through the second end face 620.

[0034] Among them, the third optical fiber 60 is used as the receiving end. The first end face 610 of the multiple third optical fibers 60 is set to zero degrees to receive multiple external optical signals emitted by the demultiplexing of the second array waveguide grating 220. The second end face 620 of the multiple third optical fibers 60 is set to 45° to reflect the external optical signals into the PD chip 210 so that the PD chip 210 can receive the external optical signals and ensure the transmission efficiency of the external optical signals.

[0035] As a preferred embodiment, refer to Figure 1 and Figure 3 The mounting housing 30 contains a first carrier 310 and a plurality of second carriers 320; a plurality of PD chips 210 are disposed on the first carrier 310; each MPD chip 50, each laser chip 110 and each coupling lens 40 are disposed on a second carrier 320, and the plurality of second carriers 320 are distributed in an array.

[0036] The first carrier 310 provides an installation environment for multiple PD chips 210. Encapsulating multiple PD chips 210 on the first carrier 310 increases the integration of multiple PD chips 210 and facilitates the installation and deployment of multiple PD chips 210 in a wavelength division multiplexing optical transceiver device.

[0037] The second carrier 320 provides an installation environment for each MPD chip 50, each laser chip 110, and each coupling lens 40. The MPD chip 50, laser chip 110, and coupling lens 40 are packaged as a group on the second carrier 320, improving the overall integration of the MPD chip 50, laser chip 110, and coupling lens 40. This facilitates the installation and deployment of multiple groups of MPD chips 50, laser chips 110, and coupling lenses 40 within a wavelength division multiplexing optical transceiver device. (Refer to...) Figure 3 In this embodiment, there are four sets of MPD chip 50, laser chip 110 and coupling lens 40, and four sets of second carrier 320.

[0038] As a preferred embodiment, refer to Figure 3 , Figure 5 and Figure 6 The housing 30 contains an optical fiber ferrule 330, which has multiple arrayed mounting holes 331. Multiple third optical fibers 60 pass through the mounting holes 331 and are fixed to the optical fiber ferrule 330.

[0039] The fiber optic ferrule 330 is used to position and encapsulate the third fiber 60, fixing it onto the ferrule 330. This improves the integration and stability of multiple third fibers 60, facilitating their installation and deployment within the wavelength division multiplexing (WDM) optical transceiver. Specifically, the ferrule 330 has multiple arrayed mounting holes 331, the number of which matches the number of third fibers 60. Each third fiber 60 passes through one of the mounting holes 331 and is fixed to the ferrule 330, thus securing the third fiber 60 to the ferrule 330. (Refer to...) Figure 3 This embodiment provides an example where the third optical fiber 60 is configured with four fibers.

[0040] As a preferred embodiment, refer to Figure 3 and Figure 4A ceramic substrate 340 is disposed inside the mounting housing 30. A first mounting platform 341 and a second mounting platform 342 are formed on the ceramic substrate 340. A first mounting groove 3421 and a second mounting groove 3422 are disposed on the second mounting platform 342. A first array waveguide grating 120 and a second array waveguide grating 220 are both disposed adjacently on the first mounting platform 341. A first collimator 131 is disposed at one end of the first optical fiber 130, and a second collimator 231 is disposed at the other end of the first optical fiber 130. The first collimator 131 is disposed on the first mounting groove 3421, and the second collimator 231 is disposed on the second mounting groove 3422.

[0041] The ceramic substrate 340 is used to assemble two optical components, the first arrayed waveguide grating 120 and the second arrayed waveguide grating 220, onto the ceramic substrate 340, thereby improving the integration and stability of the two devices. Specifically, a first mounting platform 341 is formed on the ceramic substrate 340, and the first arrayed waveguide grating 120 and the second arrayed waveguide grating 220 are both disposed adjacently on the first mounting platform 341. In this embodiment, a first collimator 131 is provided at one end of the first optical fiber 130, and a second collimator 131 is provided at one end of the first optical fiber 130. The ceramic substrate 340 also has a second mounting platform 342 formed on the second collimator 231. The second mounting platform 342 has a first mounting groove 3421 and a second mounting groove 3422 formed on it. The first mounting groove 3421 is used to fix the first collimator 131, and the second mounting groove 3422 is used to fix the second collimator 231. Therefore, the ceramic substrate 340 is used to position and encapsulate the first arrayed waveguide grating 120, the second arrayed waveguide grating 220, and the first and second collimators 131 and 231. Simultaneously, both the first and second collimators 131 employ collimating lenses, thereby ensuring efficient separation or merging of multi-wavelength signals.

[0042] In this embodiment, the first mounting groove 3421 and the second mounting groove 3422 are V-shaped grooves, and the first collimator 131 and the second collimator 231 are stably positioned on the V-shaped grooves.

[0043] As a preferred embodiment, refer to Figure 1 and Figure 3 The housing 30 also contains a semiconductor cooler 70, which is located on one side of the ceramic substrate 340. The first carrier 310, multiple second carriers 320 and fiber optic ferrule 330 are all mounted on the semiconductor cooler 70.

[0044] The semiconductor cooler 70 is used to control the operating temperature of each laser chip 110MPD chip 50 and the receiver PD array chip to ensure the working stability of the wavelength division multiplexing optical transceiver device.

[0045] The first carrier 310, multiple second carriers 320, and fiber optic ferrule 330 are all disposed on the semiconductor cooler 70, thereby improving the integration of the wavelength division multiplexing optical transceiver device.

[0046] As a preferred embodiment, refer to Figures 1 to 3 The number of laser chip 110 and PD chip 210 is four each.

[0047] In this embodiment, four laser chips 110 and four PD chips 210 are used. The corresponding first arrayed waveguide grating 120 is used for wavelength division multiplexing to combine the four internal optical signals into one, and the second arrayed waveguide grating 220 is used for demultiplexing to divide the one external optical signal into four signal beams according to wavelength. Of course, the types of the first arrayed waveguide grating 120 and the second arrayed waveguide grating 220 correspond one-to-one with the number of laser chips 110 and PD chips 210, and no specific limitation is made here.

[0048] In this embodiment, the transmitting component 10 is the transmitting end, and four laser chips 110 emit four internal optical signals respectively. After passing through the coupling lens 40, the light beam is coupled into the waveguide of the first array waveguide grating 120 for transmission. The four optical signals of different wavelengths (taking 1270nm / 1290nm / 1310nm / 1330nm as an example) are combined into one optical signal after passing through the first array waveguide grating 120. The signal is output from the first array waveguide grating 120 and then enters the first optical fiber 130 through the first collimator 131 for transmission to the outside. In addition, the laser chip 110 emits light from the back, and the MPD chip 50 realizes the real-time monitoring function of the light emitted by the laser chip 110.

[0049] The receiving component 20 is the receiving end. One external optical signal (containing optical signals of 4 wavelengths, here again taking 1270nm / 1290nm / 1310nm / 1330nm as an example) is coupled into the second array waveguide grating 220 of the receiving end through the second optical fiber 230 and the second collimator 231. After demultiplexing / demultiplexing of the second array waveguide grating 220, the one optical signal is divided into 4 optical signals according to the 4 wavelengths. The signals are transmitted and output through the 4 waveguides of the second array waveguide grating 220 and directly enter the third optical fiber 60. After reaching its second end face 620, it is transmitted downward by total internal reflection and finally reaches the PD chip 210 one by one to complete the detection of the external optical signal.

[0050] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of this utility model.

Claims

1. A wavelength division multiplexing optical transceiver device, characterized in that, include: The transmitting component includes multiple laser chips, a first arrayed waveguide grating, and a first optical fiber. The first arrayed waveguide grating is used to receive the internal optical signals emitted by each of the laser chips, and to combine the multiple internal optical signals and transmit them to the first optical fiber. The first optical fiber is used to communicate with an external communication device. The receiving component includes multiple PD chips, a second arrayed waveguide grating, and a second optical fiber. The second optical fiber is used to receive external optical signals and transmit them to the second arrayed waveguide grating. The second arrayed waveguide grating is used to divide the external optical signals into multiple beams and transmit them one by one to each of the PD chips.

2. The wavelength division multiplexing optical transceiver device according to claim 1, characterized in that, The wavelength division multiplexing optical transceiver also includes: The mounting housing contains the laser chip, the first arrayed waveguide grating, the PD chip, and the second arrayed waveguide grating. A first through hole and a second through hole are formed on the side wall of the mounting housing. One end of the first optical fiber and the second optical fiber are located inside the mounting housing, and the other end extends outside the mounting housing through the first through hole and the second through hole, respectively.

3. The wavelength division multiplexing optical transceiver device according to claim 2, characterized in that, A coupling lens is provided in the optical path between each laser chip and the first array waveguide grating.

4. The wavelength division multiplexing optical transceiver device according to claim 3, characterized in that, Each laser chip has an MPD chip disposed on the side away from the coupling lens.

5. The wavelength division multiplexing optical transceiver device according to claim 4, characterized in that, A third optical fiber is disposed between the second array waveguide grating and each of the PD chips. The two ends of the third optical fiber are a first end face and a second end face, respectively. The first end face is disposed on the side closer to the first array waveguide grating and is at zero degrees. The second end face is disposed on the side closer to the PD chip and is at 45 degrees. External optical signals enter the third optical fiber along the first end face and are reflected into the PD chip through the second end face.

6. The wavelength division multiplexing optical transceiver device according to claim 5, characterized in that, The mounting housing contains a first carrier and multiple second carriers; Multiple PD chips are disposed on the first carrier; Each of the MPD chips, each of the laser chips, and each of the coupling lenses is disposed on a second carrier, and multiple second carriers are distributed in an array.

7. The wavelength division multiplexing optical transceiver device according to claim 6, characterized in that, The mounting housing contains an optical fiber ferrule, on which a plurality of arrayed mounting holes are formed. The plurality of third optical fibers pass through the mounting holes one by one and are fixed on the optical fiber ferrule.

8. The wavelength division multiplexing optical transceiver device according to claim 7, characterized in that, A ceramic substrate is disposed inside the mounting housing, and a first mounting platform and a second mounting platform are formed on the ceramic substrate. A first mounting groove and a second mounting groove are disposed on the second mounting platform. The first arrayed waveguide grating and the second arrayed waveguide grating are both disposed adjacent to each other on the first mounting platform; A first collimator is provided at one end of the first optical fiber, and a second collimator is provided at the other end of the first optical fiber. The first collimator is located on the first mounting slot, and the second collimator is located on the second mounting slot.

9. The wavelength division multiplexing optical transceiver device according to claim 8, characterized in that, The mounting housing also contains a semiconductor cooler, which is located on one side of the ceramic substrate. The first carrier, a plurality of second carriers, and the optical fiber ferrule are all disposed on the semiconductor cooler.

10. The wavelength division multiplexing optical transceiver device according to any one of claims 1 to 9, characterized in that, The number of laser chips and PD chips is four each.

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