800G DR8 silicon optical module
By creating anti-adhesive grooves on the PCB board in the 800G DR8 silicon photonics module, the problem of adhesive contamination on the photosensitive surface of the PD chip is solved, ensuring that the optical performance is not affected.
Patent Information
- Application Number
- CN202520663853.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-04-09
AI Technical Summary
In the mass production process of traditional 800G DR8 silicon photonics modules, the resin component of the adhesive used to bond the cover plate of the RX fiber array to the PCB board can easily contaminate the photosensitive surface of the PD chip, leading to a decrease in optical performance.
An adhesive-stop groove is made between the cover plate of each RX fiber array on the PCB board and the array PD chip to prevent overflowing adhesive from entering the photosensitive surface of the PD chip.
It effectively prevents adhesive resin components from contaminating the photosensitive surface of the PD chip, maintaining stable optical performance.
Smart Images
Figure CN223870866U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical module technology, specifically to an 800G DR8 silicon optical module. Background Technology
[0002] The traditional 800G DR8 silicon photonics module structure is as follows: A PCB board with a through-slot in the middle area contains a tungsten-copper base. A silicon photonics chip electrically connected to the PCB board is fixed on the tungsten-copper base. The silicon photonics chip has two input waveguides and eight output waveguides. Two optical transmitters and a TX fiber array are located on the tungsten-copper base. The two optical transmitters are coupled to the two input waveguides of the silicon photonics chip, respectively, while the TX fiber array is coupled to the eight output waveguides of the silicon photonics chip. An RX fiber array is placed on each side of the through-slot on the PCB board. The cover plates of the RX fiber arrays are bonded to the PCB board with adhesive, such as UV adhesive. Two array PD chips and two TIA chips are fixed on the reflective surface of each RX fiber array on the PCB board, each with four channels. A TIA chip bonded to each array PD chip is fixed on the PCB board at each array PD chip location. The IA chip, and its optical transmitter, includes a laser chip, a collimating lens, an optical isolator, and a converging lens, sequentially coupled along the light propagation direction. The converging lens is coupled to the input waveguide of the silicon photonics chip. The light emitted by each laser chip passes sequentially through the collimating lens, the optical isolator, and the converging lens before being coupled into one input waveguide of the silicon photonics chip. In the actual mass production of this type of 800G DR8 silicon photonics module, the cover plate of the RX fiber array is fixed to the PCB board with adhesive, such as... Figure 1 As shown, when there is too much glue or the glue viscosity becomes too thin, the glue will stick to the array PD chip, and the resin component of the glue will contaminate the photosensitive surface of the PD chip, resulting in a decrease in optical performance. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide an 800G DR8 silicon photonics module to overcome the shortcomings of the prior art.
[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:
[0005] An 800G DR8 silicon photonics module includes a PCB board and an RX fiber array. The cover plate of the RX fiber array is glued to the PCB board. An array PD chip coupled to the RX fiber array is fixed on the reflective surface of each RX fiber array on the PCB board. An anti-adhesion groove is formed between the cover plate of each RX fiber array and the array PD chip.
[0006] Based on the above technical solution, the present invention can be further improved as follows.
[0007] Furthermore, the two ends of the adhesive-stop groove are flush with the two ends of the array PD chip or extend beyond the two ends of the array PD chip.
[0008] Furthermore, the depth of the adhesive-stopping groove is 0.2mm to 0.5mm, and the width of the adhesive-stopping groove is 0.2mm to 0.4mm.
[0009] Furthermore, a TIA chip, which is bonded to the array PD chip with gold wire, is fixed at each array PD chip on the PCB board.
[0010] Furthermore, a through slot is opened in the middle area of the PCB board, and a tungsten copper base is arranged in the through slot. A silicon photonic chip electrically connected to the PCB board is fixed on the tungsten copper base. The silicon photonic chip has two input waveguides and eight output waveguides. Two optical transmitters and a TX fiber array are provided on the tungsten copper base. The two optical transmitters are coupled to the two input waveguides of the silicon photonic chip, respectively. The TX fiber array is coupled to the eight output waveguides of the silicon photonic chip. An RX fiber array is provided on each side of the through slot on the PCB board, and the number of array PD chips is two.
[0011] Furthermore, the optical transmitter includes a laser chip, a collimating lens, an optical isolator, and a converging lens, which are coupled sequentially along the light propagation direction. The converging lens is coupled to the input waveguide of the silicon photonics chip.
[0012] The beneficial effects of this invention are as follows: Since a stop groove is opened between the cover plate of each RX fiber array and the array PD chip on the PCB board, when the amount of glue is large or the viscosity of the glue becomes thin, the overflowing glue can only enter the stop groove, thereby avoiding the resin component of the overflowing glue from contaminating the photosensitive surface of the PD chip and ensuring that the optical performance is not affected. Attached Figure Description
[0013] Figure 1 This is an assembly diagram of the PCB board, RX fiber array, array PD chip and T IA chip in the prior art;
[0014] Figure 2 This is an assembly diagram of the PCB board, RX fiber array, array PD chip and TIA chip in this utility model;
[0015] Figure 3 This is a structural diagram of the 800G DR8 silicon photonics module in this utility model.
[0016] The attached diagram lists the components represented by each number as follows:
[0017] 1. PCB board, 110. Glue-stop groove, 120. Through groove, 2. RX fiber array, 210. Cover plate, 3. Array PD chip, 4. TIA chip, 5. Tungsten copper base, 6. Silicon photonics chip, 7. Optical emitter, 710. Laser chip, 720. Collimating lens, 730. Optical isolator, 740. Converging lens, 8. TX fiber array, 9. Glue. Detailed Implementation
[0018] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0019] Example 1
[0020] like Figure 2 As shown, an 800G DR8 silicon photonics module includes: a PCB board 1 and an RX fiber array 2. The cover plate 210 of the RX fiber array 2 is bonded and fixed to the PCB board 1 by adhesive 9, which can be UV adhesive. On the PCB board 1, an array PD chip 3 coupled to each RX fiber array 2 is fixed at the reflective surface of each RX fiber array 2. The array PD chip 3 has four channels. An adhesive-stop groove 110 is formed between the cover plate 210 of each RX fiber array 2 and the array PD chip 3. Since an adhesive-stop groove 110 is formed between the cover plate 210 of each RX fiber array 2 and the array PD chip 3, when the amount of adhesive is large or the viscosity of the adhesive becomes thin, the overflowing adhesive can only enter the adhesive-stop groove 110, thereby avoiding the resin component of the overflowing adhesive from contaminating the photosensitive surface of the PD chip and ensuring that the optical performance is not affected.
[0021] Example 2
[0022] like Figure 2 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:
[0023] The two ends of the adhesive-stop groove 110 are flush with the two ends of the array PD chip 3, or the two ends of the adhesive-stop groove 110 extend beyond the two ends of the array PD chip 3, that is, the length of the adhesive-stop groove 110 is greater than or equal to the length of the array PD chip 3.
[0024] Furthermore, the depth of the adhesive stop groove 110 is preferably 0.2mm to 0.5mm, the width of the adhesive stop groove 110 is preferably 0.2mm to 0.4mm, and the adhesive stop groove 110 does not penetrate the PCB board 1.
[0025] Example 3
[0026] like Figure 2 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:
[0027] On the PCB board 1, a TIA chip 4 is fixed at each array PD chip 3 and is bonded to the array PD chip 3 with gold wire. The TIA chip 4 is preferably bonded to the PCB board 1 with gold wire and has four channels.
[0028] Example 4
[0029] like Figure 3 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below:
[0030] A through slot 120 is formed in the middle area of the PCB board 1, and a tungsten copper base 5 is arranged in the through slot 120. A silicon photonic chip 6 electrically connected to the PCB board 1 is fixed on the tungsten copper base 5. The silicon photonic chip 6 has two input waveguides and eight output waveguides. Two optical transmitters 7 and a TX fiber array 8 are provided on the tungsten copper base 5. The two optical transmitters 7 are coupled to the two input waveguides of the silicon photonic chip 6, respectively, and the TX fiber array 8 is coupled to the eight output waveguides of the silicon photonic chip 6. An RX fiber array 2 is provided on each side of the through slot 120 on the PCB board 1. The number of array PD chips 3 is two, and the number of TIA chips 4 is two.
[0031] Furthermore, the optical transmitter 7 includes a laser chip 710, a collimating lens 720, an optical isolator 730, and a converging lens 740, which are coupled sequentially along the light propagation direction. The converging lens 740 is coupled to the input waveguide of the silicon photonic chip 6. The light emitted by each laser chip 710 is coupled into one input waveguide of the silicon photonic chip 6 after passing through the collimating lens 720, the optical isolator 730, and the converging lens 740 in sequence.
[0032] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. An 800G DR8 silicon photonics module, characterized in that, include: The PCB board (1) and the RX fiber array (2) are provided. The cover plate (210) of the RX fiber array (2) is bonded to the PCB board (1) with glue (9). On the PCB board (1), an array PD chip (3) coupled to the RX fiber array (2) is fixed at the reflective surface of each RX fiber array (2). An anti-adhesion groove (110) is opened between the cover plate (210) of each RX fiber array (2) and the array PD chip (3).
2. The 800G DR8 silicon photonics module according to claim 1, characterized in that, The two ends of the adhesive-stop groove (110) are flush with the two ends of the array PD chip (3) or extend beyond the two ends of the array PD chip (3).
3. An 800G DR8 silicon photonics module according to claim 1 or 2, characterized in that, The depth of the adhesive-stop groove (110) is 0.2mm to 0.5mm, and the width of the adhesive-stop groove (110) is 0.2mm to 0.4mm.
4. An 800G DR8 silicon photonics module according to claim 1, characterized in that, On the PCB board (1), a TIA chip (4) is fixed at each array PD chip (3) and bonded to the array PD chip (3) with gold wire.
5. An 800G DR8 silicon photonics module according to claim 1, characterized in that, A through slot (120) is opened in the middle area of the PCB board (1). A tungsten copper base (5) is arranged in the through slot (120). A silicon photonic chip (6) electrically connected to the PCB board (1) is fixed on the tungsten copper base (5). The silicon photonic chip (6) has two input waveguides and eight output waveguides. Two optical transmitters (7) and a TX fiber array (8) are provided on the tungsten copper base (5). The two optical transmitters (7) are coupled to the two input waveguides of the silicon photonic chip (6) respectively. The TX fiber array (8) is coupled to the eight output waveguides of the silicon photonic chip (6). An RX fiber array (2) is provided on each side of the through slot (120) on the PCB board (1). The number of array PD chips (3) is two.
6. An 800G DR8 silicon photonics module according to claim 5, characterized in that, The light emitting end (7) includes a laser chip (710), a collimating lens (720), an optical isolator (730), and a converging lens (740) coupled sequentially along the light propagation direction. The converging lens (740) is coupled to the input waveguide of the silicon photonic chip (6).