Display device

Abstract

The utility model discloses a display device. The display device comprises a backlight module, a display panel, a driving circuit board, a chip on film and adhesive glue, the display panel is arranged on one side of the backlight module, the display panel comprises an opposite substrate and an array substrate, the opposite substrate is arranged on the backlight module, and the array substrate is arranged on the side, away from the backlight module, of the opposite substrate; the driving circuit board is arranged on one side, far away from the display panel, of the backlight module; one end of the chip on film is electrically connected with the driving circuit board, and the other end of the chip on film extends to the display panel and is electrically connected with the binding part of the array substrate; and the bonding glue is fixed with one part of the chip on film and one part of the binding part of the array substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically to a display device. Background Technology

[0002] With the development of LCD (Liquid Crystal Display) technology, the bezels of LCD displays have become increasingly narrow, leading to the emergence of LCD displays with no bezels on all four sides. However, because the bottom bezel area of ​​an LCD display is the signal input area, bonding space needs to be reserved in this area. This results in the bottom bezel being wider than the side bezels, causing a significant difference in width between the two areas and making it difficult for LCD displays to achieve a display effect with equal width on all four sides. Utility Model Content

[0003] The embodiments of this application provide a display device to improve the problem that display devices have difficulty in achieving a display effect with equal width on all four sides.

[0004] In a first aspect, embodiments of this application provide a display device, comprising:

[0005] Backlight module;

[0006] The display panel is disposed on one side of the backlight module. The display panel includes an opposing substrate and an array substrate. The opposing substrate is disposed on the backlight module, and the array substrate is disposed on the side of the opposing substrate away from the backlight module.

[0007] A driving circuit board is disposed on the side of the backlight module away from the display panel;

[0008] A flip-chip film, one end of which is electrically connected to the driving circuit board, and the other end of which extends to the display panel and is electrically connected to the bonding portion of the array substrate;

[0009] An adhesive is used to fix a portion of the flip-chip film and a portion of the bonding portion of the array substrate.

[0010] Furthermore, the flip-chip film includes a first vertical segment, a first arc segment, and a first horizontal segment. The first arc segment is located between the first vertical segment and the first horizontal segment. The first vertical segment is electrically connected to the driving circuit board. The first horizontal segment is electrically connected to the bonding portion of the array substrate. A portion of the first arc segment is fixed to the adhesive and a portion of the bonding portion of the array substrate.

[0011] Furthermore, the display device also includes a side coating adhesive, which is disposed on the sidewall of the edge of the array substrate.

[0012] Furthermore, the adhesive is connected to the side coating adhesive, and the material of the adhesive is the same as that of the side coating adhesive.

[0013] Furthermore, the adhesive is connected to the side coating adhesive, the material of the adhesive is different from that of the side coating adhesive, and the adhesive has a stronger tack than the side coating adhesive.

[0014] Furthermore, the display device includes a lower bezel area and a side bezel area, and the display device also includes a middle frame disposed on the backlight module. The display panel is disposed on the middle frame, and the display panel also includes a light-shielding layer disposed between the opposing substrate and the array substrate. A portion of the light-shielding layer extends beyond the edge of the middle frame and toward the middle area of ​​the display panel. The distance from the edge of the middle frame located in the side bezel area to the edge of the light-shielding layer near the middle area of ​​the display panel is greater than the distance from the edge of the middle frame located in the lower bezel area to the edge of the light-shielding layer near the middle area of ​​the display panel.

[0015] Furthermore, the difference between the distance from the edge of the middle frame located in the side frame area to the edge of the light-shielding layer near the middle area of ​​the display panel and the distance from the edge of the middle frame located in the bottom frame area to the edge of the light-shielding layer near the middle area of ​​the display panel is 1.6mm to 3.6mm.

[0016] Furthermore, the display device also includes a protective component disposed on the side of the driving circuit board away from the display panel; wherein, in a top view of the display device, the protective component overlaps with the driving circuit board and the flip-chip film.

[0017] Furthermore, the display device also includes a conductive cloth disposed on the side of the flip-chip film away from the backlight module, the conductive cloth being connected to the protective member and extending toward the display panel.

[0018] Furthermore, the plane containing the top surface of the conductive cloth is not lower than the plane containing the top surface of the flip-chip film.

[0019] The beneficial effects of this application are:

[0020] This application provides a display device. By including an adhesive in the display device and fixing the adhesive to a portion of the flip-chip film and a portion of the bonding portion of the array substrate, the tear resistance of the flip-chip film when bent can be improved, and the width of the bonding portion of the array substrate can be reduced. This reduces the large difference between the width of the bottom bezel area and the width of the side bezel area of ​​the display device, and improves the problem that the display device is difficult to achieve a display effect with equal width on all four sides. Attached Figure Description

[0021] Figure 1 This is a top view of the display device of this application;

[0022] Figure 2 yes Figure 1 A cross-sectional view of the location of the display device AA′ shown;

[0023] Figure 3 yes Figure 2 An enlarged view of position C of the display device shown;

[0024] Figure 4 yes Figure 1 The cross-sectional view showing the location of the display device BB′.

[0025] Explanation of reference numerals in the attached figures:

[0026] 10-Display device; 100-Backlight module; 110-Back panel; 111-Base plate; 112-Side panel; 120-Light strip; 130-Light guide plate; 140-Receiving cavity; 150-Reflector; 200-Display panel; 210-Opposing substrate; 220-Array substrate; 221-Bonding part; 230-Light shielding layer; 300-Drive circuit board; 400-Crystal-coated film; 410-First vertical segment; 420-First arc segment; 430-First horizontal segment; 440-Second arc segment; 450-Second vertical segment; 460-Third arc segment; 470-Second horizontal segment; 500-Adhesive; 600-Side coating; 700-Middle frame; 800-Protective component; 900-Conductive cloth. Detailed Implementation

[0027] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings. The technical solutions described below are for illustrative purposes only and should not be construed as limiting the scope of protection of this application.

[0028] Furthermore, the terms "first," "second," and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different technical features. The terms "multiple" and similar words indicate two or more unless otherwise expressly specified.

[0029] Embodiments of this application provide a display device, with reference to... Figures 1-4 The display device 10 includes a backlight module 100, a display panel 200, a driving circuit board 300, a flip-chip film 400, and an adhesive 500.

[0030] Specifically, the display panel 200 is disposed on one side of the backlight module 100. The display panel 200 includes an opposing substrate 210 and an array substrate 220. The opposing substrate 210 is disposed on the backlight module 100, and the array substrate 220 is disposed on the side of the opposing substrate 210 away from the backlight module 100. The driving circuit board 300 is disposed on the side of the backlight module 100 away from the display panel 200. One end of the flip-chip film 400 is electrically connected to the driving circuit board 300, and the other end of the flip-chip film 400 extends to the display panel 200 and is electrically connected to the bonding portion 221 of the array substrate 220. The adhesive 500 is fixed to a portion of the flip-chip film 400 and a portion of the bonding portion 221 of the array substrate 220.

[0031] Since the lower bezel area BB1 of the LCD display device 10 is the signal input area, bonding space needs to be reserved in the lower bezel area BB1, making the width of the lower bezel area BB1 of the LCD display device 10 greater than the width of the side bezel area BB2. This results in a significant difference between the width of the side bezel area BB2 and the width of the lower bezel area BB1, making it difficult for the LCD display device 10 to achieve a display effect with equal width on all four sides. Therefore, the technical solution of this application includes an adhesive 500 in the display device 10, and the adhesive 500 is fixed to a part of the flip-chip film 400 and a part of the bonding portion 221 of the array substrate 220. This improves the tear resistance of the flip-chip film 400 when bent, and helps to reduce the width of the bonding portion 221 of the array substrate 220, thereby reducing the significant difference between the width of the lower bezel area BB1 and the width of the side bezel area BB2 of the display device 10, and improving the problem of the display device 10's inability to achieve a display effect with equal width on all four sides.

[0032] In this embodiment, reference Figure 2 The backlight module 100 includes a back plate 110, a light strip 120, and a light guide plate 130. The back plate 110 includes a base plate 111 and a side plate 112 connected to the base plate 111. The side plate 112 and the base plate 111 form a receiving cavity 140. The light guide plate 130 is disposed in the receiving cavity 140. The light strip 120 is disposed in the receiving cavity 140. The light strip 120 is located on one side of the light guide plate 130, and the light-emitting surface of the light strip 120 faces the light guide plate 130.

[0033] In this embodiment, reference Figure 2The backlight module 100 further includes a reflector 150, which is disposed on the side of the light guide away from the display panel 200.

[0034] In this embodiment, the reflector 150 is a reflector sheet.

[0035] In this embodiment, the reflector 150 is a reflective coating applied to a surface of the light guide plate 130 away from the display panel 200.

[0036] In this embodiment, reference Figure 2 The flip-chip film 400 includes a first vertical segment 410, a first arc segment 420, and a first horizontal segment 430. The first arc segment 420 is located between the first vertical segment 410 and the first horizontal segment 430. The first vertical segment 410 is electrically connected to the driving circuit board 300. The first horizontal segment 430 is electrically connected to the bonding portion 221 of the array substrate 220. A portion of the first arc segment 420 is fixed to the adhesive 500 and a portion of the bonding portion 221 of the array substrate 220. By configuring the flip-chip film 400 to include a first vertical segment 410, a first arc segment 420, and a first horizontal segment 430, with the first arc segment 420 located between the first vertical segment 410 and the first horizontal segment 430, the first vertical segment 410 being electrically connected to the driving circuit board 300, and the first horizontal segment 430 being electrically connected to the bonding portion 221 of the array substrate 220, a portion of the first arc segment 420 being fixed to the adhesive 500 and a portion of the bonding portion 221 of the array substrate 220, the adhesive 500 can fix the first arc segment 420 to the bonding portion 221 of the array substrate 220, thereby improving the tear resistance of the flip-chip film 400 when bent, and helping to reduce the width of the bonding portion 221 of the array substrate 220, thereby reducing the large difference between the width of the lower bezel area BB1 and the width of the side bezel area BB2 of the display device 10, and improving the problem that the display device 10 is difficult to achieve a display effect with equal width on all four sides.

[0037] In this embodiment, reference Figure 2 The flip-chip film 400 further includes a second arc-shaped segment 440, a second vertical segment 450, a third arc-shaped segment 460, and a second horizontal segment 470, which are connected in sequence. The first vertical segment 410 is connected to the second arc-shaped segment 440 at one end away from the display panel 200, and the second horizontal segment 470 is electrically connected to the driving circuit board 300 at one end away from the third arc-shaped segment 460.

[0038] In this embodiment, reference Figure 2 , Figure 3 The display device 10 further includes a side coating 600, which is disposed on the sidewall of the edge of the array substrate 220. By including the side coating 600 on the sidewall of the edge of the array substrate 220, the side coating 600 can play a role in blocking light, preventing light from the backlight module 100 from leaking from the edge of the display panel 200, thereby improving the light leakage problem of the display device 10.

[0039] In this embodiment, the adhesive 500 is connected to the side coating 600, and the material of the adhesive 500 is the same as that of the side coating 600. By setting the adhesive 500 and the side coating 600 to be connected, and the material of the adhesive 500 being the same as that of the side coating 600, the adhesive 500 can be manufactured simultaneously when the side coating 600 is manufactured, eliminating the need to manufacture the side coating 600 and the adhesive 500 separately in two processes, thereby reducing the difficulty of the manufacturing process of the display device 10.

[0040] In this embodiment, the adhesive 500 is connected to the side coating adhesive 600. The materials of the adhesive 500 and the side coating adhesive 600 are different, and the adhesive 500 has a stronger tack than the side coating adhesive 600. By setting the adhesive 500 to have a stronger tack than the side coating adhesive 600, the flip-chip film 400 can be more stably connected to the bonding portion 221 of the array element, reducing the risk of the arc-shaped segment of the flip-chip film 400 detaching from the bonding portion 221 of the array substrate 220.

[0041] In this embodiment, reference Figures 1-4The display device 10 includes a lower bezel area BB1 and a side bezel area BB2. The display device 10 also includes a middle frame 700, which is disposed on the backlight module 100. The display panel 200 is disposed on the middle frame 700. The display panel 200 also includes a light-shielding layer 230, which is disposed between the opposing substrate 210 and the array substrate 220. A portion of the light-shielding layer 230 extends beyond the edge of the middle frame 700 and toward the middle region of the display panel 200. The distance d1 from the edge of the middle frame 700 in the side bezel area BB2 to the edge of the light-shielding layer 230 near the middle region of the display panel 200 is greater than the distance d2 from the edge of the middle frame 700 in the lower bezel area BB1 to the edge of the light-shielding layer 230 near the middle region of the display panel 200. In conventional designs, to reduce the manufacturing complexity of the display device 10, the distance from the edge of the middle frame 700 in the side bezel area BB2 to the edge of the light-shielding layer 230 near the middle area of ​​the display panel 200 is set to be greater than the distance from the edge of the middle frame 700 in the lower bezel area BB1 to the edge of the light-shielding layer 230 near the middle area of ​​the display panel 200. However, since the lower bezel area BB1 of the display device 10 needs to reserve space for bonding, the width of the lower bezel area BB1 of the display device 10 is greater than the width of the side bezel area BB2, resulting in a significant difference between the width of the side bezel area BB2 and the width of the lower bezel area BB1 of the display device 10. Therefore, the technical solution of this application, by setting the distance d1 from the edge of the middle frame 700 located in the side bezel area BB2 to the edge of the light-shielding layer 230 near the middle area of ​​the display panel 200, to be greater than the distance d2 from the edge of the middle frame 700 located in the lower bezel area BB1 to the edge of the light-shielding layer 230 near the middle area of ​​the display panel 200, can increase the width of the side bezel area BB2 and reduce the difference between the width of the side bezel area BB2 and the width of the lower bezel area BB1 of the display device 10, thereby improving the problem that the display device 10 is difficult to achieve a display effect with equal width on all four sides.

[0042] In this embodiment, the side border area BB1 includes the left border area, the right border area, or the top border area.

[0043] In this embodiment, the difference between the distance d1 from the edge of the middle frame 700 located in the side frame area BB2 to the edge of the light-shielding layer 230 near the middle area of ​​the display panel 200 and the distance d2 from the edge of the middle frame 700 located in the lower frame area BB1 to the edge of the light-shielding layer 230 near the middle area of ​​the display panel 200 is 1.6mm to 3.6mm. By setting the difference between the distance d1 from the edge of the middle frame 700 in the side bezel area BB2 to the edge of the light-shielding layer 230 near the middle area of ​​the display panel 200 and the distance d2 from the edge of the middle frame 700 in the lower bezel area BB1 to the edge of the light-shielding layer 230 near the middle area of ​​the display panel 200 to 1.6mm to 3.6mm, on the one hand, the difference between the width of the side bezel area BB2 and the width of the lower bezel area BB1 of the display device 10 is reduced, thereby improving the problem that the display device 10 is difficult to achieve a display effect with equal width on all four sides. On the other hand, it can avoid the light efficiency of the display device 10 being reduced due to an excessive increase in the width of the light-shielding layer 230 corresponding to the middle frame 700 in the side bezel area BB2.

[0044] In this embodiment, reference Figure 2 The display device 10 further includes a protective member 800, which is disposed on the side of the driving circuit board 300 away from the display panel 200. In a top view of the display device 10, the protective member 800 overlaps with the driving circuit board 300 and the flip-chip film 400. By including the protective member 800 on the side of the driving circuit board 300 away from the display panel 200, and in a top view of the display device 10, overlapping with the driving circuit board 300 and the flip-chip film 400, the protective member 800 can shield the portions of the driving circuit board 300 and the flip-chip film 400 located in the horizontal direction X, reducing the risk of damage to the components on the driving circuit board 300 and the flip-chip film 400.

[0045] In this embodiment, the protective member 800 includes a horizontal portion and a vertical portion connected to the horizontal portion, the vertical portion extending toward the display panel 200.

[0046] In this embodiment, reference Figure 2The display device 10 further includes a conductive cloth 900, which is disposed on the side of the flip-chip film 400 away from the backlight module 100. The conductive cloth 900 is connected to the protective member 800 and extends towards the display panel 200. By including the conductive cloth 900 on the side of the flip-chip film 400 away from the backlight module 100, connected to the protective member 800, and extending towards the display panel 200, the conductive cloth 900 can improve the anti-static capability of the display device 10. Furthermore, the conductive cloth 900 can shield the portion of the flip-chip film 400 located in the vertical Y direction, thereby reducing the risk of damage to the components on the flip-chip film 400.

[0047] In this embodiment, the plane containing the top surface of the conductive cloth 900 is not lower than the plane containing the top surface of the flip-chip film 400. By ensuring that the plane containing the top surface of the conductive cloth 900 is not lower than the plane containing the top surface of the flip-chip film 400, it is guaranteed that the conductive cloth 900 can effectively block a portion of the flip-chip film 400 in the vertical Y direction.

[0048] In this embodiment, the vertical direction Y is consistent with the thickness direction of the display device 10.

[0049] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display device, characterized in that, include: Backlight module; The display panel is disposed on one side of the backlight module. The display panel includes an opposing substrate and an array substrate. The opposing substrate is disposed on the backlight module, and the array substrate is disposed on the side of the opposing substrate away from the backlight module. A driving circuit board is disposed on the side of the backlight module away from the display panel; A flip-chip film, one end of which is electrically connected to the driving circuit board, and the other end of which extends to the display panel and is electrically connected to the bonding portion of the array substrate; An adhesive is used to fix a portion of the flip-chip film and a portion of the bonding portion of the array substrate.

2. The display device according to claim 1, characterized in that, The flip-chip film includes a first vertical segment, a first arc segment, and a first horizontal segment. The first arc segment is located between the first vertical segment and the first horizontal segment. The first vertical segment is electrically connected to the driving circuit board. The first horizontal segment is electrically connected to the bonding portion of the array substrate. A portion of the first arc segment is fixed to the adhesive and a portion of the bonding portion of the array substrate.

3. The display device according to claim 1, characterized in that, The display device further includes a side coating adhesive, which is applied to the sidewall of the edge of the array substrate.

4. The display device according to claim 3, characterized in that, The adhesive is connected to the side coating adhesive, and the material of the adhesive is the same as that of the side coating adhesive.

5. The display device according to claim 3, characterized in that, The adhesive is connected to the side coating adhesive, the material of the adhesive is different from that of the side coating adhesive, and the adhesive has a stronger tack than the side coating adhesive.

6. The display device according to claim 1, characterized in that, The display device includes a bottom bezel area and a side bezel area. The display device also includes a middle frame disposed on the backlight module. The display panel is disposed on the middle frame. The display panel also includes a light-shielding layer disposed between the opposing substrate and the array substrate. A portion of the light-shielding layer extends beyond the edge of the middle frame and toward the middle area of ​​the display panel. The distance from the edge of the middle frame located in the side bezel area to the edge of the light-shielding layer near the middle area of ​​the display panel is greater than the distance from the edge of the middle frame located in the bottom bezel area to the edge of the light-shielding layer near the middle area of ​​the display panel.

7. The display device according to claim 6, characterized in that, The difference between the distance from the edge of the middle frame located in the side frame area to the edge of the light-shielding layer near the middle area of ​​the display panel and the distance from the edge of the middle frame located in the bottom frame area to the edge of the light-shielding layer near the middle area of ​​the display panel is 1.6mm to 3.6mm.

8. The display device according to claim 1, characterized in that, The display device further includes a protective component disposed on the side of the driving circuit board away from the display panel; wherein, in a top view of the display device, the protective component overlaps with the driving circuit board and the flip-chip film.

9. The display device according to claim 8, characterized in that, The display device further includes a conductive cloth disposed on the side of the flip-chip film away from the backlight module. The conductive cloth is connected to the protective component and extends toward the display panel.

10. The display device according to claim 9, characterized in that, The plane containing the top surface of the conductive cloth is not lower than the plane containing the top surface of the flip-chip film.

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