Magnesium alloy notebook computer bottom shell

Abstract

The utility model relates to a magnesium alloy notebook computer bottom shell, and belongs to the technical field of magnesium alloy application. Comprising a bottom plate, and a plurality of air inlet holes are formed in the bottom plate at intervals. The bottom of the bottom plate is provided with at least two heat dissipation bases arranged in parallel, and the heat dissipation bases are arranged at the rear end of the bottom of the bottom plate. The bottom plate and the heat dissipation base are made of magnesium alloy materials. According to the utility model, the magnesium alloy is adopted as the material, compared with the aluminum alloy, the weight is lighter, the heat dissipation effect is better, and the electromagnetic shielding performance is obviously improved. And through the design of the heat dissipation base, the keyboard area of the notebook computer is obliquely arranged, so that the notebook computer better conforms to ergonomics, and the use comfort is improved.

Description

Technical Field

[0001] This utility model belongs to the field of magnesium alloy application technology, specifically relating to a magnesium alloy laptop bottom shell. Background Technology

[0002] As a core component for structural support and heat dissipation in laptops, the choice of materials directly impacts device performance and user experience. Early engineering plastics (such as ABS and PC / ABS) were widely used due to their low cost, but their thermal conductivity (0.1-0.3 W / m·K) resulted in poor heat dissipation efficiency, and their bending strength (50-80 MPa) was insufficient to meet the structural requirements of ultra-thin designs. After 2010, aluminum alloys (such as the 6000 series) became the mainstream choice due to their high specific strength (tensile strength 310 MPa, density 2.7 g / cm³), but their shortcomings in electromagnetic shielding effectiveness (30-50 dB) and shock absorption performance gradually became apparent.

[0003] In recent years, 3C electronic devices have been iterating towards lighter weight (<1.2 kg) and higher strength (impact resistance >500 J / m), pushing traditional materials to their performance limits. Take Apple's MacBook series as an example: models after 2020 use 100% recycled aluminum alloy, which improves environmental friendliness, but requires an additional copper vapor chamber for the overall cooling module (increasing weight by 12%), thus hindering the goal of lightweighting. This contradiction has spurred the need to explore new alloy materials.

[0004] Meanwhile, the current bottom structure design of laptops still faces two major bottlenecks:

[0005] (1) Decreased heat dissipation efficiency due to planar base plate

[0006] Current designs typically employ a single flat base plate (radius of curvature > 1000 mm), with the air intake area accounting for less than 15%. Thermodynamic simulations show that this type of structure creates a "negative pressure dead zone" in the gap between the bottom and the desktop (< 3 mm), resulting in a 40%-60% reduction in airflow. For example, the Dell XPS 15's base plate temperature can reach 48°C under full load (ambient temperature 25°C), significantly degrading tactile comfort. Adopting a tilted design (e.g., a 5°-8° tilt angle) can guide airflow speed up by 30% through the Coanda effect, reducing the thermal resistance of the cooling module by 22%.

[0007] (2) Ergonomic injuries caused by zero-angle design

[0008] The flat base plate forces the keyboard into a horizontal position, requiring users to maintain a 15°-25° dorsiflexion of the wrists. According to OSHA standards, this posture for more than 2 hours increases the risk of carpal tunnel syndrome (CTS) by 3 times. Comparative experiments show that designing the keyboard area at a 3°-5° tilt can reduce the load on the finger extensor muscles by 18% and improve typing efficiency by 12% (based on WPM testing). However, existing aluminum alloy casings lack sufficient rigidity, making it difficult to achieve a reliable structural tilt design while maintaining an ultra-thin profile (<15 mm). Utility Model Content

[0009] The technical problem this invention aims to solve is to overcome the shortcomings of existing technologies and provide a magnesium alloy laptop bottom shell. This invention uses magnesium alloy as the material, which, compared to aluminum alloy, is lighter, has better heat dissipation, and significantly improved electromagnetic shielding performance. The design of the heat dissipation base allows the laptop's keyboard area to be arranged at an angle, which is more ergonomic and improves user comfort.

[0010] The technical solution adopted by this utility model to solve the problems existing in the prior art is:

[0011] A magnesium alloy laptop computer bottom casing includes a base plate with a plurality of spaced-apart air intake holes.

[0012] The bottom of the base plate is provided with at least two parallel heat dissipation bases, which are located at the rear end of the bottom of the base plate.

[0013] The base plate and heat dissipation base are made of magnesium alloy.

[0014] Preferably, the base plate and heat sink are made of magnesium alloy material of any one of AZ31B, AZ91D or AM60B.

[0015] Preferably, the heat dissipation base includes a finned plate, the finned plate protruding to the bottom of the base plate, and the heat dissipation base is integrally formed with the base plate.

[0016] Preferably, the heat dissipation base includes a finned plate and a top plate provided above the finned plate. The heat dissipation base and the base plate are separately formed and connected by welding or splicing.

[0017] Preferably, the heat dissipation base is connected to the base plate by welding, and the top plate is welded to the bottom surface of the base plate.

[0018] Preferably, the heat dissipation base and the base plate are connected by splicing. The base plate is provided with mounting holes. The finned plate passes through the mounting holes and is placed below the base plate. The end face of the top plate overlaps the base plate outside the mounting holes.

[0019] Preferably, the mounting hole end is provided with a mounting plate, and the top plate is mounted on the mounting plate.

[0020] Preferably, the top plate and the bottom plate are fixedly connected by adhesive or screws.

[0021] Preferably, the bottom of the base plate is provided with a first snap-fit ​​groove, the air inlet is disposed inside the first snap-fit ​​groove, and a filter plate is snapped inside the first snap-fit ​​groove.

[0022] Preferably, the bottom of the base plate is provided with a first snap-fit ​​groove, and the air inlet is disposed inside the first snap-fit ​​groove. A filter box is connected to the first snap-fit ​​groove, and the bottom surface of the filter box is higher than the bottom surface of the heat dissipation base. An electrostatic electret air filter is provided inside the filter box.

[0023] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0024] (1) The magnesium alloy material is used to reduce weight, optimize heat dissipation and improve electromagnetic shielding performance.

[0025] (2) By setting up the heat dissipation base, the base plate is tilted, forming an airflow channel under the base plate to optimize the heat dissipation effect. The tilted base plate makes the keyboard area tilted at a certain angle, which is more ergonomic and reduces fatigue from typing for a long time. Attached Figure Description

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0027] Figure 1 This is a top view of the bottom casing of a magnesium alloy laptop computer according to this application.

[0028] Figure 2 This is a first bottom view of a magnesium alloy laptop computer bottom casing according to this application.

[0029] Figure 3 This is a side view of the bottom casing of a magnesium alloy laptop computer according to this application.

[0030] Figure 4 This is an exploded view of the bottom casing of a magnesium alloy laptop computer according to this application.

[0031] Figure 5 This is a second bottom view of a magnesium alloy laptop computer bottom casing according to this application.

[0032] Figure 6 for Figure 5 sectional view,

[0033] Figure 7 for Figure 5 Structural diagram of the middle air intake filter box.

[0034] Figure 8 This is a bottom view of the bottom plate of a magnesium alloy notebook computer bottom casing according to this application.

[0035] In the diagram: 1-base plate, 101-rear baffle, 102-air inlet, 103-exhaust port, 104-first snap-fit ​​groove, 105-mounting hole, 106-mounting plate, 107-second snap-fit ​​groove, 2-heat dissipation base, 201-fin plate, 202-top plate, 3-filter plate, 4-filter box. Detailed Implementation

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of this application belong. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of this application.

[0037] Furthermore, the specification and claims of this utility model use terms indicating direction, such as "front," "rear," "upper," "lower," "left," "right," "side," "top," and "bottom," to describe various exemplary structural parts and elements of this utility model. However, the use of these terms is merely for illustrative purposes and is based on the exemplary orientations shown in the accompanying drawings. Therefore, these terms indicating direction are for illustrative purposes only and should not be considered as limitations. For example, "upper" and "lower" are not necessarily limited to directions opposite to or consistent with the direction of gravity.

[0038] The following description, in conjunction with the accompanying drawings, provides a more detailed description of the magnesium alloy bottom casing of a laptop computer according to this utility model.

[0039] A magnesium alloy laptop bottom casing, made of Figures 1 to 8 As shown, the device includes a base plate 1 with several spaced-apart air inlets 102. At least two parallel heat dissipation bases 2 are located at the bottom rear end of the base plate 1. Both the base plate 1 and the heat dissipation bases 2 are made of magnesium alloy.

[0040] Magnesium alloys have a density (1.75-1.85 g / cm³) that is only 64% of that of aluminum alloys. Taking a 14-inch laptop as an example, using a magnesium alloy casing can reduce the overall weight by 18%-22% (a reduction of approximately 200-250 g). This characteristic has significant implications for improving fatigue in mobile work scenarios—research by the Society for Ergonomics shows that for every 100 g reduction in device weight, the load on the user's wrist muscles can be reduced by 7.3%. Magnesium alloys optimized through vacuum die casting (such as AZ91D-T6) can achieve a yield strength of up to 220 MPa, higher than ordinary aluminum alloys (6063-T5: 170 MPa), and their specific stiffness (elastic modulus / density reaches 26 GPa·cm³ / g) is 4% higher than that of aluminum alloys (25 GPa·cm³ / g). This characteristic allows the casing to pass the MIL-STD-810G drop test (1.2 m) with 26-sided impact even when the thickness is reduced to 0.6 mm.

[0041] Magnesium alloys have a thermal conductivity (75-95 W / m·K) that is 60%-80% of that of aluminum alloys (120-180 W / m·K), but their thermal diffusivity (α=K / ρc) is actually higher than that of aluminum alloys due to their lower density (magnesium alloy α≈40 mm² / s vs. aluminum alloy α≈35 mm² / s). Experimental data shows that, under the same power consumption, magnesium alloy casings can reduce CPU core temperature by 3-5℃, reduce cooling fan speed by 800-1200 RPM, and reduce noise by 4-6 dB. The electromagnetic shielding effectiveness of magnesium alloys (60-90 dB) is more than 50% higher than that of aluminum alloys, eliminating the need for the 5% weight metal plating found in traditional plastic models. Furthermore, the energy consumption for magnesium alloy recycling is only 4% of that for ore smelting, meeting EU RoHS 3.0 and EPEAT Silver certification requirements.

[0042] Therefore, using magnesium alloy as the manufacturing material for the bottom shell of a laptop can effectively reduce the weight of the laptop shell, optimize its heat dissipation, reduce fan power consumption and noise, improve the comfort of using the laptop, and also optimize the electromagnetic shielding performance of the laptop shell.

[0043] However, there are many licenses for magnesium alloy materials. In this embodiment, the base plate 1 and the heat dissipation base 2 are made of magnesium alloy material with any one of the following grades: AZ31B, AZ91D, or AM60B. The specific reasons are as follows:

[0044] AZ31B magnesium alloy has a density of only 1.78 g / cm³, 34% lower than aluminum alloy (2.7 g / cm³), allowing 14-inch laptops to be 200-250g lighter. Its specific stiffness reaches 26 GPa·cm³ / g, meeting the bending resistance requirements of ultra-thin designs (<1.5 mm). It supports high-speed rolling (120 m / min), with a sheet uniformity error of <1.5%, increasing the yield to over 85%. It has good stamping formability, capable of processing 0.6 mm thin-walled curved structures, reducing welding processes. Its thermal conductivity reaches 75 W / m·K, and with optimized heat dissipation channel design, it can reduce CPU core temperature by 3-5℃.

[0045] AZ91D magnesium alloy is highly adaptable to die-casting processes, with a low melting point (598℃) and a solidification shrinkage rate of only 0.5%, making it suitable for die-casting complex structures (such as bottom shells with reinforcing ribs). The mold life can reach over 200,000 cycles. It has a tensile strength of 310 MPa and a yield strength of 220 MPa. After T6 heat treatment, the hardness is increased to 85 HB, and the wear resistance is improved by 15% compared to AZ31B. After surface anodizing, the salt spray test results are >500 hours (ASTM B117), meeting the requirements for use in coastal areas.

[0046] AM60B magnesium alloy, with an elongation of 12%-15%, supports stamping for 3°-5° keyboard tilt designs, alleviating wrist fatigue (EMG signal strength reduced by 22%). It has an impact toughness of 25 J / cm², and passed a 1.2 m drop test without cracking, superior to AZ series alloys.

[0047] Therefore, the grade of magnesium alloy can be rotated according to the specific application scenario and processing technology:

[0048] (1) For thin and light shells, magnesium alloy of grade AZ31B can be selected by rolling or stamping process.

[0049] (2) For complex curved surface shells, magnesium alloy of grade AZ91D can be selected by die casting.

[0050] (3) The outer shell needs to be made into a keyboard area with an ergonomic tilt angle, and it can be formed by stamping + CNC precision finishing process. It can be made of magnesium alloy with AM60B license.

[0051] The base plate 1 is supported by the heat dissipation base 2, allowing the base plate 1 to be tilted at an angle of 1.5° to 3°. The connection between the heat dissipation base 2 and the base plate 1 can be in the following two forms:

[0052] In the first embodiment, the heat dissipation base 2 is integrally formed with the base plate 1. The heat dissipation base 2 includes a finned plate 201, which protrudes to the bottom of the base plate 1. The heat dissipation base 2 and the base plate 1 are formed by die casting. If the heat dissipation base 2 and the base plate 1 are formed by stamping, the finned plate 201 can be designed to be wavy for easy processing.

[0053] In the second type, the heat dissipation base 2 and the base plate 1 are formed separately and connected by welding or splicing. The heat dissipation base 2 includes a finned plate 201 and a top plate 202 provided above the finned plate 201.

[0054] Furthermore, the heat dissipation base 2 is connected to the base plate 1 by welding, and the top plate 202 is welded and fixed to the bottom surface of the base plate 1.

[0055] Furthermore, the heat dissipation base 2 is connected to the base plate 1 by splicing. The base plate 1 has mounting holes 105, and the finned plate 201 passes through the mounting holes 105 and is placed below the base plate 1. The end face of the top plate 202 rests on the base plate 1 outside the mounting holes 105. The end of the mounting holes 105 has a mounting plate 106, and the top plate 202 rests on the mounting plate 106. The top plate 202 and the base plate 1 are fixedly connected by adhesive or screws.

[0056] Dust inside the laptop casing, especially dust adsorbed on the fan blades, not only affects the fan's operating efficiency, increases noise and energy consumption, but may also cause short circuits, burnout of components such as the motherboard, and other malfunctions. This dust mainly enters through the air intake 102 during fan operation, becoming trapped in the air. To avoid this phenomenon, this invention adds the following two structural arrangements:

[0057] In the first embodiment, the bottom of the base plate 1 is provided with a first snap-fit ​​groove 104, and the air inlet 102 is disposed inside the first snap-fit ​​groove 104. A filter plate 3 is snapped inside the first snap-fit ​​groove 104. The filter holes on the filter plate 3 are small in diameter and more dense, which makes it easier for some dust to be adsorbed on the filter plate 3, reducing the amount of dust entering the laptop casing.

[0058] In the second configuration, the bottom of the base plate 1 is provided with a first snap-fit ​​groove 104, and an air inlet 102 is disposed inside the first snap-fit ​​groove 104. A filter box 4 is connected to the first snap-fit ​​groove 104, and the bottom surface of the filter box 4 is higher than the bottom surface of the heat dissipation base 2. The filter box 4 is provided with an electrostatic electret air filter, which electrostatically adsorbs dust in the air about to enter the air inlet 102.

[0059] The filter plate 3 and the filter box 4 are snapped into the first snap-fit ​​groove 104, or are detachably connected by bolts, which facilitates later maintenance and cleaning.

[0060] A rear baffle 101 is provided vertically on the upper rear end of the base plate 1. The rear baffle 101 is provided with an exhaust hole 103. The exhaust hole 103 is arranged in a certain way. A second snap-fit ​​groove 107 is recessed on the rear baffle 101. The exhaust hole 103 is located inside the second snap-fit ​​groove 107. The second snap-fit ​​groove 107 restricts the arrangement position of the exhaust pipe, which facilitates later assembly.

[0061] The air intake 102 is located between the heat sink bases 2, which further optimizes the air intake and heat dissipation effect.

[0062] The heat sink 2 can be positioned to correspond with components that generate a lot of heat, such as graphics cards and CPUs, and the heat dissipation effect can be further optimized through the setting of finned plates 201.

[0063] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A magnesium alloy laptop computer bottom casing, comprising a bottom plate (1), wherein the bottom plate (1) is provided with a plurality of spaced air inlets (102), characterized in that: The bottom of the base plate (1) is provided with at least two parallel heat dissipation bases (2), and the heat dissipation bases (2) are located at the rear end of the bottom of the base plate (1); The base plate (1) and the heat dissipation base (2) are made of magnesium alloy.

2. The magnesium alloy laptop bottom casing according to claim 1, characterized in that: The base plate (1) and the heat sink base (2) are made of magnesium alloy material of any one of AZ31B, AZ91D or AM60B.

3. The magnesium alloy laptop bottom casing according to claim 1, characterized in that: The heat dissipation base (2) includes a finned plate (201), which protrudes to the bottom of the base plate (1) and is integrally formed with the base plate (1).

4. The magnesium alloy laptop bottom casing according to claim 1, characterized in that: The heat dissipation base (2) includes a finned plate (201) and a top plate (202) provided above the finned plate (201). The heat dissipation base (2) and the base plate (1) are formed separately and connected by welding or splicing.

5. The magnesium alloy laptop bottom casing according to claim 4, characterized in that: The heat dissipation base (2) is connected to the base plate (1) by welding, and the top plate (202) is welded to the bottom surface of the base plate (1).

6. The magnesium alloy laptop bottom casing according to claim 4, characterized in that: The heat dissipation base (2) is connected to the base plate (1) by splicing. The base plate (1) is provided with mounting holes (105). The finned plate (201) passes through the mounting holes (105) and is placed below the base plate (1). The end face of the top plate (202) overlaps the base plate (1) outside the mounting holes (105).

7. The magnesium alloy laptop bottom casing according to claim 6, characterized in that: The mounting hole (105) is provided with a mounting plate (106) at its end, and the top plate (202) is mounted on the mounting plate (106).

8. A magnesium alloy laptop bottom casing according to claim 6 or 7, characterized in that: The top plate (202) and the bottom plate (1) are fixedly connected by adhesive or screws.

9. A magnesium alloy laptop bottom casing according to any one of claims 2 to 7, characterized in that: The bottom plate (1) is provided with a first snap-fit ​​groove (104) and an air inlet (102) is provided inside the first snap-fit ​​groove (104). A filter plate (3) is snapped inside the first snap-fit ​​groove (104).

10. A magnesium alloy laptop bottom casing according to any one of claims 2 to 7, characterized in that: The bottom of the base plate (1) is provided with a first snap-fit ​​groove (104), and the air inlet (102) is located inside the first snap-fit ​​groove (104). The first snap-fit ​​groove (104) is connected to a filter box (4), and the bottom surface of the filter box (4) is higher than the bottom surface of the heat dissipation base (2). The filter box (4) is equipped with an electrostatic electret air filter.

Images